CN2735377Y - Flip chip structure - Google Patents

Flip chip structure Download PDF

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Publication number
CN2735377Y
CN2735377Y CNU2004200836937U CN200420083693U CN2735377Y CN 2735377 Y CN2735377 Y CN 2735377Y CN U2004200836937 U CNU2004200836937 U CN U2004200836937U CN 200420083693 U CN200420083693 U CN 200420083693U CN 2735377 Y CN2735377 Y CN 2735377Y
Authority
CN
China
Prior art keywords
chip
driving
substrate
flip chip
function
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2004200836937U
Other languages
Chinese (zh)
Inventor
柯炳宏
黄茂源
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Innolux Corp
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Innolux Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Innolux Corp filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNU2004200836937U priority Critical patent/CN2735377Y/en
Application granted granted Critical
Publication of CN2735377Y publication Critical patent/CN2735377Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Abstract

The utility model provides a flip chip structure, comprising a driving chip, a base plate by which the driving chip is born and a conductive film with a different direction used for connecting the driving chip and the base plate. The surface of the driving chip corresponding to the base plate is provided with a plurality of function lugs, the bearing surface of the base plate is provided with a plurality of function conductivity gaskets corresponding to the number and the positions of the function lugs of the driving chip. The driving chip is further provided with dummy function lugs corresponding to the four corners of the surface of the base plate, and the bearing surface of the base plate is further provided with dummy function conductivity gaskets whose number and positions are corresponding to the number and the positions of the dummy function lugs of the driving chip. The liquid crystal display provided with the flip chip structure of the utility model can assure the excellent electrically connecting of the product.

Description

Flip chip structure
[technical field]
The utility model relates to a kind of flip chip structure, especially relates to a kind of LCD device drive chip (Integrated Circuit, IC) Feng Zhuan flip chip structure of being used for.
[background technology]
LCD since its compare with triniscope (Cathode Ray Tube) have low voltage drive, low-power consumption, the capacity of display are big, hang down radiation and frivolous advantage, various audio-visual devices and communication apparatus have been widely used in, the packaged type of its chip for driving is also by early stage routing encapsulation technology (Chip on Board, COB), the automatic joining technique of winding (TapeAutomated Bonding, TAB) develop into glass flip chip of today (Chip on Glass, COG) and pad cover crystalline substance (Chip on Film COF) wait the packaged type of flip chip structure.
Seeing also Fig. 1, is a kind of glass flip chip structural representation of prior art.This glass flip chip structure 1 comprises a chip for driving 11, carry the glass substrate 13 and the Anisotropically conductive film (Anisotropic Conductor Film) 12 that is used to be connected this chip for driving 11 and this glass substrate 13 of this chip for driving 11, the surface 110 of these chip for driving 11 relative these glass substrates 13 has a plurality of function projections (Function Bump) 111, the loading end 130 of this glass substrate 13 has the corresponding functional conductive pad (Function Conductor Pattern) 131 of function projection 111 numbers and position a plurality of and chip for driving 11, and this Anisotropically conductive film 12 is made up of binder 121 and the conducting particles 122 that is positioned at wherein.This glass flip chip structure 1 is carried out crimping, and the function projection 111 of this chip for driving 11 can be realized conducting by the conducting particles 122 of this Anisotropically conductive film 12 with 131 on the functional conductive pad of glass substrate 13.
Please consult Fig. 2 together, the crimping process of this glass flip chip structure 1 comprises: glass substrate 13 is provided, and the loading end 130 of this glass substrate 13 has a plurality of functional conductive pads 131; Anisotropically conductive film 12 is pasted loading end 130 at this glass substrate 13; This chip for driving 11 is placed on this Anisotropically conductive film 12, have a plurality of function projections 111 on the surface 110 of these chip for driving 11 relative these glass substrates 13, these a plurality of function projections 111 are corresponding with a plurality of functional conductive pads 131 on the loading end 130 of glass substrate 13 respectively; Under uniform temperature, speed and pressure condition, said structure is carried out precompressed and this press operation, make the function projection 111 of chip for driving 11 realize electrically connecting by the conducting particles 122 of this Anisotropically conductive film 12, and chip for driving 11 and glass substrate 13 are binded by binder 121 with the functional conductive pad 131 of glass substrate 11.Usually, after finishing, this crimping process needs the stress relief that produces in the crimping process, yet because these chip for driving 11 length are longer, material stress is distributed in four corners of chip for driving 11, make the impression in encapsulation rear drive chip 11 4 corners not obvious, be that function projection 111 on chip for driving 11 4 corners is relatively poor with the electric connection effect of the functional conductive pad 131 of corresponding glass substrate 13, even connection failure, influence the stability and the reliability of product.Though, adopt reducing parameters such as this pressures temperature, this pressure speed in the actual engineering and improve the unconspicuous situation of this impression, it is failed thoroughly to solve stress distribution all the time and causes in four corners that impression is not obvious, the relatively poor problem of electric connection effect.
[utility model content]
The glass flip chip structure electrically connects poor defective in the prior art in order to overcome, and the utility model provides a kind of preferable flip chip structure that electrically connects.
The technical scheme that the utility model technical solution problem is adopted is: a kind of glass flip chip structure is provided, it comprises a chip for driving, one the carrying this chip for driving substrate be used for the Anisotropically conductive film that this chip for driving is connected with this substrate, this chip for driving surface of this substrate relatively has a plurality of function projections, the loading end of this substrate has a plurality of and chip for driving function projection number and position corresponding function conductive spacer, this chip for driving four corners on the surface of this substrate relatively further has mute function projection (Dummy Bump), and the loading end of this substrate further has and mute function projection number of chip for driving and the corresponding mute functional conductive pad (Dummy Conductor Pattern) in position.
Compared with prior art, the utility model flip chip structure is owing to further be provided with four corners of mute function projection in chip for driving, be connected with the mute functional conductive pad of substrate by the Anisotropically conductive pad function projection of will making mute, can effectively reduce or eliminate the destruction of material stress to function projection and the electric connection of functional conductive pad, therefore it is more reliable function projection and functional conductive pad to be electrically connected, and guarantees that product electrically connects preferable and good stable.
[description of drawings]
Fig. 1 is a kind of glass flip chip structural representation of prior art.
Fig. 2 is the crimping synoptic diagram of glass flip chip structure shown in Figure 1.
Fig. 3 is the synoptic diagram of the utility model flip chip structure.
Fig. 4 is the function projection of Fig. 3 chip for driving and the distribution schematic diagram of mute function projection.
Fig. 5 is the crimping procedure chart of the utility model flip chip structure.
Fig. 6 is the anti-failure synoptic diagram that electrically connects of Fig. 3 flip chip structure.
[embodiment]
Seeing also Fig. 3, is the synoptic diagram of the utility model flip chip structure.This flip chip structure 2 comprises a chip for driving 21, carry the glass substrate 23 and the Anisotropically conductive film 22 that is used to be connected this chip for driving 21 and this glass substrate 23 of this chip for driving 21, wherein this chip for driving 21 is elongated, the surface 210 of its relative glass substrate 23 has a plurality of equally distributed function projections 211 and mute function projection 212, the function projection 212 of should making mute is distributed in four corners of this chip for driving 21, the loading end 230 of this glass substrate 23 have a plurality of respectively with the function projection 211 of chip for driving 21 and the corresponding functional conductive pad 231 and mute functional conductive pad 232 of mute function projection 212 numbers and position, this Anisotropically conductive film 22 is made up of binder 221 and the conducting particles 222 that is positioned at wherein.This flip chip structure 2 is carried out crimping, and the function projection 211 of chip for driving 21 is realized conducting with the functional conductive pad 231 of glass substrate 23 by this Anisotropically conductive film 22, and mute function projection 212 is realized being connected with mute functional conductive pad 232.
Please consult Fig. 4 together, this chip for driving 21 is elongated, this function projection 211 is evenly distributed on the surface 210 of chip for driving 21 relative glass substrates 23 (Fig. 4 does not show) with mute function projection 212, the function projection 212 of should making mute is distributed in four corners of chip for driving 21, each corner of this chip for driving 21 comprises at least one mute function projection 212, this function projection 211 is consistent with mute function projection 212 external forms and size, its shape is square or circular, and according to the demand of cost or function projection 211 with mute function projection 212 pitches (Pitch), this function projection 211 also can be different with mute function projection 212 external forms and size.
See also Fig. 5, the crimping process of the utility model flip chip structure 2 comprises: glass substrate 23 is provided, has a plurality of functional conductive pads 231 and mute functional conductive pad 232 on the loading end 230 of this glass substrate 23; Anisotropically conductive film 22 is pasted on the loading end 230 of this glass substrate 23; This chip for driving 21 is placed on this Anisotropically conductive film 22, wherein, this chip for driving 21 is elongated, have a plurality of equally distributed function projections 211 and mute function projection 212 on the surface 210 of its relative glass substrate 23, the function projection 212 of should making mute is distributed in four corners of this chip for driving 21, and the number of this function projection 211 and mute function projection 212 and position correspond respectively to functional conductive pad 231 and mute functional conductive pad 232; Under uniform temperature, speed and pressure condition, this flip chip structure 2 is carried out precompressed and this press operation, the function projection 211 of chip for driving 21 is realized electrically connecting by the conducting particles 222 of this Anisotropically conductive film 22 with the functional conductive pad 231 of glass substrate 23, mute simultaneously function projection 212 is realized being connected by Anisotropically conductive film 22 with mute functional conductive pad 232, to realize the bonding of chip for driving 21 and glass substrate 23.
Seeing also Fig. 6, is the utility model flip chip structure 2 anti-failure synoptic diagram that electrically connect.This chip for driving 21 is in uniform temperature, following and glass substrate 23 bondings of speed and pressure condition, because these chip for driving 21 length are longer, the residual stress distribution that exists is in four corners of this chip for driving 21, to connect effects relatively poor so four corners of this chip for driving 21 may produce its corresponding mute functional conductive pads 232 of mute function projection 212 of four corners that deformation makes the surface 210 of chip for driving 21 relative glass substrates 23, even connection failure, but this situation can't influence functional conductive pad 231 electric connections of function projection 211 with the glass substrate 23 of chip for driving 21, promptly mute function projection 212 positions that increase a plurality of mute function projections 212 and glass substrate 23 loading ends 230 corresponding chip for driving 21 by four corners on the surface 210 of the relative glass substrate 23 of chip for driving 21 increase the mute functional conductive pad 232 of corresponding number, effectively reduce or eliminate the destruction that material stress electrically connects function projection 211 and functional conductive pad 231, thereby guarantee that product electrically connects preferable and good stable.
This flip chip structure 2 can be used as the chip for driving packing forms, is used for LCD.The function projection 211 of this chip for driving 21 can be conductive materials such as gold or leypewter with the material of mute function projection 212.
Certainly, the substrate of the carrying chip for driving 21 of this utility model flip chip structure 2 also can be substrate or the resin film that resin material is made, and therefore, this flip chip structure 2 also can be applied to pad and cover packaged types such as crystalline substance.

Claims (10)

1. flip chip structure, it comprises a chip for driving, one the carrying this chip for driving substrate be used for the Anisotropically conductive film that this chip for driving is connected with this substrate, this chip for driving surface of this substrate relatively has a plurality of function projections, the loading end of this substrate has a plurality of and chip for driving function projection number and position corresponding function conductive spacer, it is characterized in that: this chip for driving four corners on the surface of this substrate relatively further has mute function projection, and the loading end of this substrate further has and mute function projection number of chip for driving and the corresponding mute functional conductive pad in position.
2. glass flip chip structure as claimed in claim 1 is characterized in that: this chip for driving is connected with glass substrate.
3. glass flip chip structure as claimed in claim 1 is characterized in that: this chip for driving is connected with resin substrate.
4. glass flip chip structure as claimed in claim 1 is characterized in that: this chip for driving is connected with resin film.
5. glass flip chip structure as claimed in claim 1 is characterized in that: the function projection of this chip for driving and mute function projection are even distributions.
6. glass flip chip structure as claimed in claim 1 is characterized in that: this chip for driving shape is a strip.
7. glass flip chip structure as claimed in claim 1 is characterized in that: the function projection of this chip for driving and mute function projection are square or round bump.
8. glass flip chip structure as claimed in claim 1 is characterized in that: this Anisotropically conductive film is made up of binder and the conducting particles that is positioned at wherein.
9. glass flip chip structure as claimed in claim 8 is characterized in that: this chip for driving and substrate are by the binder bonding connection of Anisotropically conductive film.
10. glass flip chip structure as claimed in claim 8 is characterized in that: this chip for driving and substrate are that the conducting particles by the Anisotropically conductive film electrically connects.
CNU2004200836937U 2004-08-31 2004-08-31 Flip chip structure Expired - Lifetime CN2735377Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2004200836937U CN2735377Y (en) 2004-08-31 2004-08-31 Flip chip structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2004200836937U CN2735377Y (en) 2004-08-31 2004-08-31 Flip chip structure

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CN2735377Y true CN2735377Y (en) 2005-10-19

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103079343A (en) * 2011-10-26 2013-05-01 日立化成工业株式会社 Circuit component
CN104470210A (en) * 2014-12-31 2015-03-25 京东方科技集团股份有限公司 Circuit board, manufacturing method of circuit board and display device of circuit board
CN106658988A (en) * 2017-02-07 2017-05-10 武汉华星光电技术有限公司 Display, circuit board, and pin structure of circuit board
CN110752194A (en) * 2018-07-23 2020-02-04 美科米尚技术有限公司 Micro-adhesive structures and methods of forming the same
CN111009501A (en) * 2019-08-27 2020-04-14 武汉华星光电半导体显示技术有限公司 Chip binding structure

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103079343A (en) * 2011-10-26 2013-05-01 日立化成工业株式会社 Circuit component
CN104470210A (en) * 2014-12-31 2015-03-25 京东方科技集团股份有限公司 Circuit board, manufacturing method of circuit board and display device of circuit board
CN106658988A (en) * 2017-02-07 2017-05-10 武汉华星光电技术有限公司 Display, circuit board, and pin structure of circuit board
WO2018145341A1 (en) * 2017-02-07 2018-08-16 武汉华星光电技术有限公司 Display, wiring board and pin structure thereof
CN110752194A (en) * 2018-07-23 2020-02-04 美科米尚技术有限公司 Micro-adhesive structures and methods of forming the same
CN110752194B (en) * 2018-07-23 2023-11-28 美科米尚技术有限公司 Micro-adhesive structure and method of forming the same
CN111009501A (en) * 2019-08-27 2020-04-14 武汉华星光电半导体显示技术有限公司 Chip binding structure

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20140831

Granted publication date: 20051019