CN203350849U - Capacitor type touch screen module - Google Patents
Capacitor type touch screen module Download PDFInfo
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- CN203350849U CN203350849U CN 201320345707 CN201320345707U CN203350849U CN 203350849 U CN203350849 U CN 203350849U CN 201320345707 CN201320345707 CN 201320345707 CN 201320345707 U CN201320345707 U CN 201320345707U CN 203350849 U CN203350849 U CN 203350849U
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Abstract
The utility model provides a capacitor type touch screen module, and relates to a touch screen. The capacitor type touch screen module comprises a substrate, a cover plate and a flexible circuit board. A lower transparent conductive film is arranged on the lower surface of the substrate in a deposition mode, a lower circuit pattern and a lower conductive electrode are manufactured on the lower transparent conductive film, an upper transparent conductive film is arranged on the upper surface of the substrate in a deposition mode, an upper circuit pattern and an upper conductive electrode are manufactured on the upper transparent conductive film, the cover plate is provided with a transparent insulating layer, a color coating is manufactured on a non-visual area of the cover plate, an external electrode is arranged on the color coating, the cover plate is attached to the lower transparent conductive film through the transparent insulating layer, the external electrode is correspondingly connected with the lower conductive electrode in a contact mode, the external electrode and the upper conductive electrode are respectively provided with a conductive adhesive layer, and the flexible circuit board is bound with the upper conductive electrode and the external electrode.
Description
Technical field
The utility model relates to a kind of touch-screen, especially relates to a kind of capacitive touch screen module.
Background technology
Touch-screen, as a kind of novel human-computer interaction interface, is widely used on various digital information systems.On market, the traditional fabrication method of capacitance touch screen module is first flexible circuit board to be bound on the capacitance plate substrate, then capacitance plate substrate and cover plate laminating are formed to module.Due to the driving of capacitance plate with receive two surfaces that pattern is produced in substrate, therefore must adopt two surfaces of flexible circuit board binding capacitance plate substrate twice binding operation just can complete, and need the bending flexible circuit board just can bind for the second time, can cause like this flexible circuit board cabling to open circuit, thereby affect yields, production efficiency and the production cost of capacitance plate module.Therefore, how in making capacitance touch screen module process, reduce binding operation, the reduction manufacturing technology of flexible circuit board and capacitance plate complicacy, enhance productivity and product yield, reduction module production cost etc., be the problem that the utility model need to solve.
Chinese patent 201110137392.2 discloses a kind of capacitive touch screen, comprises that front is provided with the ito glass substrate of layer printed circuit board, and the layer printed circuit board outer surface is pasted with the PET film.The preparation method of above-mentioned capacitive touch screen also is provided, comprises: the binding step, moulding layer printed circuit board on ito glass substrate, then flexible PCB is tied on ito glass substrate and is connected with layer printed circuit board; Step of membrane sticking, be attached to PET film surface by optical cement, and the PET film is cut into to the small pieces suitable with the ito glass substrate size, and the PET film of small pieces is attached to layer printed circuit board outer surface on ito glass substrate.This invention replaces the traditional glass cover plate with the PET film, and equipment and the technological operation of bonding process are greatly simplified, and cost is low, and efficiency is high, is applicable to producing in enormous quantities; The laminating of PET film belongs to the hard mode of soft subsides, and product yield can reach more than 99%.
Summary of the invention
The purpose of this utility model is for the complicacy of the binding operation that how in making capacitance touch screen module process, to reduce flexible circuit board and capacitance plate, reduction manufacturing technology, enhances productivity and the problems such as product yield, reduction module production cost, and a kind of capacitive touch screen module is provided.
The utility model is provided with substrate, cover plate and flexible circuit board (FPC);
Deposit lower nesa coating on the lower surface of described substrate, be prepared with lower circuit pattern and lower conductive electrode on lower nesa coating, deposit nesa coating on the upper surface of described substrate, be prepared with circuit pattern and upper conductive electrode on upper nesa coating; Described cover plate is provided with transparent insulating layer, at the non-visible area of described cover plate, is prepared with color coating, is provided with external electrode on color coating; Described cover plate is by transparent insulating layer and the laminating of lower nesa coating, and external electrode contact corresponding to lower conductive electrode connects; Be equipped with conductive adhesive layer on external electrode and upper conductive electrode; Described flexible circuit board (FPC) and upper conductive electrode and external electrode binding.
Described substrate can adopt a kind of in armourplate glass, strengthening glass sheets, simple glass plate, macromolecular material transparent panel etc.
Described cover plate can adopt a kind of in armourplate glass, strengthening glass sheets, simple glass plate, macromolecular material transparent panel etc.
Described nesa coating can adopt ITO film, graphene film, carbon nano-tube and transparent conductive material film etc. to be prepared from.
Described color coating can adopt ink coating, gloss oil coating or versicolor frame adhesive coating etc.
The material that ability is strong is led in the optional electricity consumption of described external electrode material, as carbon slurry or silver slurry etc.
Described transparent insulation glue can be selected the various UV glue of OCA, LOCA, OCR etc.
Described conductive adhesive layer can be selected ACF, ACP, ACA glue etc.
The utility model can adopt the following methods preparation:
1) on the lower surface of substrate the deposition under nesa coating, deposit nesa coating on the upper surface of substrate;
2) preparation circuit pattern layer and lower conductive electrode on lower nesa coating, preparation circuit pattern layer and upper conductive electrode on upper nesa coating;
3) the non-visible area at cover plate prepares one deck color coating;
4) prepare external electrode on the color coating surface; The described method for preparing external electrode on the color coating surface can be passed through silk-screen printing technique, and the effect of external electrode is for connecting outside control circuit;
5) on the cover board prepare the transparent insulation glue-line; Described transparent insulation glue-line and external electrode preferably in same level with after guaranteeing the laminating of substrate and cover plate in the opposing parallel state;
6), after the product eliminates bubble, substrate is fitted with cover plate and conductive electrode contact corresponding to external electrode is connected, normal in transmission to guarantee electric signal;
7) prepare conductive adhesive layer on the upper conductive electrode of external electrode on the cover board and substrate;
8) flexible circuit board (FPC) and upper conductive electrode and external electrode are bound, obtained the capacitive touch screen module.Described upper conductive electrode and external electrode are in the same side of cover plate, so flexible circuit board (FPC) can disposablely complete with the binding of substrate.
The utility model is deposition of transparent conductive film on two surfaces of substrate, and prepares corresponding transparent pattern layer and conductive electrode on described nesa coating; On the cover board non-visible area prepares color coating, and prepares external electrode on described color coating; Except described external electrode, prepare the transparent insulation glue-line on described cover plate; Described substrate and the laminating of described cover plate, and the lip-deep described conductive electrode of described substrate one is connected with the corresponding contact of described external electrode on described substrate; Be prepared with conductive adhesive layer on the described conductive electrode on another surface of described substrate and on the described external electrode of described cover plate; Finally, be prepared with flexible circuit board (FPC) on described conductive adhesive layer.
Due to the described conductive electrode of the described external electrode of described cover plate and described substrate the same side at described cover plate, described FPC can realize by a hot pressing with being connected of described conductive electrode: the part be connected is on the described external electrode of described cover plate, and another part is on the described conductive electrode of described substrate.After described substrate and the laminating of described cover plate, also to be eliminated bubble and be processed.
The accompanying drawing explanation
The structure composition diagram that Fig. 1 is substrate, nesa coating and upper nesa coating.
The structure that Fig. 2 is upper nesa coating, lower conductive electrode and upper conductive electrode forms planimetric map.
The A-A sectional view that Fig. 3 is Fig. 2.
In Fig. 2 and 3, the dotted line frame is lower conductive electrode, and solid box is upper conductive electrode.
Fig. 4 is the color coating planimetric map.In Fig. 4, dash area is non-visible area.
The B-B sectional view that Fig. 5 is Fig. 4.
The structure that Fig. 6 is color coating and external electrode forms planimetric map.
The C-C sectional view that Fig. 7 is Fig. 6.
The structure that Fig. 8 is transparent insulation glue-line, external electrode and color coating forms planimetric map.
The D-D sectional view that Fig. 9 is Fig. 8.
The structure that Figure 10 is color coating, upper nesa coating, external electrode, conductive electrode and upper conductive electrode forms planimetric map.
The E-E sectional view that Figure 11 is Figure 10.
The structure that Figure 12 is color coating, upper nesa coating, conductive adhesive layer and conductive electrode forms planimetric map.
The F-F sectional view that Figure 13 is Figure 12.
The structure that Figure 14 is color coating, upper nesa coating, flexible circuit board (FPC) and conductive electrode forms planimetric map.
The G-G sectional view that Figure 15 is Figure 14.
Embodiment
As shown in Fig. 1～15, the utility model embodiment is provided with substrate 008, cover plate 001 and flexible circuit board (FPC) 011.Deposit lower nesa coating 007 on the lower surface of described substrate 008, be prepared with lower circuit pattern and lower conductive electrode 006 on lower nesa coating 007, deposit nesa coating 009 on the upper surface of described substrate 008, be prepared with circuit pattern and upper conductive electrode 010 on upper nesa coating 009; Described cover plate 001 is provided with transparent insulating layer 004, at the non-visible area of described cover plate 001, is prepared with color coating 002, is provided with external electrode 003 on color coating 002; Described cover plate 001 is by transparent insulating layer 004 and lower nesa coating 007 laminating, and external electrode 003 contact corresponding to lower conductive electrode 006 connects; Be equipped with conductive adhesive layer 005 on external electrode 003 and upper conductive electrode 010; Described flexible circuit board (FPC) 011 and upper conductive electrode 010 and external electrode 003 binding.
The utility model can adopt the following methods preparation:
1) on the lower surface of substrate 008 deposition under nesa coating 007, deposit nesa coating 009 on the upper surface of substrate 008, as shown in Figure 1;
2) preparation circuit pattern layer and lower conductive electrode 006 on lower nesa coating 007, on upper nesa coating 009, as shown in Figures 2 and 3, Fig. 2 is planimetric map for preparation circuit pattern layer and upper conductive electrode 010(, Fig. 3 is sectional view; The dotted line frame is lower conductive electrode 006, and solid box is upper conductive electrode 010);
3) dash area in the non-visible area of cover plate 001 prepares one deck color coating 002(Fig. 4 is non-visible area, and Fig. 4 is planimetric map, and Fig. 5 is sectional view);
4) prepare external electrode 003 on color coating 002 surface; The described method for preparing external electrode 003 on color coating 002 surface can be passed through silk-screen printing technique, and the effect of external electrode 003 is that Fig. 6 is planimetric map for connecting outside control circuit, and Fig. 7 is sectional view.
5) prepare transparent insulation glue-line 004 on cover plate 001; Described transparent insulation glue-line 004 and external electrode 003 preferably in same level with after guaranteeing substrate 008 and cover plate 001 laminating in the opposing parallel state; Described transparent insulation glue-line 004 can adopt OCA glue because this glue have transmittance good, high temperature resistant, be difficult for the advantages such as yellow is rotten; In Fig. 8, in the dotted line frame, be transparent insulation glue-line 004; Fig. 8 is planimetric map, and Fig. 9 is sectional view.
6) after the product eliminates bubble, substrate 008 is fitted with cover plate 001 and conductive electrode 006 contact corresponding to external electrode 003 is connected, normal in transmission to guarantee electric signal, Figure 10 is planimetric map, and Figure 11 is sectional view.
7) prepare conductive adhesive layer 005 on the upper conductive electrode 010 of the external electrode on cover plate 001 003 and substrate 008; Described conductive adhesive layer 005 can adopt ACF glue, and the characteristics of this glue are Z axis electrically conductings and, in XY plane insulation, Figure 12 is planimetric map, and Figure 13 is sectional view.
8) flexible circuit board (FPC) 011 and upper conductive electrode 010 and external electrode 003 are bound, obtained the capacitive touch screen module.Described upper conductive electrode 010 and external electrode 003 are in the same side of cover plate 001, so flexible circuit board (FPC) 011 can disposablely complete with the binding of substrate 008; Figure 14 is planimetric map, and Figure 15 is sectional view.
Described substrate can adopt a kind of in armourplate glass, strengthening glass sheets, simple glass plate, macromolecular material transparent panel etc.
Described cover plate can adopt a kind of in armourplate glass, strengthening glass sheets, simple glass plate, macromolecular material transparent panel etc.
Described nesa coating can adopt ITO film, graphene film, carbon nano-tube and transparent conductive material film etc. to be prepared from.
Described color coating can adopt ink coating, gloss oil coating or versicolor frame adhesive coating etc.
The material that ability is strong is led in the optional electricity consumption of described external electrode material, as carbon slurry or silver slurry etc.
Described transparent insulation glue can be selected the various UV glue of OCA, LOCA, OCR etc.
Described conductive adhesive layer can be selected ACF, ACP, ACA glue etc.
The shape of described external conductive electrode and described conductive electrode can be rectangle, square, circle, ellipse etc.
Claims (1)
1. a capacitive touch screen module, is characterized in that being provided with substrate, cover plate and flexible circuit board;
Deposit lower nesa coating on the lower surface of described substrate, be prepared with lower circuit pattern and lower conductive electrode on lower nesa coating, deposit nesa coating on the upper surface of described substrate, be prepared with circuit pattern and upper conductive electrode on upper nesa coating; Described cover plate is provided with transparent insulating layer, at the non-visible area of described cover plate, is prepared with color coating, is provided with external electrode on color coating; Described cover plate is by transparent insulating layer and the laminating of lower nesa coating, and external electrode contact corresponding to lower conductive electrode connects; Be equipped with conductive adhesive layer on external electrode and upper conductive electrode; Described flexible circuit board and upper conductive electrode and external electrode binding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320345707 CN203350849U (en) | 2013-06-15 | 2013-06-15 | Capacitor type touch screen module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320345707 CN203350849U (en) | 2013-06-15 | 2013-06-15 | Capacitor type touch screen module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203350849U true CN203350849U (en) | 2013-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320345707 Expired - Fee Related CN203350849U (en) | 2013-06-15 | 2013-06-15 | Capacitor type touch screen module |
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| Country | Link |
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| CN (1) | CN203350849U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110032298A (en) * | 2018-01-11 | 2019-07-19 | 苏州欧菲光科技有限公司 | Capacitive touch screen and preparation method thereof |
-
2013
- 2013-06-15 CN CN 201320345707 patent/CN203350849U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110032298A (en) * | 2018-01-11 | 2019-07-19 | 苏州欧菲光科技有限公司 | Capacitive touch screen and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131218 Termination date: 20200615 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |