TWI710819B - Liquid crystal display - Google Patents
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Abstract
Description
本發明是有關於一種顯示器,且特別是有關於一種液晶顯示器。The present invention relates to a display, and more particularly to a liquid crystal display.
液晶矽晶顯示器(liquid crystal on silicon;LCOS)是一種利用半導體製程在矽晶片上製作出畫素陣列、驅動積體電路及其他電子元件的液晶顯示器。液晶矽晶顯示器不僅具有畫素尺寸小及解析度高等技術優勢,還具有製程簡單、成本低及體積小等優點,因此,液晶矽晶顯示器已廣泛被應用在各式電子產品,例如:手提攝影機、投影機等器材。Liquid crystal on silicon (LCOS) is a type of liquid crystal display that uses semiconductor processes to fabricate pixel arrays, drive integrated circuits and other electronic components on a silicon wafer. Liquid crystal silicon crystal displays not only have the technical advantages of small pixel size and high resolution, but also have the advantages of simple manufacturing process, low cost and small size. Therefore, liquid crystal silicon crystal displays have been widely used in various electronic products, such as portable cameras. , Projectors and other equipment.
在液晶矽晶顯示器的製造過程中,須在矽晶片上形成配向膜。然而,矽晶片的表面大多不平整,在不平整之表面上形成配向膜時,易出現條紋缺陷(striation defect)。In the manufacturing process of the liquid crystal silicon crystal display, an alignment film must be formed on the silicon wafer. However, the surface of the silicon wafer is mostly uneven. When an alignment film is formed on the uneven surface, striation defects are likely to occur.
本發明提供一種液晶顯示器,性能優良。The invention provides a liquid crystal display with excellent performance.
本發明的一種液晶顯示器,包括第一基板、畫素陣列、第一接墊、介電層、填充圖案、第一導體、第二基板及液晶層。第一基板具有顯示區及位於顯示區外的接墊區。畫素陣列設置於第一基板的顯示區上。第一接墊設置於第一基板的接墊區上。介電層設置於第一基板的接墊區上,且具有第一開口。介電層的第一開口與第一接墊重疊。填充圖案設置於介電層的第一開口內。填充圖案具有多個貫孔,且填充圖案的多個貫孔與第一接墊重疊。第一導體設置於介電層的第一開口中,且通過填充圖案的多個貫孔電性連接至第一接墊。第二基板設置於第一基板的對向。液晶層設置於畫素陣列與第二基板之間。A liquid crystal display of the present invention includes a first substrate, a pixel array, a first pad, a dielectric layer, a filling pattern, a first conductor, a second substrate and a liquid crystal layer. The first substrate has a display area and a pad area outside the display area. The pixel array is arranged on the display area of the first substrate. The first pad is disposed on the pad area of the first substrate. The dielectric layer is disposed on the pad area of the first substrate and has a first opening. The first opening of the dielectric layer overlaps with the first pad. The filling pattern is arranged in the first opening of the dielectric layer. The filling pattern has a plurality of through holes, and the plurality of through holes of the filling pattern overlap the first pad. The first conductor is disposed in the first opening of the dielectric layer, and is electrically connected to the first pad through a plurality of through holes of the filling pattern. The second substrate is disposed opposite to the first substrate. The liquid crystal layer is disposed between the pixel array and the second substrate.
在本發明的一實施例中,上述的填充圖案的材質包括光阻。In an embodiment of the present invention, the material of the aforementioned filling pattern includes photoresist.
在本發明的一實施例中,上述的液晶顯示器更包括配向膜,位於第一導體與填充圖案之間。In an embodiment of the present invention, the above-mentioned liquid crystal display further includes an alignment film located between the first conductor and the filling pattern.
在本發明的一實施例中,上述的第一接墊透過第一導體電性連接至第二基板。In an embodiment of the present invention, the above-mentioned first pad is electrically connected to the second substrate through the first conductor.
在本發明的一實施例中,上述的液晶顯示器更包括焊線及電路板。焊線設置於第一導體上且與第一導體電性連接。電路板透過焊線及第一導體電性連接至第一接墊。In an embodiment of the present invention, the above-mentioned liquid crystal display further includes a bonding wire and a circuit board. The bonding wire is arranged on the first conductor and electrically connected with the first conductor. The circuit board is electrically connected to the first pad through the bonding wire and the first conductor.
在本發明的一實施例中,上述的填充圖案之多個貫孔的其中一個具有孔徑D,且0.3µm≤D≤ 10µm。In an embodiment of the present invention, one of the plurality of through holes of the above-mentioned filling pattern has an aperture D, and 0.3 μm≦D≦10 μm.
在本發明的一實施例中,上述的第一基板為矽基板。In an embodiment of the present invention, the aforementioned first substrate is a silicon substrate.
在本發明的一實施例中,上述的第一導體的材質包括鎳。In an embodiment of the present invention, the material of the aforementioned first conductor includes nickel.
在本發明的一實施例中,上述的介電層更具有與第一開口隔開的一第二開口。液晶顯示器更包括第二接墊及第二導體。第二接墊設置於第一基板的接墊區上,且與第一接墊隔開。介電層的第二開口與第二接墊重疊。第二導體設置於介電層的第二開口內。第二接墊具有與介電層之第二開口重疊的表面,而第二導體直接地接觸且完全地覆蓋第二接墊的表面。In an embodiment of the present invention, the above-mentioned dielectric layer further has a second opening separated from the first opening. The liquid crystal display further includes a second pad and a second conductor. The second pad is disposed on the pad area of the first substrate and is separated from the first pad. The second opening of the dielectric layer overlaps with the second pad. The second conductor is disposed in the second opening of the dielectric layer. The second pad has a surface overlapping with the second opening of the dielectric layer, and the second conductor directly contacts and completely covers the surface of the second pad.
在本發明的一實施例中,上述的第二接墊的面積小於第一接墊的面積。In an embodiment of the present invention, the area of the second pad is smaller than the area of the first pad.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
圖1為本發明一實施例之液晶顯示器10的剖面示意圖。FIG. 1 is a schematic cross-sectional view of a
圖2為圖1之畫素陣列基板100的上視示意圖。FIG. 2 is a schematic top view of the
圖3A至圖3E為本發明一實施例之液晶顯示器10的製造流程的剖面示意圖。圖3A至圖3E對應圖2的剖線Ι-Ι’及剖線П-П’。3A to 3E are schematic cross-sectional views of the manufacturing process of the
以下配合圖1、圖2及圖3A至圖3E說明本發明一實施例之液晶顯示器10的製造流程及其構造。The following describes the manufacturing process and structure of the
請參照圖1、圖2及圖3A,首先,提供畫素陣列基板100。畫素陣列基板100包括第一基板110、畫素陣列120及多個接墊131、132。第一基板110具有顯示區110a及位於顯示區110a外的接墊區110b。畫素陣列120設置於第一基板110的顯示區110a上。多個接墊131、132設置於第一基板110的接墊區110b上。在本實施例中,多個接墊131、132可與位於顯示區110a的畫素陣列120及/或畫素陣列基板100的其它構件電性連接,但本發明不以此為限。Please refer to FIG. 1, FIG. 2 and FIG. 3A. First, a
舉例而言,在本實施例中,第一基板110可以是一矽基板,畫素陣列120包括多個畫素,且每一畫素可包括形成於所述矽基板上的一電晶體及電性連接至所述電晶體的一反射電極。簡言之,在本實施例中,畫素陣列基板100可以是反射式單晶矽液晶面板(reflective liquid crystal on silicon panel)的一矽晶片,但本發明不以此為限。For example, in this embodiment, the
畫素陣列基板100還包括介電層140。介電層140至少設置於第一基板110的接墊區110b上,且具有多個開口141、142。介電層140的多個開口141、142分別與多個接墊131、132重疊。The
舉例而言,在本實施例中,介電層140的材料可以是無機材料(例如:氧化矽、氮化矽、氮氧化矽、或上述至少二種材料的堆疊層)、有機材料或上述之組合;多個接墊131、132的材料可以是金屬或其他導電材料。For example, in this embodiment, the material of the
請參照圖1、圖2及圖3B,接著,在第一基板110上形成多個填充圖案151、152。多個填充圖案151、152分別設置於介電層140的多個開口141、142內。特別是,填充圖案151具有多個貫孔151a,且填充圖案151的多個貫孔151a與接墊131重疊;填充圖案152具有多個貫孔152a,且填充圖案152的多個貫孔152a與接墊132重疊。Please refer to FIG. 1, FIG. 2 and FIG. 3B. Next, a plurality of
舉例而言,在本實施例中,可在介電層140及多個接墊131、132上形成整面的光阻材料層(未繪示);之後,再對所述光阻材料層進行圖案化製程,以形成多個填充圖案151、152。在本實施例中,多個填充圖案151、152的材質可包括光阻(photoresist),但本發明不以此為限。For example, in this embodiment, an entire photoresist layer (not shown) can be formed on the
另外,在本實施例中,填充圖案151、152之多個貫孔151a、152a的每一個具有一孔徑D,且0.3µm≤D≤ 10µm,但本發明不以此為限。In addition, in this embodiment, each of the plurality of through
請參照圖1、圖2及圖3C,接著,形成配向膜160,以覆蓋畫素陣列120、介電層140及填充圖案151、152。配向膜160用以提供的錨定力(Anchoring force),以使液晶層300中的多個液晶分子在液晶顯示器10未致能時具有指定的預傾角(pre-tile angle)。Please refer to FIGS. 1, 2 and 3C. Then, an
舉例而言,在本實施例中,可利用旋轉塗佈(spin coating)的方法,於介電層140及填充圖案151、152上形成配向膜160,但本發明不以此為限。For example, in this embodiment, a spin coating method can be used to form the
值得一提的是,在本實施例中,是在填充圖案151、152已經填入介電層140的開口141、142後,才形成配向膜160;透過填充圖案151、152的填充,介電層140的上表面140b及多個填充圖案151、152的頂面151b、152b會形成一較為平整的表面,而有助於在形成配向膜160時,不易出現條紋缺陷(striation defect)。It is worth mentioning that, in this embodiment, the
請參照圖1、圖2及圖3D,接著,在多個接墊131、132上形成多個導體410、420。在本實施例中,導體410、420可透過膠體500初步固定在第一基板110的上方。舉例而言,在本實施例中,導體410、420例如是鎳球(Ni Ball),膠體500例如是用以封裝液晶層300的密封物(sealant),但本發明不以此為限。Please refer to FIG. 1, FIG. 2 and FIG. 3D. Next, a plurality of
請參照圖1、圖2及圖3E,接著,令導體410、420電性連接至接墊131、132。舉例而言,在本實施例中,組立(assemble)畫素陣列基板100與第二基板200的同時,第二基板200會下壓導體410、420,而使導體410、420設置於介電層140的開口141、142中且通過填充圖案151、152的多個貫孔151a、152a電性連接至接墊131、132。Please refer to FIG. 1, FIG. 2 and FIG. 3E. Next, the
值得一提的是,由於填充圖案151、152具有多個貫孔151a、152a,因此,導體410、420能夠容易得穿過填充圖案151、152,以和接墊131、132電性連接。也就是說,在開口141、142中設置填充圖案151、152以避免條紋缺陷(striation defect)產生的同時,由於填充圖案151、152具有多個貫孔151a、152a,因此填充圖案151、152的設置並不易影響導體410、420與接墊131、132的電性連接。It is worth mentioning that since the filling
此外,在本實施例中,由於導體410、420是在配向膜160形成之後才通過填充圖案151、152的多個貫孔151a、152a與接墊131、132電性連接,因此,部分的配向膜160可能會殘存於導體410、420與填充圖案151、152之間,但本發明不以此為限。In addition, in this embodiment, since the
第二基板200設置於第一基板110的對向。舉例而言,在本實施例中,第二基板200可包括一玻璃基板以及設置於玻璃基板上的透明導電層,所述透明導電層與畫素陣列120的反射電極之間的電位差可用以驅動液晶層300中的液晶分子,進而使液晶顯示器10顯示畫面。然而,本發明不限於此,根據其它實施例,第二基板200也可以是其它構造。The
在本實施例中,導體410、420可用以電性連接第二基板200與接墊131、132。也就是說,在本實施例中,設置於第一基板110上的接墊131、132可透過導體410、420電性連接至第二基板200,但本發明不以此為限。In this embodiment, the
請參照圖1、圖2及圖3E,接著,在本實施例中,可選擇性得使用真空注入法將液晶層300填入畫素陣列基板100、第二基板200與膠體500所圍出的空間內。然後,封止膠體500的液晶注入口(未繪示)。於此,便完成本實施例的液晶顯示器10。Please refer to FIG. 1, FIG. 2 and FIG. 3E. Next, in this embodiment, a vacuum injection method can be selectively used to fill the
由於畫素陣列基板100之介電層140的開口141、142中設有填充圖案151、152,因此,液晶顯示器10不易出現條紋缺陷(striation defect)。更重要的是,由於填充圖案151、152具有多個貫孔151a、152b,因此,在製造液晶顯示器10的過程中,導體410、420能良好得與接墊131、132電性連接,而使液晶顯示器10具有正常的功能及優良的信賴性。Since the
在本實施例中,介電層140之所有的開口141、142中皆設有填充圖案151、152。然而,本發明不限於此,根據其它實施例,若介電層140之部分的開口(例如:開口142)不大,而介電層140之所述部分的開口不易造成條紋缺陷(striation defect),則介電層140之所述部分的開口中也可不設置填充圖案(例如:填充圖案152),以下配合圖4、圖5及圖6說明之。In this embodiment, all the
在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重述。It must be noted here that the following embodiments use the element numbers and part of the content of the foregoing embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, refer to the foregoing embodiment, and the following embodiments will not be repeated.
圖4為本發明另一實施例之液晶顯示器10A的剖面示意圖。4 is a schematic cross-sectional view of a
圖5為圖4之畫素陣列基板100A的上視示意圖。FIG. 5 is a schematic top view of the pixel array substrate 100A of FIG. 4.
圖6為對應圖5之剖線Ι-Ι’及剖線П-П’的液晶顯示器10A的剖面示意圖。6 is a schematic cross-sectional view of the
請參照圖4、圖5及圖6,本實施例的液晶顯示器10A與前述的液晶顯示器10類似,兩者的差異在於,在本實施例中,介電層140之部分的開口(例如:開口141)中有設置填充圖案151,而介電層140之另一部分的開口(例如:開口142)中可不設置填充圖案。4, 5 and 6, the
具體而言,在本實施例中,畫素陣列基板100A的多個接墊131、132包括面積較大的一接墊131及面積較小的另一接墊132。與面積較大之接墊131重疊之介電層140的開口141較大,而與面積較小之接墊132重疊之介電層140的開口142較小。較小的開口142中可不設置填充圖案。也就是說,在本實施例中,接墊132具有開口142重疊的一表面132a,而導體420可直接接觸且完全覆蓋接墊132的表面132a。Specifically, in this embodiment, the
圖7為本發明又一實施例之液晶顯示器10B的剖面示意圖。圖8為圖7之液晶顯示器10B的局部R的放大示意圖。FIG. 7 is a schematic cross-sectional view of a
請參照圖7及圖8,本實施例的液晶顯示器10B與前述的液晶顯示器10類似,說明兩者的差異如下。7 and 8, the
在本實施例中,畫素陣列基板100B更包括用以供打線接合(wire bonding)使用的接墊133。介電層140還具有與接墊133重疊的開口143。液晶顯示器10B更包括填充圖案153,設置於介電層140的開口143內。填充圖案153具有多個貫孔153a,且填充圖案153的多個貫孔153a與接墊133重疊。液晶顯示器10B更包括導體700,設置於介電層140的開口143中,且通過填充圖案153的多個貫孔153a電性連接至接墊133。液晶顯示器10B更包括焊線710,設置於導體700上且與導體700電性連接。液晶顯示器10B更包括電路板800。電路板800之一線路的接點810可透過焊線710及導體700電性連接至接墊133。舉例而言,在本實施例中,電路板800可以是可撓式電路板(flexible printed circuit;FPC),但本發明不以此為限。In this embodiment, the
在本實施例中,在打線接合(wire bonding)的過程中,導電球(即導體700)可通過填充圖案153的多個貫孔153a,以和接墊133良好得電性連接,進而使液晶顯示器10B具有正常的功能及良好的信賴性。In this embodiment, during the wire bonding process, the conductive ball (ie, the conductor 700) can pass through the multiple through
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.
10、10A、10B:液晶顯示器
100、100A、100B:畫素陣列基板
110:第一基板
110a:顯示區
110b:接墊區
120:畫素陣列
131、132、133:接墊
132a:表面
140:介電層
141、142、143:開口
151、152、153:填充圖案
151a、152a、153a:貫孔
151b、152b:頂面
160:配向膜
200:第二基板
300:液晶層
410、420:導體
500:膠體
700:導體
710:導體
800:電路板
810:接點
D:孔徑
R:局部
Ι-Ι’、П-П’:剖線10, 10A, 10B:
圖1為本發明一實施例之液晶顯示器10的剖面示意圖。
圖2為圖1之畫素陣列基板100的上視示意圖。
圖3A至圖3E為本發明一實施例之液晶顯示器10的製造流程的剖面示意圖。
圖4為本發明另一實施例之液晶顯示器10A的剖面示意圖。
圖5為圖4之畫素陣列基板100A的上視示意圖。
圖6為對應圖5之剖線Ι-Ι’及剖線П-П’的液晶顯示器10A的剖面示意圖。
圖7為本發明又一實施例之液晶顯示器10B的剖面示意圖。
圖8為圖7之液晶顯示器10B的局部R的放大示意圖。
FIG. 1 is a schematic cross-sectional view of a
10:液晶顯示器 10: LCD display
110:第一基板 110: first substrate
131、132:接墊 131, 132: pads
140:介電層 140: Dielectric layer
141、142:開口 141, 142: Opening
151、152:填充圖案 151, 152: Fill pattern
151a、152a:貫孔 151a, 152a: through hole
160:配向膜 160: Alignment film
200:第二基板 200: second substrate
410、420:導體 410, 420: Conductor
500:膠體 500: colloid
D:孔徑 D: Aperture
I-I’、Π-Π’:剖線 I-I’, Π-Π’: cut line
Claims (10)
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6246458B1 (en) * | 1997-11-18 | 2001-06-12 | Sanyo Electric Co., Ltd. | Method for manufacturing liquid crystal display |
TWI489184B (en) * | 2012-07-26 | 2015-06-21 | Au Optronics Corp | Liquid crystal display panel |
TWI527258B (en) * | 2012-05-28 | 2016-03-21 | 日立全球先端科技股份有限公司 | Method and apparatus for forming pattern |
TW201831963A (en) * | 2006-08-31 | 2018-09-01 | 日商半導體能源研究所股份有限公司 | Liquid crystal display device |
-
2019
- 2019-08-29 TW TW108130981A patent/TWI710819B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6246458B1 (en) * | 1997-11-18 | 2001-06-12 | Sanyo Electric Co., Ltd. | Method for manufacturing liquid crystal display |
TW201831963A (en) * | 2006-08-31 | 2018-09-01 | 日商半導體能源研究所股份有限公司 | Liquid crystal display device |
TWI527258B (en) * | 2012-05-28 | 2016-03-21 | 日立全球先端科技股份有限公司 | Method and apparatus for forming pattern |
TWI489184B (en) * | 2012-07-26 | 2015-06-21 | Au Optronics Corp | Liquid crystal display panel |
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