CN101539690A - Substrate electrode structure and connected structure using same and drive element - Google Patents
Substrate electrode structure and connected structure using same and drive element Download PDFInfo
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- CN101539690A CN101539690A CN200810085763A CN200810085763A CN101539690A CN 101539690 A CN101539690 A CN 101539690A CN 200810085763 A CN200810085763 A CN 200810085763A CN 200810085763 A CN200810085763 A CN 200810085763A CN 101539690 A CN101539690 A CN 101539690A
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Abstract
The invention relates to a substrate electrode structure and a connected structure using the same and a drive element. The width of connected areas for external connection on a substrate electrode is less than a signal circuit area for a liquid crystal display pixel so as to enlarge the space between the connected areas; and the width of the connected areas is less than that of a lug so as to reduce the influence of compression joint contraposition deviation. Under the condition of not influencing the electrical connection effect, the assembly easiness is increased, and the yield influencing an integral liquid crystal display module is promoted.
Description
Technical field
The present invention relates to a kind of electrode of substrate structure and use it and the connected structure of driving element, particularly on the glass substrate with the electrode structure of drive engages.
Background technology
LCD has big, low radiation of low voltage drive, little power consumption, the capacity of display and characteristic such as frivolous, so be widely used in various audio-visual devices and communication apparatus.The packaged type of the driving element of LCD also directly encapsulates (Chip onBoard by early stage chip, COB), coil type encapsulation (Tape Carrier Bonding, TAB) develop into glass flip chip of today (Chip on Glass, COG), membrane of flip chip (Chip on Film, packaged type such as COF), this kind encapsulation technology then need be utilized the abutting end of projection as driving element.
See also Fig. 1, the driving element of general LCD and the connected structure of substrate comprise: a driving element 11, an Anisotropically conductive film 12 and a glass substrate 13.Have a plurality of projections 111 on this driving element 11, and has electrode of substrate 14 a plurality of and these projection 111 corresponding numbers and position on this glass substrate 13, (AnisotropicConductive Film, ACF) 12 are made up of binder (binder) 121 and the conducting particles (conductive particles) 122 that is positioned at wherein this Anisotropically conductive film.This chip package (glass flip chip) structure is to make the projection 111 of this driving element 11 and the electrode of substrate 14 crimping conductings on the glass substrate 13 by this Anisotropically conductive film 12.
This crimping mode is this glass substrate 13 at first to be provided, and to have these electrode of substrate 14 on this glass substrate 13; This Anisotropically conductive film 12 is covered on this glass substrate 13; This driving element 11 is placed on this Anisotropically conductive film 12, and these projections 111 on this driving element 11 are corresponding with these electrode of substrate 14 on the glass substrate 13 respectively.Then under uniform temperature, speed and pressure condition, said structure is carried out precompressed and this pressure (mainbonding) operation, make the projection 111 of this driving element 11 realize being electrically connected with the electrode of substrate 14 of this glass substrate 13, and this driving element 11 and this glass substrate 13 are binded by binder 121 by crushing partially conductive particle 122.
The principal feature of this Anisotropically conductive film 12 is that Z axle (thickness) direction conducts, and the characteristic that horizontal direction is not conducted, therefore as long as conducting particles 122 reaches little or mutually insulated is proper, can reach the joint effect of 111 thin spaces of each projection (fine pitch).
Because LCD is used towards more high-resolution demonstration at present, it is intensive more to face electrode of substrate 14, the pin of this driving element 11 (pin) number is also more and more, just not only on the driving element 11 the aggregation degree of circuit more and more high, the number of these projections 111 is also more and more.So the deviser is for reducing the shared space of projection 111 spacings (pitch), the spacing that will remove to dwindle 111 of each projections if projection 111 spacings can't effectively reduce, will limit the ability that driving element 11 sizes are dwindled.
As Fig. 2, be the projection 111 of general driving element 11 and the arrangement contraposition synoptic diagram of electrode of substrate 14.Electrode of substrate 14 on now general this glass substrate 13 is divided into the signal line district 142 that liquid crystal display pixel is used, and is used for the bonding land 141 that these projections 111 are connected, and all is that in-line arrangement is arranged side by side.The width of supposing this projection 111 is A1, and the width of the bonding land 141 of electrode of substrate 14 is D1, and the spacing that projection is 111 is C1, and the spacing in the adjacent bond district 141 of electrode of substrate 14 is B1.A1=D1 wherein, B1=C1, and the spacing B1 in the adjacent bond district 141 of this electrode of substrate 14 is big more, the yield of display panels is high more; The spacing C1 that projection is 111 is big more, projection 111 and electrode of substrate 14 to engage yield high more.
In being connected of the projection 111 of general standard and electrode of substrate 14, need crush the conducting particles 122 more than five, so generally each projection 111 has surface area 1500～2000 μ m approximately
2With being electrically connected with this electrode of substrate 14.
But, because general electrode of substrate 14 exposure imagings and etched tolerance are ± 3 μ m (some is poorer to ± 5 μ m), and the crimping board tolerance that the projection 111 of this driving element 11 of crimping engages with electrode of substrate 14 is ± 3 μ m (some is to ± 5 μ m), the diameter minimum of adding present conducting particles 122 is 3 μ m, if so the spacing B1 of 14 of the spacing C1 of 111 of projections and electrode of substrate has only 9 μ m short circuits easily, general spacing B1 and the minimum distance that 10 μ m will be arranged of C1.
Comprehensively above-mentioned, spacing B1 111 of the projections of this driving element 11 is too small, under existing electrode of substrate 14 exposure imagings and etching condition of poor, under the error condition of crimping, may cause the crimping area of 111 of electrode of substrate 14 and projections not enough, cause not having good electrical connection effect, influence the yield of whole LCD MODULE.
Summary of the invention
So, fundamental purpose of the present invention is to solve the configuration relation of the projection on the driving element and the electrode of substrate on the substrate on the display panels, at existing electrode of substrate exposure imaging and etching technique, the crimping error that solves between electrode of substrate and projection is excessive, the problem that assembling is difficult for promotes the yield that influences whole LCD MODULE.
The technical scheme that technical solution problem of the present invention is adopted is, at being applied in the LCD structure of all electrode of substrate on the glass substrate, it is characterized in that: the bonding land that described electrode of substrate is divided into the signal line district that liquid crystal display pixel uses and is used for externally connecting, and the width of this bonding land is less than the width in this signal line district, thereby can strengthen the spacing between the bonding land of these electrode of substrate.
And with the engaging of driving element, this driving element is by the joint of Anisotropically conductive film and the electrode of substrate on this glass substrate, be electrically connected with these bonding lands respectively by a plurality of projections on this driving element, and the width of this bonding land is less than the width of this projection.Wherein the bonding land of these electrode of substrate is isometric side by side, and these projections on this driving element are isometric side by side.Or further the bonding land of these electrode of substrate is not isometric side by side staggered, and these projections on this driving element are isometric side by side staggered, thereby adds the alternate distance in the big protruding block left and right sides.
The invention has the beneficial effects as follows width by the bonding land that dwindles this electrode of substrate, enlarge the spacing in the adjacent bond district of this electrode of substrate, and make under the width situation of width less than this projection of this bonding land, under existing electrode of substrate exposure imaging and etching technique, reduce the influence of crimping contraposition deviation, the bonding land that makes this electrode of substrate all can with the projection crimping, and add the alternate distance in the big protruding block left and right sides, short-circuit conditions during the bonding land crimping that can remove projection and electrode of substrate, do not influencing under the situation that is electrically connected effect, increase the easness of assembling, promote the yield of the whole LCD MODULE of influence.
Description of drawings
Fig. 1 is the known drive element and the synoptic diagram that engages of electrode of substrate.
Fig. 2 is the projection of known drive element and the arrangement contraposition synoptic diagram of electrode of substrate.
Fig. 3 is a driving element of the present invention and the synoptic diagram that engages of electrode of substrate.
Fig. 4 is the projection of driving element of the present invention and the arrangement contraposition synoptic diagram of electrode of substrate.
Fig. 5 is that the projection of driving element of the present invention and the another kind of electrode of substrate are arranged the contraposition synoptic diagram.
Embodiment
Relevant detailed content of the present invention and technical descriptioon now are described further with embodiment, but will be appreciated that these embodiment are the usefulness for illustrating only, and should not be interpreted as restriction of the invention process.
See also the 3rd figure, the present invention is with known identical in the enforcement that engages, and its structure comprises: a driving element 21, an Anisotropically conductive film 22 and a glass substrate 23.Have a plurality of projections 211 on this driving element 21, and the electrode of substrate 24 that has a plurality of and these projection 211 corresponding numbers and position on this glass substrate 23, wherein the material of this electrode of substrate 24 be selected from indium tin oxide (ITO), aluminium zinc oxide (AZO), indium-zinc oxide (IZO) and cadmium tin-oxide (CdSnO) at least one of them.This Anisotropically conductive film (ACF) 22 is made up of binder 221 and the conducting particles 222 that is positioned at wherein.This chip package (glass flip chip) structure is to make the projection 211 of this driving element 21 and the electrode of substrate 24 crimping conductings on the glass substrate 23 by this Anisotropically conductive film 22.
Please consult shown in Figure 4 again, it is the arrangement contraposition synoptic diagram of these electrode of substrate 24 on projection 211 and this glass substrate 23 of this driving element 21 in the embodiment of the invention, it is characterized in that these electrode of substrate 24 are divided into the signal line district 242 that liquid crystal display pixel is used, reach one and be used for the externally bonding land 241 of connection, and the width D 2 of this bonding land 241 is less than the width in this signal line district 242, thereby can strengthen the spacing B2 of 241 of the bonding lands of these electrode of substrate 24.And engaging at the projection 211 of these electrode of substrate 24 and this driving element 21, the width D 2 of this bonding land 241 is less than the width A2 of this projection 211, wherein the bonding land 241 of these electrode of substrate 24 is isometric arranged side by side, and these projections 211 on this driving element 21 also are isometric arranged side by side.
According to aforementioned enforcement of the present invention, under the width A2 of these projections 211 situation identical (A1=A2), under the situation that the spacing C2 of 211 of these projections is identical with the spacing C1 of 111 of known these projections in the embodiment of the invention (C1=C2) with the width A1 of known these projections 111.And, signal line district 242 width in the embodiment of the invention on these electrode of substrate 24 are with known identical, but the width D 2 of its bonding land 241 is less than the width in this signal line district 242, is D1 (D2＜D1) less than the width of the bonding land 141 of known electrode of substrate 14 just; And, the spacing B2 in the adjacent bond district 241 of this electrode of substrate 24 is greater than the spacing B1 in known adjacent bond district 141 (B2＞B1) in the embodiment of the invention, and in the width D 2 of this bonding land 241 (under the situation of A2＞D2), the present invention enlarges the spacing B2 in the adjacent bond district 241 of this electrode of substrate 24 less than the width A2 of this projection 211.Under the width A2 situation of width D 2 less than this projection 211 of this bonding land 241, under electrode of substrate 24 exposure imagings and etching technique, the present invention can reduce the influence of crimping contraposition deviation, the bonding land 241 that makes this electrode of substrate 24 all can with projection 211 crimping, do not influence under the situation that is electrically connected effect with projection 211 areas in bonding land 241, can increase the easness of assembling, promote the yield of the whole LCD MODULE of influence.
Please consult shown in Figure 5 again, another embodiment of the present invention is, the width D 3 of this bonding land 241 is less than the width in this signal line district 242, strengthen the spacing B3 of 241 of the bonding lands of these electrode of substrate 24, the width D 3 of this bonding land 241 is less than the width A3 of this projection 211, and the bonding land 241 of these electrode of substrate 24 is for not isometric side by side staggered, and these projections 211 on this driving element 21 are isometric side by side staggered.
Thereby embodiment, at the width D 3 of its bonding land 241 width less than this signal line district 242, under the condition of identical with last embodiment (D3=D2), though the width A3 of these projections 211 identical with last embodiment (A3=A2), and under the situation of the spacing B3 in the adjacent bond district 241 of these electrode of substrate 24 identical with last embodiment (B3=B2).But the bonding land 241 at these electrode of substrate 24 does not interlock side by side for isometric, and under the situation of the isometric staggered arrangement contrapositions arranged side by side of these projections on this driving element 21 211, the spacing C3 that these projections are 211 will become the wide width A1 that adds known these projections 111 of the spacing C1 twice of 111 of known these projections (C3=2 * C1+A1).Thereby add the alternate distance in big protruding block 211 left and right sides, the short-circuit conditions during bonding land 241 crimping that can remove 211 of these projections and electrode of substrate 24.
In sum, the width D 2 of the bonding land 241 of the present invention by dwindling this electrode of substrate 24, D3, enlarge the spacing B2 in the adjacent bond district 241 of this electrode of substrate 24, B3, and make the width D 2 of this bonding land 241, D3 is less than the width A2 of this projection 211, under the A3 situation, can reduce the influence of the crimping contraposition deviation of board, the bonding land 241 that makes this electrode of substrate 24 all can with projection 211 crimping, and be under the not isometric staggered situation arranged side by side in the bonding land 241 of these electrode of substrate 24, can further strengthen these alternate distances in projection 211 left and right sides, short-circuit conditions during bonding land 241 crimping that can remove projection 211 and electrode of substrate 24, do not influencing under the situation that is electrically connected effect, increase the easness of assembling, promote the yield of the whole LCD MODULE of influence.
Above-mentioned is the preferred embodiments of the present invention only, is not to be used for limiting scope of the invention process.Be that all equalizations of doing according to claim of the present invention change and modification, be all claim of the present invention and contain.
Claims (6)
1. electrode of substrate structure is applied in the structure of all electrode of substrate (24) on the glass substrate in the LCD (23), it is characterized in that:
The bonding land (241) that described electrode of substrate (24) is divided into the signal line district (242) that liquid crystal display pixel uses and is used for externally connecting, and the width of described bonding land (241) is less than the width in described signal line district (242).
2. electrode of substrate structure according to claim 1 is characterized in that, the bonding land (241) of described electrode of substrate (24) is isometric side by side.
3. electrode of substrate structure according to claim 1 is characterized in that, the bonding land (241) of described electrode of substrate (24) is not isometric side by side staggered.
4. the connected structure of electrode of substrate and driving element is applied in electrode of substrate (24) and driving element (21) on the glass substrate in the LCD (23) by the engaging of Anisotropically conductive film (22), and it is characterized in that:
The bonding land (241) that described electrode of substrate (24) is divided into the signal line district (242) that liquid crystal display pixel uses and is used for externally connecting, and the width of described bonding land (241) is less than the width in described signal line district (242); And
Described driving element (21) places on the described Anisotropically conductive film (22), be electrically connected with described bonding land (241) respectively by a plurality of projections (211) on the described driving element (21), and the width of described bonding land (241) is less than the width of described projection (211).
5. connected structure according to claim 4 is characterized in that, the bonding land (241) of described electrode of substrate (24) is isometric side by side, and the described projection (211) on the described driving element (21) is isometric side by side.
6. connected structure according to claim 4 is characterized in that, the bonding land (241) of described electrode of substrate (24) is not isometric side by side staggered, and the described projection (211) on the described driving element (21) is isometric side by side staggered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810085763A CN101539690A (en) | 2008-03-20 | 2008-03-20 | Substrate electrode structure and connected structure using same and drive element |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810085763A CN101539690A (en) | 2008-03-20 | 2008-03-20 | Substrate electrode structure and connected structure using same and drive element |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104808451A (en) * | 2015-05-15 | 2015-07-29 | 合肥京东方光电科技有限公司 | Alignment exposure method |
| CN105486333A (en) * | 2015-11-19 | 2016-04-13 | 业成光电（深圳）有限公司 | Sensor structure for handling lamination offset of bonding pads of narrow line space |
| CN106681066A (en) * | 2017-01-11 | 2017-05-17 | 京东方科技集团股份有限公司 | Liquid crystal grating and stereoscopic display device |
| CN113189819A (en) * | 2020-11-20 | 2021-07-30 | 友达光电股份有限公司 | Display device |
-
2008
- 2008-03-20 CN CN200810085763A patent/CN101539690A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104808451A (en) * | 2015-05-15 | 2015-07-29 | 合肥京东方光电科技有限公司 | Alignment exposure method |
| CN104808451B (en) * | 2015-05-15 | 2017-07-18 | 合肥京东方光电科技有限公司 | A kind of contraposition exposure method |
| US9715173B2 (en) | 2015-05-15 | 2017-07-25 | Boe Technology Group Co., Ltd. | Alignment exposure method and method of fabricating display substrate |
| CN105486333A (en) * | 2015-11-19 | 2016-04-13 | 业成光电（深圳）有限公司 | Sensor structure for handling lamination offset of bonding pads of narrow line space |
| CN105486333B (en) * | 2015-11-19 | 2018-08-24 | 业成光电（深圳）有限公司 | Improve the sensor structure of narrow line-spacing joint sheet pressing dislocation |
| CN106681066A (en) * | 2017-01-11 | 2017-05-17 | 京东方科技集团股份有限公司 | Liquid crystal grating and stereoscopic display device |
| CN113189819A (en) * | 2020-11-20 | 2021-07-30 | 友达光电股份有限公司 | Display device |
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Open date: 20090923 |