CN103268181B - Capacitive touch screen module and preparation method thereof - Google Patents
Capacitive touch screen module and preparation method thereof Download PDFInfo
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- CN103268181B CN103268181B CN201310236541.XA CN201310236541A CN103268181B CN 103268181 B CN103268181 B CN 103268181B CN 201310236541 A CN201310236541 A CN 201310236541A CN 103268181 B CN103268181 B CN 103268181B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 239000011248 coating agent Substances 0.000 claims abstract description 48
- 238000000576 coating method Methods 0.000 claims abstract description 48
- 238000009500 colour coating Methods 0.000 claims abstract description 27
- 239000010410 layer Substances 0.000 claims abstract description 17
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 238000010030 laminating Methods 0.000 claims abstract description 10
- 239000011521 glass Substances 0.000 claims description 24
- 239000003292 glue Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 6
- 238000005728 strengthening Methods 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000007772 electrode material Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 7
- 229920002799 BoPET Polymers 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
Capacitive touch screen module and preparation method thereof, relates to a kind of touch-screen. Described capacitive touch screen module is provided with substrate, cover plate and FPC; On the lower surface of described substrate, deposit lower nesa coating, on lower nesa coating, be prepared with lower circuit pattern and lower conductive electrode, on the upper surface of described substrate, deposit nesa coating, on upper nesa coating, be prepared with circuit pattern and upper conductive electrode; Described cover plate is provided with transparent insulating layer, is prepared with color coating at the non-visible area of described cover plate, is provided with external electrode on color coating; Described cover plate is by transparent insulating layer and the laminating of lower nesa coating, and external electrode contact corresponding to lower conductive electrode connects; On external electrode and upper conductive electrode, be equipped with conductive adhesive layer; Described FPC and upper conductive electrode and external electrode binding.
Description
Technical field
The present invention relates to a kind of touch-screen, especially relate to a kind of capacitive touch screen module and preparation method thereof.
Background technology
Touch-screen, as a kind of novel human-computer interaction interface, is widely used on various digital information systems. Market powers onThe traditional fabrication method of holding touch-screen module is first FPC to be bound on capacitance plate substrate, then capacitance plate substrate and lidPlate laminating forms module. Due to the driving of capacitance plate with receive pattern and be produced in two surfaces of substrate, therefore flexibilityTwo surfaces of wiring board binding capacitance plate substrate must adopt twice binding operation just can complete, and need to bend flexible wiresRoad plate just can be bound for the second time, can cause like this FPC cabling to open circuit, thereby has affected the good of capacitance plate moduleProduct rate, production efficiency and production cost. Therefore, how make in capacitance touch screen module process, reduce FPC withThe binding operation of capacitance plate, reduce manufacturing technology complexity, enhance productivity and product yield, reduction module are produced intoThis etc., be the problem that the present invention need to solve.
Chinese patent 201110137392.2 discloses a kind of capacitive touch screen, comprises that front is provided with the ITO glass of layer printed circuit boardGlass substrate, layer printed circuit board outer surface is pasted with PET film. The preparation method that above-mentioned capacitive touch screen is also provided, comprising:Binding step, moulding layer printed circuit board on ito glass substrate, then by flexible PCB be tied on ito glass substrate withLayer printed circuit board is connected; Step of membrane sticking, is attached to PET film surface by optical cement, and PET film is cut into and ito glass baseThe small pieces that plate size is suitable, are attached to layer printed circuit board outer surface on ito glass substrate by the PET film of small pieces. This inventionReplace traditional glass cover plate with PET film, equipment and the technological operation of bonding process are greatly simplified, and cost is low, and efficiency is high,Be applicable to producing in enormous quantities; The laminating of PET film belongs to the hard mode of soft subsides, and product yield can reach more than 99%.
Summary of the invention
The object of the invention is to for how in capacitance touch screen module process, to reduce FPC and capacitance plate makingBinding operation, reduce manufacturing technology complexity, enhance productivity and the problem such as product yield, reduction module production cost,A kind of capacitive touch screen module and preparation method thereof is provided.
Described capacitive touch screen module is provided with substrate, cover plate and FPC (FPC);
On the lower surface of described substrate, deposit lower nesa coating, on lower nesa coating, be prepared with lower circuit pattern and underConductive electrode, deposits nesa coating on the upper surface of described substrate, is prepared with circuit diagram on upper nesa coatingCase and upper conductive electrode; Described cover plate is provided with transparent insulating layer, is prepared with color coating at the non-visible area of described cover plate,On color coating, be provided with external electrode; Described cover plate is by the laminating of transparent insulating layer and lower nesa coating, external electrode withThe corresponding contact of lower conductive electrode connects; On external electrode and upper conductive electrode, be equipped with conductive adhesive layer; Described FPC(FPC) with upper conductive electrode and external electrode binding.
Described substrate can adopt one in armorplate glass, strengthening glass sheets, simple glass plate, macromolecular material transparent panel etc.Kind.
Described cover plate can adopt one in armorplate glass, strengthening glass sheets, simple glass plate, macromolecular material transparent panel etc.Kind.
Described nesa coating can adopt ITO film, graphene film, CNT and transparent conductive material film etc. to be prepared from.
Described color coating can adopt ink coating, gloss oil coating or versicolor frame adhesive coating etc.
The material that ability is strong is led in the optional electricity consumption of described external electrode material, as carbon slurry or silver slurry etc.
Described transparent insulation glue can be selected the various UV glue of OCA, LOCA, OCR etc.
Described conductive adhesive layer can be selected ACF, ACP, ACA glue etc.
The preparation method of described capacitive touch screen module, comprises the following steps:
1) on the lower surface of substrate deposition under nesa coating, on the upper surface of substrate, deposit nesa coating;
2) on lower nesa coating, prepare circuit pattern layer and lower conductive electrode, on upper nesa coating, prepare circuit patternLayer and upper conductive electrode;
3) prepare one deck color coating at the non-visible area of cover plate;
4) on color coating surface, prepare external electrode;
5) on the cover board prepare transparent insulation glue-line;
6) after product eliminates bubble, substrate is fitted with cover plate and conductive electrode contact corresponding to external electrode is connected, with reallyProtect the signal of telecommunication normal in transmission;
7) on the upper conductive electrode of external electrode on the cover board and substrate, prepare conductive adhesive layer;
8) FPC (FPC) and upper conductive electrode and external electrode are bound, obtained capacitive touch screen module.
In step 4), the described method of preparing external electrode on color coating surface can be passed through silk-screen printing technique, outerThe effect of receiving electrode is for connecting outside control circuit.
In step 5), described transparent insulation glue-line and external electrode preferably paste to guarantee substrate and cover plate in same levelAfter closing in opposing parallel state.
In step 8), described upper conductive electrode and external electrode are in the same side of cover plate, so FPC (FPC)Can disposablely complete with the binding of substrate.
The present invention is deposition of transparent conductive film on two surfaces of substrate, and on described nesa coating, prepares corresponding transparent printCase layer and conductive electrode; On the cover board non-visible area is prepared color coating, and prepares external electrode on described color coating;Except described external electrode, on described cover plate, prepare transparent insulation glue-line; Described substrate and the laminating of described cover plate, and makeThe lip-deep described conductive electrode of described substrate one connects with the corresponding contact of described external electrode on described substrate; At described baseOn the described conductive electrode on another surface of plate and on the described external electrode of described cover plate, be prepared with conductive adhesive layer; Finally, in instituteState and on conductive adhesive layer, be prepared with FPC (FPC).
Because the described external electrode of described cover plate and the described conductive electrode of described substrate are in the same side of described cover plate, described inFPC can realize by a hot pressing with being connected of described conductive electrode: the part being connected is outside described cover plate describedOn receiving electrode, another part is on the described conductive electrode of described substrate. After described substrate and the laminating of described cover plate, also wantEliminate bubble processing.
Brief description of the drawings
Fig. 1 is the structure composition diagram of substrate, nesa coating and upper nesa coating.
Fig. 2 is the structure composition plane of upper nesa coating, lower conductive electrode and upper conductive electrode.
Fig. 3 is the A-A profile of Fig. 2.
In Fig. 2 and 3, dotted line frame is lower conductive electrode, and solid box is upper conductive electrode.
Fig. 4 is color coating plane. In Fig. 4, dash area is non-visible area.
Fig. 5 is the B-B profile of Fig. 4.
Fig. 6 is the structure composition plane of color coating and external electrode.
Fig. 7 is the C-C profile of Fig. 6.
Fig. 8 is the structure composition plane of transparent insulation glue-line, external electrode and color coating.
Fig. 9 is the D-D profile of Fig. 8.
Figure 10 is the structure composition plane of color coating, upper nesa coating, external electrode, conductive electrode and upper conductive electrodeFigure.
Figure 11 is the E-E profile of Figure 10.
Figure 12 is the structure composition plane of color coating, upper nesa coating, conductive adhesive layer and conductive electrode.
Figure 13 is the F-F profile of Figure 12.
Figure 14 is the structure composition plane of color coating, upper nesa coating, FPC (FPC) and conductive electrode.
Figure 15 is the G-G profile of Figure 14.
Detailed description of the invention
As shown in Fig. 1～15, described capacitive touch screen module embodiment is provided with substrate 008, cover plate 001 and FPC(FPC) 011. On the lower surface of described substrate 008, deposit lower nesa coating 007, system on lower nesa coating 007Have lower circuit pattern and lower conductive electrode 006, on the upper surface of described substrate 008, deposit nesa coating 009,On upper nesa coating 009, be prepared with circuit pattern and upper conductive electrode 010; Described cover plate 001 is provided with transparent insulating layer004, be prepared with color coating 002 at the non-visible area of described cover plate 001, on color coating 002, be provided with external electrode 003;Described cover plate 001 is fitted by transparent insulating layer 004 and lower nesa coating 007, external electrode 003 and lower conductive electrode006 corresponding contact connects; On external electrode 003 and upper conductive electrode 010, be equipped with conductive adhesive layer 005; Described flexible wiresRoad plate (FPC) 011 is bound with upper conductive electrode 010 and external electrode 003.
The preparation method of described capacitive touch screen module, comprises the following steps:
1) on the lower surface of substrate 008 deposition under nesa coating 007, on the upper surface of substrate 008, deposit transparentConducting film 009, as shown in Figure 1;
2) on lower nesa coating 007, prepare circuit pattern layer and lower conductive electrode 006, on upper nesa coating 009As shown in Figures 2 and 3, Fig. 2 is plane for preparation circuit pattern layer and upper conductive electrode 010(, and Fig. 3 is sectional view; Dotted lineFrame is lower conductive electrode 006, and solid box is upper conductive electrode 010);
3) dash area of preparing in one deck color coating 002(Fig. 4 at the non-visible area of cover plate 001 is non-visible area, figure4 is plane, and Fig. 5 is sectional view);
4) on color coating 002 surface, prepare external electrode 003; Describedly on color coating 002 surface, prepare external electricityThe method of the utmost point 003 can be passed through silk-screen printing technique, and the effect of external electrode 003 is for connecting outside control circuit,Fig. 6 is plane, and Fig. 7 is sectional view.
5) on cover plate 001, prepare transparent insulation glue-line 004; Described transparent insulation glue-line 004 is best with external electrode 003In same level with after guaranteeing 001 laminating of substrate 008 and cover plate in opposing parallel state; Described transparent insulation glue-line004 can adopt OCA glue because this glue have light transmittance good, high temperature resistant, be difficult for the advantages such as yellow is rotten; In Fig. 8, voidIn wire frame, it is transparent insulation glue-line 004; Fig. 8 is plane, and Fig. 9 is sectional view.
6), after product eliminates bubble, substrate 008 and cover plate 001 are fitted and make conductive electrode 006 and external electrode 003 rightShould contact connection, to guarantee that the signal of telecommunication is normal in transmission, Figure 10 is plane, and Figure 11 is sectional view.
7) on the upper conductive electrode 010 of the external electrode 003 on cover plate 001 and substrate 008, prepare conductive adhesive layer 005;Described conductive adhesive layer 005 can adopt ACF glue, and the feature of this glue is Z axis electrically conducting and at XY plane insulation, Tu12WeiPlane, Figure 13 is sectional view.
8) FPC (FPC) 011 and upper conductive electrode 010 and external electrode 003 are bound, obtained capacitive touchTouch screen module. Described upper conductive electrode 010 and external electrode 003 are in the same side of cover plate 001, so FPC (FPC)011 can disposablely complete with the binding of substrate 008; Figure 14 is plane, and Figure 15 is sectional view.
Described substrate can adopt one in armorplate glass, strengthening glass sheets, simple glass plate, macromolecular material transparent panel etc.Kind.
Described cover plate can adopt one in armorplate glass, strengthening glass sheets, simple glass plate, macromolecular material transparent panel etc.Kind.
Described nesa coating can adopt ITO film, graphene film, CNT and transparent conductive material film etc. to be prepared from.
Described color coating can adopt ink coating, gloss oil coating or versicolor frame adhesive coating etc.
The material that ability is strong is led in the optional electricity consumption of described external electrode material, as carbon slurry or silver slurry etc.
Described transparent insulation glue can be selected the various UV glue of OCA, LOCA, OCR etc.
Described conductive adhesive layer can be selected ACF, ACP, ACA glue etc.
The shape of described external conductive electrode and described conductive electrode can be rectangle, square, circle, ellipse etc.
Claims (7)
1. capacitive touch screen module, is characterized in that being provided with substrate, cover plate and FPC;
On the lower surface of described substrate, deposit lower nesa coating, on lower nesa coating, be prepared with lower circuit pattern and under leadElectricity electrode, on the upper surface of described substrate, deposit nesa coating, on upper nesa coating, be prepared with circuit pattern andUpper conductive electrode; Described cover plate is provided with transparent insulating layer, is prepared with color coating, in color at the non-visible area of described cover plateCoating is provided with external electrode; Described cover plate is by transparent insulating layer and the laminating of lower nesa coating, and described baseplate-laminating is describedOn cover plate, described substrate portion ground covers external electrode; In the direction vertical with the lower surface of described substrate, by described baseThe part contact corresponding to lower conductive electrode of the external electrode that plate covers connects; The part of the external electrode not covered by described substrateWith on upper conductive electrode, be equipped with conductive adhesive layer; Described FPC and upper conductive electrode and external electrode binding;
Described nesa coating adopts ITO film, graphene film, CNT and transparent conductive material film preparation to form;
Described external electrode material selection carbon slurry or silver slurry.
2. capacitive touch screen module as claimed in claim 1, is characterized in that described substrate adopts armorplate glass, strengthening glassOne in glass plate, simple glass plate, macromolecular material transparent panel; Described cover plate adopt armorplate glass, strengthening glass sheets,One in simple glass plate, macromolecular material transparent panel.
3. capacitive touch screen module as claimed in claim 1, is characterized in that described color coating adopts ink coating, gloss oilCoating or versicolor frame adhesive coating.
4. capacitive touch screen module as claimed in claim 1, it is characterized in that described transparent insulating layer select OCA, LOCA,The various UV glue of OCR; Described conductive adhesive layer can be selected ACF, ACP, ACA glue.
5. the preparation method of capacitive touch screen module as described in arbitrary in claim 1～4, is characterized in that comprising followingStep:
1) on the lower surface of substrate deposition under nesa coating, on the upper surface of substrate, deposit nesa coating;
2) on lower nesa coating preparation under circuit pattern and lower conductive electrode, on upper nesa coating, prepare circuit patternWith upper conductive electrode;
3) prepare one deck color coating at the non-visible area of cover plate;
4) on color coating surface, prepare external electrode;
5) on the cover board prepare transparent insulating layer;
6), after product eliminates bubble, substrate is fitted with cover plate and conductive electrode contact corresponding to external electrode is connected, to guaranteeThe signal of telecommunication is normal in transmission;
7) on the upper conductive electrode of external electrode on the cover board and substrate, prepare conductive adhesive layer;
8) FPC and upper conductive electrode and external electrode are bound, obtained capacitive touch screen module; Described upper conductionElectrode and external electrode are in the same side of cover plate, and the binding of FPC and substrate is disposable to be completed.
6. the preparation method of capacitive touch screen module as claimed in claim 5, is characterized in that in step 4) in, describedThe method of preparing external electrode on color coating surface is to pass through silk-screen printing technique.
7. the preparation method of capacitive touch screen module as claimed in claim 5, is characterized in that in step 5) in, describedBright insulating barrier and external electrode be in same level with after guaranteeing the laminating of substrate and cover plate in opposing parallel state.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310236541.XA CN103268181B (en) | 2013-06-15 | 2013-06-15 | Capacitive touch screen module and preparation method thereof |
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| CN201310236541.XA CN103268181B (en) | 2013-06-15 | 2013-06-15 | Capacitive touch screen module and preparation method thereof |
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| CN103268181A CN103268181A (en) | 2013-08-28 |
| CN103268181B true CN103268181B (en) | 2016-05-04 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103677424A (en) * | 2013-12-24 | 2014-03-26 | 江西合力泰科技股份有限公司 | Touch screen induction layer printed with bottom adhesive layer |
| CN105138174B (en) * | 2015-09-06 | 2017-12-08 | 黄石瑞视光电技术股份有限公司 | Pure plane touch screen and preparation method thereof |
| CN106502480A (en) * | 2015-09-08 | 2017-03-15 | 深圳安道云科股份有限公司 | A kind of manufacture method of oversize capacitive touch screen |
| CN106201139A (en) * | 2016-07-06 | 2016-12-07 | 深圳市骏达光电股份有限公司 | A kind of processing technology of TP monolayer multiple spot GFM |
| CN113330401A (en) * | 2019-05-15 | 2021-08-31 | 深圳市柔宇科技股份有限公司 | Electronic device and method for manufacturing electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017417A (en) * | 2006-02-07 | 2007-08-15 | 松下电器产业株式会社 | Touch panel |
| KR20110008453A (en) * | 2009-07-20 | 2011-01-27 | (주) 월드비젼 | Capacitive touch sensor integrated with window panel and mathod for manufacturing thereof |
| CN102089735A (en) * | 2008-08-07 | 2011-06-08 | 夏普株式会社 | Touch panel, display, and electronic device |
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2013
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017417A (en) * | 2006-02-07 | 2007-08-15 | 松下电器产业株式会社 | Touch panel |
| CN102089735A (en) * | 2008-08-07 | 2011-06-08 | 夏普株式会社 | Touch panel, display, and electronic device |
| KR20110008453A (en) * | 2009-07-20 | 2011-01-27 | (주) 월드비젼 | Capacitive touch sensor integrated with window panel and mathod for manufacturing thereof |
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Address after: 351100 Licheng Economic Development Zone, Putian City, Fujian Province (Donghu Village, West Tianwei Town) Patentee after: KECHUANG OPTOELECTRONIC (PUTIAN) Co.,Ltd. Address before: 351111 Licheng Economic Development Zone, Putian City, Fujian Province (Donghu Village, West Tianwei Town) Patentee before: Fujian Kechuang Photoelectric Co.,Ltd. |
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Effective date of registration: 20231128 Address after: 362200 No. 168, huge industrial zone, Xintang street, Jinjiang City, Quanzhou City, Fujian Province Patentee after: Quanzhou Shengwei Electronic Technology Co.,Ltd. Address before: 351100 Licheng Economic Development Zone, Putian City, Fujian Province (Donghu Village, Xitianwei Town) Patentee before: KECHUANG OPTOELECTRONIC (PUTIAN) Co.,Ltd. |