CN205015517U - A active device for optical communication - Google Patents
A active device for optical communication Download PDFInfo
- Publication number
- CN205015517U CN205015517U CN201520676072.8U CN201520676072U CN205015517U CN 205015517 U CN205015517 U CN 205015517U CN 201520676072 U CN201520676072 U CN 201520676072U CN 205015517 U CN205015517 U CN 205015517U
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- optical communication
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- pcb board
- active device
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Abstract
The utility model discloses an active device for optical communication, it includes tube socket, the fixed carrier PCB board that sets up on the tube socket, integrated metal pin and the power ground pin of placing the various light communication chip on carrier PCB board and running through the tube socket setting, metal pin and power ground pin pass through on the carrier PCB board metal coating with the electrically conductive intercommunication of corresponding pin on the light communication chip, metal pin and/or power ground pin all through insulating filler through fixed on the tube socket. The beneficial effects of the utility model are that preparation simple process is high -efficient, with low costs, shock -resistant and convenient to use is reliable.
Description
Technical field
The utility model relate to a kind of active device for optical communication, belongs to optical communication field.
Background technology
In existing product, in transmitting active device, chip of laser sintering is on the facade launching in TO base a vertical important actor, back light detector chip is then mounted on the upper surface of base, these two faces are vertical, cause the complex process of attachment, sintering, bonding, need use special and the equipment of costliness.
In reception active device, trans-impedance amplifier chip and TIA chip attachment are at reception TO base upper surface, detector chip is mounted on carrier, carrier is mounted on base upper surface, re-use multiple chip capacity and filtering is carried out to detector, power supply, cause attachment step many, bonding gold wire is many, the conducting resinl of trans-impedance amplifier chip bottom easily overflows and causes fraction defective to raise with pin short circuit, and chip capacity costliness causes cost of products to increase.
Utility model content
Technical problem to be solved in the utility model there is provided the active device for optical communication that a kind of manufacture craft is simple efficiently, cost is low, shock-resistant, easy to use and reliable.
The utility model adopts following technical scheme:
For an active device for optical communication, it comprises base, the carrier pcb board be fixedly installed on base, integrated be placed on the various optical communication chip on carrier pcb board and run through base arrange metal pin and power supply ground pin; Described metal pin and power supply ground pin are by the metallic coating on carrier pcb board and the respective pins conductive communication on described optical communication chip.According to circuit needs, described carrier pcb board is integrated with the peripheral component of optical communication chip, it need not mount and be integrated on carrier pcb board, eliminates a lot of attachment and step and bonding gold wire, time saving and energy saving and cost-saving.
Pin on described optical communication chip is connected by conducting resinl, scolding tin or conductive filament with the metallic coating on carrier pcb board.
Further, described metal pin and/or power supply ground pin are all run through by insulation filler and are fixed on base, the shielding ground of the external corresponding optical module of described base.
Further, described carrier pcb board is the metallized ceramics base PCB plate of single-side/double-side, conventional pcb board or Metal Substrate pcb board.
Further, described optical communication chip only comprises chip of laser, and now the utility model belongs to the active device for utilizing emitted light signal.
Further, described optical communication chip only comprises detector chip, and now the utility model belongs to the active device for receiving optical signals.
Further, described optical communication chip comprises chip of laser and detector chip, and now the utility model belongs to the active device having transmitting and receiving light signal concurrently.
Further, when described optical communication chip comprises detector chip, described optical communication chip also comprises trans-impedance amplifier chip; Described trans-impedance amplifier chip, detector chip and pin are connected to each other as required, and the earth terminal of described trans-impedance amplifier chip connects described power supply ground pin.
Further, when the utility model belongs to the active device for receiving optical signals, described optical communication chip also comprises electric capacity, and described electric capacity is connected across the described power positive cathode of trans-impedance amplifier chip and the positive and negative end of detector chip respectively, carries out filtering.
Further, described carrier pcb board comprises the horizontal pcb board be horizontally set on base and/or the vertical pcb board be vertically arranged on base, can place carrier pcb board by different angles independent assortment as required, conveniently install combination, automated production.
Further, described carrier pcb board is by bonding or be welded on base, and instead of and original described optical communication chip is directly directly pasted the problem easily caused on base by conducting resinl, namely conducting resinl excessive causing causes bad with pin short circuit.
Further, described insulation filler is insulating glass sealant, glass insulator or other insulating material.
Further, when described optical communication chip comprises detector chip and trans-impedance amplifier chip, the both positive and negative polarity of described detector chip is connected to the input positive and negative terminal of trans-impedance amplifier chip; Or the positive pole of detector chip is connected to the input anode of trans-impedance amplifier chip, detector chip negative pole is connected on a metal pin.
Further, when described optical communication chip comprises detector chip, described optical communication chip also comprises trans-impedance amplifier chip, power end, output terminal, the input end of described trans-impedance amplifier chip, in the respective terminal of connection metal pin and detector chip as required, concrete corresponding pin is the conventional annexation of this area.
The beneficial effects of the utility model are as follows:
(1) the utility model have employed carrier pcb board, thus will be placed on carrier pcb board in optical communication chipset, reduce volume, connect pin and optical communication chip by carrier pcb board simultaneously, decrease bonding number of times, thus improve production efficiency, add the reliability of product, reduce cost.
(2) the utility model first will be placed on carrier pcb board in optical communication chipset, be arranged on base by horizontal or vertical for carrier pcb board again, solve the original TO base paster that causes owing to there being rugged chip carrier of surface and bonding efficiency low, and be unfavorable for the problem of automated production, because carrier pcb board is regular planar, be easy to clamping, also paster and bonding is thereon easy to, this kind of design, make its structure more simple, produce convenient, reduce the requirement to production equipment, improve production efficiency, be applicable to fully-automatic production.
(3)when the utility model belongs to the active device for receiving optical signals, the earth terminal of the active device of receiving optical signals is drawn by independent power supply ground pin, power supply ground pin and base are isolated by insulation filler, non-conductive each other, thus make base can with the shielding of external optical module be communicated with, electromagnetic screen protection is carried out to the utility model, improves the performance of product; Avoid original earth terminal to be communicated with base and to conduct electricity, easily introduce the problem of electromagnetic interference (EMI).
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1 of the present utility model.
Fig. 2 is the structural representation of embodiment 2 of the present utility model.
Fig. 3 is the structural representation of embodiment 4 of the present utility model.
Fig. 4 is the structural representation of embodiment 5 of the present utility model.
Wherein, 1 base, 2 metal pins, 3 insulation filler, 4 carrier pcb boards, the horizontal pcb board of 4-1, the vertical pcb board of 4-2,5 optical communication chips, 5-1 chip of laser, 5-2 detector chip, 5-3 trans-impedance amplifier chip, 5-4 electric capacity, 6 conductive filaments, 7 power supply ground pins.
Embodiment
Below in conjunction with accompanying drawing 1 ~ 4, the utility model is described in further detail.
Embodiment 1, with reference to Fig. 1: it comprises base 1, run through metal pin 2 that base 1 arranges and power supply ground pin 7, be arranged on carrier pcb board 4 on base 1 and the integrated optical communication chip 5 be placed on carrier pcb board 4; Optical communication chip 5 described in the present embodiment 1 comprises chip of laser 5-1 and detector chip 5-2, and now the utility model belongs to the active device having transmitting and receiving light signal concurrently.Described optical communication chip 5 also comprises trans-impedance amplifier chip 5-3, due to the relation of angle in Fig. 1, cannot mark, for amplifying the light signal received and processing; Described trans-impedance amplifier chip 5-3, detector chip 5-2 and pin two are connected to each other as required, and the earth terminal of described trans-impedance amplifier chip 5-3 connects described power supply ground pin 7.Power end, output terminal, the input end of described trans-impedance amplifier chip 5-3, in the respective terminal of connection metal pin two and detector chip 5-2 as required, concrete corresponding pin is the conventional annexation of this area.
The both positive and negative polarity of described detector chip 5-2 is connected to the input positive and negative terminal of trans-impedance amplifier chip 5-3; Or the positive pole of detector chip 5-2 is connected to the input anode of trans-impedance amplifier chip 5-3, detector chip 5-2 negative pole is connected on a metal pin 2.
Further, described optical communication chip 5 also comprises electric capacity 5-4, and described electric capacity 5-4 is connected across the described power positive cathode of trans-impedance amplifier chip 5-3 and the positive and negative end of detector chip 5-2 respectively, carries out filtering.
Pin on described optical communication chip 5 metallic coating passed through on carrier pcb board 4 conducts electricity with metal pin 2 and power supply ground pin 7 and is connected, and the pin on described optical communication chip 5 is connected by conducting resinl, scolding tin or conductive filament 6 with the metallic coating on carrier pcb board 4.
In the present embodiment 1, because the angle of sending and receiving light signal needs, described carrier pcb board 4 comprises horizontal pcb board 4-1 and vertical pcb board 4-2, described chip of laser 5-1 is fitted on vertical pcb board 4-2, described vertical pcb board 4-2 is vertically fixed on base 1, described detector chip 5-2 is fitted on horizontal pcb board 4-1, and described horizontal pcb board 4-1 is horizontally fixed on base 1; Described horizontal pcb board 4-1 and the metallic coating on vertical pcb board 4-2 conduct electricity with metal pin 2 and are connected.
Further, described metal pin 2 and power supply ground pin 7 are all run through by insulation filler 3 and are fixed on base 1, the shielding ground of the external corresponding optical module of described base 1.
Further, described insulation filler 3 is common glue, glass cement, glass insulator or other insulating material.
Further, described carrier pcb board 4 is the metallized ceramics base PCB plate of single-side/double-side, conventional pcb board or Metal Substrate pcb board.
Further, described carrier pcb board 4 is by bonding or be welded on base 1.
Embodiment 2, with reference to Fig. 2: it comprises base 1, run through metal pin 2 that base 1 arranges and power supply ground pin 7, be arranged on carrier pcb board 4 on base 1 and the integrated optical communication chip 5 be placed on carrier pcb board 4; Described in the present embodiment 2, optical communication chip 5 comprises detector chip 5-2; Now the utility model belongs to the active device for receiving optical signals.Further, this optical communication chip 5 can also comprise trans-impedance amplifier chip 5-3, can also comprise electric capacity 5-4, and its connected mode is identical with embodiment 1.
Pin on described optical communication chip 5 metallic coating passed through on carrier pcb board 4 conducts electricity with metal pin 2 and power supply ground pin 7 and is connected, and the pin on described optical communication chip 5 is connected by conducting resinl, scolding tin or conductive filament 6 with the metallic coating on carrier pcb board 4.
Because described carrier pcb board 4 is horizontal pcb board 4-1 and/or vertical pcb board 4-2.In the present embodiment 2, described carrier pcb board 4 is horizontal pcb board 4-1, and described detector chip 5-2 is fitted on horizontal pcb board 4-1, and described horizontal pcb board 4-1 is horizontally fixed on base 1; Metallic coating on described horizontal pcb board 4-1 conducts electricity with metal pin 2 and is connected.
Further, described metal pin 2 and power supply ground pin 7 are all run through by insulation filler 3 and are fixed on base 1, the shielding ground of the external corresponding optical module of described base 1.
Further, described insulation filler 3 is common glue, glass cement, glass insulator or other insulating material.
Further, described carrier pcb board 4 is the metallized ceramics base PCB plate of single-side/double-side, conventional pcb board or Metal Substrate pcb board.
Further, described carrier pcb board 4 is by bonding or be welded on base 1.
Embodiment 3, from embodiment 1 and the different of embodiment 2, it is that described optical communication chip 5 only comprises chip of laser 5-1, now the present embodiment 3 belongs to the active device for utilizing emitted light signal, and now the installation site of described chip of laser 5-1 is identical with mounting means with the installation site of this chip of laser 5-1 in embodiment 1 with mounting means.
Embodiment 4, as shown in Figure 3: metal pin 2 described in the present embodiment 4 and power supply ground pin 7 become semi-cylindrical, cause described metal pin 2 need not be connected with relevant position by conductive filament 6 again with power supply ground pin 7 thus, but directly by the semi circular surface of semi-cylindrical pin by be attached to described carrier pcb board 4 conductive coating on realize electrical connection, technique is more simple and convenient, connects use also more reliable.Other technical characteristic is identical with embodiment 1.
Embodiment 5, as shown in Figure 4: metal pin 2 described in the present embodiment 5 and power supply ground pin 7 become semi-cylindrical, cause described metal pin 2 need not be connected with relevant position by conductive filament 6 again with power supply ground pin 7 thus, but directly by the semi circular surface of semi-cylindrical pin by be attached to described carrier pcb board 4 conductive coating on realize electrical connection, technique is more simple and convenient, connects use also more reliable.Other technical characteristic is identical with embodiment 2.
The positive and negative terminal of the positive pole of the power supply of described trans-impedance amplifier chip 5-3 and its output signal is connected respectively to corresponding metal pin 2; The current monitoring end of described trans-impedance amplifier chip 5-3 or the negative pole of described detector chip 5-2 all can connect pin two; The negative pole of the power supply of described trans-impedance amplifier chip 5-3 connects power supply ground pin 7.
Such as, when the current monitoring end of described trans-impedance amplifier chip 5-3 is connected to pin two, the both positive and negative polarity of described detector chip 5-2 is connected respectively to the input positive and negative terminal of described trans-impedance amplifier chip 5-3; When the current monitoring end of described trans-impedance amplifier chip 5-3 is unsettled, the positive pole of described detector chip 5-2 is connected to the input anode of described trans-impedance amplifier chip 5-3, and the negative pole of described detector chip 5-2 is connected to pin two.
The above embodiment is only preferred embodiment of the present utility model, and is not the exhaustive of the feasible enforcement of the utility model.For persons skilled in the art, to any apparent change done by it under the prerequisite not deviating from the utility model principle and spirit, all should be contemplated as falling with within claims of the present utility model.
Claims (10)
1. for an active device for optical communication, it is characterized in that: it comprises base (1), the carrier pcb board (4) be fixedly installed on base (1), the integrated metal pin (2) and power supply ground pin (7) being placed on the various optical communication chip (5) on carrier pcb board (4) and running through that base (1) arranges; Described metal pin (2) and power supply ground pin (7) are by the respective pins conductive communication on the metallic coating on carrier pcb board (4) and described optical communication chip (5).
2. a kind of active device for optical communication according to claim 1, is characterized in that: described metal pin (2) and/or power supply ground pin (7) are all run through by insulation filler (3) and be fixed on base (1).
3. a kind of active device for optical communication according to claim 1, is characterized in that: described carrier pcb board (4) is the metallized ceramics base PCB plate of single-side/double-side, conventional pcb board or Metal Substrate pcb board.
4. a kind of active device for optical communication according to claim 1, is characterized in that: described optical communication chip (5) comprises chip of laser (5-1).
5. a kind of active device for optical communication according to claim 1 or 4, is characterized in that: described optical communication chip (5) comprises detector chip (5-2).
6. a kind of active device for optical communication according to claim 5, is characterized in that: described optical communication chip (5) also comprises trans-impedance amplifier chip (5-3); Described trans-impedance amplifier chip (5-3), connect as required between detector chip (5-2) and pin (2), the earth terminal of described trans-impedance amplifier chip (5-3) connects described power supply ground pin (7).
7. a kind of active device for optical communication according to claim 6, it is characterized in that: described optical communication chip (5) also comprises electric capacity (5-4), described electric capacity (5-4) is connected across the power positive cathode of described trans-impedance amplifier chip (5-3) and the positive and negative end of detector chip (5-2) respectively.
8. a kind of active device for optical communication according to claim 1, is characterized in that: described carrier pcb board (4) comprises the horizontal pcb board (4-1) be horizontally set on base (1) and/or the vertical pcb board (4-2) be vertically arranged on base (1).
9. a kind of active device for optical communication according to claim 1 or 8, is characterized in that: described carrier pcb board (4) is by bonding or be welded on base (1).
10. a kind of active device for optical communication according to claim 2, is characterized in that: described insulation filler (3) is insulating glass sealant, glass insulator or other insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520676072.8U CN205015517U (en) | 2015-09-02 | 2015-09-02 | A active device for optical communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520676072.8U CN205015517U (en) | 2015-09-02 | 2015-09-02 | A active device for optical communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205015517U true CN205015517U (en) | 2016-02-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520676072.8U Active CN205015517U (en) | 2015-09-02 | 2015-09-02 | A active device for optical communication |
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| Country | Link |
|---|---|
| CN (1) | CN205015517U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108333693A (en) * | 2018-02-11 | 2018-07-27 | 青岛海信宽带多媒体技术有限公司 | Optical secondary module and optical module |
| CN108387979A (en) * | 2018-02-11 | 2018-08-10 | 青岛海信宽带多媒体技术有限公司 | optical secondary module |
| CN108873190A (en) * | 2018-06-25 | 2018-11-23 | 重庆霓扬科技有限责任公司 | A kind of integrated opto-electronic receiver module and its production technology containing low-noise amplifier |
| CN111865433A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver and manufacturing method thereof |
-
2015
- 2015-09-02 CN CN201520676072.8U patent/CN205015517U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108333693A (en) * | 2018-02-11 | 2018-07-27 | 青岛海信宽带多媒体技术有限公司 | Optical secondary module and optical module |
| CN108387979A (en) * | 2018-02-11 | 2018-08-10 | 青岛海信宽带多媒体技术有限公司 | optical secondary module |
| CN108873190A (en) * | 2018-06-25 | 2018-11-23 | 重庆霓扬科技有限责任公司 | A kind of integrated opto-electronic receiver module and its production technology containing low-noise amplifier |
| CN111865433A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver and manufacturing method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |