JP2010169803A - Electrooptical apparatus and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance reliability and yield of an electrooptical apparatus. <P>SOLUTION: The electrooptical apparatus is so configured that a leader line (L1) which is arranged in the peripheral region (A2) of a first substrate (S1) to connect an external terminal (P) with a first or a second driving circuit (DC1, DC2) has a first layer wiring part and a second layer wiring part electrically connected with each other, formed in different layers, and overlapping with each other in a plan view, wherein the first layer wiring part (L1a) is formed on the first substrate (S1) side and the second layer wiring part (L1b) is formed on a second substrate (S2) side. In this configuration, even when a physical impact is applied to the peripheral region and the substrate is chipped or cracked, the multiple layered wiring parts can ensure driving of circuits. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electro-optical device, and more particularly to an electro-optical device having a lead wiring in a peripheral region of a substrate.

  An electro-optical device typified by a liquid crystal display (LCD) has a configuration in which an electro-optical material such as liquid crystal is disposed between an active matrix substrate and a counter substrate.

  A pixel region is disposed at the center of the active matrix substrate, and a drive circuit and wiring for driving the pixels are disposed around the pixel region.

  For example, Patent Document 1 below discloses an electro-optical device having a connection wiring 34 c on the outer periphery of a substrate 20.

JP 2005-215616 A

  The inventor has been conducting research and development related to an electro-optical device typified by a liquid crystal display (LCD) and the like, and is considering improvement of device characteristics.

  In the device in which the wiring is arranged on the outer peripheral portion of the substrate as described above, a physical impact may be applied to the substrate due to a handling mistake or the like during the manufacturing process or the mounting process of the device. Such an impact is often applied to the end portion of the substrate (device), thereby causing chipping or cracking of the substrate. At this time, the wiring arranged around the substrate is torn and causes display failure. Such chipping and cracking defects at the end of the apparatus are called chipping defects, leading to a decrease in manufacturing yield, and also a decrease in reliability when the actual apparatus is used.

  Therefore, a specific aspect of the present invention aims to provide a device configuration that can improve the reliability and yield of an electro-optical device.

  One of the forms of the electro-optical device according to the present invention is a first substrate having a first pixel region and a first peripheral region located on the outer periphery of the first pixel region, and disposed opposite to the first substrate. A second substrate having a second pixel region opposed to the first pixel region and a second peripheral region located on an outer periphery of the second pixel region; and the first pixel region. An electro-optical element disposed; first and second drive circuits disposed in the peripheral region and driving the electro-optical element; an external terminal disposed in the peripheral region; the external terminal; and the first Or a first wiring for connecting a second drive circuit, or a second wiring for connecting the first drive circuit and the second drive circuit, the lead wiring arranged in the peripheral region, And the lead wires are electrically connected to each other and formed in different layers. , Having a first layer wiring portion and a second layer wiring portion that overlap each other in plan view, wherein the first layer wiring portion is formed on the first substrate side, and the second layer wiring portion is formed on the second substrate. Formed on the side.

  According to such a configuration, even when a physical impact is applied to the peripheral region and chipping or cracking of the substrate occurs, circuit driving is ensured by one of the first layer wiring unit and the second layer wiring unit, and the device Reliability can be improved. In addition, the manufacturing yield of the device can be improved.

  For example, the substrate is a hard substrate. Thus, even when a hard substrate that is easily damaged by an impact is used, the reliability of the apparatus can be improved.

  For example, the first layer wiring portion and the second layer wiring portion are electrically connected via a connection portion in the insulating layer. Thus, an insulating layer is arrange | positioned between wiring parts. A sealing film disposed between the first substrate and the second substrate and disposed on an outer periphery of the first pixel region; and the connection portion is disposed in the sealing film. . As described above, the contact between the wiring portions may be achieved using the sealing region.

  For example, the first peripheral region is wider than the second peripheral region, and the first and second drive circuits and the external terminals are arranged on the first peripheral region extending to the outer periphery of the second peripheral region. Is done. In this way, the drive circuit and the external terminals are arranged in the exposed area of the first substrate.

  For example, the second substrate has a counter electrode, and the second layer wiring portion is provided in a layer different from the counter electrode. The second substrate has a counter electrode. For example, the second layer wiring portion is formed of the same material in the same layer as the counter electrode. As described above, the second wiring portion can be provided in a layer different from the counter electrode or in the same layer.

  An electronic apparatus according to the present invention includes the electro-optical device. According to such a configuration, the characteristics of the electronic device can be improved.

1 is a plan view showing a configuration of a liquid crystal device (electro-optical device) according to an embodiment. It is AA and BB sectional drawing of FIG. It is a circuit diagram which shows the structure of the active matrix substrate of this Embodiment. FIG. 2 is an enlarged plan view and a cross-sectional view showing a configuration of a liquid crystal device (electro-optical device) according to the present embodiment. FIG. 3 is an enlarged plan view showing a configuration on a substrate S1 side of a liquid crystal device (electro-optical device) according to the present embodiment. FIG. 4 is an enlarged plan view showing a configuration of a counter substrate S2 side of the liquid crystal device (electro-optical device) according to the present embodiment. It is sectional drawing which shows the manufacturing process of the liquid crystal device (electro-optical device) of this Embodiment. Sectional drawing which showed typically the multilayer wiring part Lm of the extraction wiring L1 of this Embodiment is shown. Sectional drawing which showed typically the multilayer wiring part Lm of the extraction wiring L1 of this Embodiment is shown. It is sectional drawing which shows the comparative example which comprised the extraction wiring L1 only with the wiring of single layer. It is sectional drawing which shows the effect in the case of this Embodiment which led wire L1 was multilayered. It is a top view which shows the example of the connection form of the wiring part L1a and the wiring part L1b. It is a top view which shows the other structure of the liquid crystal device (electro-optical device) of this Embodiment. It is a top view which shows the other structure of the liquid crystal device (electro-optical device) of this Embodiment. . It is a figure which shows the example of the electronic device using an electro-optical apparatus.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same or related code | symbol is attached | subjected to what has the same function, and the repeated description is abbreviate | omitted. In addition, the gray area | region of FIG. 1 shows the mode of a connection with the external connection terminal P and the extraction wiring L1, L2 in a simplified manner.

  FIG. 1 is a plan view showing a configuration of a liquid crystal device (electro-optical device) according to the present embodiment, and FIG. 2 is a cross-sectional view taken along lines AA and BB in FIG. FIG. 3 is a circuit diagram showing the configuration of the active matrix substrate of the present embodiment.

  As shown in FIG. 1 and FIG. 2, an active matrix substrate (array substrate, hereinafter simply referred to as “substrate”) S1 and a counter substrate S2 are arranged to face each other, and between them, a sealing film (sealant, Liquid crystal (not shown) is injected and sealed by an insulating layer 50. The material and size of the substrates S1 and S2 are not limited, but are made of, for example, a hard substrate such as a glass substrate. As an example, the substrate S1 is configured to be slightly larger than the counter substrate S2.

  As shown in FIG. 1, the substrate S1 has a pixel region A1 and a peripheral region A2 around it. As shown in FIG. 3, in the pixel region A1, a plurality of pixels are arranged in an array, and each pixel includes a thin film transistor T and a pixel electrode PE. The gate electrode of the thin film transistor T is connected to the scanning line SL, one of the source and drain electrodes is connected to the pixel electrode PE, and the other is connected to the data line DL. Here, scanning line driving circuits (circuit blocks) DC2 are arranged on both sides in the x direction of the pixel area A1, and the scanning lines SL are driven alternately. The data line DL is connected to and driven by a data line driving circuit (circuit block) DC1.

  On the other hand, the counter substrate S2 also has a pixel region B1 and a peripheral region B2 around it as shown in FIG. Among these, the pixel region B1 corresponds to the pixel region A1, and the peripheral region B2 is configured to be narrower than the peripheral region A2. That is, the peripheral area A2 is exposed on the outer periphery of the peripheral area B2, and the scanning line driving circuit DC2 and the data line driving circuit DC1 are arranged on the exposed portion (see FIG. 1). Further, the scanning line driving circuit DC2 and the data line driving circuit DC1 are connected to an external connection terminal (external terminal) P, receive a drive signal input to the terminal, and send a predetermined signal to the external connection terminal P. Output to the outside. The external connection terminal P is also disposed in the exposed portion.

  Here, the wiring connecting the external connection terminal P, the scanning line driving circuit DC2 and the data line driving circuit DC1, and the wiring connecting the driving circuits (here, the scanning line driving circuit DC2) are routed to the peripheral region A2. Since they are rotated, they are referred to as extraction wirings (extraction wirings) L1 and L2.

  A part of L1 among the lead wires L1 and L2 is a multilayer wiring portion Lm, and includes a wiring portion L1a arranged on the substrate S1 side and a wiring portion L1b arranged on the counter substrate S2 side. The multilayer structure portion Lm is arranged in the overlapping portion of the substrates S1 and S2 in L1 shown in FIG. The wiring portions L1a and L1b are electrically connected via the connection pad CP1.

  CP2 is a wiring (not shown) connected to a counter electrode E2 (not shown in FIG. 2) formed on almost the entire surface of the counter substrate S2 and a predetermined external connection terminal (for example, a ground potential supply terminal) P. ).

  Hereinafter, the configuration of the liquid crystal device (electro-optical device) according to the present embodiment will be described in more detail with reference to FIGS. FIG. 4 is an enlarged plan view showing the configuration of the liquid crystal device (electro-optical device) according to the present embodiment and a cross-sectional view thereof. FIG. FIG. 6 is an enlarged plan view showing the configuration on the counter substrate S2 side of the liquid crystal device (electro-optical device) of the present embodiment. FIG. 7 is a cross-sectional view showing a manufacturing process of the liquid crystal device (electro-optical device) of the present embodiment. For ease of explanation, the plan view is also appropriately hatched.

  FIG. 4A is a partially enlarged view of the upper left part of FIG. In the region shown in FIG. 4A where cross hatching is applied, a multilayer wiring portion Lm is configured. That is, as shown in FIG. 4B, the wiring portion L1a arranged on the substrate S1 side and the wiring portion L1b arranged on the counter substrate S2 side are arranged to overlap each other. Note that these wiring portions are electrically connected by connection pads CP1 that do not appear in the cross-sectional view of FIG.

  That is, as shown in FIG. 5, the wiring portion L1a extending from the scanning line driving circuit DC2 is arranged in the peripheral region A2 on the substrate S1 side. On the other hand, as shown in FIG. 6, the wiring portion L1b is disposed in the peripheral region B2 on the counter substrate S2 side. The wiring portion L1b has a pattern overlapping the wiring portion L1a. Note that L1d in FIG. 5 is a part of the wiring, and is a wiring part connected to an external connection terminal (for example, a ground potential supply terminal) P via a wiring (not shown). A counter electrode E2 is formed on substantially the entire surface of the counter substrate S2, and a wiring portion L1b is disposed on the counter electrode E2 via the insulating layer 40 (see FIGS. 4B and 7).

  For example, a conductive paste is applied on predetermined portions (CP1, CP2) of the wiring portions L1a, L1d shown in FIG. 5, and a sealing resin (50) is applied to the outer periphery of the pixel region A1 of the substrate S1. By aligning and joining S1 and the counter substrate S2, the wiring portions L1a and L1b can be electrically connected, and the sealing film 50 is formed (FIG. 7). Further, after filling the liquid crystal from the injection port of the sealing film 50 (not shown), the injection port is closed with a resin or the like.

  Further, if not previously mounted on the peripheral area A2 of the substrate S1 exposed on the outer periphery of the counter substrate S2, IC chips constituting the scanning line driving circuit DC2 and the data line driving circuit DC1 are mounted. At this time, a plurality of external terminals of the IC chip, for example, a plurality of bump electrodes and the respective ends of the lead wires L1 (L1a) and L2 are aligned and bonded. Note that an IC chip may be mounted in the region in advance, or various elements may be formed in the region and used as a driver circuit in the same manner as the element such as the thin film transistor T included in the pixel.

  8 and 9 are cross-sectional views schematically showing the multilayer wiring portion Lm of the lead-out wiring L1 of the present embodiment. As shown in FIG. 8A, a wiring portion L1a is formed in the peripheral region A2 of the substrate S1. Thereafter, if necessary, the insulating layer 30 may be formed on the upper portion. In this case, the contact hole C1 is formed in a predetermined region (CP1) on the wiring portion L1a. On the other hand, as shown in FIG. 9, a wiring portion L1b is formed in the peripheral region B2 of the substrate S2. Next, as shown in FIG. 9B, these substrates S1 and S2 are arranged to face each other, a conductive material such as a conductive paste is applied over the contact hole C1, and the wirings L1a and L1b are electrically connected.

  Thus, in the present embodiment, a part of the lead wiring L1 arranged in the peripheral region A2 is multilayered (multilayer wiring part Lm), and the wiring part L1a arranged on the substrate S1 side and the counter substrate S2 Since it is configured by the wiring portion L1b arranged on the side, even if a physical impact is applied to the peripheral region and chipping or cracking of the substrate occurs, electrical communication can be ensured by any wiring layer.

  FIG. 10 is a cross-sectional view showing a comparative example in which the lead-out line L1 is composed of only a single-layer line, and FIG. 11 is a cross-sectional view showing the effect of the present embodiment in which the lead-out line L1 is multilayered. .

  That is, as shown in FIG. 10, when the lead-out line L1 is configured by only a single-layer line, when a physical impact is applied and the line is disconnected, electrical communication cannot be ensured, resulting in failure or failure. On the other hand, as shown in FIG. 11, when the lead-out wiring L1 is multi-layered, even if the upper layer wiring (here, L1b) is disconnected due to physical impact, the wiring L1a on the substrate S1 side causes the electrical Secure communication. As a result, the manufacturing yield of the apparatus can be improved and the reliability can be improved.

  FIG. 12 is a plan view illustrating an example of a connection form of the wiring portion L1a and the wiring portion L1b. As shown in FIG. 12A, the connection pads CP1 are arranged in a staggered manner so that two rows are staggered, or the connection pads CP1 are arranged obliquely as shown in FIG. 12B. Also good.

  FIG. 13 is a plan view showing another configuration of the liquid crystal device (electro-optical device) of the present embodiment. In FIG. 1, the multilayer wiring portion Lm (L1a, L1b) is extended along the upper side of the substrate S1, but as shown in FIG. 13, only the wiring portion L1a is present at the center of the side. May be routed. As described above, it is also effective to intensively layer the four corners of the substrate S1, which is easily subjected to an impact in handling or the like.

  Further, the wiring portion L1a formed on the substrate S1 side may be formed in the same process (same material) as any of the components formed in the pixel region A1, for example, any constituent portion of the thin film transistor T. For example, the thin film transistor T may be formed in the same process (same material) as a semiconductor layer, a gate electrode, a source, a drain electrode (wiring), and the like that constitute the thin film transistor T.

  FIG. 14 is a plan view showing another configuration of the liquid crystal device (electro-optical device) according to the present embodiment. As described with reference to FIGS. 4 and 6 and the like, in the above, the wiring portion L1b formed on the counter substrate S2 side is formed of a layer different from the counter electrode E2, but as shown in FIG. By laying out the wiring portion L1b on the outer periphery of the electrode E2, these may be formed in the same process (same material). In the above description, the counter electrode E2 is formed in a rectangular shape with a large area, but the electrode may have other shapes such as a line shape.

  In the above description, the wiring portion L1a or L1b is a single layer, but the wiring portions formed on each substrate may be further multilayered. At this time, on the conductive layer formed in the pixel region of the substrate, for example, on the substrate S1 side, each wiring layer is configured in the same process as the gate electrode, the source, and the drain electrode (wiring). You may electrically connect with a predetermined connection part. Thus, the reliability can be further improved by further multilayering the wiring portions on each substrate side.

In the above embodiment, as an example of the lead-out wiring, the wiring connecting the external connection terminal P, the scanning line driving circuit DC2 and the data line driving circuit DC1, and the driving circuit (here, between the scanning line driving circuit DC2). Although the wirings (L1, L2) for connecting the terminals are described as an example, the lead wirings between other circuits and external connection terminals or between other blocks may be multilayered. In the above embodiment, the active matrix substrate has been described as an example. However, the present invention is not limited to the substrate, and the present invention can be applied to various substrates such as a passive matrix substrate in which a lead wiring is formed in a peripheral region. In the above embodiment, the liquid crystal device has been described as an example. However, the present invention can be applied to various electro-optical devices such as an organic EL device and an electrophoresis device. In such an electro-optical device, in order to secure a large pixel region, wiring is often drawn around the peripheral region, which is preferable to apply the present invention.
<Electronic equipment>
The electro-optical device can be incorporated into various electronic devices. An electronic apparatus in which such an electro-optical device is used will be described. FIG. 15 illustrates an example of an electronic device using an electro-optical device.

  FIG. 15A shows an application example to a mobile phone, and FIG. 15B shows an application example to a video camera. FIG. 15C shows an application example to a television (TV).

  As shown in FIG. 15A, the cellular phone 530 includes an antenna portion 531, an audio output portion 532, an audio input portion 533, an operation portion 534, and an electro-optical device (display portion) 500.

  As shown in FIG. 15B, the video camera 540 includes an image receiving unit 541, an operation unit 542, an audio input unit 543, and an electro-optical device (display unit) 500.

  As illustrated in FIG. 15C, the television 550 includes an electro-optical device (display unit) 500. A personal computer or the like also includes an electro-optical device.

  In addition to the above, the electronic apparatus having the electro-optical device includes a fax machine with a display function, a digital camera finder, a portable TV, an electronic notebook, an electric bulletin board, a display for advertisements, and the like. The electro-optical device of the present invention can be incorporated in the electro-optical device portion of the electronic apparatus.

  It should be noted that the examples and application examples described through the above embodiment can be used in appropriate combination according to the application, or can be used with modifications or improvements, and the present invention is limited to the description of the above embodiment. Is not to be done.

  DESCRIPTION OF SYMBOLS 30, 40 ... Insulating layer, 50 ... Sealing film, 500 ... Electro-optical device, 530 ... Mobile phone, 531 ... Antenna part, 532 ... Audio | voice output part, 533 ... Audio | voice input part, 534 ... Operation part, 540 ... Video camera 541 ... image receiving unit, 542 ... operation unit, 543 ... audio input unit, 550 ... television, A1 ... S1 pixel region, A2 ... S1 peripheral region, B1 ... S2 pixel region, B2 ... S2 peripheral region, CP1, CP2 ... connection pad, C1 ... contact hole, E2 ... counter electrode, DL ... data line, DC1 ... data line drive circuit, DC2 ... scanning line drive circuit, L1a ... wiring part, L1b ... wiring part, Lm ... multilayer wiring Part, L1, L2 ... lead wiring, PE ... pixel electrode, P ... external connection terminal, S1 ... substrate (active matrix substrate), S2 ... counter substrate, SL ... scanning line, T ... thin film transistor

Claims (8)

A first substrate having a first pixel region and a first peripheral region located on an outer periphery of the first pixel region;
A second substrate disposed opposite to the first substrate, the second substrate having a second pixel region facing the first pixel region, and a second peripheral region located on the outer periphery of the second pixel region. A substrate,
An electro-optic element disposed in the first pixel region;
First and second drive circuits disposed in the first peripheral region and driving the electro-optic element;
An external terminal disposed in the first peripheral region;
A first wiring that connects the external terminal and the first or second driving circuit, or a second wiring that connects the first driving circuit and the second driving circuit, the first or second driving circuit; 2 lead wires arranged in the peripheral area,
The lead-out wiring is electrically connected to each other, formed in different layers, and has a first layer wiring portion and a second layer wiring portion that overlap each other in plan view,
The electro-optical device, wherein the first layer wiring portion is formed on the first substrate side, and the second layer wiring portion is formed on the second substrate side.   The electro-optical device according to claim 1, wherein the substrate is a hard substrate.   The electro-optical device according to claim 1, wherein the first layer wiring portion and the second layer wiring portion are electrically connected through a connection portion in an insulating layer. A sealing film disposed between the first substrate and the second substrate and disposed on an outer periphery of the first pixel region;
The electro-optical device according to claim 1, wherein the connection portion is disposed in the sealing film.   The first peripheral region is wider than the second peripheral region, and the first and second drive circuits and the external terminals are disposed on the first peripheral region extending to the outer periphery of the second peripheral region. The electro-optical device according to claim 1. The second substrate has a counter electrode;
The electro-optical device according to claim 1, wherein the second layer wiring portion is provided in a different layer from the counter electrode. The second substrate has a counter electrode;
The electro-optical device according to claim 1, wherein the second layer wiring portion is formed of the same material in the same layer as the counter electrode.   An electronic apparatus comprising the electro-optical device according to claim 1.