CN202262053U - Printed circuit board with improved electronic signal transmission rate circuit structure - Google Patents
Printed circuit board with improved electronic signal transmission rate circuit structure Download PDFInfo
- Publication number
- CN202262053U CN202262053U CN2012200215620U CN201220021562U CN202262053U CN 202262053 U CN202262053 U CN 202262053U CN 2012200215620 U CN2012200215620 U CN 2012200215620U CN 201220021562 U CN201220021562 U CN 201220021562U CN 202262053 U CN202262053 U CN 202262053U
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- circuit structure
- transmission rate
- signal transmission
- electronic signal
- cloth
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Abstract
The utility model relates to a printed circuit board with an improved electronic signal transmission rate circuit structure, which comprises a base plate (1), a circuit structure (2) and a glass fiber fabric layer (3), wherein the circuit structure (2) and the glass fiber fabric layer (3) are arranged in the base plate (1). The printed circuit board is characterized in that wiring in the circuit structure (2) and the glass fiber fabric layer (3) form an included angle, namely warp direction wiring of the circuit structure (2) and warp direction fibers of the glass fiber fabric layer (3) form an included angle, and weft direction wiring of the circuit structure (2) and weft fibers of the glass fiber fabric layer (3) form an included angle, so that the whole circuit structure (2) is enabled to be inclined to be connected onto the glass fiber fabric layer (3) and forms an included angle (4) with a plate side of the base plate (1), and the improved electronic signal transmission rate circuit structure is obtained. Due to the fact that a circuit and the glass fiber fabric layer form a certain angle, resistance of electronic signals in transmission is changed, transmission rate of the electronic signals is improved, dielectric constant of the electronic signals is enabled to change, and the printed circuit board with the improved electronic signal transmission rate circuit structure has the advantages of being simple in structure and convenient to use.
Description
Technical field
The utility model relates to a kind of circuit board, especially relates to a kind of printed circuit board (PCB) with improvement electronic signal transmission rate circuit structure, can be widely used in industries such as electronics, communication, aviation, medical treatment, military affairs.Belong to the printed-board technology field.
Background technology
The history in existing more than 100 year of the development of printed circuit board (PCB); Be the supplier that electronic devices and components are electrically connected, its design mainly is a layout design, and the major advantage that adopts circuit board is the mistake that significantly reduces wiring and assembling; Automatization level and productive labor rate have been improved; And circuit is to make one of important tool in the printed circuit board (PCB) process, utilizes its design that substrate is made and has electrical characteristic and function, draws the film through light then.Specifically comprise: operations such as boring, interior layer pattern, outer graphics, anti-welding literal.Yet, because present employed printed circuit board (PCB) electronic signal transmission speed is low, thereby cause occurring the not high problem of dielectric constant (being permitivity), therefore, designing the high printed circuit board (PCB) of a kind of dielectric constant is the problem that the utility model need solve.
The utility model content
The purpose of the utility model is in order to solve the low problem of printed circuit board (PCB) electronic signal transmission speed of above-mentioned prior art, a kind of printed circuit board (PCB) with improvement electronic signal transmission rate circuit structure to be provided.
The purpose of the utility model can reach through following technical scheme:
A kind of printed circuit board (PCB) with improvement electronic signal transmission rate circuit structure; Comprise substrate and be arranged on circuit structure and the glass layer of cloth in the substrate; Its design feature is: the cabling in the said circuit structure becomes angle to arrange with the glass layer of cloth; The warp-runners that is circuit structure becomes the angle setting with the warp fiber of glass layer of cloth; The broadwise cabling of circuit structure becomes the angle setting with the weft fiber of glass layer of cloth, circuit structure is tilted to be connected on the substrate on the whole and forms angle with the edges of boards of substrate, has improvement electronic signal transmission rate circuit structure.
The purpose of the utility model can also reach through following technical scheme:
Further Technological improvement plan is: the angle of said circuit structure and the formation of substrate edges of boards can be between 0 °~90 °.
Further Technological improvement plan is: said glass layer of cloth can be made up of the silvalin interlacing, and said silvalin is distributed in the warp-wise and the broadwise of substrate, forms warp thread and weft yarn.
Further Technological improvement plan is: the warp thread of said glass layer of cloth is shape linearly, and it is wavy that the weft yarn of glass layer of cloth can be.
The utlity model has following outstanding beneficial effect:
The design of the printed circuit board (PCB) that the utility model is traditional relatively; Circuit and glass cloth form the design of certain angle; Changed the resistance of the signal of telecommunication in transmission, made the speed of electronic signal transmission obtain improvement, thereby its dielectric constant is changed; Reach specific electronic signal, and have advantage simple in structure, easy to use.
The main transmission rate of the copper clad laminate signal of telecommunication in medium that change changes its dielectric constant.The design of tradition relatively, this kind circuit and glass cloth form the design of angle, have changed signal of telecommunication resistance in transmission, the speed of improvement signal of telecommunication transmission, thus its dielectric constant is changed, reach specific electronic signal.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the A place structure for amplifying sketch map of Fig. 1.
Wherein, 1-substrate, 2-circuit structure, 3-glass layer of cloth, 4-angle, 5-warp thread, 6-weft yarn.
Embodiment
Specific embodiment 1:
Fig. 1 and Fig. 2 constitute the specific embodiment 1 of the utility model.
With reference to Fig. 1; Present embodiment comprises substrate 1 and the circuit structure 2 and glass layer of cloth 3 that are arranged in the substrate; 3 one-tenth angles of cabling in the said circuit structure 2 and glass layer of cloth are arranged; The warp-runners that is circuit structure 2 becomes the angle setting with the warp fiber of glass layer of cloth 3; The broadwise cabling of circuit structure 2 becomes the angle setting with the weft fiber of glass layer of cloth 3, circuit structure 2 is tilted to be connected on the substrate 3 on the whole and forms angle 4 with the edges of boards of substrate 3, has improvement electronic signal transmission rate circuit structure.
In the present embodiment; The circuit of circuit structure 2 is at 3 one-tenth 20 ° of angles of level and glass layer of cloth, at 3 one-tenth 20 ° of angles of vertical direction and glass layer of cloth; Perhaps the circuit of circuit structure 2 is at 3 one-tenth 70 ° of angles of level and glass layer of cloth, at 3 one-tenth 70 ° of angles of vertical direction and glass layer of cloth; Change the transport resistance of the copper clad laminate signal of telecommunication in medium, thereby improve its dielectric constant, make the speed of electronic signal transmission obtain improvement.
Said glass layer of cloth 3 is made up of the silvalin interlacing, and said silvalin is distributed in the warp-wise and the broadwise of substrate, forms warp thread 5 and weft yarn 6.The warp thread 5 of said glass layer of cloth 3 is shape linearly, and the weft yarn 6 of glass layer of cloth 3 is wavy.
Other specific embodiments:
The main feature of other specific embodiments of the utility model is: the angle that the edges of boards of said circuit structure 2 and substrate 3 form can be 1 °, 5 °, 10 °, 15 °, 20 °, 25 °, 30 °, 45 °, 60 °, 75 ° or, 90 °.All the other are with specific embodiment 1.
The above; It only is the preferred embodiment of the utility model; Be not that the technical scope of the utility model is done any restriction; So every technical spirit according to the utility model to any trickle modification, equivalent variations and modification that above embodiment did, all still belongs in the scope of the utility model technology Fang An.
Claims (4)
1. one kind has the printed circuit board (PCB) of improveing electronic signal transmission rate circuit structure; Comprise substrate (1) and be arranged on circuit structure (2) and the glass layer of cloth (3) in the substrate; It is characterized in that: the cabling in the said circuit structure (2) becomes angle to arrange with glass layer of cloth (3); The warp-runners that is circuit structure (2) becomes the angle setting with the warp fiber of glass layer of cloth (3); The broadwise cabling of circuit structure (2) becomes the angle setting with the weft fiber of glass layer of cloth (3), makes circuit structure (2) tilt to be connected that substrate (3) is gone up and form angle (4) with the edges of boards of substrate (3) on the whole, has improvement electronic signal transmission rate circuit structure.
2. a kind of printed circuit board (PCB) with improvement electronic signal transmission rate circuit structure according to claim 1, it is characterized in that: the angle that said circuit structure (2) and substrate (3) edges of boards form is between 0 °~90 °.
3. a kind of printed circuit board (PCB) according to claim 1 with improvement electronic signal transmission rate circuit structure; It is characterized in that: said glass layer of cloth (3) is made up of the silvalin interlacing; Said silvalin is distributed in the warp-wise and the broadwise of substrate, forms warp thread (5) and weft yarn (6).
4. a kind of printed circuit board (PCB) according to claim 1 with improvement electronic signal transmission rate circuit structure, it is characterized in that: the warp thread (5) of said glass layer of cloth (3) is shape linearly, and the weft yarn (6) of glass layer of cloth (3) is wavy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012200215620U CN202262053U (en) | 2012-01-16 | 2012-01-16 | Printed circuit board with improved electronic signal transmission rate circuit structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012200215620U CN202262053U (en) | 2012-01-16 | 2012-01-16 | Printed circuit board with improved electronic signal transmission rate circuit structure |
Publications (1)
Publication Number | Publication Date |
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CN202262053U true CN202262053U (en) | 2012-05-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2012200215620U Expired - Fee Related CN202262053U (en) | 2012-01-16 | 2012-01-16 | Printed circuit board with improved electronic signal transmission rate circuit structure |
Country Status (1)
Country | Link |
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CN (1) | CN202262053U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109195314A (en) * | 2018-09-27 | 2019-01-11 | 郑州云海信息技术有限公司 | A kind of pcb board and a kind of electronic equipment |
CN113316324A (en) * | 2021-05-27 | 2021-08-27 | 定颖电子(昆山)有限公司 | HDI board manufacturing process |
CN113873746A (en) * | 2021-09-18 | 2021-12-31 | 苏州浪潮智能科技有限公司 | Printed circuit board and design method thereof |
-
2012
- 2012-01-16 CN CN2012200215620U patent/CN202262053U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109195314A (en) * | 2018-09-27 | 2019-01-11 | 郑州云海信息技术有限公司 | A kind of pcb board and a kind of electronic equipment |
CN113316324A (en) * | 2021-05-27 | 2021-08-27 | 定颖电子(昆山)有限公司 | HDI board manufacturing process |
CN113873746A (en) * | 2021-09-18 | 2021-12-31 | 苏州浪潮智能科技有限公司 | Printed circuit board and design method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20130116 |