CN113189819A

CN113189819A - Display device

Info

Publication number: CN113189819A
Application number: CN202110494111.2A
Authority: CN
Inventors: 林宜欣
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2020-11-20
Filing date: 2021-05-07
Publication date: 2021-07-30
Anticipated expiration: 2041-05-07
Also published as: CN113189819B; TW202221392A; TWI737545B

Abstract

The invention provides a display device which comprises a first substrate, a second substrate, frame glue and a wire. The first substrate has a display area. The frame glue is positioned between the first substrate and the second substrate. The frame glue surrounds the display area of the first substrate. The conducting wire is positioned on the first substrate and at least positioned on the outer side of the frame glue. The wire includes a first conductive portion and a second conductive portion. The first conductive portion is closer to an edge of the first substrate than the second conductive portion. The width of the first conductive portion is less than the width of the second conductive portion. The first conductive portion has a thickness greater than a thickness of the second conductive portion or a cross-sectional area greater than a cross-sectional area of the second conductive portion. The display device of the invention has better quality.

Description

Display device

Technical Field

The present disclosure relates to electronic devices, and particularly to a display device.

Background

In an electronic device, the quality of the connection between conductors may directly or indirectly affect the quality of the electronic device.

Disclosure of Invention

The invention provides a display device with better quality.

The display device comprises a first substrate, a second substrate, frame glue and a wire. The first substrate has a display area. The frame glue is positioned between the first substrate and the second substrate. The frame glue surrounds the display area of the first substrate. The conducting wire is positioned on the first substrate and at least positioned on the outer side of the frame glue. The wire includes a first conductive portion and a second conductive portion. The first conductive portion is closer to an edge of the first substrate than the second conductive portion. The width of the first conductive portion is less than the width of the second conductive portion. The first conductive portion has a thickness greater than a thickness of the second conductive portion or a cross-sectional area greater than a cross-sectional area of the second conductive portion.

Based on the above, the display device of the present invention has better quality by making the width of the first conductive portion smaller than the width of the second conductive portion, and making the thickness of the first conductive portion larger than the thickness of the second conductive portion or the cross-sectional area of the first conductive portion larger than the cross-sectional area of the second conductive portion.

Drawings

Fig. 1A is a schematic partial cross-sectional view of a display device according to a first embodiment of the present invention.

Fig. 1B is a schematic partial cross-sectional view of a display device according to a first embodiment of the present invention.

Fig. 1C is a schematic top view of a portion of a display device according to a first embodiment of the invention.

Fig. 1D is a schematic partial cross-sectional view of a display device according to a first embodiment of the present invention.

Fig. 1E is a schematic partial cross-sectional view of a display device according to a first embodiment of the present invention.

Fig. 2 is a schematic top view of a portion of a display device according to a second embodiment of the invention.

Fig. 3 is a schematic top view of a portion of a display device according to a third embodiment of the invention.

The reference numerals are explained below:

100. 200, 300 display device

110 first substrate

R1 non-display area

R2 display area

110a surface

110c edge

120: second substrate

120c edge

191 frame glue

130: conducting wire

131 first conductive part

131d length

131w width

Thickness of 131h

131r cross section

131c edge

132 second conductive part

132d length

132w width

132h thickness

132r cross section

140. 141, 142 insulating layer

150. 250, 350 side electrodes

150w, 250w, 350w width

160 circuit board

164 connecting line

164w width

170 buffer structure

170d length

194 conductive adhesive layer

197 air gap

L1 first distance

L2 second distance

R3 region

X, Y, Z direction

Detailed Description

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, without departing from the spirit or scope of the present invention.

In the drawings, the size of some of the elements may be exaggerated or reduced for clarity. Like reference numerals refer to like elements throughout the specification. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physically and/or electrically connected.

It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a "first element," "member," "region," "layer" or "portion" discussed below could be termed a second element, member, region, layer or portion without departing from the teachings herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms, including "at least one" or "at least one", unless the content clearly indicates otherwise. "or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, regions integers, steps, operations, elements, components, and/or groups thereof.

Furthermore, relative terms, such as "lower" and "upper" or "left" and "right," may be used herein to describe one element's relationship to another element, as illustrated. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" can include both an orientation of "lower" and "upper," depending on the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "beneath" can encompass both an orientation of above and below. In addition, for clearly showing the directional relationship between different drawings, the corresponding direction is exemplarily shown by a Cartesian coordinate system (XYZ rectangular coordinate system) in some of the drawings, but the invention is not limited thereto.

As used herein, "substantially" includes the stated value and the average value within an acceptable range of deviation of the specified value as determined by one of ordinary skill in the art, taking into account the measurement in question and the specified amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ± 30%, ± 20%, ± 10%, ± 5%.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to cross-sectional views that are schematic illustrations of idealized embodiments. Thus, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region shown or described as flat may generally have rough and/or nonlinear features. Further, the acute angles shown may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.

Fig. 1A is a schematic partial cross-sectional view of a display device according to a first embodiment of the present invention. Fig. 1B is a schematic partial cross-sectional view of a display device according to a first embodiment of the present invention. Fig. 1C is a schematic top view of a portion of a display device according to a first embodiment of the invention. Fig. 1D is a schematic partial cross-sectional view of a display device according to a first embodiment of the present invention. Fig. 1E is a schematic partial cross-sectional view of a display device according to a first embodiment of the present invention. For example, fig. 1A may be a partial side cross-sectional view of the display device 100. Fig. 1B may be an enlarged view corresponding to the region R3 shown in fig. 1A. Fig. 1C may be a partial schematic top view of a region corresponding to region R3 shown in fig. 1A. Fig. 1D and 1E may be partial front cross-sectional schematic views of the display device 100. In addition, portions of the layers or members may be omitted from the drawings for clarity. For example, the conductive adhesive layer 194 is omitted from fig. 1C, and only a portion of the first substrate 110 and a portion of the conductive line 130 are exemplarily shown in fig. 1D or fig. 1E.

Referring to fig. 1A and 1B, the display device 100 includes a first substrate 110, a second substrate 120, a sealant 191, and a conductive line 130.

The first substrate 110 has a display region R2 and a non-display region R1. In an embodiment, a pixel array layer (not shown) may be disposed in the display region R2 of the first substrate 110. The pixel array layer may be formed of a plurality of pixel structures including active devices (e.g., transistors), passive devices (e.g., capacitors) and/or corresponding conductive lines. That is, the first substrate 110 may include a corresponding substrate and a corresponding film layer on the substrate. In an embodiment, the first substrate 110 may be referred to as an array substrate (array substrate), but the present invention is not limited thereto.

The sealant 191 is located between the first substrate 110 and the second substrate 120, and the sealant 191 surrounds the display region R2 of the first substrate 110. That is, the display region R2 of the first substrate 110 may be located inside the sealant 191. In the embodiment, the non-display region R1 of the first substrate 110 may be located outside the sealant 191, but the invention is not limited thereto.

In an embodiment, the sealant 191 may include a photo-curing adhesive, a thermal-curing adhesive, or a combination thereof, but the invention is not limited thereto.

In an embodiment, the second substrate 120 may include a corresponding optical film or optical sheet. That is, the second substrate 120 may include a corresponding substrate and a corresponding film layer on the substrate. For example, the second substrate 120 is, for example, a color filter having a red filter (not shown), a green filter (not shown), a blue filter (not shown), a corresponding light shielding layer (not shown), and a corresponding polarizer (not shown). In one embodiment, the second substrate 120 may be referred to as a color filter substrate (cfb), but the invention is not limited thereto.

In one embodiment, the display device 100 may be a liquid crystal display device 100. For example, a space formed by the first substrate 110, the second substrate 120 and the sealant 191 may have a liquid crystal layer (not shown). The red filter, the green filter, the blue filter, the light shielding layer, the polarizer and/or the liquid crystal layer may be configured in the same or similar manner as a general liquid crystal display device, and thus are not described herein again.

The conductive line 130 is located on the surface 110a of the first substrate 110. The wires 130 are at least positioned outside the sealant 191. For example, the wires 130 may extend from the inner side of the sealant 191 to the outer side of the sealant 191, but the invention is not limited thereto. In one embodiment, the conductive lines 130 may be electrically connected to elements in a pixel array layer (not shown), but the invention is not limited thereto.

It should be noted that only one wire 130 is shown in the drawings for illustrative purposes, but the number of wires 130 in the display device 100 is not limited in the present invention. For example, the display device 100 may include a plurality of wires that are the same or similar to the wires 130. In addition, a plurality of wires that are the same or similar to the wire 130 may be parallel to each other.

In the present embodiment, the conductive line 130 can be formed by plating (e.g., sputtering, electroplating or other suitable plating), photolithography etching and/or polishing, but the invention is not limited thereto. In one embodiment, the aforementioned means (such as, but not limited to, plating, polishing, etc.) may be performed one or more times. There may be corresponding different parameters and/or directions between the multiple plating and/or multiple polishing.

The conductive line 130 includes a first conductive portion 131 and a second conductive portion 132. The first conductive part 131 is closer to the edge 110c of the first substrate 110 than the second conductive part 132. In the present embodiment, the first conductive portion 131 and the second conductive portion 132 of the conductive wire 130 may be both located outside the sealant 191. The first conductive portion 131 and the second conductive portion 132 may be connected to each other.

In the present embodiment, an edge 131c of the first conductive portion 131 of the conductive line 130 is substantially flush with an edge 110c of the first substrate 110. That is, the outer side of the wire 130 (i.e., the surface of the wire 130 outside the sealant 191 and farthest from the sealant 191; e.g., the outer side of the first conductive portion 131) and one side of the first substrate 110 may be substantially coplanar.

In an embodiment, an edge 131c of the first conductive portion 131 of the wire 130 may be substantially flush with an edge 120c of the second substrate 120. That is, the outer side of the conductive line 130 (e.g., the outer side of the first conductive portion 131) and a side of the second substrate 120 may be substantially coplanar.

In the present embodiment, the display device 100 may further include an insulating layer 140 covering the conductive line 130, but the present invention is not limited thereto. The insulating layer may include a single film layer or a stack of a plurality of film layers, but the present invention is not limited thereto. For example, the insulating layer 140 may include an insulating layer 141 and an insulating layer 142, but the invention is not limited thereto. The insulating layer 140 may extend from the inner side of the sealant 191 to the outer side of the sealant 191, but the invention is not limited thereto. In the display device 100, the insulating layer (e.g., a portion or the whole of the insulating layer 140) may be referred to as a gate insulating layer, a planarization layer, and a buffer layer, but the present invention is not limited thereto.

In the present embodiment, the display device 100 may further include a side electrode 150. The side electrode 150 covers the edge 131c of the first conductive portion 131 and the edge 110c of the first substrate 110. For example, the conductive material may be formed at least on the side surface of the first substrate 110 by printing (e.g., screen printing), plating (e.g., sputtering, evaporation), pasting (e.g., pasting) or other suitable methods, so that the side electrode 150 formed by the conductive material can directly contact the side surface of the conductive wire 130. For example, the side electrode 150 formed of the conductive material may directly contact the edge 131c of the first conductive portion 131.

In an embodiment, the side electrode 150 may further cover the edge 120c of the second substrate 120. That is, the side electrode 150 may directly contact the side of the second substrate 120.

In the present embodiment, the display device 100 may further include a circuit board 160. The circuit board 160 is located on a side of the first substrate 110 and/or a side of the second substrate 120. The circuit board 160 includes a connection line 164. The connection line 164 is electrically connected to the conductive line 130 via the side electrode 150.

For example, the display device 100 may further include a conductive adhesive layer 194. The conductive adhesive layer 194 covers the corresponding side electrode 150. The conductive adhesive layer 194 is, for example, a film formed of Anisotropic Conductive Paste (ACP) or Anisotropic Conductive Film (ACF). The connecting wires 164 of the circuit board 160 may be electrically connected to the corresponding side electrodes 150 by the conductive adhesive layer 194, but the invention is not limited thereto.

In one embodiment, the Circuit board 160 includes, for example, a Flexible Printed Circuit (FPC), but the invention is not limited thereto. The circuit board 160 includes, for example, a circuit board having a Chip On Film (COF) package structure.

Referring to fig. 1B and 1C, in a top view (e.g., looking in a direction perpendicular to the surface 110 a; as shown in fig. 1C), the width 131w of the first conductive portion 131 is smaller than the width 132w of the second conductive portion 132. Accordingly, the covered region of the first conductive part 131 may be lifted. For example, the side electrode 150 may be raised to cover the area of the conductive line 130. In this way, a process window (process window) of the display device 100 may be improved, or a signal transmission quality and/or a power supply quality of the display device 100 may be further improved.

Referring to fig. 1B to fig. 1E, in the present embodiment, a cross-sectional area of the cross-section 131r of the first conductive portion 131 is larger than a cross-sectional area of the cross-section 132r of the second conductive portion 132. Thus, the covered area of the first conductive portion 131 can be further improved. The aforementioned cross section 131r and the aforementioned cross section 132r are substantially parallel to each other.

Referring to fig. 1B to fig. 1E, in the present embodiment, a thickness 131h of the first conductive portion 131 is greater than a thickness 132h of the second conductive portion 132. Thus, the covered area of the first conductive portion 131 can be further improved.

In one embodiment, the thickness (e.g., thickness 131h) of the first conductive portion 131 may be a maximum dimension of the first conductive portion 131 in a direction perpendicular to the surface 100a on the corresponding cross section (e.g., cross section 131 r). Similarly, the width (e.g., width 131w) of the first conductive portion 131 may be the largest dimension of the first conductive portion 131 in the aforementioned cross section (e.g., cross section 131r) in a direction parallel to the surface 100 a.

In one embodiment, the thickness (e.g., thickness 132h) of the second conductive portion 132 may be the largest dimension of the second conductive portion 132 in a direction perpendicular to the surface 100a in a corresponding cross section (e.g., cross section 132 r). Similarly, the width (e.g., width 132w) of the second conductive portion 132 may be the largest dimension of the second conductive portion 132 in the aforementioned cross section (e.g., cross section 132r) in a direction parallel to the surface 100 a.

In comparing the thickness of the first conductive portion 131 (e.g., the thickness 131h) and the thickness of the second conductive portion 132 (e.g., the thickness 132h), the cross-section defining the thickness of the first conductive portion 131 (e.g., the cross-section 131r) and the cross-section defining the thickness of the second conductive portion 132 (e.g., the cross-section 132r) are substantially parallel to each other.

In an embodiment, the thickness of the first conductive part 131 may substantially gradually increase from a region close to the second conductive part 132 to a region far from the second conductive part 132, but the present invention is not limited thereto.

In an embodiment, the width of the first conductive part 131 may be substantially gradually decreased from a region close to the second conductive part 132 to a region far from the second conductive part 132, but the present invention is not limited thereto.

In the present embodiment, the width 132w of the second conductive portion 132 of the conductive line 130 is less than about 75 micrometers (μm). Thus, the wiring density of the conductive wires 130 can be increased.

In the present embodiment, the width 150w of the side electrode 150 is greater than the width 132w of the second conductive portion 132 in a top view (e.g., in a direction perpendicular to the surface 110 a; as shown in FIG. 1C).

In the present embodiment, the width 131w of the first conductive portion 131 is greater than the width 164w of the connection line 164 in a top view (e.g., a view in a direction perpendicular to the surface 110 a; as shown in FIG. 1C). In this way, a process window (process window) of the display device 100 may be improved, or a signal transmission quality and/or a power supply quality of the display device 100 may be further improved.

In this embodiment, the display device 100 may further include a buffer structure 170. The buffer structure 170 is located on the surface 110a of the first substrate 110 and outside the sealant 191. The first conductive portion 131 of the conductive line 130 is closer to the edge 110c of the first substrate 110 than the buffer structure 170.

In the present embodiment, the buffer structure 170 may include corresponding layers and/or corresponding elements. That is, the buffer structure 170 may be formed by one or more layers, one or more elements, or a combination, stack, or combination thereof. For example, the buffer structure 170 may include a bump and a solid element or a film (such as, but not limited to, the insulating layer 140) on the bump.

In the present embodiment, an air gap (air gap)197 may be disposed between the second substrate 120 and the first conductive portion 131 and/or between the second substrate 120 and the second conductive portion 132. In a direction perpendicular to the surface 110a, the air gap 197 has a first distance L1. That is, there may be a non-physical space (e.g., air gap 197) between the second substrate 120 and the first conductive portion 131, and/or a non-physical space (e.g., air gap 197) between the second substrate 120 and the second conductive portion 132. Also, the first distance L1 is substantially greater than 0 microns. The second substrate 120 and the buffer structure 170 have a second distance L2 in a direction perpendicular to the surface 110 a. The first distance L1 is greater than the second distance L2.

In one embodiment, the buffer structure 170 may improve process stability or yield during the manufacturing process of the display device 100, but the invention is not limited thereto.

In the present embodiment, the first distance L1 is greater than 1 micron and the first distance L1 is less than or equal to about 5 microns. As such, although the invention is not limited thereto, the process stability or yield of the display device 100 may be further improved.

In the present embodiment, the second distance L2 is greater than or equal to 0 microns, and the second distance L2 is less than or equal to about 1 micron.

In an embodiment, the second substrate 120 and the buffer structure 170 may be opposite to each other, but the invention is not limited thereto. That is, the second distance L2 may be equal to 0 microns.

In the present embodiment, the second conductive portion 132 of the middle conductive line 130 is closer to the edge 110c of the first substrate 110 than the buffer structure 170. The sum of the length 131d of the first conductive portion 131 and the length 132d of the second conductive portion 132 is less than the length 171d of the buffer structure 170. As such, the process stability or yield may be further improved in the process of manufacturing the display device 100, but the invention is not limited thereto.

Fig. 2 is a schematic partial cross-sectional view of a display device according to a second embodiment of the present invention. The display device 200 of the present embodiment is similar to the display device 100 of the first embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials, or formation manners, and descriptions thereof are omitted. Specifically, fig. 2 may be a partial schematic top view of a display device 200 similar to region R3 shown to fig. 1C. In addition, for clarity, only a portion of the first substrate 110, a portion of the conductive line 130, a portion of the side electrode 250, and a portion of the circuit board 160 are exemplarily shown in fig. 2.

Referring to fig. 2, the display device 200 includes a first substrate 110, a second substrate (not shown) similar to the second substrate 120, a sealant (not shown) similar to the sealant 191, a conductive wire 130 and a side electrode 250. The side electrode 250 of the present embodiment is similar to the side electrode 150 of the previous embodiment. The width 250w of the side electrode 250 is equal to the width 132w of the second conductive portion 132.

Fig. 3 is a schematic partial cross-sectional view of a display device according to a third embodiment of the present invention. The display device 300 of the present embodiment is similar to the display device 100 of the first embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials, or formation manners, and descriptions thereof are omitted. Specifically, fig. 3 may be a partial schematic top view of a display device 300 similar to the region R3 shown to fig. 1C. In addition, for clarity, only a portion of the first substrate 110, a portion of the conductive line 130, a portion of the side electrode 350, and a portion of the circuit board 160 are exemplarily shown in fig. 3.

Referring to fig. 3, the display device 300 includes a first substrate 110, a second substrate (not shown) similar to the second substrate 120, a sealant (not shown) similar to the sealant 191, a conductive wire 130 and a side electrode 350. The side electrode 350 of the present embodiment is similar to the side electrode 150 of the previous embodiment. The width 350w of the side electrode 350 is greater than the width 132w of the second conductive portion 132.

All elements or components in the drawings may be combined into a line assembly in another drawing not shown by suitable arrangement and/or combination. In addition, additional components, elements and/or their corresponding functions may be added without departing from the invention. For example, in a not-shown drawing, the display device may include a plurality of conductive lines (e.g., the same or similar conductive lines as the conductive lines 130), and the plurality of conductive lines are not limited to be identical. For example, in a drawing not shown, the display device may include a plurality of wires (e.g., wires identical or similar to the wires 130) and a plurality of corresponding side electrodes, one of the plurality of side electrodes may be identical or similar to the side electrode 150 of the previous embodiment, another one of the plurality of side electrodes may be identical or similar to the side electrode 250 of the previous embodiment, and/or another one of the plurality of side electrodes may be identical or similar to the side electrode 350 of the previous embodiment.

In summary, the display device of the present invention has better quality by making the width of the first conductive portion smaller than the width of the second conductive portion, and making the thickness of the first conductive portion larger than the thickness of the second conductive portion or the cross-sectional area of the first conductive portion larger than the cross-sectional area of the second conductive portion.

Claims

1. A display device, comprising:

a first substrate having a display region;

a second substrate;

the frame glue is positioned between the first substrate and the second substrate and surrounds the display area of the first substrate; and

a wire located on the first substrate and at least located outside the sealant, the wire including a first conductive portion and a second conductive portion, the first conductive portion being closer to an edge of the first substrate than the second conductive portion, wherein:

the width of the first conductive portion is less than the width of the second conductive portion; and is

The first conductive portion has a thickness greater than a thickness of the second conductive portion or a cross-sectional area greater than a cross-sectional area of the second conductive portion.

2. The display device according to claim 1, wherein an edge of the first conductive portion of the wire is substantially flush with an edge of the first substrate.

3. The display device of claim 2, further comprising:

and the side electrode covers the edge of the first conductive part and the edge of the first substrate or the second substrate, and the width of the side electrode is greater than or equal to that of the second conductive part.

4. The display device of claim 1, further comprising:

the circuit board is positioned on the side surface of the first substrate and comprises a connecting wire, wherein the connecting wire is electrically connected with the lead, and the width of the first conductive part is greater than that of the connecting wire.

5. The display device of claim 4, further comprising:

and the side electrode is positioned between the connecting wire and the lead, and the connecting wire of the circuit board is electrically connected with the lead through the side electrode.

6. The display device of claim 1, further comprising:

a buffer structure located on the first substrate and outside the sealant, wherein the first conductive portion of the conductive wire is closer to the edge of the first substrate than the buffer structure, wherein:

an air gap between the second substrate and the first conductive portion or between the second substrate and the second conductive portion has a first distance;

a second distance is reserved between the second substrate and the buffer structure; and is

The first distance is greater than the second distance.

7. The display device of claim 6, wherein the first distance is greater than 1 micron and less than or equal to 5 microns.

8. The display device according to claim 6, wherein the second conductive portion of the conductive line is closer to an edge of the first substrate than the buffer structure, and a sum of lengths of the first conductive portion and the second conductive portion is smaller than a length of the buffer structure.

9. The display device of claim 1, wherein the width of the second conductive portion of the conductive line is less than 75 microns.