CN107422553B - Array substrate and display panel - Google Patents
Array substrate and display panel Download PDFInfo
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- CN107422553B CN107422553B CN201710793254.7A CN201710793254A CN107422553B CN 107422553 B CN107422553 B CN 107422553B CN 201710793254 A CN201710793254 A CN 201710793254A CN 107422553 B CN107422553 B CN 107422553B
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- circuit board
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- 239000000758 substrate Substances 0.000 title claims abstract description 88
- 238000005452 bending Methods 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- 239000010408 film Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses an array substrate and a display panel, wherein the array substrate comprises: the bonding pad comprises a first area and a second area, wherein the thickness of the first area is smaller than that of the second area, and the second area is used for being connected with the flexible circuit board; the first area is closer to the display area of the substrate than the second area, the flexible circuit board is relatively fixed on one surface of the second area, and the surface of the second area is vertical to the surface of the substrate. Through the mode, the width of the non-display area can be reduced, and the narrow frame design is facilitated.
Description
Technical Field
The invention relates to the technical field of display, in particular to an array substrate and a display panel.
Background
The display has a display area formed by an array of display pixels and a non-display area surrounding the display area. The non-display area includes support circuits such as signal lines, driver circuits, and bonding pads, but does not include effective pixels for generating an image. In the prior art, in the non-display area, the flexible circuit board carrying the driving chip is usually directly disposed on the bonding pad to form an external wire bonding area, and thus, the display is not favorable for implementing a narrow bezel design due to the external wire bonding area.
Disclosure of Invention
The invention mainly solves the technical problem of providing an array substrate and a display panel, and can solve the problem that a display in the prior art is not beneficial to realizing narrow-frame design.
In order to solve the technical problems, the invention adopts a technical scheme that: provided is an array substrate including: the bonding pad comprises a first area and a second area, wherein the thickness of the first area is smaller than that of the second area, and the second area is used for being connected with the flexible circuit board; the first area is closer to the display area of the substrate than the second area, the flexible circuit board is relatively fixed on one surface of the second area, and the surface of the second area is vertical to the surface of the substrate.
In order to solve the technical problem, the invention adopts another technical scheme that: there is provided a display panel including the array substrate as described above.
The invention has the beneficial effects that: unlike the prior art, the array substrate in the embodiment of the present invention includes: the bonding pad comprises a first area and a second area, wherein the thickness of the first area is smaller than that of the second area, and the second area is used for being connected with the flexible circuit board; the first area is closer to the display area of the substrate than the second area, the flexible circuit board is relatively fixed on the first surface of the second area, the first surface of the second area is perpendicular to the first surface of the substrate, the thickness of the second area is large, the connection strength and the conduction efficiency of the flexible circuit board and the first surface of the second area can be enhanced, the flexible circuit board is arranged on the side edge of the array substrate due to the fact that the first surface of the second area is perpendicular to the first surface of the substrate, an external lead bonding area is omitted, the width of a non-display area is reduced, and narrow-frame design is facilitated.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of an array substrate according to the present invention;
FIG. 2 is a schematic structural diagram of a second embodiment of an array substrate according to the present invention;
FIG. 3 is a schematic structural diagram of a third embodiment of an array substrate according to the invention;
FIG. 4 is a schematic structural diagram of a fourth embodiment of an array substrate according to the invention;
fig. 5 is a schematic structural diagram of a first scheme of nonlinear continuous incremental increase of a third area of a bonding pad in a fourth embodiment of the array substrate of the invention;
fig. 6 is a schematic structural diagram of a second scheme of nonlinear continuous incremental increase of a third area of a bonding pad in a fourth embodiment of the array substrate of the invention;
fig. 7 is a schematic structural diagram of a fifth embodiment of an array substrate according to the invention;
FIG. 8 is a schematic structural diagram of a display panel according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, the first embodiment of the array substrate of the present invention includes:
the circuit board comprises a substrate 10 and a pad 102 fixed on a non-display area of a surface 101 of the substrate 10, wherein the pad 102 comprises a first area 1021 and a second area 1022, the thickness T1 of the first area 1021 is smaller than the thickness T2 of the second area 1022, and the second area 1022 is used for connecting a flexible circuit board 20; wherein the first region 1021 is closer to the display area of the substrate 10 than the second region 1022.
Specifically, the substrate 10 is an array substrate, the array substrate is provided with an array layer of Thin Film Transistors (TFTs) arranged in an array, the substrate 10 may be a glass substrate or a flexible substrate, the pads 102 are fixed to a non-display region on a surface 101 of the substrate 10, the pads 102 include a first region 1021 and a second region 1022, the thicknesses of which are T1 and T2, respectively, wherein the second region is used for connecting a flexible circuit board 20(Chip on Film, COF), the flexible circuit board 20 is a flexible flat cable used for connecting an external driving circuit (for example, a driving Chip) and the TFT circuit, the Chip 30 is provided thereon, and the Chip 30 may be a driving Chip used for driving the TFT circuit. The first region 1021 is responsible for transmitting a driving signal generated by an external driving circuit to a TFT circuit array inside the substrate 10, and has no high requirement on the thickness of a conducting wire; the second region 1022 is responsible for connecting and fixing the flexible circuit board 20, and in order to increase the conductive efficiency and the structural connection strength between the second region 1022 and the flexible circuit board 20, the requirement on the thickness of the conductive wire is higher, so the thickness T2 of the second region 1022 is greater than the thickness T1 of the first region 1021, for example, the thickness T1 of the first region 1021 is 200nm to 500nm, and the thickness T2 of the second region 1022 is 2000nm to 4000 nm. Of course, in other embodiments, the values of T1 and T2 may be determined according to the actual situation such as different material of the TFT, and are not limited herein.
In one application example, as shown in fig. 1, the flexible circuit board 20 is relatively fixed to a surface 10221 of the second region 1022, and a surface 10221 of the second region 1022 is perpendicular to a surface 101 of the substrate 10. Because the second region 1022 of the pad 102 has a larger thickness, the end face 10221 of the second region 1022 is connected to the flexible circuit board 20, so that the contact area is larger, good electrical connection can be performed, and external signals can be input, and because a surface 10221 of the second region 1022 is perpendicular to the surface 101 of the substrate 10, i.e., the flexible circuit board 20 is disposed at the side of the array substrate 10, an external lead bonding region can be omitted, the width of a non-display region is reduced, and a narrow frame design is facilitated.
As shown in fig. 2, the structure of the second embodiment of the array substrate of the present invention is similar to that of the first embodiment of the array substrate of the present invention, and is not repeated herein, except that the projections of the flexible circuit board 20 and the substrate 10 along the direction perpendicular to the surface 101 of the substrate 10 are not overlapped.
Specifically, as shown in fig. 2, projections of the flexible circuit board 20 and the substrate 10 in a direction perpendicular to the one surface 101 of the substrate 10 are 401 and 402, respectively, wherein the projection areas 401 and 402 do not overlap.
As shown in fig. 3, the structure of the third embodiment of the array substrate of the present invention is similar to that of the second embodiment of the array substrate of the present invention, and is not repeated herein, except that the flexible circuit board 20 includes a non-bending region 201 and a bending region 202, and the non-bending region 201 is fixed on a surface 10221 of the second region 1022.
Specifically, as shown in fig. 3, the non-bending region 201 of the flexible circuit board 20 is fixed on a surface 10221 of the second region 1022 of the pad 102, the bending region 202 is bent toward the other surface 103 of the substrate 10, and the circuit board or chip 30 is disposed on the bending region 202, so that the thickness of the display can be reduced.
In other embodiments, the non-bending region of the flexible circuit board may also refer to the structure of the flexible circuit board in the first embodiment of the array substrate of the present invention, which is not limited herein.
As shown in fig. 4, the structure of the fourth embodiment of the array substrate of the present invention is similar to that of the second embodiment of the array substrate of the present invention, and is not repeated here, except that the pad 102 further includes: and a third region 1023, wherein the third region 1023 is positioned between the first region 1021 and the second region 1022, and the thickness of the third region 1023 increases towards the second region 1022, so that the thickness of the bonding pad 102 increases towards the direction far away from the display area.
Specifically, in one application example, as shown in fig. 4, the thickness of the third region 1023 of the bonding pad 102 increases linearly toward the second region 1022, such as a trapezoid structure.
Of course, in other embodiments, as shown in fig. 5 or fig. 6, the thickness of the third region 1023 of the bonding pad 102 may also increase in a non-linear continuous manner in a direction approaching the second region 1022, or increase in a non-linear manner (e.g., increase in a step shape), which is not limited herein.
As shown in fig. 7, the structure of the fifth embodiment of the array substrate of the invention is similar to that of the second embodiment of the array substrate of the invention, and is not repeated herein, except that the pads 102 are correspondingly disposed in the non-display areas on two sides of the surface 101 of the substrate 10, that is, the pads 102 are correspondingly disposed on two opposite sides of the substrate 10, so that the driving circuits can be respectively disposed on two opposite sides of the display, so that the driving is more flexible.
Of course, in other embodiments, the pad structure may also be the pad structure of the fourth embodiment of the array substrate of the present invention, and is not limited specifically here.
As shown in fig. 8, an embodiment 80 of the display panel of the present invention at least includes: the structure of the array substrate 801 may refer to the structure of any one of the first to fifth embodiments of the array substrate of the present invention, and will not be repeated here.
Referring further to fig. 8, an embodiment 80 of the display panel of the present invention further includes:
a color film substrate 802 arranged opposite to the array substrate 801, and a liquid crystal layer 803 filled between the display areas of the array substrate 801 and the color film substrate 802, wherein a black matrix 804 and a flexible circuit board 805 connected to the pad 8011 are arranged in an area of the color film substrate 802 corresponding to the pad 8011.
The flexible circuit board 805 is used to connect and fix an external driving circuit and the pad 8011, and the black matrix 804 is a light-absorbing black coating layer that absorbs external light and scatters emitted light of an adjacent pattern, and is mainly used to prevent light leakage between pixels and increase contrast of color.
Further, an embodiment 80 of the display panel of the present invention further includes:
a driving chip 806 disposed on the flexible circuit board 805, an encapsulation layer 807 disposed on a surface 8012 of the pad 8011 away from the array substrate 801, and a light shielding resin 808 coated on an edge of the display panel 80.
The driving chip 806 is a chip for driving the TFT circuit in the array substrate 801, and the encapsulation layer 807 is a sealant frame around the display area of the display panel 80.
In this embodiment, the pad of the array substrate of the display panel in the non-display area includes a first area and a second area, the thickness of the first area is smaller than that of the second area, and the second area is used for connecting the flexible circuit board; the first area is closer to the display area of the substrate than the second area, the flexible circuit board is relatively fixed on the first surface of the second area, the first surface of the second area is perpendicular to the first surface of the substrate, the thickness of the second area is large, the connection strength and the conduction efficiency of the flexible circuit board and the first surface of the second area can be enhanced, the flexible circuit board is arranged on the side edge of the array substrate due to the fact that the first surface of the second area is perpendicular to the first surface of the substrate, an external lead bonding area is omitted, the width of a non-display area is reduced, and narrow-frame design is facilitated.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. An array substrate, comprising:
the bonding pad comprises a substrate and a bonding pad which is relatively fixed on a non-display area on one surface of the substrate, wherein the bonding pad comprises a first area and a second area, the thickness of the first area is smaller than that of the second area, and the second area is used for connecting a flexible circuit board;
the first area is closer to the display area of the substrate than the second area, the flexible circuit board is relatively fixed on one surface of the second area, and the surface of the second area is vertical to the surface of the substrate;
the flexible circuit board comprises a non-bending area and a bending area, the non-bending area is relatively fixed on one surface of the second area, the bending area bends towards the other surface of the substrate, and a circuit board or a chip is arranged on the bending area;
the flexible circuit board and the substrate are not overlapped along the projection in the direction vertical to one surface of the substrate;
the thickness of the first region is 200 nm-500 nm; the thickness of the second region is 2000nm to 4000 nm.
2. The array substrate of claim 1, wherein the pad further comprises: a third region between the first region and the second region, the third region having a thickness increasing toward the second region such that the pad has a thickness increasing away from the display region.
3. The array substrate of claim 1, wherein the bonding pads are disposed on the non-display areas on two sides of the surface of the substrate.
4. A display panel comprising the array substrate according to any one of claims 1 to 3.
5. The display panel according to claim 4, characterized by further comprising: the flexible circuit board, a color film substrate arranged opposite to the array substrate and a liquid crystal layer filled between the array substrate and a display area of the color film substrate, wherein a black matrix is arranged in an area of the color film substrate corresponding to the bonding pad.
6. The display panel according to claim 5, characterized by further comprising: the display panel comprises a driving chip arranged on the flexible circuit board, a packaging layer arranged on one surface of the bonding pad far away from the array substrate, and shading resin coated on the edge of the display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710793254.7A CN107422553B (en) | 2017-09-05 | 2017-09-05 | Array substrate and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710793254.7A CN107422553B (en) | 2017-09-05 | 2017-09-05 | Array substrate and display panel |
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| Publication Number | Publication Date |
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| CN107422553A CN107422553A (en) | 2017-12-01 |
| CN107422553B true CN107422553B (en) | 2020-12-25 |
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| CN201710793254.7A Active CN107422553B (en) | 2017-09-05 | 2017-09-05 | Array substrate and display panel |
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Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109782474B (en) * | 2018-01-29 | 2022-04-12 | 友达光电（昆山）有限公司 | Display panel |
| TWI711199B (en) * | 2018-09-11 | 2020-11-21 | 啟端光電股份有限公司 | Microled display panel |
| CN109637368B (en) | 2019-01-07 | 2023-12-26 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| CN112201155A (en) | 2019-07-08 | 2021-01-08 | 瀚宇彩晶股份有限公司 | Display panel |
| CN110505756B (en) * | 2019-07-30 | 2020-12-08 | 武汉华星光电技术有限公司 | Flexible printed circuit board and display device |
| CN110262701B (en) | 2019-07-30 | 2021-12-10 | 昆山国显光电有限公司 | Display panel and display device |
| CN110568682B (en) * | 2019-08-08 | 2020-12-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
| CN111083255B (en) * | 2019-11-29 | 2022-01-25 | 维沃移动通信有限公司 | Display module and electronic equipment |
| CN110911393B (en) * | 2019-11-29 | 2022-05-20 | 京东方科技集团股份有限公司 | Display driving board, preparation method thereof and display device |
| CN111352258B (en) * | 2020-04-28 | 2022-07-26 | 厦门天马微电子有限公司 | Liquid crystal display panel and display device |
| TWI737545B (en) * | 2020-11-20 | 2021-08-21 | 友達光電股份有限公司 | Display apparatus |
| CN113299852B (en) * | 2021-05-11 | 2022-12-06 | 深圳市华星光电半导体显示技术有限公司 | Display panel |
| CN114253038A (en) * | 2021-12-20 | 2022-03-29 | 武汉华星光电技术有限公司 | Display panel |
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| US7139060B2 (en) * | 2004-01-27 | 2006-11-21 | Au Optronics Corporation | Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film |
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| CN107422553A (en) | 2017-12-01 |
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Address after: No.9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: No.9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |
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