CN203192932U - Antenna device with smaller clearance areas - Google Patents
Antenna device with smaller clearance areas Download PDFInfo
- Publication number
- CN203192932U CN203192932U CN 201320129094 CN201320129094U CN203192932U CN 203192932 U CN203192932 U CN 203192932U CN 201320129094 CN201320129094 CN 201320129094 CN 201320129094 U CN201320129094 U CN 201320129094U CN 203192932 U CN203192932 U CN 203192932U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- headroom district
- insulated substrate
- metal ground
- dwindles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
An antenna device with smaller clearance areas comprises a chip antenna module and a circuit board. The chip antenna module includes a dielectric body of which the upper surface is respectively provided with a signal radiator and a grounding radiator. The chip antenna module is arranged on the circuit board. The circuit board includes an insulating substrate and at least one metal grounding layer, wherein the metal grounding layers are located on at least one of upper and lower surfaces of the insulating substrate and are provided with clearance areas, and the chip antenna module is located in the clearance areas. By directly arranging the signal radiator and the grounding radiator of the chip antenna module on the upper surface of the dielectric body, the height between each radiator and the circuit board can be improved, and interference of other electronic components or metal components on the circuit board to the antenna can be reduced. The size of the clearance areas can be effectively reduced, which is conducive to miniaturization of the circuit board or an electronic product.
Description
Technical field
The utility model refers to a kind of antenna component device that dwindles the headroom district especially relevant for a kind of antenna component.
Background technology
General antenna component, see also shown in Figure 1, usually superimposed to form an antenna body 1 by several layers of ceramic substrate, its technology mode more commonly adopts LTCC (Low Temperature Co-fired Ceramic at present, LTCC) technology, this antenna body 1 inside is provided with a signal amplitude beam 11 and a ground connection radiant body 12, this antenna body 1 outer surface is provided with one first termination electrode 13 and one second termination electrode 14 again, this first termination electrode 13 and second termination electrode 14 are electrically connected with this signal amplitude beam 11 and ground connection radiant body 12 respectively, whereby, please cooperate again consult shown in Figure 2, this antenna body 1 can be arranged in the headroom district 211 of circuit external plate 2 its metal ground planes 21, this first termination electrode 13 and second termination electrode 14 can be electrically connected with these circuit board 2 its signal feed-in lines 22 and metal ground plane 21 by welding manner respectively more simultaneously, and then make this antenna component can reach the purpose of receiving and transmitting signal.
Please consult Fig. 1 again, shown in Figure 2, this existing chip antenna, though can reach the purpose of receiving and transmitting signal, but all be located at the inside of this antenna body 1 because of signal amplitude beam 11 and ground connection radiant body 12, and make each radiant body lower apart from the height of circuit board 2, so being subjected on the circuit board 2 other electronic components or metal device easily for fear of this antenna component disturbs and causes radiation characteristic to descend, existing antenna component is when practical application, must or keep a relatively large headroom district 211 in these circuit board 2 increasings, but the space that other electronic components can be set on this circuit board 2 thus just can be reduced, then be not inconsistent the compact trend of electronic product if directly increase the size of circuit board 2, and then cause the puzzlement in the product design; In addition, has the ceramic substrate of this signal amplitude beam 11 and ground connection radiant body 12 in the process of stacking, also cause product percent of pass to reduce and the manufacturing cost increase because of the position skew easily, hereat, how to develop and a kind ofly can effectively dwindle headroom district 211, also can simplify simultaneously process complexity to promote product percent of pass and to reduce the antenna assembly of manufacturing cost, be the technological difficulties that this case inventor institute desire solves.
The utility model content
Because existing chip antenna, because of each radiant body lower apart from the height of circuit board, cause the headroom district to be difficult to further dwindle, therefore the purpose of this utility model is to provide a kind of antenna assembly that dwindles the headroom district, directly be arranged at this dielectric body upper surface by its signal amplitude beam of this chip antenna unit and ground connection radiant body, just can improve each radiant body apart from the height between this circuit board, advance to reduce other electronic components on the circuit board or metal device to the interference of antenna, and make the utility model can effectively dwindle the size in this headroom district, just can be beneficial to the miniaturization of circuit board or electronic product, and then make the utility model can reach the effect that promotes product practicality and applicability.
For reaching the above object, the utility model provides a kind of antenna assembly that dwindles the headroom district, it comprises: a chip antenna unit, this chip antenna unit includes a dielectric body, this dielectric body upper surface is respectively equipped with a signal amplitude beam and a ground connection radiant body, this dielectric body side is respectively equipped with one first termination electrode and one second termination electrode again, and this first termination electrode and second termination electrode are electrically connected with this signal amplitude beam and ground connection radiant body respectively; One circuit board, this chip antenna unit is arranged on this circuit board, this circuit board includes an insulated substrate and at least one metal ground plane, this metal ground plane is located at least one surface in the upper surface of this insulated substrate or the lower surface, this metal ground plane is provided with a headroom district, and this chip antenna unit is positioned at this headroom district.
Wherein, this dielectric body is ceramic material, and this insulated substrate is glass fiber material.
Wherein, the quantity of this metal ground plane is two, and these two metal ground planes are located at upper surface and the lower surface of this insulated substrate respectively.
Wherein, the headroom district of these two metal ground planes is corresponding mutually up and down.
Wherein, this signal amplitude beam is strip, and this ground connection radiant body is the word of falling U shape.
Wherein, this ground connection radiant body has notch portion, and this notch portion is positioned at around this signal amplitude beam.
Wherein, this insulated substrate upper surface still is provided with signal feed-in line, one end of this signal feed-in line and the metal ground plane of this insulated substrate upper surface are electrically connected with this first termination electrode and this second termination electrode by welding manner respectively, and the other end of this signal feed-in line is provided with load point again.
Wherein, more can further include a connector, this connector is welded on the metal ground plane of this insulated substrate lower surface, and this connector is corresponding mutually up and down with the position of this load point again, and this connector is electrically connected with this load point.
The beneficial effects of the utility model are, directly be arranged at this dielectric body upper surface by its signal amplitude beam of this chip antenna unit and ground connection radiant body, just can improve each radiant body apart from the height between this circuit board, advance to reduce other electronic components on the circuit board or metal device to the interference of antenna, and make the utility model can effectively dwindle the size in this headroom district, just can be beneficial to the miniaturization of circuit board or electronic product, and then make the utility model can reach the effect that promotes product practicality and applicability.
Description of drawings
Fig. 1 is the combination schematic diagram of existing antenna component.
The schematic diagram that Fig. 2 is combined with circuit board for existing antenna component.
Fig. 3 is decomposing schematic representation of the present utility model.
Fig. 3-A figure is the partial schematic diagram of its chip antenna unit of the utility model.
Fig. 4 is combination schematic diagram of the present utility model.
[main element symbol description]
(prior art)
1 antenna body, 11 signal amplitude beams
12 ground connection radiant bodies, 13 first termination electrodes
14 second termination electrodes, 2 circuit boards
21 metal ground planes, 211 headroom districts
22 signal feed-in lines
(the utility model)
3 chip antenna units, 31 dielectric body
32 signal amplitude beams, 33 ground connection radiant bodies
331 notch portion, 34 first termination electrodes
35 second termination electrodes, 4 circuit boards
41 insulated substrates, 42 ground metal layer
421 headroom districts, 43 signal feed-in lines
431 load points, 5 connectors.
Embodiment
See also Fig. 3, shown in Figure 4, the utility model provides a kind of antenna assembly that dwindles the headroom district, and it comprises:
One chip antenna unit 3, please cooperate and consult shown in Fig. 3-A figure, this chip antenna unit 3 includes a dielectric body 31, the material of this dielectric body 31 can be pottery, the making molding mode of this dielectric body 31 belongs to prior art and non-this case technical characterictic again, will not describe in detail at this, these dielectric body 31 upper surfaces are respectively equipped with a signal amplitude beam 32 and a ground connection radiant body 33, in the present embodiment, this signal amplitude beam 32 can be strip, this ground connection radiant body 33 can be the word of falling U shape, also namely this ground connection radiant body 33 has a notch portion 331, and this notch portion 331 is positioned at around this signal amplitude beam 32, and these dielectric body 31 sides are respectively equipped with one first termination electrode 34 and one second termination electrode 35 again, and this first termination electrode 34 and second termination electrode 35 are electrically connected with this signal amplitude beam 32 and ground connection radiant body 33 respectively.
One circuit board 4, this chip antenna unit 3 is arranged on this circuit board 4, this circuit board 4 includes an insulated substrate 41 and at least one metal ground plane 42, this metal ground plane 42 is located at least one surface in the upper surface of this insulated substrate 41 or the lower surface, in the present embodiment, the quantity of this metal ground plane 42 is two, and these two metal ground planes 42 are located at upper surface and the lower surface of this insulated substrate 41 respectively, these two metal ground planes 42 are respectively equipped with a headroom district 421 again, and the headroom district of these two metal ground planes 42 is corresponding about in the of 421, this chip antenna unit 3 is positioned at this headroom district 421, in the present embodiment, this chip antenna unit 3 more specifically is positioned at the headroom district 421 of these insulated substrate 41 upper surfaces, the material of this insulated substrate 41 can be glass fibre in addition, in addition, these insulated substrate 41 upper surfaces still can further be provided with a signal feed-in line 43, whereby, please cooperate again consult shown in Figure 4, the metal ground plane 42 of these signal feed-in line 43 1 ends and insulated substrate 41 upper surfaces can be electrically connected with these chip antenna unit 3 its first termination electrodes 34 and second termination electrode 35 by welding manner respectively, and these signal feed-in line 43 other ends can be provided with a load point 431 again.
In addition, please close and consult Fig. 3, shown in Figure 4, the utility model more can further include a connector 5, this connector 5 sets firmly mutually with this circuit board 4, in the present embodiment, this connector 5 more specifically is welded on the metal ground plane 42 of these insulated substrate 41 lower surfaces, this connector 5 is corresponding up and down with the position of these signal feed-in line 43 its load points 431 again, and this connector 5 is electrically connected with this load point 431, this can utilize at this circuit board 4 through hole (through hole is set, or title via) reaches, possess in the technical field under its related production or principle are all and know that usually the knowledgeable knows, repeat no more in this, whereby, outside electronic signal can be fed into this chip antenna unit 3 by this connector 5, and then makes this chip antenna unit 3 can reach the purpose of receiving and transmitting signal.
See also Fig. 3-A figure, shown in Figure 4, directly be arranged at this dielectric body 31 upper surfaces by these chip antenna unit 3 its signal amplitude beams 32 with ground connection radiant body 33, just can improve each radiant body apart from the height between this circuit board 4, so can reduce other electronic components on the circuit board 4 or metal device to the interference of antenna, and the size that makes the utility model under the prerequisite of the aerial radiation characteristic that do not detract (i.e. gain), effectively dwindle this headroom district 421, and can help the miniaturization of circuit board 4 or electronic product, and significantly promote the elasticity of product design; Simultaneously, be not to be arranged at this dielectric body 31 inside by this signal amplitude beam 32 with ground connection radiant body 33 again, and can avoid existing ceramic substrate in the process of stacking, to cause signal amplitude beam 11 and 12 skews of ground connection radiant body, cause the disappearance that product percent of pass reduces and manufacturing cost improves, and then make the utility model can have lifting product percent of pass and the effect that reduces manufacturing cost concurrently.
Claims (8)
1. antenna assembly that can dwindle the headroom district is characterized in that it comprises:
A chip antenna unit, this chip antenna unit includes a dielectric body, this dielectric body upper surface is respectively equipped with a signal amplitude beam and a ground connection radiant body, this dielectric body side is respectively equipped with first termination electrode and second termination electrode again, and this first termination electrode and this second termination electrode are electrically connected with this signal amplitude beam and this ground connection radiant body respectively;
A circuit board, this chip antenna unit is arranged on this circuit board, this circuit board includes an insulated substrate and at least one metal ground plane, this metal ground plane is located at least one surface of the upper surface of this insulated substrate or lower surface, this metal ground plane is provided with a headroom district, and this chip antenna unit is positioned at this headroom district.
2. the antenna assembly that dwindles the headroom district as claimed in claim 1 is characterized in that, the material of this dielectric body is ceramic material, and the material of this insulated substrate is glass fiber material.
3. the antenna assembly that dwindles the headroom district as claimed in claim 1 is characterized in that, the quantity of this metal ground plane is two, and these two metal ground planes are located at respectively on the upper surface and lower surface of this insulated substrate.
4. the antenna assembly that dwindles the headroom district as claimed in claim 3 is characterized in that, the headroom district of these two metal ground planes is corresponding mutually up and down.
5. the antenna assembly that dwindles the headroom district as claimed in claim 1 is characterized in that, this signal amplitude beam is strip, and this ground connection radiant body is the word of falling U shape.
6. the antenna assembly that dwindles the headroom district as claimed in claim 5 is characterized in that, this ground connection radiant body has notch portion, and this notch portion is positioned at around this signal amplitude beam.
7. the antenna assembly that dwindles the headroom district as claimed in claim 3, it is characterized in that, this insulated substrate upper surface is provided with signal feed-in line, one end of this signal feed-in line and the metal ground plane of this insulated substrate upper surface are electrically connected with this chip first termination electrode and this second termination electrode by welding manner respectively, and the other end of this signal feed-in line is provided with load point again.
8. the antenna assembly that dwindles the headroom district as claimed in claim 7, it is characterized in that, further include a connector, this connector is welded on the metal ground plane of this insulated substrate lower surface, this connector is corresponding mutually up and down with the position of this load point again, and this connector is electrically connected with this load point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320129094 CN203192932U (en) | 2013-03-20 | 2013-03-20 | Antenna device with smaller clearance areas |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320129094 CN203192932U (en) | 2013-03-20 | 2013-03-20 | Antenna device with smaller clearance areas |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203192932U true CN203192932U (en) | 2013-09-11 |
Family
ID=49109762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320129094 Expired - Fee Related CN203192932U (en) | 2013-03-20 | 2013-03-20 | Antenna device with smaller clearance areas |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203192932U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107038473A (en) * | 2016-01-18 | 2017-08-11 | 仁宝电脑工业股份有限公司 | For the slot antenna structure in electronic tag |
| CN110581353A (en) * | 2018-06-07 | 2019-12-17 | 株式会社东芝 | chip antenna |
| CN111276810A (en) * | 2020-02-18 | 2020-06-12 | 环鸿电子（昆山）有限公司 | Chip antenna |
-
2013
- 2013-03-20 CN CN 201320129094 patent/CN203192932U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107038473A (en) * | 2016-01-18 | 2017-08-11 | 仁宝电脑工业股份有限公司 | For the slot antenna structure in electronic tag |
| CN110581353A (en) * | 2018-06-07 | 2019-12-17 | 株式会社东芝 | chip antenna |
| CN111276810A (en) * | 2020-02-18 | 2020-06-12 | 环鸿电子（昆山）有限公司 | Chip antenna |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130911 |