CN220252230U - Optical module with high-frequency radio frequency signals - Google Patents
Optical module with high-frequency radio frequency signals Download PDFInfo
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- CN220252230U CN220252230U CN202321637094.4U CN202321637094U CN220252230U CN 220252230 U CN220252230 U CN 220252230U CN 202321637094 U CN202321637094 U CN 202321637094U CN 220252230 U CN220252230 U CN 220252230U
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- radio frequency
- signal
- adapter plate
- pins
- optical module
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- 230000003287 optical effect Effects 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 27
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000010931 gold Substances 0.000 claims abstract description 11
- 229910052737 gold Inorganic materials 0.000 claims abstract description 11
- 230000007704 transition Effects 0.000 claims description 28
- 239000003292 glue Substances 0.000 claims description 7
- 230000008054 signal transmission Effects 0.000 abstract description 11
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Abstract
The utility model provides an optical module with high-frequency radio frequency signals, which comprises a base, a COC substrate, radio frequency pins and a signal adapter plate, wherein the COC substrate, the radio frequency pins and the signal adapter plate are arranged on the base, a chip is arranged on the COC substrate, the chip on the COC substrate is electrically connected with one surface of the signal adapter plate through a plurality of gold wires, and the signal adapter plate is in surface contact with the radio frequency pins and is electrically conducted. According to the utility model, the electrical connection between the COC substrate and the radio frequency pins is realized by adding the signal adapter plate, so that the impedance of a high-frequency signal is reduced, the radio frequency signal is greatly improved, and the low impedance, high frequency and high reliability of optical device test signal transmission are ensured.
Description
Technical Field
The utility model belongs to the technical field of optical communication, and particularly relates to an optical module with high-frequency radio frequency signals.
Background
In the prior art, the rf signal transmission for the optical module generally directly conducts the output/input signal of the chip 5 to the rf pin 2 through a gold wire 3, as shown in fig. 1 and 2. However, the existing connection mode that only one gold wire is conducted to realize the transmission of the radio frequency signal has large impedance to the transmission of the high frequency signal, and influences the transmission quality of the radio frequency signal.
Disclosure of Invention
The utility model aims to provide an optical module with high-frequency radio-frequency signals, which can at least solve part of defects in the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an optical module with high frequency radio frequency signal, includes base and sets up COC base plate, radio frequency pin and the signal keysets on the base, be equipped with the chip on the COC base plate, the chip on the COC base plate through many gold wires with a surface electricity of signal keysets is connected, the signal keysets with radio frequency pin face contact and electric conduction.
Further, through holes are formed in the base corresponding to the radio frequency pins, and the radio frequency pins penetrate through the base through the through holes.
Further, the signal transfer board is located between the COC substrate and the radio frequency pins, a signal transition block is arranged on the signal transfer board corresponding to the radio frequency pins, the top surface of the signal transition block is electrically connected with the COC substrate through a plurality of gold wires, and one side surface, close to the radio frequency pins, of the signal transfer board is attached to the side surface of the radio frequency pins and is electrically conducted.
Further, the signal transition block is of an integrally formed inverted U-shaped structure, the signal transition block is buckled on the top of the signal adapter plate, and the bottom end face of the signal transition block is higher than the bottom end face of the signal adapter plate.
Further, a plurality of gold wires are connected between the top surface of the signal transition block and the COC substrate side by side.
Further, the contact surfaces of the signal adapter plate and the radio frequency pins are adhered and fixed through conductive glue.
Compared with the prior art, the utility model has the beneficial effects that:
according to the optical module with the high-frequency radio frequency signals, the signal adapter plate is added to realize the electric connection between the COC substrate and the radio frequency pins, so that the impedance of the high-frequency signals is reduced, the radio frequency signals are greatly improved, and the optical device test signals are guaranteed to be transmitted with low impedance, high frequency and high reliability.
The present utility model will be described in further detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a top view of a radio frequency signal connection of a prior art optical module;
FIG. 2 is a front view of a radio frequency signal connection of a prior art optical module;
FIG. 3 is a top view of the RF signal connection of the optical module of the present utility model;
FIG. 4 is a front view of the RF signal connection of the optical module of the present utility model;
fig. 5 is a schematic structural diagram of a signal patch panel in an optical module according to the present utility model.
Reference numerals illustrate: 1. a base; 2. a radio frequency pin; 3. gold wire; 4. a COC substrate; 5. a chip; 6. a signal patch panel; 7. a signal transition block; 8. conductive glue.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or by an abutting connection or integrally connected; the specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
As shown in fig. 3 and 4, the embodiment provides an optical module with high-frequency radio-frequency signals, which comprises a base 1, a COC substrate 4, radio-frequency pins 2 and a signal adapter plate 6, wherein the COC substrate 4 is provided with a chip 5, the chip 5 on the COC substrate 4 is electrically connected with one surface of the signal adapter plate 6 through a plurality of wires 3, and the signal adapter plate 6 is in surface contact with and electrically connected with the radio-frequency pins 2. Because the traditional radio frequency signal transmission is to directly transmit the output/input signals of the chip 5 to the radio frequency pin 2 through the gold wire 3, and the surface area of the radio frequency pin 2 is small, only one gold wire 3 can be used for radio frequency signal transmission between the chip 5 and the radio frequency pin 2, so that the impedance of the high-frequency signal is large; based on this, in this embodiment, for signal transmission between the chip 5 on the COC substrate 4 and the radio frequency pin 2, the signal transfer board 6 is added to perform transition, the signal transfer board 6 is electrically connected with the chip 5 on the COC substrate 4 through the gold wire 3, and the output/input signal of the chip 5 on the COC substrate 4 is firstly conducted to the signal transfer board 6 through the gold wire 3, and then the signal transfer board 6 is combined with the radio frequency pin 2, so that the radio frequency signal is conducted to the radio frequency pin 2; the area of the electric conduction area on the signal adapter plate 6 for connecting the gold wires 3 can be designed according to actual needs, so that a plurality of gold wires 3 can be designed to transmit output/input signals of the chip 5 on the COC substrate 4, meanwhile, the signal adapter plate 6 and the radio frequency pins 2 are designed to be in surface contact, the contact area of radio frequency signal transmission between the COC substrate 4 and the radio frequency pins 2 is greatly increased, the radio frequency signal transmission quality is improved, and the low impedance, high frequency and high reliability of optical device test signal transmission are ensured.
The contact surfaces of the signal adapter plate 6 and the radio frequency pins 2 are adhered and fixed through conductive glue 8, so that the electric conduction and fixing effects between the signal adapter plate 6 and the radio frequency pins 2 are ensured.
In this embodiment, the base 1 plays a role of bearing each part in the whole optical module, for the installation of the radio frequency pins 2 on the base 1, through holes may be formed in positions corresponding to the radio frequency pins 2 on the base 1, the radio frequency pins 2 are arranged through the base 1 by penetrating through the through holes, and the number of the through holes is consistent with the number of the radio frequency pins 2 and corresponds to one. Preferably, an insulating layer may be further disposed on the inner wall of the through hole, so as to keep the radio frequency pin 2 insulated from the through hole.
As a specific embodiment, as shown in fig. 3 and fig. 5, the signal adapter plate 6 is located between the COC substrate 4 and the radio frequency pins 2, a signal transition block 7 is disposed on the signal adapter plate 6 corresponding to the radio frequency pins 2, the top surface of the signal transition block 7 is electrically connected with the chip 5 on the COC substrate 4 through a plurality of gold wires 3, and preferably, a plurality of gold wires 3 are connected between the top surface of the signal transition block 7 and the COC substrate 4 side by side; and one side surface of the signal transition plate 6, which is close to the radio frequency pin 2, is attached to the side surface of the radio frequency pin 2 and is electrically conducted.
Optionally, as shown in fig. 5, the signal transition block 7 is designed into an inverted U-shaped structure formed integrally, and is fastened to the top of the signal adapter plate 6, so that the signal transition block 7 with the inverted U-shaped structure protrudes out of the surface of the signal adapter plate 6, and the bottom end surface of the signal transition block 7 is higher than the bottom end surface of the signal adapter plate 6. Optimally, the side surface of the signal transition block 6 is tightly attached to the upper part of the corresponding radio frequency pin 2, the part of the signal transition block 6 below the bottom end surface of the signal transition block 7 is fixedly bonded to the lower part of the radio frequency pin 2 through conductive glue 8, and the thickness of the conductive glue 8 is equal to the thickness of the side wall of the signal transition block 7, so that the contact fixing effect between the signal transition block 6 and the radio frequency pin 2 can be ensured, meanwhile, the conductive glue is not used between the signal transition block 7 and the radio frequency pin 2, the signal transmission impedance between the signal transition block 7 and the radio frequency pin 2 is reduced, and the signal transmission quality is improved.
In summary, the optical module with the high-frequency radio frequency signal provided by the utility model realizes the electrical connection between the COC substrate and the radio frequency pin by adding the signal adapter plate, so that the impedance of the high-frequency signal is reduced, the radio frequency signal is greatly improved, and the low impedance, high frequency and high reliability of the optical device test signal transmission are ensured.
The foregoing examples are merely illustrative of the present utility model and are not intended to limit the scope of the present utility model, and all designs that are the same or similar to the present utility model are within the scope of the present utility model.
Claims (6)
1. An optical module having a high frequency radio frequency signal, characterized by: the COC substrate is provided with a chip, the chip on the COC substrate is electrically connected with one surface of the signal adapter plate through a plurality of gold wires, and the signal adapter plate is in surface contact with the radio frequency pin and is electrically conducted.
2. The optical module with high frequency radio frequency signal according to claim 1, wherein: the base is provided with through holes corresponding to the radio frequency pins, and the radio frequency pins penetrate through the base through the through holes.
3. The optical module with high frequency radio frequency signal according to claim 1, wherein: the signal transfer board is located between the COC substrate and the radio frequency pins, a signal transition block is arranged on the signal transfer board corresponding to the radio frequency pins, the top surface of the signal transition block is electrically connected with the COC substrate through a plurality of gold wires, and one side surface of the signal transfer board, which is close to the radio frequency pins, is attached to the side surface of the radio frequency pins and is electrically conducted.
4. An optical module having a high frequency radio frequency signal as claimed in claim 3, wherein: the signal transition block is of an integrally formed inverted U-shaped structure, the signal transition block is buckled on the top of the signal adapter plate, and the bottom end face of the signal transition block is higher than the bottom end face of the signal adapter plate.
5. An optical module having a high frequency radio frequency signal as claimed in claim 3, wherein: and the plurality of gold wires are connected between the top surface of the signal transition block and the COC substrate side by side.
6. The optical module with high frequency radio frequency signal according to claim 1, wherein: the contact surfaces of the signal adapter plate and the radio frequency pins are adhered and fixed through conductive glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321637094.4U CN220252230U (en) | 2023-06-27 | 2023-06-27 | Optical module with high-frequency radio frequency signals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321637094.4U CN220252230U (en) | 2023-06-27 | 2023-06-27 | Optical module with high-frequency radio frequency signals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220252230U true CN220252230U (en) | 2023-12-26 |
Family
ID=89227973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321637094.4U Active CN220252230U (en) | 2023-06-27 | 2023-06-27 | Optical module with high-frequency radio frequency signals |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220252230U (en) |
-
2023
- 2023-06-27 CN CN202321637094.4U patent/CN220252230U/en active Active
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