CN113189819B - Display device - Google Patents

Abstract

The invention provides a display device, which includes a first substrate, a second substrate, a frame glue and a wire. The first substrate has a display area. The frame glue is located between the first substrate and the second substrate. The sealant surrounds the display area of the first substrate. The wires are located on the first substrate and at least on the outside of the sealant. The wire includes a first conductive part and a second conductive part. The first conductive portion is closer to the edge of the first substrate than the second conductive portion. The width of the first conductive portion is smaller than the width of the second conductive portion. The thickness of the first conductive part is greater than the thickness of the second conductive part or the cross-sectional area of the first conductive part is larger than the cross-sectional area of the second conductive part. The display device of the present invention has better quality.

Description

display device

technical field

The invention relates to an electronic device, in particular to a display device.

Background technique

In an electronic device, the connection quality between conductors may directly or indirectly affect the quality of the electronic device.

Contents of the invention

The invention provides a display device with better quality.

The display device of the present invention includes a first substrate, a second substrate, a sealant, and wires. The first substrate has a display area. The frame glue is located between the first substrate and the second substrate. The sealant surrounds the display area of the first substrate. The wires are located on the first substrate and at least on the outside of the sealant. The wire includes a first conductive part and a second conductive part. The first conductive portion is closer to the edge of the first substrate than the second conductive portion. The width of the first conductive portion is smaller than the width of the second conductive portion. The thickness of the first conductive part is greater than the thickness of the second conductive part or the cross-sectional area of the first conductive part is larger than the cross-sectional area of the second conductive part.

Based on the above, by making the width of the first conductive part smaller than the width of the second conductive part, and making the thickness of the first conductive part larger than the thickness of the second conductive part or the cross-sectional area of the first conductive part larger than the cross-sectional area of the second conductive part area, so that the display device of the present invention has better quality.

Description of drawings

FIG. 1A is a schematic partial cross-sectional view of a display device according to a first embodiment of the present invention.

FIG. 1B is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention.

FIG. 1C is a schematic partial top view of a display device according to the first embodiment of the present invention.

FIG. 1D is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention.

FIG. 1E is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention.

FIG. 2 is a schematic partial top view of a display device according to a second embodiment of the present invention.

FIG. 3 is a schematic partial top view of a display device according to a third embodiment of the present invention.

The reference signs are explained as follows:

100, 200, 300: display device

110: the first substrate

R1: non-display area

R2: display area

110a: surface

110c: edge

120: second substrate

120c: edge

191: Frame glue

130: wire

131: the first conductive part

131d: Length

131w: width

131h: thickness

131r: section

131c: edge

132: the second conductive part

132d: Length

132w: width

132h: Thickness

132r: section

140, 141, 142: insulating layer

150, 250, 350: side electrodes

150w, 250w, 350w: Width

160: circuit board

164: connecting line

164w: width

170: buffer structure

170d: Length

194: Conductive adhesive layer

197: air gap

L1: first distance

L2: second distance

R3: Region

X, Y, Z: direction

Detailed ways

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In the drawings, the size of some of the elements may be exaggerated or reduced for clarity. Throughout the specification, the same reference numerals denote the same elements. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection.

It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, members, regions, layers and/or sections, these elements, members, regions, and/or sections should not limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, "a first element," "component," "region," "layer" or "section" discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include plural forms including "at least one" or "at least one" unless the content clearly dictates otherwise. "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It should also be understood that when used in this specification, the terms "comprising" and/or "comprising" designate the stated features, regions, integers, steps, operations, the presence of elements and/or components, but do not exclude one or more Existence or addition of other features, regions as a whole, steps, operations, elements, components and/or combinations thereof.

Furthermore, relative terms such as "lower" and "upper" or "left" and "right" may be used herein to describe one element's relationship to another element as shown in the figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "below" can encompass both an orientation of "below" and "upper," depending on the particular orientation of the drawing. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "beneath" can encompass both an orientation of above and below. In addition, in order to clearly show the directional relationship between different drawings, the Cartesian coordinate system (Cartesian coordinate system; XYZ Cartesian coordinate system) is used to represent the corresponding directions in some illustrations, but the present invention does not use This is the limit.

As used herein, "substantially" includes stated values and averages within acceptable deviations from the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the particular amount of error associated with the measurement (i.e. , limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art and the present invention, and will not be interpreted as idealized or excessive formal meaning, unless expressly so defined herein.

Exemplary embodiments are described herein with reference to cross section illustrations that are schematic illustrations of idealized embodiments. Accordingly, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances are to be expected. Thus, embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region shown or described as flat, may, typically, have rough and/or non-linear features. Additionally, acute corners shown may be rounded. Thus, the regions shown in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.

FIG. 1A is a schematic partial cross-sectional view of a display device according to a first embodiment of the present invention. FIG. 1B is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention. FIG. 1C is a schematic partial top view of a display device according to the first embodiment of the present invention. FIG. 1D is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention. FIG. 1E is a schematic partial cross-sectional view of a display device according to the first embodiment of the present invention. For example, FIG. 1A may be a partial side cross-sectional schematic view of the display device 100 . FIG. 1B may be an enlarged view corresponding to the region R3 shown in FIG. 1A . FIG. 1C may be a schematic partial top view corresponding to the region R3 shown in FIG. 1A . FIG. 1D and FIG. 1E may be partial front cross-sectional schematic diagrams of the display device 100 . In addition, for the sake of clarity, some film layers or components may be omitted in the drawings. For example, the conductive adhesive layer 194 is omitted in 1C, and only a part of the first substrate 110 and a part of the wire 130 are exemplarily shown in FIG. 1D or FIG. 1E .

Referring to FIG. 1A and FIG. 1B , the display device 100 includes a first substrate 110 , a second substrate 120 , a sealant 191 and wires 130 .

The first substrate 110 has a display area R2 and a non-display area R1. In an embodiment, a pixel array layer (not shown) may be disposed in the display region R2 of the first substrate 110 . The aforementioned pixel array layer may be composed of a plurality of pixel structures composed of active elements (such as transistors), passive elements (such as capacitors) and/or corresponding wires. That is to say, the first substrate 110 may include a corresponding base material and a corresponding film layer on the base material. In one embodiment, the first substrate 110 may be called an array substrate, but the invention is not limited thereto.

The sealant 191 is located between the first substrate 110 and the second substrate 120 , and the sealant 191 surrounds the display region R2 of the first substrate 110 . That is to say, the display region R2 of the first substrate 110 may be located inside the sealant 191 . In this embodiment, the non-display region R1 of the first substrate 110 may be located outside the sealant 191 , but the invention is not limited thereto.

In one embodiment, the material of the sealant 191 may include light-curable glue, heat-curable glue or a combination thereof, but the invention is not limited thereto.

In an embodiment, the second substrate 120 may include a corresponding optical film or sheet. That is to say, the second substrate 120 may include a corresponding base material and a corresponding film layer on the base material. For example, the second substrate 120 has a red filter film (not shown), a green filter film (not shown), a blue filter film (not shown), a corresponding light-shielding layer (not shown) ) and the color filter of the corresponding polarizer (not shown). In one embodiment, the second substrate 120 may be called a color filter substrate, but the invention is not limited thereto.

In an embodiment, the display device 100 may be a liquid crystal display device 100 . For example, there may be a liquid crystal layer (not shown) in the space formed by the first substrate 110 , the second substrate 120 and the sealant 191 . The arrangement of the aforementioned red filter film, green filter film, blue filter film, light-shielding layer, polarizer and/or liquid crystal layer may be the same or similar to that of a general liquid crystal display device, so details will not be repeated here.

The wire 130 is located on the surface 110 a of the first substrate 110 . The wire 130 is at least located on the outer side of the sealant 191 . For example, the wire 130 can extend from the inner side of the frame glue 191 to the outside of the frame glue 191 , but the invention is not limited thereto. In one embodiment, the wire 130 may be electrically connected to elements in the pixel array layer (not shown), but the invention is not limited thereto.

It should be noted that only one wire 130 is schematically shown in the figure, but the present invention does not limit the number of wires 130 in the display device 100 . For example, the display device 100 may include a plurality of wires that are the same as or similar to the wires 130 . In addition, multiple wires that are the same as or similar to wire 130 may be parallel to each other.

In this embodiment, the conductive wire 130 may be formed by plating (such as sputtering, electroplating or other suitable plating methods), photoetching and/or grinding, but the invention is not limited thereto. In one embodiment, the aforementioned methods (eg, plating, grinding, etc., but not limited) may be performed once or more than once. Multiple times of plating and/or multiple times of grinding may have correspondingly different parameters and/or directions.

The wire 130 includes a first conductive portion 131 and a second conductive portion 132 . The first conductive portion 131 is closer to the edge 110 c of the first substrate 110 than the second conductive portion 132 . In this embodiment, the first conductive portion 131 and the second conductive portion 132 of the wire 130 may both be located outside the sealant 191 . The first conductive part 131 and the second conductive part 132 may be connected to each other.

In this embodiment, an edge 131c of the first conductive portion 131 of the wire 130 is substantially flush with an edge 110c of the first substrate 110 . That is to say, the outer surface of the wire 130 (that is, the surface of the wire 130 on the outer side of the sealant 191 and farthest from the sealant 191; such as: the outer surface of the first conductive part 131) and one side of the first substrate 110 can be substantially Coplanar.

In one embodiment, an edge 131c of the first conductive portion 131 of the wire 130 may be substantially flush with an edge 120c of the second substrate 120 . That is to say, the outer surface of the wire 130 (eg, the outer surface of the first conductive portion 131 ) and a side surface of the second substrate 120 may be substantially coplanar.

In this embodiment, the display device 100 may further include an insulating layer 140 covering the wires 130, but the present invention is not limited thereto. The insulating layer may include a single film layer or a stack of multiple film layers, but the present invention is not limited thereto. For example, the insulating layer 140 may include an insulating layer 141 and an insulating layer 142 , but the invention is not limited thereto. The insulating layer 140 may extend from the inside of the sealant 191 to the outside of the sealant 191 , but the invention is not limited thereto. In the display device 100 , the insulating layer (such as part or all of the aforementioned insulating layer 140 ) may be referred to as a gate insulating layer, a planar layer, or a buffer layer, but the present invention is not limited thereto.

In this embodiment, the display device 100 may further include a side electrode 150 . The side electrode 150 covers the edge 131c of the first conductive portion 131 and the edge 110c of the first substrate 110 . For example, the conductive material can be formed on at least the first substrate by printing (such as: screen printing), plating (such as: sputtering, evaporation), sticking (such as: pasting) or other suitable methods. 110 , so that the side electrode 150 formed by the aforementioned conductive material can directly contact the side surface of the wire 130 . For example, the side electrode 150 formed by the aforementioned conductive material may directly contact the edge 131c of the first conductive portion 131 .

In one embodiment, the side electrodes 150 may further cover the edge 120c of the second substrate 120 . That is, the side electrode 150 may directly contact the side of the second substrate 120 .

In this embodiment, the display device 100 may further include a circuit board 160 . The circuit board 160 is located on the side of the first substrate 110 and/or the side of the second substrate 120 . The circuit board 160 includes connecting wires 164 . The connection wire 164 is electrically connected to the wire 130 through the side electrode 150 .

For example, the display device 100 may further include a conductive adhesive layer 194 . The conductive adhesive layer 194 covers the corresponding side electrodes 150 . The conductive adhesive layer 194 is, for example, a film layer formed by anisotropic conductive paste (ACP) or anisotropic conductive film (ACF). The connecting lines 164 of the circuit board 160 can be electrically connected to the corresponding side electrodes 150 through the conductive adhesive layer 194 , but the invention is not limited thereto.

In one embodiment, the circuit board 160 includes, for example, a flexible printed circuit board (Flexible Printed Circuit; FPC), but the invention is not limited thereto. For example, the circuit board 160 includes a circuit board with a chipon film (COF) packaging structure.

Please refer to FIG. 1B and FIG. 1C , in a plan view (for example: viewed from a direction perpendicular to the surface 110a; as shown in FIG. 1C ), the width 131w of the first conductive portion 131 is smaller than the width 132w of the second conductive portion 132 . Accordingly, the covered area of the first conductive part 131 may be lifted. For example, the area where the side electrode 150 can cover the wire 130 can be raised. In this way, the process window of the display device 100 can be improved, or the signal transmission quality and/or power supply quality of the display device 100 can be further improved.

Referring to FIG. 1B to FIG. 1E , in this embodiment, the cross-sectional area of the cross-section 131r of the first conductive portion 131 is larger than the cross-sectional area of the cross-section 132r of the second conductive portion 132 . In this way, the covered area of the first conductive portion 131 can be further improved. The aforementioned section 131r and the aforementioned section 132r are substantially parallel to each other.

Referring to FIG. 1B to FIG. 1E , in this embodiment, the thickness 131h of the first conductive portion 131 is greater than the thickness 132h of the second conductive portion 132 . In this way, the covered area of the first conductive portion 131 can be further improved.

In one embodiment, the thickness of the first conductive portion 131 (for example: thickness 131h) may be on the corresponding cross section (for example: cross section 131r), in the direction perpendicular to the surface 100a, the first conductive portion 131 has biggest size. Similarly, the width of the first conductive portion 131 (eg, the width 131w) may be the maximum dimension of the first conductive portion 131 in the direction parallel to the surface 100a on the aforementioned section (eg, the section 131r).

In one embodiment, the thickness of the second conductive portion 132 (for example: thickness 132h) can be on the corresponding cross section (for example: cross section 132r), in the direction perpendicular to the surface 100a, the second conductive portion 132 has biggest size. Similarly, the width of the second conductive portion 132 (such as the width 132w) may be the maximum dimension of the second conductive portion 132 in the direction parallel to the surface 100a on the aforementioned cross section (such as the cross section 132r).

In the comparison between the thickness of the first conductive part 131 (such as: thickness 131h) and the thickness of the second conductive part 132 (such as: thickness 132h), the section (such as: section 131r) used to define the thickness of the first conductive part 131 ) and the section (eg: section 132r) used to define the thickness of the aforementioned second conductive portion 132 are substantially parallel to each other.

In one embodiment, the thickness of the first conductive portion 131 may basically gradually increase from a region close to the second conductive portion 132 to a region away from the second conductive portion 132 , but the invention is not limited thereto.

In one embodiment, the width of the first conductive portion 131 may gradually decrease from a region close to the second conductive portion 132 to a region away from the second conductive portion 132 , but the invention is not limited thereto.

In this embodiment, the width 132w of the second conductive portion 132 of the wire 130 is less than about 75 micrometers (micrometer; μm). In this way, the layout density of the wires 130 can be increased.

In this embodiment, the width 150w of the side electrode 150 is greater than the width 132w of the second conductive portion 132 in a plan view (eg, viewed from a direction perpendicular to the surface 110a; as shown in FIG. 1C ).

In this embodiment, the width 131w of the first conductive portion 131 is greater than the width 164w of the connection line 164 in a plan view (eg, viewed from a direction perpendicular to the surface 110a; as shown in FIG. 1C ). In this way, the process window of the display device 100 can be improved, or the signal transmission quality and/or power supply quality of the display device 100 can be further improved.

In this embodiment, the display device 100 may further include a buffer structure 170 . The buffer structure 170 is located on the surface 110 a of the first substrate 110 and outside the sealant 191 . The first conductive portion 131 of the wire 130 is closer to the edge 110 c of the first substrate 110 than the buffer structure 170 .

In this embodiment, the buffer structure 170 may include corresponding film layers and/or corresponding elements. That is to say, the buffer structure 170 may be composed of one or more film layers, one or more elements, or combinations, stacks or combinations thereof. For example, the buffer structure 170 may include protrusions and solid elements or film layers (such as the insulating layer 140 , but not limited to) on the protrusions.

In this embodiment, there may be an air gap 197 between the second substrate 120 and the first conductive portion 131 and/or between the second substrate 120 and the second conductive portion 132 . In a direction perpendicular to the surface 110a, the air gap 197 has a first distance L1. That is to say, there may be a non-substantial space (such as: an air gap 197) between the second substrate 120 and the first conductive portion 131, and/or there may be a non-substantial space (such as: an air gap 197) between the second substrate 120 and the second conductive portion 132. Such as: air gap 197). Moreover, the first distance L1 is substantially greater than 0 micrometer. In a direction perpendicular to the surface 110 a, there is a second distance L2 between the second substrate 120 and the buffer structure 170 . The first distance L1 is greater than the second distance L2.

In one embodiment, during the process of manufacturing the display device 100 , the buffer structure 170 may improve the stability or yield of the process, but the invention is not limited thereto.

In this embodiment, the first distance L1 is greater than 1 micron, and the first distance L1 is less than or equal to about 5 microns. In this way, the process stability or yield of the display device 100 may be improved, but the present invention is not limited thereto.

In this embodiment, the second distance L2 is greater than or equal to 0 micrometer, and the second distance L2 is less than or equal to about 1 micrometer.

In one embodiment, the second substrate 120 and the buffer structure 170 may be in conflict, but the invention is not limited thereto. That is, the second distance L2 may be equal to 0 microns.

In this embodiment, the second conductive portion 132 of the middle wire 130 is closer to the edge 110 c of the first substrate 110 than the buffer structure 170 . The sum of the length 131d of the first conductive portion 131 and the length 132d of the second conductive portion 132 is smaller than the length 171d of the buffer structure 170 . In this way, in the process of manufacturing the display device 100 , the stability or yield of the process may be improved, but the present invention is not limited thereto.

FIG. 2 is a schematic partial cross-sectional view of a display device according to a second embodiment of the present invention. The display device 200 of this embodiment is similar to that of the display device 100 of the first embodiment, and its similar components are denoted by the same reference numerals, and have similar functions, materials or formation methods, and descriptions thereof are omitted. Specifically, FIG. 2 may be a schematic partial top view of the display device 200 similar to the region R3 shown in FIG. 1C . In addition, for clarity, only part of the first substrate 110 , part of the wire 130 , part of the side electrode 250 and part of the circuit board 160 are shown in FIG. 2 .

2, the display device 200 includes a first substrate 110, a second substrate (not shown, such as: a second substrate similar to the aforementioned second substrate 120), a frame (not shown, such as similar to the aforementioned frame glue 191 frame glue), wires 130 and side electrodes 250 . The side electrode 250 of this embodiment is similar to the side electrode 150 of the previous embodiment. The width 250w of the side electrode 250 is equal to the width 132w of the second conductive portion 132 .

3 is a schematic partial cross-sectional view of a display device according to a third embodiment of the present invention. The display device 300 of this embodiment is similar to that of the display device 100 of the first embodiment, and its similar components are denoted by the same reference numerals, and have similar functions, materials or formation methods, and descriptions thereof are omitted. Specifically, FIG. 3 may be a partial top view of a display device 300 similar to the region R3 shown in FIG. 1C . In addition, for clarity, only part of the first substrate 110 , part of the wire 130 , part of the side electrode 350 and part of the circuit board 160 are shown in FIG. 3 .

Please refer to FIG. 3 , the display device 300 includes a first substrate 110, a second substrate (not shown, such as: a second substrate similar to the aforementioned second substrate 120 ), a sealant (not shown, such as similar to the aforementioned sealant 191 frame glue), wires 130 and side electrodes 350. The side electrode 350 of this embodiment is similar to the side electrode 150 of the previous embodiment. The width 350w of the side electrode 350 is greater than the width 132w of the second conductive portion 132 .

Components or elements in all the drawings can be formed into another lined-up component in another unshown drawing through proper arrangement and/or combination. In addition, additional components, elements and/or their corresponding functions may also be added without departing from the present invention. For example, in an unshown figure, the display device may include multiple wires (eg, wires that are the same as or similar to the wire 130 ), and the multiple wires are not limited to be completely identical. For another example, in an unshown drawing, the display device may include multiple wires (such as wires that are the same as or similar to the wire 130) and corresponding multiple side electrodes, and among the multiple side electrodes One of them may be the same as or similar to the side electrode 150 of the aforementioned embodiment, another of the aforementioned plurality of side electrodes may be the same as or similar to the side electrode 250 of the aforementioned embodiment, and/or the other of the aforementioned plurality of side electrodes may be The same or similar to the side electrode 350 of the previous embodiment.

To sum up, by making the width of the first conductive part smaller than the width of the second conductive part, and making the thickness of the first conductive part larger than the thickness of the second conductive part or the cross-sectional area of the first conductive part larger than the second conductive part The cross-sectional area can make the display device of the present invention have better quality.

Claims (7)

1. A display device, comprising:

a first substrate having a display region;

a second substrate;

the frame glue is positioned between the first substrate and the second substrate and surrounds the display area of the first substrate; and

a wire located on the first substrate and at least located outside the sealant, the wire including a first conductive portion and a second conductive portion, the first conductive portion being closer to an edge of the first substrate than the second conductive portion, wherein:

the width of the first conductive portion is less than the width of the second conductive portion; and is

The thickness of the first conductive portion is greater than the thickness of the second conductive portion or the cross-sectional area of the first conductive portion is greater than the cross-sectional area of the second conductive portion;

a buffer structure located on the first substrate and outside the sealant, wherein the first conductive portion of the conductive wire is closer to the edge of the first substrate than the buffer structure, wherein:

an air gap between the second substrate and the first conductive portion or between the second substrate and the second conductive portion has a first distance;

a second distance is reserved between the second substrate and the buffer structure; and is

The first distance is greater than the second distance;

wherein the second conductive portion of the conductive line is closer to an edge of the first substrate than the buffer structure, and a sum of lengths of the first conductive portion and the second conductive portion is less than a length of the buffer structure.

2. The display device according to claim 1, wherein an edge of the first conductive portion of the wire is substantially flush with an edge of the first substrate.

3. The display device of claim 2, further comprising:

and the side electrode covers the edge of the first conductive part and the edge of the first substrate or the second substrate, and the width of the side electrode is greater than or equal to that of the second conductive part.

4. The display device of claim 1, further comprising:

the circuit board is positioned on the side surface of the first substrate and comprises a connecting wire, wherein the connecting wire is electrically connected with the lead, and the width of the first conductive part is greater than that of the connecting wire.

5. The display device of claim 4, further comprising:

and the side electrode is positioned between the connecting wire and the lead, and the connecting wire of the circuit board is electrically connected with the lead through the side electrode.

6. The display device of claim 1, wherein the first distance is greater than 1 micron and less than or equal to 5 microns.

7. The display device of claim 1, wherein the width of the second conductive portion of the conductive line is less than 75 microns.

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