TWI603138B - Repair structure and display panel thereof - Google Patents

Description

Repair structure and its display panel

The present invention relates to a repair structure and a display panel thereof, and more particularly to a repair structure and a display panel thereof which can achieve a good repair effect.

The display device includes an array substrate, a counter substrate, and a display dielectric layer filled between the two substrates. The array substrate is provided with a large number of signal lines (such as scan lines and data lines). However, in the production process, a large number of signal lines may be disconnected. At this time, the signal on the broken line cannot be transmitted normally, thereby forming display defects of the display panel. Therefore, some signal line repair methods are needed to reduce the number of signal lines. Cost of production.

The method commonly used today is carried out by means of laser welding or/and laser cutting. However, if the energy of the lightning ray is too small, there is a problem of incomplete repair; if the energy of the lightning ray is too large, the problem of damage of the surrounding wires may exist.

The invention provides a repair structure and a display panel thereof, which can avoid metal chip splash caused by the signal line repairing process of the repair structure and the display panel thereof. Moreover, the repair structure of the present invention can be produced without greatly increasing the number of process steps and costs, and can effectively reduce the production cost.

The present invention provides a repair structure including a repair line, a signal line, an insulating layer, an auxiliary layer, and a barrier layer. The repair line is disposed on the substrate. The signal line is disposed on the substrate, and the signal line and the repair line are disposed at intersection. The insulating layer is disposed between the repairing line and the signal line. The auxiliary layer is disposed on the insulating layer, and the auxiliary layer has a hole, and the vertical projection of the hole is disposed above the overlap of the repair line and the signal line. The barrier layer is disposed on the substrate, and the barrier layer covers a portion of the auxiliary layer and is filled in the hole, wherein the auxiliary layer and the barrier layer are composed of a non-conductor material.

The present invention further provides a display panel comprising the repair structure, the opposite substrate and the display dielectric layer as described above. The display dielectric layer is disposed between the substrate and the opposite substrate.

The above described features and advantages of the invention will be apparent from the following description.

The various embodiments of the present invention are disclosed in the drawings, and in the claims However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified manner.

In the following detailed description, reference is made to the accompanying drawings. In the drawings, like reference characters generally refer to the The exemplary embodiments described in the Detailed Description, the drawings, and the claims are not limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein. It should be understood that the various aspects of the present disclosure, which are set forth in the <RTIgt;

The words used in the text are for the purpose of describing particular embodiments and are not intended to limit the invention. As used herein, the singular forms " " " The use of "first", "second", etc., is used to describe various elements, regions, layers, etc., but such terms are used to distinguish one element, region or layer from another element, region or layer. Thus, a first element, component, region, layer, and/or portion discussed below may be referred to as a second element, component, region, layer, and/or portion, without departing from the disclosure.

In addition, spatially relative terms such as "under", "on", "lower", "upper" and the like may be used herein to describe one element or feature in the drawings. The relationship of a component or feature. It will be appreciated that the spatially relative terms may encompass different orientations of the elements in the application in addition to the orientation depicted in the drawings. For example, elements in the "following" or "beneath" or "an" or "an" Thus, the spatially relative terms "under" can include both orientations above and below.

As used herein, the terms "about", "about", "nearly" or "substantially" shall mean substantially within twenty percent of a given value or range, preferably in percent. Within ten, better than five percent. The quantities provided herein are approximate, meaning that unless otherwise stated, the terms "about", "about", "nearly" or "substantially" may be used.

In the figures, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It will be understood that when an element such as a layer, a film, a region or a substrate is referred to as "on" or "connected to" another element, it can be Intermediate components can also be present. In contrast, when an element is referred to as “directly on” or “directly connected to” another element, As used herein, "connected" may refer to both physical and/or electrical connections.

FIG. 1 is a schematic diagram showing the configuration of a display panel signal line. Referring to Fig. 1, the display panel 10, 10' of the comparative embodiment and the plurality of embodiments has a display area 31 and a peripheral area 33. The substrate 100, 100' has one or more repair lines 21, 21' disposed in the peripheral region 33, the signal lines 11, 11' are disposed in the display area 31, and the repair lines 21, 21' are interlaced with the signal lines 11, 11' to Pre-patching points 124a and 124b are formed. When the signal lines 11, 11' have a break point D and a disconnection occurs, the two ends of the damaged signal lines 11, 11' can be respectively passed through the pre-repair points 124a and 124b by using laser welding. The repaired wires 21, 21' are welded to maintain the electrically connected (electrically conductive state) of the damaged signal lines 11, 11' via the repair lines 21, 21', and the display area 31 is normally operated.

In one embodiment, the signal line is electrically connected to the driving chip IC, wherein the signal line can be a data line or a gate line (or a scan line). The following description uses the signal line as a data line as an example, but not Limited to this. The signal lines 11, 11' are disposed in the display area 31 and extend to the peripheral area 33, and when the signal lines 21, 21' do not have the break point D, the repair lines 21, 21' are floating lines, when the signal When the lines 11, 11' have a break point D, the repair lines 21, 21' remain electrically connected to the signal lines 11, 11'. The enlarged view and the cross-sectional view of the area A of Fig. 1 will be described in detail below.

Please refer to FIG. 2. FIG. 2 is an enlarged top view (or top view) of a portion of FIG. 1 of the present invention. The repair structure P includes a repair line 21, a signal line 11, an insulating layer (not shown in the upper view), an auxiliary layer 43, 43', a barrier layer 45, and holes TH, TH'. In this embodiment, an insulating layer (not shown in the upper view) is disposed between the signal line 21 (for example, the data line) and the repairing line 21. For example, the signal line 21 (for example, a data line) may be disposed above the repairing line 21 with an insulating layer disposed therebetween (not shown in the upper view), but is not limited thereto. In other embodiments, the repairing line 21 can be disposed above the signal line 21 with an insulating layer disposed therebetween (not shown in the upper view), and the repairing line 21 can be selectively one of a scanning line or a data line. . The auxiliary layers 43, 43' are disposed above the signal line 21, and the auxiliary layers 43, 43' have holes TH, TH'. The vertical projections of the holes TH and TH' are disposed directly above the overlap of the repairing line 21 and the signal line 11, that is, the overlapping range A1 of the repairing line 21 and the signal line 11 is perpendicularly projected on the substrate 100 and vertically projected on the substrate by the holes TH, TH'. The area A2 on 100 overlaps each other. Preferably, the area A2 of the holes TH, TH' is greater than or substantially equal to the overlapping range A1 of the repair line 21 and the signal line 11. In other words, when the area A2 of the holes TH, TH' is larger than the overlapping range A1 of the repair line 21 and the signal line 11, the holes TH, TH' may overlap at least partially with the overlapping area A1 of the repair line 21 and the signal line 11. The barrier layer 45 is disposed on the auxiliary layers 43, 43', and the barrier layer 45 is filled in the holes TH, TH', wherein the auxiliary layers 43, 43' and the barrier layer 45 are composed of a non-conductive material.

Please refer to FIG. 3. FIG. 3 is a cross-sectional view of the A-A' section line of the first embodiment of FIG. 2 of the repair structure of the present invention. The repair signal line 21 is disposed on the inner surface of the substrate 100, and the inner surface of the substrate 100 can be selectively provided with other layers such as a buffer layer (not shown) to increase the effect of at least one of flexibility or adhesion, etc. The invention is not limited thereto. The repair line 21 is disposed on the substrate 100. The signal line 11 is disposed on the substrate 100, and the insulating layer 41 is disposed between the repair line 21 and the signal line 11. For example, the signal line 21 (for example, a data line) may be disposed above the repairing line 21 with an insulating layer disposed therebetween (not shown in the upper view), but is not limited thereto. In other embodiments, the repairing line 21 can be disposed above the signal line 21 with an insulating layer disposed therebetween (not shown in the upper view), and the repairing line 21 can be selectively one of a scanning line or a data line. . The auxiliary layer 43 is disposed on the insulating layer 41, and the auxiliary layer 43 has a hole TH. The hole TH is vertically projected and disposed above the repair line 21 and the signal line 11. The hole TH is defined by the auxiliary layer 43, so that the hole TH has no other protective layer or auxiliary layer 43 to form the bottom surface of the hole TH, that is, the hole TH itself has no bottom surface and the top surface is regarded as a perforation. The barrier layer 45 is disposed on the substrate 100, and the barrier layer 45 covers at least a portion of the auxiliary layer 43 and is filled in the hole TH. The auxiliary layer 43 and the barrier layer 45 are composed of a non-conductor material. In this embodiment, the hole TH is formed by the auxiliary layer 43, and the inner side wall 43b of the auxiliary layer 43 and the upper surface 11a of the signal line 11 define a hole TH. The barrier layer 45 is filled in the hole TH, wherein the barrier layer 45 contacts the inner side wall 43b and the upper surface 11a of the signal line 11. The barrier layer 45 can partially fill the holes TH. However, in order to achieve a better protective effect, the barrier layer 45 covers the upper surface 43a of at least a portion of the auxiliary layer 43, that is, the barrier layer 45 contacts the upper surface 43a of at least a portion of the auxiliary layer 43, and the barrier layer 45 fills the hole. TH, however, the present invention allows for alignment errors in the process.

Further, the hole TH of the auxiliary layer 43 can provide the thickness H of the barrier layer 45 in the direction of the vertical substrate 100 to facilitate the protection function of the subsequent repair process. The thickness H of the barrier layer 45 is preferably, for example, greater than or equal to about 2.15 micrometers (um) and less than or equal to 3 micrometers (um). In this embodiment, the auxiliary layer 43 may be a single layer or a multilayer structure, and the material thereof may be selected from organic materials such as, for example, a photo resist, a photo spacer, and a black light shielding layer ( Black matrix) or color filter or other suitable material. The barrier layer 45 material may be selected from organic materials such as photo resists, photo spacers, black matrices, or color filters. In a variant embodiment, the auxiliary layer 43 can be a red color filter layer, a green color filter layer or a blue color filter layer.

Please refer to FIG. 4, which is a cross-sectional view showing another modified embodiment of the first embodiment of the repair structure of the present invention. 4 differs from the first embodiment shown in FIG. 3 in that the auxiliary layer 43 material is selected from inorganic materials such as oxides, nitrides, oxynitrides, aluminas, or other suitable materials. The auxiliary layer 43 is an inorganic material that can increase the adhesion of the interface when the subsequent barrier layer 45 is disposed. In this variant embodiment, the auxiliary layer 43 includes a first protective layer PV1 and a second protective layer PV2, and the materials of the first protective layer PV1 and the second protective layer PV2 may be different or substantially the same, when the protective layers PV1, PV2 The first protective layer PV1 corresponds to the auxiliary layer 43 when it is a single layer. The first protective layer PV1 and the second protective layer PV2 material are selected from inorganic materials such as oxides, nitrides, oxynitrides, aluminum oxides, or other suitable materials. The hole TH is defined by the auxiliary layer 43, so that the hole TH has no other protective layer PV1, PV2 or the auxiliary layer 43 to form the bottom surface of the hole TH, that is, the hole TH itself has no bottom surface and the top surface is regarded as a through hole or It is a through hole, that is, penetrates the upper surface and the lower surface of the auxiliary layer 43.

The barrier layer 45 may be a single layer or a multilayer structure, and the material thereof may be selected from an organic material such as a photo resist, a photo spacer, a black matrix or a color filter layer ( Color filter), or other suitable material. When the barrier layer 45 is formed, since the barrier layer 45 has a material flow property, it is difficult to form a thickness in the direction of the vertical substrate 100 at the time of coating. Therefore, the hole TH is formed in advance, and the thickness of the barrier layer 45 in the direction perpendicular to the substrate 100 can be increased. Therefore, in this embodiment, the barrier layer 45 and the auxiliary layer 43 are in direct contact with each other. When the barrier layer 45 is made of an organic material, such as directly disposed on the signal line 11, there may be a problem of peeling. Therefore, an auxiliary of inorganic materials may be used. The layer 43 can serve as an adhesion layer, so that the barrier layer 45 is filled in the holes TH and is not easily peeled off. However, in order to achieve a better protective effect, the barrier layer 45 covers the upper surface 43a of at least a portion of the auxiliary layer 43, that is, the barrier layer 45 contacts the upper surface 43a of at least a portion of the auxiliary layer 43, and the barrier layer 45 fills the hole. TH, however, the present invention allows for alignment errors in the process.

The barrier layer 45 may be transparent or opaque, preferably an opaque material, such as a black matrix, because the black matrix is often the last process. Thus, the display area 31 and the peripheral area 33 can be made together, so that no additional process steps are added. In other embodiments, if the barrier layer 45 is made of an opaque material, it may be stacked by a plurality of color resists of different colors, but is not limited thereto.

Referring to FIG. 5, FIG. 5 is a cross-sectional view showing a second embodiment of the A-A' section line of FIG. 2 of the repair structure of the present invention. The repairing line 21 is disposed on the inner surface of the substrate 100. The inner surface of the substrate 100 may be provided with other layers such as a buffer layer to increase flexibility, and the invention is not limited thereto. The repair line 21 is disposed on the substrate 100. The insulating layer 41 is provided on the repairing line 21. The signal line 11 is disposed above the insulating layer 41. In other words, the insulating layer 41 is disposed between the repair line 21 and the signal line 11. The signal line 11 can also be disposed under the repairing line 21, and the invention is not limited thereto.

As shown in FIG. 5, FIG. 5 is different from the other variation of the first embodiment of FIG. 4 in that the auxiliary layer 43' of the second embodiment further includes an organic layer 431, and the organic layer 431 is disposed on the first protective layer PV1'. Between the second protective layer PV2' and the second protective layer PV2' contacts the first protective layer PV1' in the hole TH. For example, the second protective layer PV2' extends over the side 431a of the organic layer 431. The organic layer 431 may be a single layer or a multilayer structure, and its material is, for example, a photo resist, a photo spacer, a black matrix, or a color filter. ) or other suitable materials. In the present embodiment, the first protective layer PV1' covers a portion of the upper surface of the insulating layer 41 and a portion of the upper surface 11a of the signal line 11. In a preferred embodiment, the first protective layer PV1' contacts the insulating layer 41 (for example, the upper surface of the insulating layer 41) and covers the side surface 11c of the signal line 11 and a portion of the upper surface 11a, wherein the lower surface 11b of the signal line 11 is in contact with the insulating layer. The top surface (or upper surface) of the layer 41, the upper surface 11a of the signal line 11 is exposed by the hole TH, and the side surface 11c of the signal line 11 is connected to the upper surface 11a of the signal line 11 and the lower surface 11b of the signal line 11. The hole TH exposes the upper surface 11a of the signal line 11, i.e., where the auxiliary layer 43' does not cover the upper surface 11a of the signal line 11. The second protective layer PV2' is disposed on the top surface of the organic layer 431, and the side surface 431a of the second protective layer PV2' extending the organic layer 431 extends to form the inner sidewall 43b of the hole TH, and the second protective layer PV2' preferably extends to The hole TH is in contact with the first protective layer PV1'. The hole TH is defined by the auxiliary layer 43', so the hole TH has no other protective layer PV1', PV2', the organic layer 431 or the auxiliary layer 43' to form the bottom surface of the hole TH (or fill in the hole TH), that is, the hole The TH itself has no bottom surface and a top surface as a through hole. In other words, the barrier layer 45 is in contact with the layer (or surface) disposed under the auxiliary layer 43' by the hole TH, for example, with the signal line 11. Part of the upper surface 11a is in contact.

Please refer to FIG. 6. FIG. 6 is a cross-sectional view showing a third embodiment of the line A-A' of FIG. 2 of the present invention. Figure 6 differs from the second embodiment illustrated in Figure 5 in that it further comprises a recess O. Preferably, the recess O has a bottom surface B1, B2, and the bottom surface B1, B2 is formed by the first protective layer PV1" and the second protective layer PV2", respectively, and the bottom surfaces B1, B2 are disposed in the hole TH', such a barrier layer 45 is not in contact with the layer (or surface) disposed under the auxiliary layer 43'. In other words, the barrier layer 45 is in contact with one of the auxiliary layers 43', wherein the auxiliary layer 43' further includes an organic layer 431 disposed on the first protective layer PV1" and the second protective layer PV2 "between. The first protective layer PV1" and the second protective layer PV2" material is selected from inorganic materials such as oxides, nitrides, oxynitrides, aluminum oxides, or other suitable materials, wherein the first protective layer PV1" The material may be the same or different from the second protective layer PV2". The groove O of this embodiment is formed by the organic layer 431, the first protective layer PV1" and the second protective layer PV2". The hole TH' is formed by the organic layer 431. The hole TH' has no other protective layer PV1", PV2", the organic layer 431 or the auxiliary layer 43' forms the bottom surface of the hole TH (or is filled in the hole TH), that is, the hole TH itself has no bottom surface and The top surface is regarded as a through hole, that is, the film layer disposed on the lower layer and the lower layer of the organic layer 431 can be directly contacted by the holes TH, for example, the first protective layer PV1" and the second protective layer PV2" The holes TH are in direct contact. The bottom surfaces B1, B2 are formed by the first protective layer PV1" and the second protective layer PV2, respectively. In other words, the bottom surface B2 of the recess O may be the top surface (or upper surface) of the second protective layer PV2", and the bottom surface B1 of the recess O may be the top surface (or upper surface of the first protective layer PV1" ), that is, the bottom surface B1 and the bottom surface B1 are located at different horizontal planes. In other embodiments, the recess has only one bottom surface. For example, the first protective layer PV1" extends into the hole TH', and the first protective layer PV1" covers at least part of the signal line 11 upper surface 11a to form the bottom surface B1, and The second protective layer PV2" covers only the inner side wall 43b of the hole TH' without covering the bottom surface B1, thereby defining the groove O. In another variant embodiment, the second protective layer PV2" extends over the hole TH, second The topography surface of the protective layer PV2" extends the organic layer 431, the first protective layer PV1" does not extend into the hole TH', and the second protective layer PV2" covers the upper surface of the portion of the signal line 11 to form the bottom surface B2.

Referring to FIG. 1 , FIG. 7 and FIG. 8 , FIG. 7 is a schematic cross-sectional view of a control panel of the present invention after being repaired, and FIG. 8 is a cross-sectional view of the display panel of the present invention after repair. 8 is a view showing a display panel 10 formed by any of the first embodiment, the second embodiment, the third embodiment, and the above-described modification, but the second embodiment is taken as an example. The display panels 10, 10' of FIGS. 7 and 8 have a substrate 100, 100' and a counter substrate 200, 200' and a display dielectric layer (not shown), wherein a display medium layer (not shown) is disposed on the substrate 100. Between 100' and the opposite substrate 200, 200'. The repair structures P, P' are disposed on the inner surface of the substrate 100, 100' and are located in the peripheral region 33 shown in FIG. The substrate 100, 100', 200, 200' may be a rigid substrate or a flexible substrate, the material of which may include, for example, glass, quartz, plastic, sapphire or other suitable inorganic or organic transparent material, and the substrate 100, 100' and the pair The materials to the substrates 200, 200' may be the same or different. The display medium layer (not shown) may include a polymer dispersed liquid crystal (PDLC) layer, a polymer network liquid crystal (PNLC) layer, a cholesteric liquid crystal layer, an electro-change layer, and the like may be driven by a vertical electric field or a horizontal electric field. The display medium layer or the electro-optic light layer or other suitable display medium layer, however, the material of the display medium layer and the driving mode of the display panel can be appropriately selected by those skilled in the art as needed. The repair structure P' of the comparative embodiment includes a substrate 100', a repair line 21', an insulating layer 41', a signal line 11', and a barrier layer 53. The comparative embodiment may further include an intermediate protective layer 51 for providing a subsequent adhesion of the barrier layer 53 to prevent the barrier layer 53 from peeling off. The repair structure P of the display panel 10 of the second embodiment includes a substrate 100, a repair line 21, an insulating layer 41, a signal line 11, an auxiliary layer 43', a hole TH, and a barrier layer 45.

The repair process is usually performed via the outer surfaces 100b, 100b' of the substrates 100, 100', and the repair lines 21, 21' and the signal lines 11, 11' are welded by laser L or the like to form the solder conductor 3. The display panel 10' of the comparative embodiment has no auxiliary layer compared to the display panel 10 formed by the first embodiment, the second embodiment, or the third embodiment, so that the repair line 21' and the signal line 11 are The 'vertical projection' does not have holes TH, TH' or grooves O where the substrate 100' overlaps. The metal debris of the melted signal line 11' or the repair line 21' may be passed through the barrier layer 53 during the repair process of the display panel 10' of the embodiment, causing metal debris to splash onto the opposite substrate 200' or The surrounding signal line causes a short circuit. Alternatively, when the display panel of the comparative embodiment is pressed by a touch or test or the like and the electrode layer 61' is also provided on the opposite substrate 200', there is a possibility of coming into contact with metal debris passing through the barrier layer 53'. Further, the signal line 11' is short-circuited with the electrode layer 61', so that the display quality of the display panel of the comparative example is deteriorated. Here, the electrode layer 61' may be a transparent electrode and may provide a common voltage (Com).

The display panel formed in the above embodiment has holes or grooves. When the repair process is performed, the auxiliary layer can provide the barrier layer to have a thickness thicker than that of the comparative embodiment in the direction of the vertical substrate, thereby avoiding the melted signal during the repair process. The metal residue of the wire or the repair wire penetrates the barrier layer to provide a good protection for the barrier layer, thereby providing better display quality. In addition, it can be produced without significantly increasing the process steps and costs, and can effectively reduce production costs.

Although the present invention has been described in connection with the exemplary embodiments of the present invention, it is understood that the invention is not limited to the disclosed embodiments, but rather, it is intended to apply to various modifications and equivalent arrangements. Within the spirit and scope of the claims.

100, 100'‧‧‧ substrates

IC‧‧‧Drive Chip

31‧‧‧The surrounding area

33‧‧‧The surrounding area

124a, 124b‧‧‧ pre-repair points

D‧‧‧ breakpoint

A‧‧‧ area

41, 41'‧‧‧Insulation

11, 11'‧‧‧ signal line

21, 21’‧‧‧ repair line

43, 43’‧‧‧ auxiliary layer

TH, TH’‧‧‧ holes

A1‧‧‧ overlapping range

A2‧‧‧ area

11a, 43a‧‧‧ upper surface

11b‧‧‧ lower surface

11c, 431a‧‧‧ side

43b‧‧‧ inner side wall

H‧‧‧thickness

45, 53‧‧‧ barrier

PV2, PV2'‧‧‧ second protective layer

PV1, PV1'‧‧‧ first protective layer

B1, B2‧‧‧ bottom

431‧‧‧Organic layer

51‧‧‧Intermediary protection

O‧‧‧ Groove

100a, 100a’‧‧‧ inner surface

61'‧‧‧Electrical layer

L‧‧‧Laser

100b, 100b’‧‧‧ outer surface

P, P’‧‧‧ repair structure

3‧‧‧Welded conductor

1 is a schematic view showing the arrangement of a signal line and a repairing line of the display panel of the present invention; FIG. 2 is an enlarged top view of a portion of the repairing structure of the present invention; FIG. 3 is a view of FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a cross-sectional view showing another modified embodiment of the first embodiment of the repair structure of the present invention; FIG. 5 is a view of the repair structure of the present invention taken along line A-A' of FIG. FIG. 6 is a cross-sectional view showing a third embodiment of the cross-sectional line A-A' of FIG. 2 of the repair structure of the present invention; FIG. 7 is a cross-sectional view of the display panel of the present invention. FIG. 8 is a schematic cross-sectional view of the display panel of the present invention after repair.

100‧‧‧Substrate

43a, 11a‧‧‧ upper surface

21‧‧‧ repair line

43b‧‧‧ inner side wall

41‧‧‧Insulation

H‧‧‧thickness

11‧‧‧Signal line

TH‧‧‧ hole

43‧‧‧Auxiliary layer

45‧‧‧Block

Claims (10)

A repairing structure includes: a repairing line disposed on a substrate, wherein the repairing line is a floating line; a signal line is disposed on the substrate, and the signal line crosses the repairing line An insulating layer is disposed between the repairing line and the signal line; an auxiliary layer is disposed on the insulating layer, and the auxiliary layer has a hole, and the hole is vertically projected on the repairing line and the signal line Above the overlap; at least one protective layer disposed on the substrate, the at least one protective layer partially overlapping the auxiliary layer, and extending to cover the hole to form a groove; and a barrier layer disposed on the substrate And filling the hole, wherein the auxiliary layer and the barrier layer are composed of a non-conductor material. The repairing structure of claim 1, wherein the auxiliary layer comprises a first protective layer and a second protective layer, and the first protective layer and the second protective layer are formed of an inorganic material. The repairing structure of claim 2, wherein the auxiliary layer further comprises an organic layer disposed between the first protective layer and the second protective layer. The repair structure of claim 1, wherein the auxiliary layer is composed of an organic material. The repair structure of claim 1, wherein the barrier layer comprises at least one of a light spacer or a color filter layer. The repair structure of claim 1, wherein the at least one protective layer comprises a first protective layer and a second protective layer, wherein the first protective layer is disposed under the auxiliary layer and extends to cover the hole, and the second protective layer is disposed on the auxiliary layer and extends to cover The hole, and the second protective layer contacts the first protective layer at the hole. A display panel comprising: the repair structure according to any one of claims 1 to 6; a pair of a substrate and a display dielectric layer, wherein the display dielectric layer is disposed between the substrate and the opposite substrate. The display panel of claim 7, further comprising an electrode layer disposed on an inner surface of the opposite substrate. The display panel of claim 7, wherein the display panel has a display area and a peripheral area, wherein the repairing line is disposed in the peripheral area, the signal line is electrically connected to a driving chip, and the signal line is disposed on the The display area extends to the peripheral area. The display panel of claim 9, wherein the driving chip is a data line driving chip.