CN109348651A - A kind of ELIC pcb board part position alignment of inner layer plates processing method - Google Patents
A kind of ELIC pcb board part position alignment of inner layer plates processing method Download PDFInfo
- Publication number
- CN109348651A CN109348651A CN201811205246.7A CN201811205246A CN109348651A CN 109348651 A CN109348651 A CN 109348651A CN 201811205246 A CN201811205246 A CN 201811205246A CN 109348651 A CN109348651 A CN 109348651A
- Authority
- CN
- China
- Prior art keywords
- elic
- radium
- shine
- hole
- copper sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention discloses a kind of ELIC pcb board part position alignment of inner layer plates processing methods, including following step: S1: sawing sheet, form dry film, after sawing sheet, cancel the movement in the original hole power auger tooling, first pass through the copper window of MASK four 3.0mm in ELIC plate uplifting window etch copper dermatotome, then it is drilled at the edges of boards of copper sheet plate using the technology of laser drill, four drilled out through-hole diameter is 3.0mm through-hole, this four through-holes are supplied to outer layer and carry out what contraposition used.The present invention, which passes through, simplifies manufacture craft, shortens process flow, improves processing efficiency, cost of manufacture is reduced, by mark point, for radium-shine contraposition, it ensure that radium-shine hole and the alignment precision of MASK, it is all at radium-shine station while to drill out by registration holes and radium-shine hole, and same contraposition system ensure that the position precision consistency in registration holes and radium-shine hole, outer layer, which has used, radium-shine drills out four registration holes, figure is produced, radium-shine via hole consistency is good in figure and plate, and there is no systemic contraposition deviations.
Description
Technical field
The present invention relates to wiring board processing technique field, specifically a kind of ELIC pcb board part position alignment of inner layer plates processing method.
Background technique
ELIC plate random layer interconnection PCB (Every Layer Interconnect Printed Circuit Board,
Printed circuit board) all levels be that high density interconnects (High Density Interconnector, HDI) layer, each layer leads
Body can be stacked by the hole HDI and freely be connected, to be provided in hand-held and mobile device using highly complex big pin device
It may；For example, CPU etc. provides reliable Interworking Solution, and random layer interconnection technique is widely used in high-performance intelligence
It can field of mobile phones.
But restriction of the price of existing ELIC plate by main electron carrier High density of PCB cost；This kind of height
Density PCB often uses the conventional lay-up method technique processing and fabricating of random layer interconnection technique, and process flow is extremely long, therefore directly leads
The rising of process cost and scrap cost is caused, and then directly affects the cost of such route panel products.Therefore, those skilled in the art
Member provides a kind of ELIC pcb board part position alignment of inner layer plates processing method, to solve the problems mentioned in the above background technology.
Summary of the invention
The purpose of the present invention is to provide a kind of ELIC pcb board part position alignment of inner layer plates processing methods, to solve above-mentioned background skill
The problem of being proposed in art.
To achieve the above object, the invention provides the following technical scheme:
A kind of ELIC pcb board part position alignment of inner layer plates processing method, comprising the following steps:
S1: sawing sheet, form dry film after sawing sheet, cancel the movement in the original hole power auger tooling, first pass through MASK
The copper window of four 3.0mm in ELIC plate uplifting window etch copper dermatotome, then using the technology of laser drill in copper sheet plate
It drills at edges of boards, four drilled out through-hole diameter is 3.0mm through-hole, this four through-holes, which are supplied to outer layer, which carries out contraposition, makes
?；
S2: laser drilling makes four radium-shine mark points used on the edges of boards of MASK, can be for radium-shine progress
Then laser drilling machine is directed at mark point and through-hole, then carries out laser drilling by positioning；
S3: plating filling perforation: then hole is filled out using electroplating technology；
S4: internal layer dry film, acid etching: finally carrying out acid etching, produces the figure of needs.
As further scheme of the invention: the intermediate base material of the ELIC plate uses circular shape, the circle
For proper circle shape, the very circular substrate diameter is 3.5mil.
As further scheme of the invention: using copper sheet around the proper circle shape substrate, the copper sheet is side
Shape, and copper sheet diameter design is 10-15mil, the design diameter that the copper sheet optimizes is 12.5mil.
As further scheme of the invention: the annular substrate in use side, side's annular base outside the ELIC plate
The position of material design is in the surrounding of copper sheet, and side's annular substrate diameter is 2-3mil, and the optimization of side's annular substrate is set
The diameter of meter is 2.5mil.
As further scheme of the invention: being designed around side's annular substrate using big copper sheet.
As further scheme of the invention: the shape after the copper sheet etching is proper circle shape, and position is located at ELIC plate
Four plate angles of part are designed using big copper sheet around the copper sheet after the etching.
As further scheme of the invention: described 4 positioning bore dias are 16mil, and 4 location holes are set
It is calculated as combination reaming, forms looping pit.
As further scheme of the invention: the big copper sheet around the copper sheet after the overall diameter of the looping pit and etching
Diameter is equal.
As the present invention further scheme: the registration holes and radium-shine hole be all at radium-shine station while drilling out, and
Same contraposition system, the radium-shine aperture for using chambering process, forming that diameter is 3.0-3.5mm.
Compared with prior art, the beneficial effects of the present invention are: the present invention devises a kind of ELIC pcb board part internal layer pair
Position processing method by simplifying manufacture craft, shortens process flow, improves processing efficiency, reduction is fabricated in actual use
This, ensure that radium-shine hole and the alignment precision of MASK for radium-shine contraposition by mark point, be all by registration holes and radium-shine hole
It at radium-shine station while drilling out, and same contraposition system, ensure that the position precision consistency in registration holes and radium-shine hole, outer layer makes
Four registration holes are drilled out with radium-shine, produce figure, radium-shine via hole consistency is good in figure and plate, and there is no systematicness is right
Position deviation can be realized shape after four plate angle etchings of design, and be given to the crawl of radium-shine production blind hole.
Detailed description of the invention
Fig. 1 is that a kind of MASK process of ELIC pcb board part position alignment of inner layer plates processing method makes the radium-shine hole contraposition tooling
Design structure schematic diagram；
Fig. 2 is that a kind of MASK process of ELIC pcb board part position alignment of inner layer plates processing method produces 4 location hole form moneys
Expect design structure schematic diagram；
Fig. 3 be a kind of ELIC pcb board part position alignment of inner layer plates processing method radium-shine process produce 4 positioning can hole it is radium-shine
Data Design structural schematic diagram.
In figure: 1, round substrate；2, rectangular copper sheet；3, square ring group material；4, the first big copper sheet；5, copper sheet is etched；6,
Two big copper sheets；7, reaming is combined；8, reaming overall diameter is combined.
Specific embodiment
Please refer to Fig. 1~3, in the embodiment of the present invention, a kind of ELIC pcb board part position alignment of inner layer plates processing method, including it is following
Step:
S1: sawing sheet, form dry film after sawing sheet, cancel the movement in the original hole power auger tooling, first pass through MASK
The copper window of four 3.0mm in ELIC plate uplifting window etch copper dermatotome, then using the technology of laser drill in copper sheet plate
It drills at edges of boards, four drilled out through-hole diameter is 3.0mm through-hole, this four through-holes, which are supplied to outer layer, which carries out contraposition, makes
?；
S2: laser drilling makes four radium-shine mark points used on the edges of boards of MASK, can be for radium-shine progress
Then laser drilling machine is directed at mark point and through-hole, then carries out laser drilling by positioning；
S3: plating filling perforation: then hole is filled out using electroplating technology；
S4: internal layer dry film, acid etching: finally carrying out acid etching, produces the figure of needs.
Further, the intermediate base material of ELIC plate uses circular shape, and circle is proper circle shape, very circular substrate diameter
For 3.5mil.
Further, copper sheet is used around proper circle shape substrate, copper sheet is rectangular, and copper sheet diameter design is 10-
15mil, the design diameter that copper sheet optimizes are 12.5mil.
Further, the annular substrate in use side outside ELIC plate, the position that the annular substrate in side designs copper sheet surrounding,
Side's annular substrate diameter is 2-3mil, and the diameter of the optimized design of side's annular substrate is 2.5mil.
Further, it is designed around the annular substrate in side using big copper sheet.
Further, the shape after copper sheet etching is proper circle shape, and position is located at four plate angles of ELIC plate, after etching
It is designed around copper sheet using big copper sheet.
Further, 4 positioning bore dias are 16mil, and 4 location holes are designed as combination reaming, form looping pit.
Further, the overall diameter of looping pit is equal with the big copper sheet diameter around the copper sheet after etching.
Further, registration holes and radium-shine hole are all at radium-shine station while to drill out, and same contraposition system, radium-shine use
Chambering process forms the aperture that diameter is 3.0-3.5mm.
The working principle of the invention is: cancelling the movement in the original hole power auger tooling first, first passes through MASK and exist
Then the copper window of four 3.0mm in ELIC plate uplifting window etch copper dermatotome uses the technology of laser drill in the plate of copper sheet plate
It drills at side, four drilled out through-hole diameter is 3.0mm through-hole, this four through-holes are supplied to outer layer and carry out contraposition use
, then laser drilling, four radium-shine mark points used are made on the edges of boards of MASK, can be determined for radium-shine
Then laser drilling machine is directed at mark point and through-hole, then carries out laser drilling by position, then filled out hole using electroplating technology
Come, finally carries out acid etching, produce the figure of needs.
It is above-described, it is merely preferred embodiments of the present invention, but protection scope of the present invention is not limited to
This, anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention
And its inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (9)
1. a kind of ELIC pcb board part position alignment of inner layer plates processing method, which comprises the following steps:
S1: sawing sheet, form dry film after sawing sheet, cancel the movement in the original hole power auger tooling, first pass through MASK and exist
Then the copper window of four 3.0mm in ELIC plate uplifting window etch copper dermatotome uses the technology of laser drill in the plate of copper sheet plate
It drills at side, four drilled out through-hole diameter is 3.0mm through-hole, this four through-holes are supplied to outer layer and carry out contraposition use
's；
S2: laser drilling is made four radium-shine mark points used on the edges of boards of MASK, can be determined for radium-shine
Then laser drilling machine is directed at mark point and through-hole, then carries out laser drilling, form radium-shine hole by position；
S3: plating filling perforation: then radium-shine hole is filled out using electroplating technology；
S4: internal layer dry film, acid etching: finally carrying out acid etching, produces the figure of needs.
2. a kind of ELIC pcb board part position alignment of inner layer plates processing method according to claim 1, which is characterized in that the ELIC
The intermediate base material of plate uses circular shape, and the circle is proper circle shape, and the very circular substrate diameter is 3.5mil.
3. a kind of ELIC pcb board part position alignment of inner layer plates processing method according to claim 2, which is characterized in that the proper circle
Copper sheet is used around shape substrate, the copper sheet is rectangular, and copper sheet diameter design is 10-15mil, and the copper sheet optimizes
Design diameter be 12.5mil.
4. a kind of ELIC pcb board part position alignment of inner layer plates processing method according to claim 1, which is characterized in that the ELIC
Annular substrate in use side outside plate, in the surrounding of copper sheet, side's annular substrate is straight for the position that side's annular substrate designs
Diameter is 2-3mil, and the diameter of the optimized design of side's annular substrate is 2.5mil.
5. a kind of ELIC pcb board part position alignment of inner layer plates processing method according to claim 1, which is characterized in that the Fang Huan
It is designed around shape substrate using big copper sheet.
6. a kind of ELIC pcb board part position alignment of inner layer plates processing method according to claim 1, which is characterized in that the copper sheet
Shape after etching is proper circle shape, and position is located at four plate angles of ELIC plate, uses big copper around the copper sheet after the etching
Skin design.
7. a kind of ELIC pcb board part position alignment of inner layer plates processing method according to claim 1, which is characterized in that described 4
Positioning bore dia be 16mil, 4 location holes be designed as combination reaming, formed looping pit.
8. a kind of ELIC pcb board part position alignment of inner layer plates processing method according to claim 7, which is characterized in that the annular
The overall diameter in hole is equal with the big copper sheet diameter around the copper sheet after etching.
9. a kind of ELIC pcb board part position alignment of inner layer plates processing method according to claim 1, which is characterized in that the contraposition
Hole and radium-shine hole are drilled out simultaneously at radium-shine station, and same contraposition system, described radium-shine to use chambering process, formation diameter
For the aperture of 3.0-3.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811205246.7A CN109348651A (en) | 2018-10-16 | 2018-10-16 | A kind of ELIC pcb board part position alignment of inner layer plates processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811205246.7A CN109348651A (en) | 2018-10-16 | 2018-10-16 | A kind of ELIC pcb board part position alignment of inner layer plates processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109348651A true CN109348651A (en) | 2019-02-15 |
Family
ID=65309866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811205246.7A Pending CN109348651A (en) | 2018-10-16 | 2018-10-16 | A kind of ELIC pcb board part position alignment of inner layer plates processing method |
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| CN (1) | CN109348651A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110113885A (en) * | 2019-06-05 | 2019-08-09 | 景旺电子科技(龙川)有限公司 | A kind of FPC method for manufacturing circuit board |
| CN113316324A (en) * | 2021-05-27 | 2021-08-27 | 定颖电子（昆山）有限公司 | HDI board manufacturing process |
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| CN103596368A (en) * | 2013-10-14 | 2014-02-19 | 大连太平洋电子有限公司 | Improved direct laser drilling processing method |
| CN104244584A (en) * | 2013-06-24 | 2014-12-24 | 北大方正集团有限公司 | Laser drilling alignment method |
| CN104270888A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | High-density package substrate on-hole disk product and preparation method thereof |
| CN105682366A (en) * | 2016-03-29 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Stacked via laser HDI board manufacturing process |
| WO2017156678A1 (en) * | 2016-03-14 | 2017-09-21 | 深圳崇达多层线路板有限公司 | Method for manufacturing stacked holes of circuit board |
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2018
- 2018-10-16 CN CN201811205246.7A patent/CN109348651A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244584A (en) * | 2013-06-24 | 2014-12-24 | 北大方正集团有限公司 | Laser drilling alignment method |
| CN103596368A (en) * | 2013-10-14 | 2014-02-19 | 大连太平洋电子有限公司 | Improved direct laser drilling processing method |
| CN104270888A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | High-density package substrate on-hole disk product and preparation method thereof |
| WO2017156678A1 (en) * | 2016-03-14 | 2017-09-21 | 深圳崇达多层线路板有限公司 | Method for manufacturing stacked holes of circuit board |
| CN105682366A (en) * | 2016-03-29 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Stacked via laser HDI board manufacturing process |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110113885A (en) * | 2019-06-05 | 2019-08-09 | 景旺电子科技(龙川)有限公司 | A kind of FPC method for manufacturing circuit board |
| CN110113885B (en) * | 2019-06-05 | 2021-09-07 | 景旺电子科技(龙川)有限公司 | FPC circuit board manufacturing method |
| CN113316324A (en) * | 2021-05-27 | 2021-08-27 | 定颖电子（昆山）有限公司 | HDI board manufacturing process |
| CN113316324B (en) * | 2021-05-27 | 2022-01-18 | 定颖电子（昆山）有限公司 | HDI board manufacturing process |
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Application publication date: 20190215 |
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