CN111621243B

CN111621243B - Conductive adhesive, display panel and display device

Info

Publication number: CN111621243B
Application number: CN202010425539.7A
Authority: CN
Inventors: 谢思
Original assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2020-05-19
Filing date: 2020-05-19
Publication date: 2022-02-22
Anticipated expiration: 2040-05-19
Also published as: CN111621243A

Abstract

The application discloses a conductive adhesive, a display panel and a display device, wherein the conductive adhesive comprises a first layer, a second layer and an insulating layer positioned between the first layer and the second layer; the first layer comprises a plurality of first conductive particles arranged at intervals; the second layer comprises a plurality of second conductive particles arranged at intervals; the problem of short circuit caused by the aggregation of the first conductive particles and the second conductive particles at the interval during subsequent bonding is solved. The display panel comprises a panel main body, a bonding component and conductive adhesive; the conductive particle set of the conductive adhesive is utilized to realize the electrical connection between the first bonding terminal of the panel main body and the second bonding terminal of the bonding part; the first conductive particles and the second conductive particles of the conductive adhesive are distributed in the first spacing area of the panel body and the area corresponding to the second spacing area of the bonding part at intervals, so that the first conductive particles and the second conductive particles are prevented from being gathered and short-circuited.

Description

Conductive adhesive, display panel and display device

Technical Field

The application relates to the technical field of display, in particular to conductive adhesive, a display panel and a display device.

Background

The development of display technology makes display device to the narrow frame direction development of comprehensive screen, and the bonding process that from this relates to also receives extensive concern, and display device's frame is narrower, and the region that can supply panel bonding terminal and bonding part to use just is narrower, and the interval between each bonding terminal or each pin on the bonding part is also narrower. When bonding, because the interval between each bonding terminal is less, so easily cause conductive particle gathering phenomenon, appear the short circuit problem.

Disclosure of Invention

The embodiment of the application provides a conductive adhesive, a display panel and a display device, which can avoid the problem that conductive particles are easily gathered in a bonding process due to the fact that the distance between bonding terminals is small.

The embodiment of the application provides a conductive adhesive, which comprises a first layer, a second layer and an insulating layer positioned between the first layer and the second layer;

the first layer comprises a plurality of first conductive particles arranged at intervals;

the second layer includes a plurality of second conductive particles disposed at intervals.

In some embodiments, a plurality of the first conductive particles are disposed at equal intervals in the first layer, a plurality of the second conductive particles are disposed at equal intervals in the second layer, and the plurality of the first conductive particles and the plurality of the second conductive particles are disposed at intervals of 1 μm to 6 μm.

In some embodiments, the distance between two adjacent first conductive particles is 5 μm to 10 μm; the distance between two adjacent second conductive particles is 5-10 mu m.

In some embodiments, the first layer and the second layer have a lower flowability under pressure than the insulating layer.

In some embodiments, the preparation material of the first layer and the second layer comprises an acrylic material.

In some embodiments, the material for preparing the insulating layer includes one of a plastic polymer material and an epoxy resin material.

The present application also provides a display panel, including:

the panel comprises a panel body and a plurality of first bonding terminals, wherein the panel body comprises a plurality of first bonding terminals arranged at intervals and a first interval area positioned between the first bonding terminals;

at least one bonding part, wherein the bonding part comprises a plurality of second bonding terminals arranged at intervals and a second interval area positioned between the plurality of second bonding terminals, and the plurality of second bonding terminals correspond to the plurality of first bonding terminals;

the conductive adhesive comprises a first layer, a second layer, an insulating layer and a conductive particle set, wherein the insulating layer is positioned between the first layer and the second layer, the conductive particle set is positioned between the first layer, the second layer and the insulating layer, the first layer comprises a plurality of first conductive particles which are arranged at intervals, and the second layer comprises a plurality of second conductive particles which are arranged at intervals;

the conductive adhesive is located between the panel body and the bonding part, and the conductive particle set is electrically connected between the first bonding terminal and the second bonding terminal in areas corresponding to the first bonding terminals and the second bonding terminals; the first conductive particles and the second conductive particles are distributed in the first spaced regions and regions corresponding to the second spaced regions.

In some embodiments, the width of the second bond terminals is 16-40 μm, and the second spaced area between the second bond terminals is less than or equal to 10 μm.

The application also provides a display device which comprises the display panel.

According to the conductive adhesive, the display panel and the display device, the conductive adhesive comprises a first layer, a second layer and an insulating layer located between the first layer and the second layer; the first layer comprises a plurality of first conductive particles arranged at intervals; the second layer comprises a plurality of second conductive particles arranged at intervals; the first conductive particles and the second conductive particles are arranged at intervals, so that the problem of short circuit caused by gathering of the first conductive particles and the second conductive particles at the intervals during subsequent bonding is prevented. The display panel comprises a panel main body, a bonding part and conductive adhesive positioned between the panel main body and the bonding part; electrically connecting the first bonding terminal and the second bonding terminal with a set of conductive particles of the conductive adhesive in regions corresponding to the plurality of first bonding terminals of the panel body and the plurality of second bonding terminals of the bonding part; the first conductive particles and the second conductive particles of the conductive adhesive are distributed in the first spacing area of the panel body and the area corresponding to the second spacing area of the bonding part at intervals, so that the first conductive particles and the second conductive particles are prevented from being gathered in the first spacing area and the second spacing area, and the short circuit phenomenon is prevented.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a conductive adhesive according to an embodiment of the present application;

fig. 2A to 2C are schematic structural diagrams of a display panel according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram illustrating a bonding member bonded to a panel body provided by an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Specifically, please refer to fig. 1, which is a schematic structural diagram of a conductive adhesive provided in an embodiment of the present application; the conductive adhesive 100 comprises a first layer 101, a second layer 102 and an insulating layer 103 located between the first layer 101 and the second layer 102;

the first layer 101 comprises a plurality of first conductive particles 1011 arranged at intervals;

the second layer 102 includes a plurality of second conductive particles 1021 arranged at intervals.

Since the insulating layer 103 is disposed on the conductive adhesive 100, and the first conductive particles 1011 and the second conductive particles 1021 are disposed at intervals, in a subsequent bonding process, the phenomenon that the first conductive particles 1011 and the second conductive particles 1021 gather at the interval area and short circuit occurs can be avoided.

Specifically, the first conductive particles 1011 and the second conductive particles 1021 may be disposed opposite to each other or disposed at intervals.

If the second conductive particles 1021 and the first conductive particles 1011 are disposed at an interval, the first conductive particles 1011 and the second conductive particles 1021 can effectively achieve electrical connection between bonding terminals in a subsequent bonding process, and the first conductive particles 1011 and the second conductive particles 1021 are prevented from gathering at the interval area to cause short circuit. The first conductive particles 1011 are disposed at equal intervals in the first layer 101, the second conductive particles 1021 are disposed at equal intervals in the second layer 102, and the first conductive particles 1011 and the second conductive particles 1021 are disposed at intervals of 1 μm to 6 μm, that is, L3 in fig. 1 is greater than or equal to 1 μm and less than or equal to 6 μm. Further, the first conductive particles 1011 and the second conductive particles 1021 are disposed at an interval of 4 μm, that is, L3 is 4 μm.

In order to ensure that enough conductive particles are arranged between bonding terminals in a subsequent bonding process and ensure the reliability of electrical connection, the distance between two adjacent first conductive particles 1011 is 5-10 μm; the distance between two adjacent second conductive particles 1021 is 5 μm to 10 μm, that is, L1 in fig. 1 is greater than or equal to 5 μm and less than or equal to 10 μm, and L2 is greater than or equal to 5 μm and less than or equal to 10 μm; further, the distance between two adjacent first conductive particles 1011 is 8 μm; two adjacent second conductive particles 1021 are spaced by 8 μm, that is, L1-L2-8 μm. In addition, a distance L2 between two adjacent second conductive particles 1021 may be smaller than a distance L1 between two adjacent first conductive particles 1011, so that a distribution density of the second conductive particles 1021 in the second layer 102 is greater than a distribution density of the first conductive particles 1011 in the first layer 101.

The fluidity of the first layer 101 and the second layer 102 under pressure is lower than that of the insulating layer 103 under pressure; specifically, when the conductive adhesive 100 is pressed, the insulating layer 103 has a large displacement in the area corresponding to the first conductive particle 1011 and the second conductive particle 1021 corresponding to the area where the conductive adhesive 100 is pressed greatly, so that the first conductive particle 1011 and the second conductive particle 1021 can penetrate through the insulating layer 103, and the electrical connection between the bonding terminals is realized; a plurality of the first conductive particles 1011 have smaller displacement in the first layer 101, and a plurality of the second conductive particles 1021 have smaller displacement in the second layer 102, so that the spacing distribution among the plurality of the first conductive particles 1011 and the plurality of the second conductive particles 1021 is still kept; when the conductive adhesive 100 is pressed, corresponding to the area where the conductive adhesive 100 is pressed less, the displacement of the insulating layer 103 at the area corresponding to the first conductive particles 1011 and the second conductive particles 1021 is smaller than the displacement at the area where the force is applied, the first conductive particles 1011 do not displace or have only a small displacement in the first layer 101, and the second conductive particles 1021 do not displace or have only a small displacement in the second layer 102, so that the first conductive particles 1011 and the second conductive particles 1021 maintain the interval distribution, thereby avoiding the aggregation of the conductive particles in the subsequent bonding process.

The first layer 101 and the second layer 102 are made of acrylic materials.

The preparation material of the insulating layer 103 comprises one of a plastic high polymer material and an epoxy resin material.

The first layer 101 and the second layer 102 are formed by disposing the first conductive particles 1011 and the second conductive particles 1021 at intervals by a camera having a charge coupled device.

A plurality of first conductive particles 1011 in the first layer 101 are distributed at intervals by means of transfer printing; the second conductive particles 1021 in the second layer 102 are distributed at intervals by a transfer method.

Please refer to fig. 2A to 2C, which are schematic structural diagrams of a display panel according to an embodiment of the present application; the display panel 200 includes:

panel body 201, said panel body 201 including a plurality of first bonding terminals 2011 disposed at intervals and first spacing regions L4 located between a plurality of said first bonding terminals 2011;

at least one bonding component 202, said bonding component 202 including a plurality of spaced apart second bonding terminals 2021 and a second spacing region L5 located between a plurality of said second bonding terminals 2021, said plurality of said second bonding terminals 2021 corresponding to a plurality of said first bonding terminals 2011;

a conductive paste 210, the conductive paste 210 including a first layer 211, a second layer 212, an insulating layer 213 between the first layer 211 and the second layer 212, and a conductive particle set 214 between the first layer 211, the second layer 212, and the insulating layer 213, the first layer 211 including a plurality of first conductive particles 2111 spaced apart from each other, the second layer 212 including a plurality of second conductive particles 2121 spaced apart from each other;

the conductive adhesive 210 is located between the panel body 201 and the bonding part 202, and the conductive particle set 214 is electrically connected between the first bonding terminal 2011 and the second bonding terminal 2021 in areas corresponding to the first bonding terminal 2011 and the second bonding terminal 2021; the first and second

conductive particles

2111 and 2121 are distributed in the first spaced region L4 and a region corresponding to the second spaced region L5.

Since the first conductive particles 2111 and the second conductive particles 2121 are still spaced apart from each other, the aggregation of the conductive particles does not occur in the first spacing region L4 and the second spacing region L5, and the first conductive particles 2111 and the second conductive particles 2121 are insulated from each other; in addition, short circuits between the first conductive particles 2111 and the second conductive particles 2121 in the first isolation region L4 and the second isolation region L5 can be effectively prevented by the insulating layer 103.

Since the smaller the first and second spacing regions L4 and L5, the more likely a short circuit occurs between the first bonding terminals 2011 and between the second bonding terminals 2021, to avoid this, the first spacing region L4 is larger than the diameter of the first conductive particles 2111, and the second spacing region L5 is larger than the diameter of the second conductive particles 2121. Specifically, the diameters of the first conductive particles 2111 and the second conductive particles 2121 are equal to 3 μm, and the first spacing region L4 and the second spacing region L5 are greater than 3 μm. Further, said first spacing region L4 is equal to 8 μm; the second spacing region L5 is less than or equal to 10 μm.

To ensure bonding, a plurality of second bonding terminals 2021 correspond to a plurality of first bonding terminals 2011, and the sum of the widths of first bonding terminals 2011 and first spacing region L4 is equal to the sum of the widths of second bonding terminals 2021 and second spacing region L5.

Specifically, the width of second bond terminals 2021 is 16 μm to 40 μm, and the second spacing region L5 between the second bond terminals 2021 is less than or equal to 10 μm. Further, the width of second bonding terminal 2021 is 16 μm, 18 μm, or 20 μm. The width of first bonding terminals 2011 is 17-41 μm, and the first spacing region L4 between first bonding terminals 2011 is equal to 8 μm.

The panel body 201 includes a display area and a non-display area, and the first bonding terminal 2011 is located in the non-display area. The bonding part 202 includes one of a chip on film or a printed circuit board.

In some embodiments, the panel body 201 includes an array substrate, a light emitting device on a side of the array substrate, and an encapsulation layer on a side of the light emitting device away from the array substrate. The array substrate comprises thin film transistors distributed in an array, and the light-emitting device comprises an anode electrically connected with one of a source electrode or a drain electrode of the thin film transistor, a light-emitting layer positioned in a groove of a pixel defining layer of the array substrate, and a cathode positioned on one side of the light-emitting layer far away from the array substrate.

In some embodiments, the panel body 201 includes an array substrate, a color filter substrate disposed opposite to the array substrate, and liquid crystal molecules and sealant disposed between the array substrate and the color filter substrate.

The conductive glue used to bond the panel body 201 and the bonding member 202 may be as shown in fig. 2B, or as shown in fig. 1.

If the conductive adhesive 100 as described in fig. 1 is used to bond the panel body 201 and the bonding member 202, please refer to fig. 3, which is a schematic diagram illustrating the bonding of the panel body according to an embodiment of the present application. Since a certain pressure needs to be applied to the panel body 201 and the bonding member 202 in the bonding process to achieve effective bonding of the panel body 201 and the bonding member 202, in the bonding process, the pressure applied to the regions corresponding to the first bonding terminal 2011 and the second bonding terminal 2021 is greater than the pressure applied to the regions corresponding to the first spacing region L4 and the second spacing region L5, and the first conductive particles 1011 and the second conductive particles 1021 conductive paste 100 form the conductive particle set 214 in the regions corresponding to the first bonding terminal 2011 and the second bonding terminal 2021; the first conductive particles 1011 and the second conductive particles 1021 at positions corresponding to the first spacing regions L4 and the second spacing regions L5 are still spaced apart, as shown in fig. 2C.

In the bonding process, the pressure applied to the panel body 201 and the bonding member 202 is 20 to 70MPa, and the temperature is 120 to 240 ℃.

Furthermore, the display device further comprises a touch panel, wherein the touch panel is combined with the display panel in a built-in or external-hanging arrangement mode to realize the touch function of the display device.

According to the conductive adhesive, the display panel and the display device, the conductive adhesive comprises a first layer, a second layer and an insulating layer located between the first layer and the second layer; the first layer comprises a plurality of first conductive particles arranged at intervals; the second layer comprises a plurality of second conductive particles arranged at intervals, so that the problem of short circuit caused by aggregation of the first conductive particles and the second conductive particles during subsequent bonding is solved. The display panel comprises a panel main body, a bonding part and conductive adhesive positioned between the panel main body and the bonding part; in areas corresponding to the plurality of first bonding terminals of the panel body and the plurality of second bonding terminals of the bonding part, electrically connecting the first bonding terminals and the second bonding terminals by using the conductive particle sets of the conductive adhesive; and the first conductive particles and the second conductive particles of the conductive adhesive are distributed in the first spacing area of the panel main body and the area corresponding to the second spacing area of the bonding part at intervals, so that the first conductive particles and the second conductive particles are prevented from being gathered in the first spacing area and the second spacing area, and the short circuit phenomenon is prevented.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The conductive adhesive, the display panel and the display device provided in the embodiments of the present application are described in detail above, and specific examples are applied in the present application to explain the principle and the implementation manner of the present application, and the description of the embodiments above is only used to help understand the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. A conductive paste comprising a first layer, a second layer, and an insulating layer between the first layer and the second layer;

the second layer comprises a plurality of second conductive particles arranged at intervals;

wherein a plurality of the first conductive particles are arranged at equal intervals in the first layer, a plurality of the second conductive particles are arranged at equal intervals in the second layer, and the plurality of the first conductive particles and the plurality of the second conductive particles are arranged at intervals of 1 μm to 6 μm; the distance between two adjacent first conductive particles is 5-10 mu m; the distance between two adjacent second conductive particles is 5-10 mu m; the first layer and the second layer have a lower fluidity under pressure than the insulating layer.

2. The conductive adhesive of claim 1, wherein the first layer and the second layer are made of a material comprising an acrylic material.

3. The conductive paste as claimed in claim 1, wherein the insulating layer is made of a material selected from the group consisting of a moldable polymer material and an epoxy resin material.

4. A display panel, comprising,

the conductive adhesive comprises a first layer, a second layer, an insulating layer and a conductive particle set, wherein the insulating layer is positioned between the first layer and the second layer, the conductive particle set is positioned between the first layer, the second layer and the insulating layer, the first layer comprises a plurality of first conductive particles which are arranged at intervals, and the second layer comprises a plurality of second conductive particles which are arranged at intervals; a plurality of the first conductive particles are arranged at equal intervals in the first layer, a plurality of the second conductive particles are arranged at equal intervals in the second layer, and the plurality of the first conductive particles and the plurality of the second conductive particles are arranged at intervals of 1-6 μm; the distance between two adjacent first conductive particles is 5-10 mu m; the distance between two adjacent second conductive particles is 5-10 mu m; the fluidity of the first layer and the second layer under pressure is lower than the fluidity of the insulating layer under pressure;

5. The display panel of claim 4, wherein the width of the second bonding terminals is 16-40 μm, and the second spacing region between the second bonding terminals is less than or equal to 10 μm.

6. A display device comprising the display panel according to any one of claims 4 to 5.