CN204272501U - Circuit board and display unit - Google Patents
Circuit board and display unit Download PDFInfo
- Publication number
- CN204272501U CN204272501U CN201420870639.0U CN201420870639U CN204272501U CN 204272501 U CN204272501 U CN 204272501U CN 201420870639 U CN201420870639 U CN 201420870639U CN 204272501 U CN204272501 U CN 204272501U
- Authority
- CN
- China
- Prior art keywords
- underlay substrate
- chip
- circuit board
- pad
- display unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 208000034699 Vitreous floaters Diseases 0.000 description 19
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000012528 membrane Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model discloses a kind of circuit board and display unit.This circuit board comprises: underlay substrate, chip and pad, and chip and pad are arranged on underlay substrate, and chip is connected with pad.In the technical scheme of the circuit board that the utility model provides and display unit, chip and pad are all arranged on underlay substrate, and chip is connected with pad.The utility model adopts underlay substrate to replace PCB, make the underlay substrate in circuit board can adopt identical material with the underlay substrate in display floater, just by identical manufacturer production, thus life cycle of the product can be reduced to make circuit board and display floater; The thickness of underlay substrate is less than the thickness of PCB, thus reduces the thickness of display unit; Chip is all positioned on same underlay substrate, reduces the space that circuit module takies, improves integrated level, reduce circuit impedance, reduces path-length and improves the speed of service of circuit module.
Description
Technical field
The utility model relates to Display Technique field, particularly a kind of circuit board and display unit.
Background technology
In Display Technique field, the application of liquid crystal indicator is also more and more extensive.Fig. 1 is the structural representation of liquid crystal indicator in prior art, as shown in Figure 1, this liquid crystal indicator can comprise display panels 1 and control circuit 2, wherein, display panels 1 can comprise color membrane substrates 11 and array base palte 12, control circuit 2 can comprise multiple chip, and multiple chip can comprise power module 21, system module 22 and time-sequence control module 23.Wherein, power module 21, system module 22 and time-sequence control module 23 lay respectively at three bar printing wiring boards (Printed Circuit Board, be called for short: PCB), power module 21 is connected with time-sequence control module 23 respectively by copper conductor 24 with system module 22, and time-sequence control module 23 is by flexible print wiring board (FlexiblePrinted Circuit board, be called for short: FPC) 25 display floaters 1 connect, thus realize electrical control performance.
But there is following technical problem in the technical scheme of prior art:
1) underlay substrate in display panels is different with the material of the carrier PCB of chip, and underlay substrate and PCB can only be produced respectively by different producers, thus extend life cycle of the product;
2) thickness due to PCB is comparatively large, and PCB needs the back side being arranged at display panels 1, thus adds the thickness of liquid crystal indicator;
3) different chips is positioned on different PCB, thus causes that circuit module takes up room greatly, integrated level is low, circuit impedance is high, path-length is long and run problem slowly.
Utility model content
The utility model provides a kind of circuit board and display unit, for reducing life cycle of the product, reduces the thickness of display unit, reduce the space that circuit module takies, improve integrated level, reduce circuit impedance, reduce path-length and improve the speed of service of circuit module.
For achieving the above object, the utility model provides a kind of circuit board, comprising: underlay substrate, chip and pad, and described chip and described pad are arranged on described underlay substrate, and described chip is connected with described pad.
Alternatively, described underlay substrate is transparency carrier.
Alternatively, the material of described underlay substrate is glass.
Alternatively, the material of described pad is transparent conductive material.
Alternatively, also comprise: encapsulated layer, described encapsulated layer to be positioned on described chip and described pad and to cover described underlay substrate.
Alternatively, also comprise: encapsulating structure, described encapsulating structure is positioned on the encapsulating face of described chip, and described encapsulating face is towards described underlay substrate.
Alternatively, the pin of described chip is connected with described pad.
For achieving the above object, the utility model provides a kind of display unit, display floater and the foregoing circuit plate be connected with described display floater.
The utility model has following beneficial effect:
In the technical scheme of the circuit board that the utility model provides and display unit, chip and pad are all arranged on underlay substrate, and chip is connected with pad.The utility model adopts underlay substrate to replace PCB, make the underlay substrate in circuit board can adopt identical material with the underlay substrate in display floater, just by identical manufacturer production, thus life cycle of the product can be reduced to make circuit board and display floater; The thickness of underlay substrate is less than the thickness of PCB, thus reduces the thickness of display unit; Chip is all positioned on same underlay substrate, reduces the space that circuit module takies, improves integrated level, reduce circuit impedance, reduces path-length and improves the speed of service of circuit module.
Accompanying drawing explanation
Fig. 1 is the structural representation of liquid crystal indicator in prior art;
The structural representation of the circuit board that Fig. 2 provides for the utility model embodiment one;
The structural representation of a kind of display unit that Fig. 3 provides for the utility model embodiment two;
The flow chart of the manufacture method of a kind of circuit board that Fig. 4 provides for the utility model embodiment three;
Fig. 5 a is the schematic diagram forming pad in embodiment three;
Fig. 5 b is the schematic diagram forming chip in embodiment three;
Fig. 5 c is the schematic diagram forming encapsulated layer in embodiment three.
Embodiment
For making those skilled in the art understand the technical solution of the utility model better, the circuit board provided the utility model below in conjunction with accompanying drawing and display unit are described in detail.
The structural representation of the circuit board that Fig. 2 provides for the utility model embodiment one, as shown in Figure 2, this circuit board comprises: underlay substrate 31, chip and pad 32, and chip and pad 32 are arranged on underlay substrate 31, and chip is connected with pad 32.
The quantity of chip can be one or more.The present embodiment is for three chips, and this chip can be power module 33, system module 34 or time-sequence control module 35, therefore underlay substrate 31 is provided with power module 33, system module 34 and time-sequence control module 35.In the present embodiment, chip can also be other functional module, will not enumerate herein.
Preferably, underlay substrate 31 can be transparency carrier.
Preferably, the material of underlay substrate 31 is glass.
Preferably, the material of pad 32 is transparent conductive material, such as: this transparent conductive material is ITO.
Further, this circuit board also comprises encapsulated layer, and encapsulated layer to be positioned on chip and pad 32 and to cover underlay substrate 31.Preferably, the material of this encapsulated layer is epoxy resin.Encapsulated layer is not shown in the drawings.Adopt epoxy resin to carry out overall package, reduce the cost of encapsulation.
Further, this circuit board also comprises encapsulating structure, and encapsulating structure is positioned on the encapsulating face of chip, and encapsulating face is towards underlay substrate 31.In Fig. 2, encapsulating face is the lower surface of chip, and therefore this encapsulating structure is not shown in the drawings.Preferably, the material of this encapsulating structure is epoxy resin.In the present embodiment, the encapsulating face of power module 33, system module 34 and time-sequence control module 35 is provided with encapsulating structure.
The pin of chip is directly connected with pad 33, and particularly, the pin of chip is directly connected by bonding wire (Bonding Wire) 36 with pad 33.The quantity of the pad 33 corresponding with each chip is identical with the number of pin of this chip, and pad 33 is arranged around chip.In the present embodiment, the pin of chip is directly connected with pad 33, and particularly, power module 33, system module 34 are all directly connected with pad 33 with the pin of time-sequence control module 35.In the present embodiment, the pin of chip directly can be connected by bonding wire 36 with pad 33, without the need to additionally arranging the lead-in wire be connected again between pin with pad 33, thus reducing the distance between chip and pad, making distance between chip and pad can granular more.In the present embodiment, the pin of chip directly can be connected with pad 33, without the need to arranging the lead-in wire be additionally connected again between pin with pad 33, thus improves intensity and the reliability of connection.
Further, this circuit board also comprises: the wire being arranged at underlay substrate 31, and this wire is connected with solder joint 33.One end connection welding 33 of this wire, the other end is used for being connected with display floater.It should be noted that: wire is not shown in the drawings.
In the technical scheme of the circuit board that the present embodiment provides, chip and pad are all arranged on underlay substrate, and chip is connected with pad.The present embodiment adopts underlay substrate to replace PCB, makes the underlay substrate in circuit board can adopt identical material with the underlay substrate in display floater, just by identical manufacturer production, thus can reduce life cycle of the product to make circuit board and display floater; The thickness of underlay substrate is less than the thickness of PCB, thus reduces the thickness of display unit, for subsequent development super-thin display provides solution; Chip is all positioned on same underlay substrate, reduces the space that circuit module takies, improves integrated level, reduce circuit impedance, reduces path-length and improves the speed of service.In the present embodiment, underlay substrate adopts transparency carrier, and the material of pad adopts transparent conductive material, makes the circuit board made be all transparent except welding portion, thus can bring preferably visual experience to client compared with PCB opaque in prior art.
The structural representation of a kind of display unit that Fig. 3 provides for the utility model embodiment two, as shown in Figure 3, the circuit board 3 that this display unit comprises display floater 1 and is connected with display floater 1.Circuit board 3.Can see above-described embodiment one and accompanying drawing 2, herein no longer repeated description to the specific descriptions of circuit board 3 and structure.
Display floater 1 can comprise the color membrane substrates 11 and array base palte 12 that are oppositely arranged.Connected by FPC 4 between display floater 1 and circuit board 3.Wire in circuit board 3 is connected with display floater 1 by FPC 4.Particularly, one end of wire is connected with solder joint 33, the other end of wire is by anisotropic conductive film (Anisotropic Conductive Film, be called for short: ACF) be connected with FPC 4, and display floater 1 connects by ACF and FPC 4, thus achieve between display floater 1 and circuit board 3 and connected by FPC 4.It should be noted that: ACF is not shown in the drawings.
In the technical scheme of the display unit that the present embodiment provides, chip and pad are all arranged on underlay substrate, and chip is connected with pad.The present embodiment adopts underlay substrate to replace PCB, makes the underlay substrate in circuit board can adopt identical material with the underlay substrate in display floater, just by identical manufacturer production, thus can reduce life cycle of the product to make circuit board and display floater; The thickness of underlay substrate is less than the thickness of PCB, thus reduces the thickness of display unit, for subsequent development super-thin display provides solution; Chip is all positioned on same underlay substrate, reduces the space that circuit module takies, improves integrated level, reduce circuit impedance, reduces path-length and improves the speed of service of circuit module.
The flow chart of the manufacture method of a kind of circuit board that Fig. 4 provides for the utility model embodiment three, as shown in Figure 4, the method comprises:
Step 101, pad is set on underlay substrate.
Fig. 5 a is the schematic diagram forming pad in embodiment three, as shown in Figure 5 a, arranges pad 32 according to the position preset on underlay substrate 31.Particularly, can on underlay substrate 31 deposited pad material layer, and to bonding pad material layer carry out patterning processes formed pad 32.Wherein, by magnetron sputtering technique deposited pad material layer on underlay substrate 31.
Step 102, chip is set on underlay substrate.
Fig. 5 b is the schematic diagram forming chip in embodiment three, as shown in Figure 5 b, is positioned over by chip on underlay substrate 31, particularly, in the present embodiment, power module 33, system module 34 and time-sequence control module 35 can be positioned over respectively around corresponding pad 32.
Step 103, chip to be connected with pad.
This step can be: be directly connected with pad by the pin of chip.As shown in Figure 2, the pin of chip is welded by bonding wire 36 with pad 32.In the present embodiment, the pin of power module 33, system module 34 and time-sequence control module 35 can be welded with corresponding pad 32 respectively.
Further, the method also comprises:
The mode that step 104, employing top are dripped carries out overall package to underlay substrate, and to form encapsulated layer on chip and pad, encapsulated layer covers underlay substrate.
Fig. 5 c is the schematic diagram forming encapsulated layer in embodiment three, and as shown in Figure 5 c, adopt the mode dripped in top to carry out overall package to underlay substrate 31, to form encapsulated layer 5 on chip and pad 32, encapsulated layer 5 covers underlay substrate 31.
In the present embodiment, alternatively, can also comprise before step 102: the encapsulating face of chip is encapsulated to form encapsulating structure on encapsulating face; Then in such cases, step 102 comprises: by the encapsulating face of chip towards underlay substrate, and be arranged on underlay substrate by chip.
In the technical scheme of the manufacture method of the circuit board that the present embodiment provides, chip and pad are all arranged on underlay substrate, and chip is connected with pad.The present embodiment adopts underlay substrate to replace PCB, makes the underlay substrate in circuit board can adopt identical material with the underlay substrate in display floater, just by identical manufacturer production, thus can reduce life cycle of the product to make circuit board and display floater; The thickness of underlay substrate is less than the thickness of PCB, thus reduces the thickness of display unit, for subsequent development super-thin display provides solution; Chip is all positioned on same underlay substrate, reduces the space that circuit module takies, improves integrated level, reduce circuit impedance, reduces path-length and improves the speed of service.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present utility model is described and adopts, but the utility model is not limited thereto.For those skilled in the art, when not departing from spirit of the present utility model and essence, can make various modification and improvement, these modification and improvement are also considered as protection range of the present utility model.
Claims (8)
1. a circuit board, is characterized in that, comprising: underlay substrate, chip and pad, and described chip and described pad are arranged on described underlay substrate, and described chip is connected with described pad.
2. circuit board according to claim 1, is characterized in that, described underlay substrate is transparency carrier.
3. circuit board according to claim 1 and 2, is characterized in that, the material of described underlay substrate is glass.
4. circuit board according to claim 1, is characterized in that, the material of described pad is transparent conductive material.
5. circuit board according to claim 1, is characterized in that, also comprises: encapsulated layer, and described encapsulated layer to be positioned on described chip and described pad and to cover described underlay substrate.
6. circuit board according to claim 1, is characterized in that, also comprises: encapsulating structure, and described encapsulating structure is positioned on the encapsulating face of described chip, and described encapsulating face is towards described underlay substrate.
7. circuit board according to claim 1, is characterized in that, the pin of described chip is directly connected with described pad.
8. a display unit, is characterized in that, comprising: display floater and the circuit board be connected with described display floater;
Described circuit board adopts the arbitrary described circuit board of the claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420870639.0U CN204272501U (en) | 2014-12-31 | 2014-12-31 | Circuit board and display unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420870639.0U CN204272501U (en) | 2014-12-31 | 2014-12-31 | Circuit board and display unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204272501U true CN204272501U (en) | 2015-04-15 |
Family
ID=52807345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420870639.0U Expired - Fee Related CN204272501U (en) | 2014-12-31 | 2014-12-31 | Circuit board and display unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204272501U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470210A (en) * | 2014-12-31 | 2015-03-25 | 京东方科技集团股份有限公司 | Circuit board, manufacturing method of circuit board and display device of circuit board |
-
2014
- 2014-12-31 CN CN201420870639.0U patent/CN204272501U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470210A (en) * | 2014-12-31 | 2015-03-25 | 京东方科技集团股份有限公司 | Circuit board, manufacturing method of circuit board and display device of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 |