CN113316324A - HDI board manufacturing process - Google Patents
HDI board manufacturing process Download PDFInfo
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- CN113316324A CN113316324A CN202110583712.0A CN202110583712A CN113316324A CN 113316324 A CN113316324 A CN 113316324A CN 202110583712 A CN202110583712 A CN 202110583712A CN 113316324 A CN113316324 A CN 113316324A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a HDI board manufacturing process, which comprises the following steps: respectively cutting the copper-clad plate into copper plates required by single production size; horizontally placing a copper plate on a workbench of equipment, defining the direction of the glass fiber in the same direction in glass fiber cloth soaked in the copper plate as an X1 direction, defining the direction of a circuit arranged in parallel along the same direction on a photosensitive film as an X2 direction, and attaching the photosensitive film to the surface of the copper plate to enable the X1 direction and the X2 direction to form an acute angle in a crossed manner; the method is adopted to respectively manufacture the upper sub-plate, the lower sub-plate and the middle core plate, and the expansion and contraction coefficient of the middle core plate is determined by confirming the expansion and contraction coefficient of the upper sub-plate and the expansion and contraction coefficient of the lower sub-plate. The invention effectively solves the glass fiber effect and improves the signal propagation speed by forming an acute angle by crossing the trend of the infiltrated glass fiber cloth and the trend of the circuit on the photosensitive film.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to a manufacturing process of an HDI board.
Background
HDI board refers to High Density Interconnect, i.e. High Density Interconnect board. Is a newer technology developed by the PCB industry at the end of the 20 th century. The conventional drilling of the PCB board is affected by the drill, and when the hole diameter of the drilled hole reaches 0.15mm, the cost is very high and it is difficult to improve again. Drilling of HDI plates, however, no longer relies on conventional mechanical drilling, but rather utilizes laser drilling techniques. (and therefore sometimes referred to as a laser board.) HDI boards typically have a bore diameter of 3-6 mils (0.076-0.152mm) and a line width of 3-4mi1(0.076-0.10mm), and the pad size can be reduced significantly to allow more line distribution per unit area and high density interconnects. The development of the PCB industry is adapted and promoted by the emergence of the HDI technology. So that a more dense set of BGAs, QFPs, etc. can be arranged within the HDI board.
With the increasing development level of the PCB industry, light, thin, short and small electronic products tend to be developed. The market demand is increasing, and the manufacturing of HDI board faces serious challenge to the market demand.
The common raw material of PCB is FR4 copper clad laminate, which is usually composed of glass fiber cloth and resin, and two copper foils are attached to the outside. The glass cloth has a dielectric constant of about 6.7 and the resin has a dielectric constant of about 3.2, which results in the dielectric constant of the board being non-uniform. The signal wire running on the glass fiber has a larger dielectric constant, and the wire running on the window has a smaller dielectric constant. Because the higher the dielectric constant is, the slower the signal propagation speed is, and the lower the dielectric constant is, the faster the signal propagation speed is, the difference lines have equal length among NPs due to the difference of the dielectric constants, thereby generating the glass fiber effect.
Meanwhile, when the surface of the PCB is plated with via copper, the ratio of the thickness to the aperture (called the ratio of thickness to diameter for short) of the PCB also affects the propagation speed of high signals,
disclosure of Invention
In order to solve the technical problem, the invention provides a HDI board manufacturing process, which comprises the following steps:
respectively cutting the copper-clad plate into copper plates required by single production size;
defining the transverse direction of the resin fiber on the surface of the copper plate as an X1 axis, and horizontally placing the copper plate on a workbench of equipment; defining the photosensitive film, attaching the photosensitive film to the surface of the copper plate by taking the direction of most lines as an X2 axis, wherein the X1 axis and the X2 axis are crossed and form an acute angle, so that the glass fiber effect can be effectively avoided; exposing the board pasted with the photosensitive film to cure the light-transmitting part, developing to remove the uncured dry film, etching the board pasted with the cured protective film, and removing the film, wherein the circuit pattern of the inner layer is transferred to the board to form a PCB sub-board;
respectively manufacturing an upper-layer daughter board, a lower-layer daughter board and a middle core board by adopting the method, and further confirming the expansion and contraction coefficient of the upper-layer daughter board and the expansion and contraction coefficient of the lower-layer daughter board by confirming the expansion and contraction coefficient of the copper plate, including the expansion and contraction coefficient of copper foil and the expansion and contraction coefficient of resin; after the expansion and contraction coefficient of the upper-layer daughter board and the expansion and contraction coefficient of the lower-layer daughter board are confirmed, the average value of the expansion and contraction coefficient of the upper-layer daughter board and the expansion and contraction coefficient of the lower-layer daughter board is taken, so that the expansion and contraction coefficient of the middle core board is estimated, and the difference value of the expansion and contraction coefficients among the upper-layer daughter board, the middle core board and the lower-layer daughter board is minimum;
and respectively drilling first positioning holes on the peripheries of the daughter boards and the middle core board, positioning and pressing the daughter boards through the first positioning holes to form a mother board, and simultaneously performing reaming treatment on the first positioning holes of the daughter boards on the upper layer to form second positioning holes on the mother board.
Furthermore, an acute angle formed by the X1 direction of the copper plate soaked in the glass fiber cloth and the X2 direction of the circuit in the photosensitive film in a crossing mode is 5-10 degrees.
Furthermore, when the patterns of the upper sub-board, the lower sub-board and the middle core board are transferred, the angle formed by the X1 direction of the glass fiber cloth soaked in the copper board and the X2 direction of the circuit in the photosensitive film are the same.
Further, before the middle core plate is pressed with the upper-layer sub-plate and the lower-layer sub-plate, the surfaces of the sub-plates are drilled through laser so as to form buried holes after pressing.
Furthermore, the buried holes are distributed in the inner layer of the mother board in an equidistant square or straight line manner, so that the design density of the buried holes is realized.
Furthermore, the upper layer sub-board, the lower layer sub-board and the middle core board are subjected to press-fit treatment through prepregs.
Further, the pressed mother board is subjected to blackening or browning treatment.
Furthermore, the upper sub-board, the lower sub-board and the middle core board are processed by silk-screen printing resin on two sides and baking and pressing.
Further, after the daughter board and/or the core board are ground, silk-screened and baked for multiple times, the thickness of the daughter board and/or the core board is controlled to be 0.1-0.2 mm.
The beneficial technical effects of the invention are as follows:
1. defining the transverse direction of the resin fiber on the surface of the copper plate as an X1 axis, and horizontally placing the copper plate on a workbench of equipment; defining the photosensitive film, attaching the photosensitive film to the surface of the copper plate by taking the trend of most circuits as an X2 axis, wherein the X1 axis and the X2 axis are crossed and form an acute angle, so that the glass fiber effect can be effectively avoided.
2. The density of the buried holes is reduced by distributing the buried holes in a square shape or a straight line shape of the same PITCH, so that the heat resistance manufacturability of the HDI board is improved.
3. The processing steps of blackening and browning are omitted from the double-sided silk-screen resin of the daughter board and the core board, and the thickness of the medium is effectively controlled after repeated silk-screen printing, baking and grinding, so that the electroplating of the via hole and the via hole copper on the mother board is facilitated, the via hole copper is uniform, and the poor open circuit caused by reflow soldering is avoided.
4. The method comprises the steps of firstly, respectively drilling first positioning holes on the surfaces of an upper-layer daughter board, a lower-layer daughter board and a middle core board through laser, pressing the upper-layer daughter board, the lower-layer daughter board and the middle core board through the positioning of the first positioning holes, avoiding deviation generated during pressing, further determining the expansion and contraction coefficient of the middle core board through confirming the expansion and contraction coefficients of the upper-layer daughter board and the lower-layer daughter board, and controlling the deviation generated during pressing within an effective range.
Drawings
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a process flow diagram of drilling of the present invention;
Detailed Description
In order to make the technical means of the present invention clearer and to make the technical means of the present invention capable of being implemented according to the content of the specification, the following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings and examples, which are provided for illustrating the present invention and are not intended to limit the scope of the present invention.
Embodiment 1 the present invention specifically relates to a HDI plate manufacturing process, which includes the steps of:
firstly, cutting a copper clad plate into single production copper plates; defining the transverse direction of the resin fiber on the surface of the copper plate as an X1 axis, and horizontally placing the copper plate on a workbench of equipment; defining the photosensitive film, attaching the photosensitive film to the surface of the copper plate by taking the direction of most lines as an X2 axis, wherein the X1 axis and the X2 axis are crossed and form an acute angle, so that the glass fiber effect can be effectively avoided; when the patterns of the upper sub-board, the lower sub-board and the middle core board are transferred, the X1 direction of the glass fiber cloth soaked in the copper board is the same as the X2 direction of the circuit in the photosensitive film in a crossed manner to form an angle.
It should be noted that the common raw material of PCB is FR4 copper clad laminate, which is usually composed of fiberglass cloth and resin, and two copper foils are attached to the outside. The glass cloth has a dielectric constant of about 6.7 and the resin has a dielectric constant of about 3.2, which results in the dielectric constant of the board being non-uniform. The signal wire running on the glass fiber has a larger dielectric constant, and the wire running on the window has a smaller dielectric constant. Because the higher the dielectric constant is, the slower the signal propagation speed is, and the lower the dielectric constant is, the faster the signal propagation speed is, the difference lines have equal length among NPs due to the difference of the dielectric constants, thereby generating the glass fiber effect.
At low speed, the expansion of the board time and the contraction of the size can be neglected, but at high speed, the expansion cannot be neglected. The glass fiber effect has signal influence on impedance fluctuation and difference glass fiber effect; the glass fiber bundles of the glass fiber cloth with different specifications have different widths, thicknesses and gaps, so that the caused impedance fluctuation and the glass fiber effect are different.
When the window of the glass fiber is smaller, the part of the signal wire, which is laid on the window, is smaller, and the influence of the glass fiber effect is smaller. The glass fiber effect and impedance fluctuation are effectively solved, and the high signal propagation speed is improved.
Furthermore, an acute angle formed by the X1 direction of the copper plate soaked in the glass fiber cloth and the X2 direction of the circuit in the photosensitive film in a crossing mode is 5-10 degrees.
Exposing the board pasted with the photosensitive film to cure the light-transmitting part, developing to remove the uncured dry film, etching the board pasted with the curing protective film, and removing the film, wherein the circuit pattern of the inner layer is transferred to the board to form a PCB sub-board;
respectively manufacturing an upper-layer daughter board, a lower-layer daughter board and a middle core board by adopting the method, and further confirming the expansion and contraction coefficient of the upper-layer daughter board and the expansion and contraction coefficient of the lower-layer daughter board by confirming the expansion and contraction coefficient of the copper plate, including the expansion and contraction coefficient of copper foil and the expansion and contraction coefficient of resin; after the expansion and contraction coefficient of the upper-layer daughter board and the expansion and contraction coefficient of the lower-layer daughter board are confirmed, the average value of the expansion and contraction coefficient of the upper-layer daughter board and the expansion and contraction coefficient of the lower-layer daughter board is taken, and thus the expansion and contraction coefficient of the middle core board is estimated;
it should be noted that different manufacturers of copper-clad plates cause different resin components, and further cause different expansion and contraction coefficients of each copper-clad plate; therefore, the expansion and contraction coefficient of the copper-clad plate is confirmed through the resin component, the fiber cloth and the base material, so that the expansion and contraction coefficient of the upper sub-plate and the expansion and contraction coefficient of the lower sub-plate are determined. The average value of the expansion and contraction coefficient of the upper daughter board and the expansion and contraction coefficient of the lower daughter board is obtained, so that the expansion and contraction coefficient of the middle core board can be judged in advance, the closest middle core board can be found out by judging the expansion and contraction coefficient of the middle core board in advance, and the deviation of the upper daughter board, the middle core board and the lower daughter board during lamination can be effectively avoided, so that the internal circuit is abnormal.
Further, when batch production, can carry out the management of piling, at first carry out classification management with the copper-clad plate of different producers, further, carry out the management and control of piling in a branch with the upper daughter board of the harmomegathus coefficient of same interval and the lower floor daughter board of the harmomegathus coefficient of same interval, can effectually solve the pressfitting unusual, when using, directly select the upper daughter board or the lower floor daughter board of the harmomegathus coefficient of this inside of piling in a branch simultaneously, provide production efficiency.
And simultaneously, carrying out reaming treatment on the first positioning hole of the daughter board on the upper layer to form a second positioning hole on the mother board.
Through consulting first locating hole and fixing a position, can effectually avoid daughter board and the deviation that the core produced when the pressfitting, after the pressfitting, the core of the inlayer of actual mother board and the first locating hole of upper and lower layer daughter board because the harmomegathus of panel itself to there is the error, can't accomplish completely to communicate with each other, consequently reams once more through the first locating hole department on the surface of upper daughter board, forms the second locating hole on the mother board, is convenient for fix a position once more and uses.
And before the middle core plate is pressed with the upper daughter board and the lower daughter board, the surface of the daughter board is drilled through laser so as to form a buried hole after pressing. The buried holes are distributed in the inner layer of the mother board in an equidistant square or straight line mode, and therefore the design density of the buried holes is achieved.
It should be noted that the buried holes in the delamination area are prone to delamination due to stress generated by heating, the buried holes in the market are distributed in a triangular shape at present, and slicing studies find that the stress generated by heating the buried holes in the triangular distribution is the largest, and the stress generated by heating the buried holes in the square or linear distribution at the same distance is the smallest. Further, when the power supply layer or the grounding layer is divided, the distance between the buried hole and the edge of the dividing line is larger than 2 times of the aperture, so that the heat resistance manufacturability of the HDI board is improved.
And the upper-layer sub-board, the lower-layer sub-board and the middle core board are subjected to press-fitting treatment through a TU-668 type prepreg. And carrying out blackening or browning treatment on the pressed mother board.
Second embodiment of the invention:
the upper sub-board, the lower sub-board and the middle core board are processed by silk-screen printing of resin on two sides and baking and pressing. Through silk screen printing resin, the amount of resin that can effectual control is located daughter board or core surface to the whole thickness of effectual restriction daughter board or core. When the mother board is formed by pressing, the through hole is formed on the surface of the mother board, and the thickness-diameter ratio is improved, so that the through hole copper is uniformly electroplated.
It should be noted that the PCB is not too thick and has larger aperture, the potential distribution in the electroplating process is more uniform, and the ion diffusion degree in the aperture is better, so the deep plating capability value of the electroplating solution is often larger; on the contrary, when the thickness-to-diameter ratio is relatively high, the hole wall shows a dog bone phenomenon, and the deep plating capability of the plating solution is poor.
And after the daughter boards and/or the core boards are ground, silk-screened and baked for multiple times, the thickness of the daughter boards and/or the core boards is controlled to be 0.1-0.2 mm.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (9)
1. An HDI board manufacturing process, characterized in that the manufacturing process comprises:
respectively cutting the copper-clad plate into copper plates required by single production size;
horizontally placing the copper plate on a workbench of equipment, defining the direction of the glass fiber in the same direction in the glass fiber cloth soaked in the copper plate as an X1 direction, defining the direction of a circuit arranged in parallel along the same direction on a photosensitive film as an X2 direction, and attaching the photosensitive film to the surface of the copper plate to enable the X1 direction and the X2 direction to form an acute angle in a crossed manner; exposing the copper plate with the photosensitive film, curing the light-transmitting part, developing to remove the uncured dry film, etching the plate with the cured protective film, and removing the film, wherein the inner layer of the circuit pattern is transferred to the plate to form a PCB (printed circuit board) daughter board;
respectively manufacturing an upper-layer daughter board, a lower-layer daughter board and a middle core board by adopting the method, and further confirming the expansion and contraction coefficient of the upper-layer daughter board and the expansion and contraction coefficient of the lower-layer daughter board by confirming the expansion and contraction coefficient of the copper plate, including the expansion and contraction coefficient of copper foil and the expansion and contraction coefficient of resin; after the expansion and contraction coefficient of the upper-layer daughter board and the expansion and contraction coefficient of the lower-layer daughter board are confirmed, the average value of the expansion and contraction coefficient of the upper-layer daughter board and the expansion and contraction coefficient of the lower-layer daughter board is taken, so that the expansion and contraction coefficient of the middle core board is estimated, and the difference value of the expansion and contraction coefficients among the upper-layer daughter board, the middle core board and the lower-layer daughter board is minimum;
and respectively drilling first positioning holes on the peripheries of the daughter boards and the middle core board, positioning and pressing the daughter boards through the first positioning holes to form a mother board, and simultaneously performing reaming treatment on the first positioning holes of the daughter boards on the upper layer to form second positioning holes on the mother board.
2. An HDI board manufacturing process according to claim 1, wherein the acute angle formed by the intersection of the X1 direction of the infiltrated glass cloth in the copper plate and the X2 direction of the wiring in the photosensitive film is 5 to 10 degrees.
3. An HDI board manufacturing process according to claim 1, wherein the X1 directions of the infiltrated glass fiber cloth in the copper plate are at the same angle as the X2 directions of the lines in the photosensitive film at the time of pattern transfer of the upper daughter board, the lower daughter board and the intermediate core board.
4. An HDI board manufacturing process according to claim 1, wherein before the middle core board and the upper and lower daughter boards are pressed, the surface of the daughter board is drilled through laser so as to form a buried hole after pressing.
5. An HDI board manufacturing process according to claim 4, characterized in that the buried holes are distributed in a square shape or a straight line with equal distance in the inner layer of the mother board so as to realize the designed density of the buried holes.
6. An HDI board manufacturing process according to claim 1, wherein the upper layer sub-board, the lower layer sub-board and the middle core board are subjected to press-fitting treatment through a prepreg.
7. An HDI board manufacturing process according to claim 6, characterized in that the mother board after pressing is blackened or browned.
8. An HDI board manufacturing process according to claim 1, wherein the upper layer sub-board, the lower layer sub-board and the middle core board are processed by silk-screening resin on two sides and baking and pressing.
9. An HDI board manufacturing process according to claim 8, characterized in that the thickness of the daughter board and/or the core board is controlled between 0.1 mm and 0.2mm after the daughter board and/or the core board is ground, silk-screened and baked for a plurality of times.
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| CN202110583712.0A CN113316324B (en) | 2021-05-27 | 2021-05-27 | HDI board manufacturing process |
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| CN202110583712.0A CN113316324B (en) | 2021-05-27 | 2021-05-27 | HDI board manufacturing process |
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| CN113316324B CN113316324B (en) | 2022-01-18 |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008171834A (en) * | 2007-01-05 | 2008-07-24 | Hitachi Ltd | Glass cloth wiring board |
| CN202262053U (en) * | 2012-01-16 | 2012-05-30 | 茂成电子科技（东莞）有限公司 | Printed circuit board with improved electronic signal transmission rate circuit structure |
| CN103384441A (en) * | 2012-11-27 | 2013-11-06 | 上海斐讯数据通信技术有限公司 | Printed circuit board |
| CN103813614A (en) * | 2012-11-07 | 2014-05-21 | 辉达公司 | PCB (Printed Circuit Board), core plate used for manufacturing PCB and method for manufacturing PCB |
| CN105704931A (en) * | 2014-11-28 | 2016-06-22 | 中兴通讯股份有限公司 | Wiring method of differential signal line and PCB |
| CN106793581A (en) * | 2016-11-18 | 2017-05-31 | 深圳崇达多层线路板有限公司 | The folded structure circuit board pressing localization methods of multilayer N+N |
| CN109348651A (en) * | 2018-10-16 | 2019-02-15 | 欣强电子（清远）有限公司 | A kind of ELIC pcb board part position alignment of inner layer plates processing method |
| CN110253676A (en) * | 2019-04-15 | 2019-09-20 | 深圳崇达多层线路板有限公司 | A method of improving big hole forming gong bore deformation |
| CN110708896A (en) * | 2019-10-18 | 2020-01-17 | 生益电子股份有限公司 | PIN hole machining method and HDI board manufacturing method |
| CN212573085U (en) * | 2020-07-09 | 2021-02-19 | 上海麦骏电子有限公司 | PCB structure for optimizing high-speed line signal integrity |
-
2021
- 2021-05-27 CN CN202110583712.0A patent/CN113316324B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008171834A (en) * | 2007-01-05 | 2008-07-24 | Hitachi Ltd | Glass cloth wiring board |
| CN202262053U (en) * | 2012-01-16 | 2012-05-30 | 茂成电子科技（东莞）有限公司 | Printed circuit board with improved electronic signal transmission rate circuit structure |
| CN103813614A (en) * | 2012-11-07 | 2014-05-21 | 辉达公司 | PCB (Printed Circuit Board), core plate used for manufacturing PCB and method for manufacturing PCB |
| CN103384441A (en) * | 2012-11-27 | 2013-11-06 | 上海斐讯数据通信技术有限公司 | Printed circuit board |
| CN105704931A (en) * | 2014-11-28 | 2016-06-22 | 中兴通讯股份有限公司 | Wiring method of differential signal line and PCB |
| CN106793581A (en) * | 2016-11-18 | 2017-05-31 | 深圳崇达多层线路板有限公司 | The folded structure circuit board pressing localization methods of multilayer N+N |
| CN109348651A (en) * | 2018-10-16 | 2019-02-15 | 欣强电子（清远）有限公司 | A kind of ELIC pcb board part position alignment of inner layer plates processing method |
| CN110253676A (en) * | 2019-04-15 | 2019-09-20 | 深圳崇达多层线路板有限公司 | A method of improving big hole forming gong bore deformation |
| CN110708896A (en) * | 2019-10-18 | 2020-01-17 | 生益电子股份有限公司 | PIN hole machining method and HDI board manufacturing method |
| CN212573085U (en) * | 2020-07-09 | 2021-02-19 | 上海麦骏电子有限公司 | PCB structure for optimizing high-speed line signal integrity |
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