TWI737545B - Display apparatus - Google Patents

Abstract

A display apparatus including a first substrate, a second substrate, sealant and a wire is provided. The first substrate has a display area. The sealant is disposed between the first substrate and the second substrate. The sealant surrounds the display area of the first substrate. The wire is disposed on the first substrate and at least outside the sealant. The wire includes a first conductive portion and a second conductive portion. The first conductive portion is closer to the edge of the first substrate than the second conductive portion. The width of the first conductive portion is smaller than the width of the second conductive portion. The thickness of the first conductive portion is greater than the thickness of the second conductive portion or the cross-sectional area of the first conductive portion is greater than the cross-sectional area of the second conductive portion.

Description

Display device

The present invention relates to an electronic device, and particularly relates to a display device.

In an electronic device, the connection quality between conductors may directly or indirectly affect the quality of the electronic device.

The present invention provides a display device with better quality.

The display device of the present invention includes a first substrate, a second substrate, sealant and wires. The first substrate has a display area. The sealant is located between the first substrate and the second substrate. The sealant surrounds the display area of the first substrate. The wires are located on the first substrate and at least on the outside of the sealant. The wire includes a first conductive part and a second conductive part. The first conductive portion is closer to the edge of the first substrate than the second conductive portion. The width of the first conductive portion is smaller than the width of the second conductive portion. The thickness of the first conductive portion is greater than the thickness of the second conductive portion or the cross-sectional area of the first conductive portion is greater than the cross-sectional area of the second conductive portion.

Based on the above, by making the width of the first conductive part smaller than the second conductive part The thickness of the first conductive portion is greater than the thickness of the second conductive portion or the cross-sectional area of the first conductive portion is greater than the cross-sectional area of the second conductive portion, so that the display device of the present invention has better quality.

100, 200, 300: display device

110: First substrate

R1: Non-display area

R2: Display area

110a: surface

110c: Edge

120: second substrate

120c: Edge

191: frame glue

130: Wire

131: The first conductive part

131d: length

131w: width

131h: thickness

131r: cross section

131c: Edge

132: The second conductive part

132d: length

132w: width

132h: thickness

132r: cross section

140, 141, 142: insulating layer

150, 250, 350: side electrode

150w, 250w, 350w: width

160: circuit board

164: connection line

164w: width

170: Buffer structure

170d: length

194: conductive adhesive layer

197: air gap

L1: first distance

L2: second distance

R3: area

X, Y, Z: direction

FIG. 1A is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention.

FIG. 1B is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention.

FIG. 1C is a schematic partial top view of a display device according to the first embodiment of the present invention.

FIG. 1D is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention.

FIG. 1E is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention.

2 is a partial top view audio diagram of a display device according to the second embodiment of the present invention.

FIG. 3 is a schematic partial top view of a display device according to a third embodiment of the present invention.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention.

In the drawings, the size of some elements may be enlarged or reduced for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to another element", it can be directly on or connected to another element, Or intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connected" can refer to physical and/or electrical connections.

It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, components, regions, layers, and/or parts, these elements, components, regions, and/or parts should not be affected by Limitations of these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, the "first element", "member", "region", "layer" or "portion" discussed below may be referred to as a second element, member, region, layer or portion without departing from the teachings herein.

The terminology used here is only for the purpose of describing specific embodiments and is not restrictive. As used herein, unless the content clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms, including "at least one" or "at least one." "Or" means "and/or". As used in this article, The term "and/or" includes any and all combinations of one or more of the related listed items. It should also be understood that when used in this specification, the terms "including" and/or "including" designate the presence of the features, regions, wholes, steps, operations, elements, and/or components, but do not exclude one or more The existence or addition of other features, regions as a whole, steps, operations, elements, components, and/or combinations thereof.

In addition, relative terms such as "lower" and "upper" or "left" and "right" may be used herein to describe the relationship between one element and another element, as shown in the figure. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, elements described as being on the "lower" side of other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the specific orientation of the drawing. Similarly, if the device in one figure is turned over, elements described as "below" or "beneath" other elements will be oriented "above" the other elements. Thus, the exemplary terms "below" or "below" can include an orientation of above and below. In addition, in order to clearly show the directional relationship between the different patterns, the Cartesian coordinate system (XYZ rectangular coordinate system) is used as an example to represent the corresponding directions in some of the illustrations, but the present invention does not use This is limited.

As used herein, "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account the measurement in question and the specific amount of error associated with the measurement (ie , Limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, Or within ±30%, ±20%, ±10%, ±5%.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.

The exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Therefore, a change in the shape of the diagram as a result of, for example, manufacturing technology and/or tolerances can be expected. Therefore, the embodiments described herein should not be interpreted as being limited to the specific shape of the area as shown herein, but include, for example, shape deviations caused by manufacturing. For example, regions shown or described as flat may generally have rough and/or non-linear characteristics. In addition, the acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shape of the regions, and are not intended to limit the scope of the claims.

FIG. 1A is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention. FIG. 1B is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention. FIG. 1C is a schematic partial top view of a display device according to the first embodiment of the present invention. FIG. 1D is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention. FIG. 1E is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention. For example, FIG. 1A may be a partial side cross-sectional schematic diagram of the display device 100. Figure 1B may correspond to that depicted in Figure 1A An enlarged view of the region R3 shown. FIG. 1C may be a partial schematic top view corresponding to the region R3 depicted in FIG. 1A. FIG. 1D and FIG. 1E may be partial front cross-sectional schematic diagrams of the display device 100. In addition, for clarity, some of the film layers or components may be omitted from the drawings. For example, the conductive adhesive layer 194 is omitted in 1C, and only a part of the first substrate 110 and a part of the wire 130 are exemplarily shown in FIG. 1D or FIG. 1E.

1A and 1B, the display device 100 includes a first substrate 110, a second substrate 120, a sealant 191, and a wire 130.

The first substrate 110 has a display area R2 and a non-display area R1. In an embodiment, a pixel array layer (not shown) may be disposed in the display area R2 of the first substrate 110. The aforementioned pixel array layer may be composed of multiple pixel structures composed of active components (such as transistors), passive components (such as capacitors) and/or corresponding wires. In other words, the first substrate 110 may include a corresponding base material and a corresponding film layer on the base material. In an embodiment, the first substrate 110 may be referred to as an array substrate, but the present invention is not limited thereto.

The sealant 191 is located between the first substrate 110 and the second substrate 120, and the sealant 191 surrounds the display area R2 of the first substrate 110. In other words, the display area R2 of the first substrate 110 may be located inside the sealant 191. In this embodiment, the non-display area R1 of the first substrate 110 may be located outside the sealant 191, but the present invention is not limited to this.

In one embodiment, the material of the sealant 191 may include light-curing adhesive, thermal-curing adhesive, or a combination of the foregoing, but the present invention is not limited thereto.

In an embodiment, the second substrate 120 may include a corresponding optical film or Optical sheet. In other words, the second substrate 120 may include a corresponding base material and a corresponding film layer on the base material. For example, the second substrate 120 has a red filter film (not shown), a green filter film (not shown), a blue filter film (not shown), and a corresponding light-shielding layer (not shown). ) And the color filter of the corresponding polarizer (not shown). In an embodiment, the second substrate 120 may be referred to as a color filter substrate, but the invention is not limited thereto.

In an embodiment, the display device 100 may be a liquid crystal display device 100. For example, the space formed by the first substrate 110, the second substrate 120, and the sealant 191 may have a liquid crystal layer (not shown). The aforementioned red filter film, green filter film, blue filter film, light-shielding layer, polarizer and/or liquid crystal layer can be configured in the same or similar manner as a general liquid crystal display device, so it will not be repeated here.

The wire 130 is located on the surface 110 a of the first substrate 110. The wire 130 is located at least outside the sealant 191. For example, the wire 130 may extend from the inner side of the sealant 191 to the outer side of the sealant 191, but the present invention is not limited thereto. In an embodiment, the wires 130 may be electrically connected to elements in the pixel array layer (not shown), but the invention is not limited thereto.

It is worth noting that only one wire 130 is schematically shown in the drawing, but the present invention does not limit the number of wires 130 in the display device 100. For example, the display device 100 may include a plurality of wires that are the same or similar to the wire 130. In addition, a plurality of wires that are the same or similar to the wire 130 may be parallel to each other.

In this embodiment, the wire 130 can be formed by plating (such as sputtering, electroplating or other suitable plating methods), lithographic etching and/or grinding, but The present invention is not limited to this. In an embodiment, the aforementioned methods (such as plating, grinding, etc., but not limited) can be performed one or more times. Multiple plating and/or multiple polishing may have corresponding different parameters and/or directions.

The wire 130 includes a first conductive portion 131 and a second conductive portion 132. The first conductive portion 131 is closer to the edge 110c of the first substrate 110 than the second conductive portion 132 is. In this embodiment, the first conductive portion 131 and the second conductive portion 132 of the wire 130 may both be located outside the sealant 191. The first conductive portion 131 and the second conductive portion 132 may be connected to each other.

In this embodiment, an edge 131c of the first conductive portion 131 of the wire 130 is substantially flush with an edge 110c of the first substrate 110. In other words, the outer surface of the wire 130 (ie, the surface of the wire 130 outside the sealant 191 and farthest from the sealant 191; for example, the outer surface of the first conductive portion 131) and a side surface of the first substrate 110 may be substantially Coplanar.

In an embodiment, an edge 131c of the first conductive portion 131 of the wire 130 may be substantially flush with an edge 120c of the second substrate 120. In other words, the outer side surface of the wire 130 (eg, the outer side surface of the first conductive portion 131) and a side surface of the second substrate 120 may be substantially coplanar.

In this embodiment, the display device 100 may further include an insulating layer 140 covering the wire 130, but the present invention is not limited thereto. The insulating layer may include a single film layer or a stack of multiple film layers, but the present invention is not limited thereto. For example, the insulating layer 140 may include an insulating layer 141 and an insulating layer 142, but the present invention is not limited thereto. The insulating layer 140 may extend from the inner side of the sealant 191 to the outer side of the sealant 191, but the present invention is not limited Here. In the display device 100, an insulating layer (such as a part or all of the aforementioned insulating layer 140) may be referred to as a gate insulating layer, a flat layer, or a buffer layer, but the present invention is not limited thereto.

In this embodiment, the display device 100 may further include side electrodes 150. The side electrode 150 covers the edge 131c of the first conductive portion 131 and the edge 110c of the first substrate 110. For example, for example, the conductive material can be formed at least on the first substrate by printing (such as: screen printing), plating (such as: sputtering, evaporation), pasting (such as: pasting) or other suitable methods. On the side surface of 110, so that the side electrode 150 formed of the aforementioned conductive material can directly contact the side surface of the wire 130. For example, the side electrode 150 formed of the aforementioned conductive material may directly contact the edge 131c of the first conductive portion 131.

In an embodiment, the side electrode 150 may further cover the edge 120c of the second substrate 120. That is, the side electrode 150 may directly contact the side surface of the second substrate 120.

In this embodiment, the display device 100 may further include a circuit board 160. The circuit board 160 is located on the side surface of the first substrate 110 and/or the side surface of the second substrate 120. The circuit board 160 includes connecting wires 164. The connecting wire 164 and the wire 130 are electrically connected by the side electrode 150.

For example, the display device 100 may further include a conductive adhesive layer 194. The conductive adhesive layer 194 covers the corresponding side electrode 150. The conductive adhesive layer 194 is, for example, a film layer formed of anisotropic conductive paste (ACP) or anisotropic conductive film (ACF). Circuit board 160 The connecting wire 164 of the φ can be electrically connected to the corresponding side electrode 150 through the conductive adhesive layer 194, but the present invention is not limited thereto.

In one embodiment, the circuit board 160 includes, for example, a flexible printed circuit (FPC), but the invention is not limited thereto. For example, the circuit board 160 includes, for example, a circuit board having a chip on film (COF) packaging structure.

1B and 1C, in the top view state (eg, viewed in a direction perpendicular to the surface 110a; as shown in FIG. 1C), the width 131w of the first conductive portion 131 is smaller than the width 132w of the second conductive portion 132 . Therefore, the covered area of the first conductive portion 131 may be elevated. For example, the area where the side electrode 150 can cover the wire 130 can be lifted. In this way, the process window of the display device 100 can be improved, or the signal transmission quality and/or power supply quality of the display device 100 can be further improved.

1B to 1E, in this embodiment, the cross-sectional area of the cross-section 131r of the first conductive portion 131 is larger than the cross-sectional area of the cross-section 132r of the second conductive portion 132. In this way, the covered area of the first conductive portion 131 can be further improved. The aforementioned cross section 131r and the aforementioned cross section 132r are substantially parallel to each other.

1B to 1E, in this embodiment, the thickness 131h of the first conductive portion 131 is greater than the thickness 132h of the second conductive portion 132. In this way, the covered area of the first conductive portion 131 can be further improved.

In an embodiment, the thickness of the first conductive portion 131 (such as the thickness 131h) may be on the corresponding section (such as the section 131r), which is perpendicular to the surface 110a. In the direction, the first conductive portion 131 has the largest dimension. Similarly, the width of the first conductive portion 131 (such as the width 131w) may be the largest dimension of the first conductive portion 131 in the direction parallel to the surface 110a on the aforementioned cross section (such as the cross section 131r).

In one embodiment, the thickness of the second conductive portion 132 (such as the thickness 132h) may be on the corresponding cross section (such as the cross section 132r) in the direction perpendicular to the surface 110a, the second conductive portion 132 has biggest size. Similarly, the width (eg, width 132w) of the second conductive portion 132 may be the largest dimension of the second conductive portion 132 in the direction parallel to the surface 110a on the aforementioned cross section (eg, cross section 132r).

In comparison between the thickness of the first conductive portion 131 (e.g., thickness 131h) and the thickness of the second conductive portion 132 (e.g., thickness 132h), the section used to define the thickness of the aforementioned first conductive portion 131 (e.g., section 131r) ) And the cross-section (eg, cross-section 132r) used to define the thickness of the aforementioned second conductive portion 132 are substantially parallel to each other.

In an embodiment, the thickness of the first conductive portion 131 may increase gradually from a region close to the second conductive portion 132 to a region away from the second conductive portion 132, but the present invention is not limited thereto.

In an embodiment, the width of the first conductive portion 131 may be gradually reduced from an area close to the second conductive portion 132 to an area away from the second conductive portion 132, but the present invention is not limited thereto.

In this embodiment, the width 132w of the second conductive portion 132 of the wire 130 Less than about 75 microns (micrometer; μm). In this way, the layout density of the wires 130 can be increased.

In this embodiment, in a top view state (eg, viewed in a direction perpendicular to the surface 110a; as shown in FIG. 1C), the width 150w of the side electrode 150 is greater than the width 132w of the second conductive portion 132.

In this embodiment, in a top view state (eg, viewed in a direction perpendicular to the surface 110a; as shown in FIG. 1C), the width 131w of the first conductive portion 131 is greater than the width 164w of the connecting line 164. In this way, the process window of the display device 100 can be improved, or the signal transmission quality and/or power supply quality of the display device 100 can be further improved.

In this embodiment, the display device 100 may further include a buffer structure 170. The buffer structure 170 is located on the surface 110 a of the first substrate 110 and is located outside the sealant 191. The first conductive portion 131 of the wire 130 is closer to the edge 110c of the first substrate 110 than the buffer structure 170 is.

In this embodiment, the buffer structure 170 may include a corresponding film layer and/or a corresponding element. In other words, the buffer structure 170 may be composed of one or more film layers, one or more elements, or a combination, stack or combination of the foregoing. For example, the buffer structure 170 may include protrusions and physical elements or film layers (such as the insulating layer 140, but not limited) on the protrusions.

In this embodiment, there may be an air gap 197 between the second substrate 120 and the first conductive portion 131 and/or between the second substrate 120 and the second conductive portion 132. In the direction perpendicular to the surface 110a, the air gap 197 has a first distance L1. That is to say, there may be an intangible space (such as an air gap 197) between the second substrate 120 and the first conductive portion 131, and/or there may be an intangible space between the second substrate 120 and the second conductive portion 132 ( Such as: air gap 197). Moreover, the first distance L1 is substantially greater than 0 micrometers. In the direction perpendicular to the surface 110a, there is a second distance L2 between the second substrate 120 and the buffer structure 170. The first distance L1 is greater than the second distance L2.

In an embodiment, in the process of manufacturing the display device 100, the buffer structure 170 may improve the stability or yield of the manufacturing process, but the present invention is not limited thereto.

In this embodiment, the first distance L1 is greater than 1 micrometer, and the first distance L1 is less than or equal to about 5 micrometers. In this way, the process stability or yield of the display device 100 may be improved, but the invention is not limited to this.

In this embodiment, the second distance L2 is greater than or equal to 0 micrometer, and the second distance L2 is less than or equal to about 1 micrometer.

In an embodiment, the second substrate 120 and the buffer structure 170 may conflict, but the invention is not limited thereto. That is, the second distance L2 may be equal to 0 micrometers.

In this embodiment, the second conductive portion 132 of the middle wire 130 is closer to the edge 110c of the first substrate 110 than the buffer structure 170 is. The sum of the length 131d of the first conductive portion 131 and the length 132d of the second conductive portion 132 is less than the length 170d of the buffer structure 170. In this way, during the process of manufacturing the display device 100, the stability or yield of the manufacturing process may be improved, but the present invention is not limited to this.

2 is a schematic partial cross-sectional view of a display device according to a second embodiment of the invention. The display device 200 of this embodiment and the display device of the first embodiment 100 is similar, and similar components are denoted by the same reference numerals, and have similar functions, materials, or formation methods, and the description is omitted. Specifically, FIG. 2 may be a schematic top view of a part of the display device 200 similar to the region R3 shown in FIG. 1C. In addition, for clarity, only part of the first substrate 110, part of the wire 130, part of the side electrode 250, and part of the circuit board 160 are exemplarily shown in FIG. 2.

2, the display device 200 includes a first substrate 110, a second substrate (not shown, such as: a second substrate similar to the aforementioned second substrate 120), a sealant (not shown, such as similar to the aforementioned sealant) 191), the wire 130 and the side electrode 250. The side electrode 250 of this embodiment is similar to the side electrode 150 of the previous embodiment. The width 250w of the side electrode 250 is equal to the width 132w of the second conductive portion 132.

3 is a schematic partial cross-sectional view of a display device according to a third embodiment of the present invention. The display device 300 of this embodiment is similar to the display device 100 of the first embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials, or formation methods, and descriptions are omitted. Specifically, FIG. 3 may be a schematic top view of a part of the display device 300 similar to the region R3 depicted in FIG. 1C. In addition, for clarity, only a part of the first substrate 110, a part of the wire 130, a part of the side electrode 350 and a part of the circuit board 160 are exemplarily shown in FIG. 3.

3, the display device 300 includes a first substrate 110, a second substrate (not shown, such as: a second substrate similar to the aforementioned second substrate 120), sealant (not shown, such as similar to the aforementioned sealant) 191 sealant), wires 130 and side electrodes 350. The side electrode 350 of this embodiment is similar to the side electrode 150 of the previous embodiment. The width 350w of the side electrode 350 is greater than the width 132w of the second conductive portion 132.

All the components or elements in the figures can be arranged and/or combined into a lined component in another unshown figure. In addition, without departing from the present invention, additional members, elements, and/or their corresponding functions may be added. For example, in a diagram not shown, the display device may include multiple wires (eg, wires that are the same or similar to the wire 130), and the multiple wires are not limited to being completely the same. For another example, in a diagram not shown, the display device may include a plurality of wires (such as a wire that is the same or similar to the wire 130) and a plurality of corresponding side electrodes, and among the above-mentioned side electrodes One of the side electrodes 150 may be the same or similar to the side electrode 150 of the foregoing embodiment, another of the foregoing plurality of side electrodes may be the same or similar to the side electrode 250 of the foregoing embodiment, and/or the other of the foregoing plurality of side electrodes may be The same or similar to the side electrode 350 of the previous embodiment.

In summary, by making the width of the first conductive portion smaller than the width of the second conductive portion, and making the thickness of the first conductive portion larger than the thickness of the second conductive portion or the cross-sectional area of the first conductive portion is larger than the second conductive portion The cross-sectional area can make the display device of the present invention have better quality.

100: display device

110: First substrate

R1: Non-display area

R2: Display area

120: second substrate

120c: Edge

191: frame glue

130: Wire

131: The first conductive part

131d: length

132: The second conductive part

132d: length

140, 141, 142: insulating layer

150: side electrode

160: circuit board

164: connection line

170: Buffer structure

170d: length

194: conductive adhesive layer

197: air gap

L1: first distance

L2: second distance

R3: area

X, Y, Z: direction

Claims (10)

A display device includes: a first substrate having a display area; a second substrate; a sealant located between the first substrate and the second substrate and surrounding the display area of the first substrate; and a wire , Located on the first substrate and at least outside the sealant, the wire includes a first conductive portion and a second conductive portion, and the first conductive portion is closer to the first conductive portion than the second conductive portion An edge of a substrate; and a buffer structure located on the first substrate and outside of the sealant, and the first conductive portion of the wire is closer to the edge of the first substrate than the buffer structure, Wherein: the width of the first conductive portion is smaller than the width of the second conductive portion; the thickness of the first conductive portion is greater than the thickness of the second conductive portion or the cross-sectional area of the first conductive portion is larger than the The cross-sectional area of the second conductive part; the air gap between the second substrate and the first conductive part or between the second substrate and the second conductive part has a first distance; the second substrate There is a second distance from the buffer structure; the first distance is greater than the second distance; the second conductive portion of the wire is closer to the edge of the first substrate than the buffer structure; and The sum of the lengths of the first conductive part and the second conductive part is less than the total length of the The length of the buffer structure. A display device includes: a first substrate having a display area; a second substrate; a sealant located between the first substrate and the second substrate and surrounding the display area of the first substrate; and A wire is located on the surface on the first substrate and at least outside the sealant, the wire includes a first conductive part and a second conductive part, and the first conductive part is larger than the second conductive part Close to the edge of the first substrate, wherein: the first conductive portion has a first cross section, and the first cross section of the first conductive portion is perpendicular to the surface of the first substrate; The two conductive parts have a second cross section, and the second cross section of the second conductive part is perpendicular to the surface of the first substrate; the first cross section and the second cross section are parallel to each other; In the width direction of the surface of the first substrate, the width of the first conductive portion on the first cross-section is smaller than the width of the second conductive portion on the second cross-section; In the thickness direction of the surface of the first substrate, the thickness of the first conductive portion on the first cross-section is greater than the thickness of the second conductive portion on the second cross-section; and the first The cross-sectional area of the conductive portion on the first cross-section is larger than the cross-sectional area of the second conductive portion on the second cross-section. The display device according to claim 1 or 2, wherein the edge of the first conductive part of the wire is substantially flush with the edge of the first substrate. The display device according to claim 3, further comprising: a side electrode covering the edge of the first conductive part and the edge of the first substrate or the second substrate, and the width of the side electrode is greater than or equal to The width of the second conductive portion. The display device according to claim 1 or 2, further comprising: a circuit board located on a side surface of the first substrate, the circuit board includes a connecting wire, wherein the connecting wire is electrically connected to the wire, and The width of the first conductive portion is greater than the width of the connecting line. The display device according to claim 5, further comprising: a side electrode located between the connecting wire and the wire, and the connecting wire of the circuit board is electrically connected to the wire via the side electrode . The display device according to claim 2, further comprising: a buffer structure located on the first substrate and outside the sealant, and the first conductive part of the wire is closer to the buffer structure than the buffer structure. The edge of the first substrate, wherein: the air gap between the second substrate and the first conductive part or between the second substrate and the second conductive part has a first distance; the second There is a second distance between the substrate and the buffer structure; and the first distance is greater than the second distance. The display device according to claim 1 or 7, wherein the first distance is greater than 1 micrometer and less than or equal to 5 micrometers. The display device according to claim 7, wherein the second conductive portion of the wire is closer to the edge of the first substrate than the buffer structure, and the first conductive portion and the second conductive portion are The total length is less than the length of the buffer structure. The display device according to claim 1 or 2, wherein the width of the second conductive portion of the wire is less than 75 micrometers.

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