CN103268181A - Capacitive touch screen module and preparation method thereof - Google Patents
Capacitive touch screen module and preparation method thereof Download PDFInfo
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- CN103268181A CN103268181A CN 201310236541 CN201310236541A CN103268181A CN 103268181 A CN103268181 A CN 103268181A CN 201310236541 CN201310236541 CN 201310236541 CN 201310236541 A CN201310236541 A CN 201310236541A CN 103268181 A CN103268181 A CN 103268181A
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- external electrode
- substrate
- touch screen
- cover plate
- capacitive touch
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- 238000002360 preparation method Methods 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 238000009500 colour coating Methods 0.000 claims abstract description 28
- 239000010410 layer Substances 0.000 claims abstract description 20
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims description 46
- 238000000576 coating method Methods 0.000 claims description 46
- 239000011521 glass Substances 0.000 claims description 24
- 238000009413 insulation Methods 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000002002 slurry Substances 0.000 claims description 6
- 238000005728 strengthening Methods 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000007772 electrode material Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 7
- 229920002799 BoPET Polymers 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
The invention discloses a capacitive touch screen module and a preparation method thereof and relates to touch screens. The capacitive touch screen module is provided with a substrate, a cover plate and a flexible circuit board, wherein a lower transparent conductive film is deposited on the lower surface of the substrate; lower circuit patterns and a lower conductive electrode are prepared on the lower transparent conductive film; an upper transparent conductive film is deposited on the upper surface of the substrate; upper circuit patterns and an upper conductive electrode are prepared on the upper transparent conductive film; a transparent insulating layer is arranged on the cover plate; a color coating is prepared in a non-visual area of the cover plate; an external electrode is arranged on the color coating; the cover plate is attached to the lower transparent conductive film through the transparent insulating layer; the external electrode is in corresponding contact connection with the lower conductive electrode; conductive adhesive layers are arranged on the external electrode and the upper conductive electrode; and a flexible printed circuit is bound with the upper conductive electrode and the external electrode.
Description
Technical field
The present invention relates to a kind of touch-screen, especially relate to a kind of capacitive touch screen module and preparation method thereof.
Background technology
Touch-screen is widely used on the various digital information systems as a kind of novel human-computer interaction interface.The traditional fabrication method of capacitance touch screen module is earlier on the flexible circuit board binding capacitance plate substrate, again capacitance plate substrate and cover plate applying formation module on the market.Because the driving of capacitance plate and reception pattern are produced in two surfaces of substrate, therefore must adopt two surfaces of flexible circuit board binding capacitance plate substrate twice binding operation just can finish, and need the bending flexible circuit board just can carry out the binding second time, can cause the flexible circuit board cabling to open circuit like this, thereby influence yields, production efficiency and the production cost of capacitance plate module.Therefore, how in making capacitance touch screen module process, reduce flexible circuit board and capacitance plate the binding operation, reduce manufacturing technology complicacy, enhance productivity and product yield, reduction module production cost etc., be the problem that the present invention need solve.
Chinese patent 201110137392.2 discloses a kind of capacitive touch screen, comprises that the front is provided with the ito glass substrate of layer printed circuit board, and the layer printed circuit board outer surface is pasted with the PET film.The preparation method of above-mentioned capacitive touch screen also is provided, comprises: the binding step, moulding layer printed circuit board on ito glass substrate is tied to flexible PCB on the ito glass substrate and links to each other with layer printed circuit board; Step of membrane sticking is attached to PET film surface with optical cement, and the PET film is cut into and small pieces that ito glass substrate size is suitable, and the PET film of small pieces is attached to layer printed circuit board outer surface on the ito glass substrate.This invention replaces the traditional glass cover plate with the PET film, and equipment and the technological operation of bonding process are greatly simplified, and cost is low, and the efficient height is fit to produce in enormous quantities; The applying of PET film belongs to the hard mode of soft subsides, and the product yield can reach more than 99%.
Summary of the invention
The objective of the invention is at how in making capacitance touch screen module process, to reduce flexible circuit board and capacitance plate the binding operation, reduce manufacturing technology complicacy, enhance productivity and problems such as product yield, reduction module production cost, a kind of capacitive touch screen module and preparation method thereof is provided.
Described capacitive touch screen module is provided with substrate, cover plate and flexible circuit board (FPC);
Deposit down nesa coating on the lower surface of described substrate, in following nesa coating preparation following circuit pattern and following conductive electrode are arranged, deposit nesa coating on the upper surface of described substrate, circuit pattern and last conductive electrode on last nesa coating preparation has; Described cover plate is provided with transparent insulating layer, in the non-visible area preparation of described cover plate color coating is arranged, and is provided with external electrode at color coating; Described cover plate is fitted by transparent insulating layer and following nesa coating, and the corresponding contact with following conductive electrode of external electrode connects; Be equipped with conductive adhesive layer at external electrode and last conductive electrode; Described flexible circuit board (FPC) and last conductive electrode and external electrode binding.
Described substrate can adopt a kind of in armourplate glass, strengthening glass sheets, simple glass plate, the macromolecular material transparent panel etc.
Described cover plate can adopt a kind of in armourplate glass, strengthening glass sheets, simple glass plate, the macromolecular material transparent panel etc.
Described nesa coating can adopt ITO film, graphene film, carbon nano-tube and transparent conductive material film etc. to be prepared from.
Described color coating can adopt ink coating, gloss oil coating or versicolor frame adhesive coating etc.
The strong material of ability is led in the optional electricity consumption of described external electrode material, as carbon slurry or silver slurry etc.
Described transparent insulation glue can be selected the various UV glue of OCA, LOCA, OCR etc. for use.
Described conductive adhesive layer can be selected ACF, ACP, ACA glue etc. for use.
The preparation method of described capacitive touch screen module may further comprise the steps:
1) nesa coating under the lower surface deposition of substrate deposits nesa coating at the upper surface of substrate;
2) at following nesa coating preparation circuit pattern layer and following conductive electrode, at last nesa coating preparation circuit pattern layer and last conductive electrode;
3) the non-visible area at cover plate prepares one deck color coating;
4) prepare external electrode on the color coating surface;
5) on the cover board prepare the transparent insulation glue-line;
6) behind the product eliminates bubble, substrate and cover plate are fitted and the corresponding contact with external electrode of conductive electrode are connected, with guarantee electric signal in transmission normally;
7) prepare conductive adhesive layer on the last conductive electrode of external electrode on the cover board and substrate;
8) flexible circuit board (FPC) and last conductive electrode and external electrode are bound, got the capacitive touch screen module.
In step 4), the described method for preparing external electrode on the color coating surface can be passed through silk-screen printing technique, and the effect of external electrode is for connecting outside control circuit.
In step 5), described transparent insulation glue-line and external electrode preferably are in same surface level to guarantee being in the opposing parallel state after substrate and cover plate are fitted.
In step 8), described upward conductive electrode and external electrode are in the same side of cover plate, so flexible circuit board (FPC) can disposablely be finished with the binding of substrate.
The present invention is deposition of transparent conductive film on two surfaces of substrate, and at the described nesa coating corresponding transparent pattern layer of preparation and conductive electrode; On the cover board non-visible area prepares color coating, and prepares external electrode at described color coating; Except described external electrode, at described cover plate preparation transparent insulation glue-line; Described substrate and described cover plate are fitted, and make described substrate one lip-deep described conductive electrode and the corresponding contact connection of described external electrode on the described substrate; Described external electrode preparation with described cover plate on the described conductive electrode on another surface of described substrate has conductive adhesive layer; At last, in described conductive adhesive layer preparation flexible circuit board (FPC) is arranged.
Because the described external electrode of described cover plate and the described conductive electrode of described substrate are in the same side of described cover plate, described FPC can realize by a hot pressing with being connected of described conductive electrode: a part that is connected is on the described external electrode of described cover plate, and another part is on the described conductive electrode of described substrate.After described substrate and the applying of described cover plate, also to eliminate bubble and handle.
Description of drawings
Fig. 1 is the structure composition diagram of substrate, nesa coating and last nesa coating.
Fig. 2 is that the structure of last nesa coating, following conductive electrode and last conductive electrode is formed planimetric map.
Fig. 3 is the A-A sectional view of Fig. 2.
In Fig. 2 and 3, frame of broken lines is following conductive electrode, and solid box is last conductive electrode.
Fig. 4 is the color coating planimetric map.In Fig. 4, dash area is non-visible area.
Fig. 5 is the B-B sectional view of Fig. 4.
Fig. 6 is that the structure of color coating and external electrode is formed planimetric map.
Fig. 7 is the C-C sectional view of Fig. 6.
Fig. 8 is that the structure of transparent insulation glue-line, external electrode and color coating is formed planimetric map.
Fig. 9 is the D-D sectional view of Fig. 8.
Figure 10 is that color coating, the structure that goes up nesa coating, external electrode, conductive electrode and last conductive electrode are formed planimetric map.
Figure 11 is the E-E sectional view of Figure 10.
Figure 12 is that color coating, the structure that goes up nesa coating, conductive adhesive layer and conductive electrode are formed planimetric map.
Figure 13 is the F-F sectional view of Figure 12.
Figure 14 is that color coating, the structure that goes up nesa coating, flexible circuit board (FPC) and conductive electrode are formed planimetric map.
Figure 15 is the G-G sectional view of Figure 14.
Embodiment
Shown in Fig. 1～15, described capacitive touch screen module embodiment is provided with substrate 008, cover plate 001 and flexible circuit board (FPC) 011.Deposit down nesa coating 007 on the lower surface of described substrate 008, in following nesa coating 007 preparation following circuit pattern and following conductive electrode 006 are arranged, deposit nesa coating 009 on the upper surface of described substrate 008, circuit pattern and last conductive electrode 010 on last nesa coating 009 preparation has; Described cover plate 001 is provided with transparent insulating layer 004, in the non-visible area preparation of described cover plate 001 color coating 002 is arranged, and is provided with external electrode 003 at color coating 002; Described cover plate 001 is fitted by transparent insulating layer 004 and following nesa coating 007, and external electrode 003 connects with following conductive electrode 006 corresponding contact; Be equipped with conductive adhesive layer 005 at external electrode 003 and last conductive electrode 010; Described flexible circuit board (FPC) 011 and last conductive electrode 010 and external electrode 003 binding.
The preparation method of described capacitive touch screen module may further comprise the steps:
1) nesa coating 007 under the lower surface deposition of substrate 008 deposits nesa coating 009 at the upper surface of substrate 008, as shown in Figure 1;
2) at following nesa coating 007 preparation circuit pattern layer and following conductive electrode 006, prepare circuit pattern layer and last conductive electrode 010(shown in Fig. 2 and 3 at last nesa coating 009, Fig. 2 is planimetric map, Fig. 3 is sectional view; Frame of broken lines is following conductive electrode 006, and solid box is last conductive electrode 010);
3) dash area for preparing among one deck color coating 002(Fig. 4 at the non-visible area of cover plate 001 is non-visible area, and Fig. 4 is planimetric map, and Fig. 5 is sectional view);
4) at color coating 002 surface preparation external electrode 003; The described method for preparing external electrode 003 on color coating 002 surface can be passed through silk-screen printing technique, and the effect of external electrode 003 is that Fig. 6 is planimetric map for the control circuit that connects the outside, and Fig. 7 is sectional view.
5) at cover plate 001 preparation transparent insulation glue-line 004; Described transparent insulation glue-line 004 preferably is in same surface level to guarantee being in the opposing parallel state after substrate 008 and cover plate 001 are fitted with external electrode 003; Described transparent insulation glue-line 004 can adopt OCA glue because this glue have transmittance good, high temperature resistant, be difficult for advantages such as yellow is rotten; In Fig. 8, be transparent insulation glue-line 004 in the frame of broken lines; Fig. 8 is planimetric map, and Fig. 9 is sectional view.
6) behind the product eliminates bubble, substrate 008 and cover plate 001 fitted and conductive electrode 006 is connected with external electrode 003 corresponding contact, with guarantee electric signal in transmission normally, Figure 10 is planimetric map, Figure 11 is sectional view.
7) conductive electrode 010 preparation conductive adhesive layer 005 on the external electrode 003 on the cover plate 001 and substrate 008; Described conductive adhesive layer 005 can adopt ACF glue, and the characteristics of this glue are Z axle electrically conductings and in XY plane insulation, Figure 12 is planimetric map, and Figure 13 is sectional view.
8) flexible circuit board (FPC) 011 and last conductive electrode 010 and external electrode 003 are bound, got the capacitive touch screen module.Described upward conductive electrode 010 and external electrode 003 are in the same side of cover plate 001, so flexible circuit board (FPC) 011 can disposablely be finished with the binding of substrate 008; Figure 14 is planimetric map, and Figure 15 is sectional view.
Described substrate can adopt a kind of in armourplate glass, strengthening glass sheets, simple glass plate, the macromolecular material transparent panel etc.
Described cover plate can adopt a kind of in armourplate glass, strengthening glass sheets, simple glass plate, the macromolecular material transparent panel etc.
Described nesa coating can adopt ITO film, graphene film, carbon nano-tube and transparent conductive material film etc. to be prepared from.
Described color coating can adopt ink coating, gloss oil coating or versicolor frame adhesive coating etc.
The strong material of ability is led in the optional electricity consumption of described external electrode material, as carbon slurry or silver slurry etc.
Described transparent insulation glue can be selected the various UV glue of OCA, LOCA, OCR etc. for use.
Described conductive adhesive layer can be selected ACF, ACP, ACA glue etc. for use.
The shape of described external conductive electrode and described conductive electrode can be rectangle, square, circle, ellipse etc.
Claims (10)
1. the capacitive touch screen module is characterized in that being provided with substrate, cover plate and flexible circuit board;
Deposit down nesa coating on the lower surface of described substrate, in following nesa coating preparation following circuit pattern and following conductive electrode are arranged, deposit nesa coating on the upper surface of described substrate, circuit pattern and last conductive electrode on last nesa coating preparation has; Described cover plate is provided with transparent insulating layer, in the non-visible area preparation of described cover plate color coating is arranged, and is provided with external electrode at color coating; Described cover plate is fitted by transparent insulating layer and following nesa coating, and the corresponding contact with following conductive electrode of external electrode connects; Be equipped with conductive adhesive layer at external electrode and last conductive electrode; Described flexible circuit board and last conductive electrode and external electrode binding.
2. capacitive touch screen module according to claim 1 is characterized in that described substrate adopts a kind of in armourplate glass, strengthening glass sheets, simple glass plate, the macromolecular material transparent panel; Described cover plate adopts a kind of in armourplate glass, strengthening glass sheets, simple glass plate, the macromolecular material transparent panel.
3. capacitive touch screen module according to claim 1 is characterized in that described nesa coating adopts ITO film, graphene film, carbon nano-tube and transparent conductive material film preparation to form.
4. capacitive touch screen module according to claim 1 is characterized in that described color coating adopts ink coating, gloss oil coating or versicolor frame adhesive coating.
5. capacitive touch screen module according to claim 1 is characterized in that described external electrode material selection carbon slurry or silver slurry.
6. capacitive touch screen module according to claim 1 is characterized in that described transparent insulation glue selects the various UV glue of OCA, LOCA, OCR for use; Described conductive adhesive layer can be selected ACF, ACP, ACA glue for use.
7. as the preparation method of capacitive touch screen module as described in arbitrary in the claim 1～6, it is characterized in that may further comprise the steps:
1) nesa coating under the lower surface deposition of substrate deposits nesa coating at the upper surface of substrate;
2) at following nesa coating preparation circuit pattern layer and following conductive electrode, at last nesa coating preparation circuit pattern layer and last conductive electrode;
3) the non-visible area at cover plate prepares one deck color coating;
4) prepare external electrode on the color coating surface;
5) on the cover board prepare the transparent insulation glue-line;
6) behind the product eliminates bubble, substrate and cover plate are fitted and the corresponding contact with external electrode of conductive electrode are connected, with guarantee electric signal in transmission normally;
7) prepare conductive adhesive layer on the last conductive electrode of external electrode on the cover board and substrate;
8) flexible circuit board (FPC) and last conductive electrode and external electrode are bound, got the capacitive touch screen module.
8. as the preparation method of capacitive touch screen module as described in the claim 7, it is characterized in that in step 4) the described method for preparing external electrode on the color coating surface is to pass through silk-screen printing technique.
9. as the preparation method of capacitive touch screen module as described in the claim 7, it is characterized in that in step 5) that described transparent insulation glue-line and external electrode are to be in same surface level to guarantee being in the opposing parallel state after substrate and cover plate are fitted.
10. as the preparation method of capacitive touch screen module as described in the claim 7, it is characterized in that in step 8) that described conductive electrode and the external electrode gone up is in the same side of cover plate, the binding of flexible circuit board and substrate is disposable to be finished.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310236541.XA CN103268181B (en) | 2013-06-15 | 2013-06-15 | Capacitive touch screen module and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310236541.XA CN103268181B (en) | 2013-06-15 | 2013-06-15 | Capacitive touch screen module and preparation method thereof |
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| Publication Number | Publication Date |
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| CN103268181A true CN103268181A (en) | 2013-08-28 |
| CN103268181B CN103268181B (en) | 2016-05-04 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103677424A (en) * | 2013-12-24 | 2014-03-26 | 江西合力泰科技股份有限公司 | Touch screen induction layer printed with bottom adhesive layer |
| CN105138174A (en) * | 2015-09-06 | 2015-12-09 | 黄石瑞视光电技术股份有限公司 | Flat-touch screen and manufacturing method thereof |
| CN106201139A (en) * | 2016-07-06 | 2016-12-07 | 深圳市骏达光电股份有限公司 | A kind of processing technology of TP monolayer multiple spot GFM |
| CN106502480A (en) * | 2015-09-08 | 2017-03-15 | 深圳安道云科股份有限公司 | A kind of manufacture method of oversize capacitive touch screen |
| WO2020227978A1 (en) * | 2019-05-15 | 2020-11-19 | 深圳市柔宇科技有限公司 | Electronic device and manufacturing method for electronic device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4779681B2 (en) * | 2006-02-07 | 2011-09-28 | パナソニック株式会社 | Touch panel |
| US20110134075A1 (en) * | 2008-08-07 | 2011-06-09 | Sharp Kabushiki Kaisha | Touch panel, display, and electronic device |
| KR101029490B1 (en) * | 2009-07-20 | 2011-04-18 | (주) 월드비젼 | Capacitive touch sensor integrated with window panel and mathod for manufacturing thereof |
-
2013
- 2013-06-15 CN CN201310236541.XA patent/CN103268181B/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103677424A (en) * | 2013-12-24 | 2014-03-26 | 江西合力泰科技股份有限公司 | Touch screen induction layer printed with bottom adhesive layer |
| CN105138174A (en) * | 2015-09-06 | 2015-12-09 | 黄石瑞视光电技术股份有限公司 | Flat-touch screen and manufacturing method thereof |
| CN105138174B (en) * | 2015-09-06 | 2017-12-08 | 黄石瑞视光电技术股份有限公司 | Pure plane touch screen and preparation method thereof |
| CN106502480A (en) * | 2015-09-08 | 2017-03-15 | 深圳安道云科股份有限公司 | A kind of manufacture method of oversize capacitive touch screen |
| CN106201139A (en) * | 2016-07-06 | 2016-12-07 | 深圳市骏达光电股份有限公司 | A kind of processing technology of TP monolayer multiple spot GFM |
| WO2020227978A1 (en) * | 2019-05-15 | 2020-11-19 | 深圳市柔宇科技有限公司 | Electronic device and manufacturing method for electronic device |
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| Publication number | Publication date |
|---|---|
| CN103268181B (en) | 2016-05-04 |
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Address after: 351100 Licheng Economic Development Zone, Putian City, Fujian Province (Donghu Village, West Tianwei Town) Patentee after: KECHUANG OPTOELECTRONIC (PUTIAN) Co.,Ltd. Address before: 351111 Licheng Economic Development Zone, Putian City, Fujian Province (Donghu Village, West Tianwei Town) Patentee before: Fujian Kechuang Photoelectric Co.,Ltd. |
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Effective date of registration: 20231128 Address after: 362200 No. 168, huge industrial zone, Xintang street, Jinjiang City, Quanzhou City, Fujian Province Patentee after: Quanzhou Shengwei Electronic Technology Co.,Ltd. Address before: 351100 Licheng Economic Development Zone, Putian City, Fujian Province (Donghu Village, Xitianwei Town) Patentee before: KECHUANG OPTOELECTRONIC (PUTIAN) Co.,Ltd. |
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