CN111463228A - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN111463228A
CN111463228A CN202010272555.7A CN202010272555A CN111463228A CN 111463228 A CN111463228 A CN 111463228A CN 202010272555 A CN202010272555 A CN 202010272555A CN 111463228 A CN111463228 A CN 111463228A
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CN
China
Prior art keywords
display panel
conductive terminal
display
substrate
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010272555.7A
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Chinese (zh)
Inventor
叶岩溪
肖军城
刘林峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN202010272555.7A priority Critical patent/CN111463228A/en
Publication of CN111463228A publication Critical patent/CN111463228A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application discloses display panel and display device, display panel includes base plate and a plurality of display element, and the base plate has first surface and the second surface that sets up dorsad, and the first surface includes the display area and sets up in the marginal zone of at least one side of display area, and the display element sets up in display area department, and marginal zone department is provided with first conductive terminal, is provided with the terminal that binds with first conductive terminal electricity is connected on the second surface of base plate. The electric connection of the display area of the chip-on-film board and the display panel is realized through the first conductive terminals on the different side surfaces of the substrate and the binding terminals, so that the signal of the chip-on-film board is transmitted to the display area of the display panel through the first conductive terminals, the binding terminals are arranged on the second surface of the substrate, the display area and the marginal area of the first surface cannot be occupied, the marginal area of the display panel can be reduced, the spliced seam of the display panel is reduced, and the display effect is improved.

Description

Display panel and display device
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display device.
Background
Like a general liquid crystal display panel, the Mini L ED display panel and the Micro L ED display panel also need to pull out a wire concentration area and an O L B (out lead bonding) area provided with a binding terminal through peripheral wires, and then are bound on the O L B area of the substrate by using a Chip On Film (COF), so as to transmit signals to an in-plane display area through the COF.
Mini L ED and Micro L ED can not be made large due to the problem of power consumption, and in order to realize large screen size, Mini L ED and Micro L ED both need to use a splicing technology, namely, a plurality of small-size display panels are spliced to form a large-size display panel.
However, in order to meet the binding requirement of the COF, the area of the O L B region needs to reach a certain size, which results in a larger edge region of the display panel, and thus results in an obvious spliced seam and a poor display effect.
Disclosure of Invention
In a first aspect, an embodiment of the present application provides a display panel to solve the technical problem that, in an existing display panel, an edge area of the display panel is large, so that a spliced seam is obvious and a display effect is poor.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
a display panel comprises a substrate and a plurality of display units, wherein the substrate is provided with a first surface and a second surface which are arranged oppositely, the first surface comprises a display area and an edge area arranged on at least one side of the display area, and the display units are arranged at the display area;
a first conductive terminal is arranged at the edge region, and a binding terminal electrically connected with the first conductive terminal is arranged on the second surface of the substrate
In some embodiments, the second surface of the substrate is further provided with a second conductive terminal electrically connected with the first conductive terminal, and the binding terminal is electrically connected with the second conductive terminal.
In some embodiments, the second conductive terminal is electrically connected to the first conductive terminal through a first via that extends through the substrate.
In some embodiments, the first via is filled with a conductive metal in contact with the first conductive terminal and the second conductive terminal.
In some embodiments, the first conductive terminal is provided with a second through hole penetrating through upper and lower sides of the first conductive terminal, the second conductive terminal is provided with a third through hole penetrating through upper and lower sides of the second conductive terminal, and the second through hole and the third through hole are both communicated with the first through hole.
In some embodiments, the second via and the third via are both filled with the conductive metal.
In some embodiments, the second surface includes a wire concentration area, and a connection trace electrically connected to the binding terminal and the second conductive terminal is disposed at the wire concentration area.
In some embodiments, the base plate comprises a first base plate and a second base plate which are arranged in a stacked manner, the first surface is the surface of the first base plate far away from the second base plate, and the second surface is the surface of the second base plate far away from the first base plate; the first through hole penetrates through the first substrate base plate and the second substrate base plate.
In a second aspect, the present application further provides a display device, which includes the display panel as described above, and a plurality of the display panels are arranged side by side and at intervals.
In some embodiments, the display device includes first display panel and second display panel that adjacent setting, first conductive terminal on the first display panel set up in first display panel is close to on the first avris of second display panel, the second display panel include with the adjacent second avris of first avris, first conductive terminal on the second display panel set up in on the second display panel with the second avris adjacent or/and relative avris.
The beneficial effects of the invention application are as follows: the electric connection of the display area of the flip chip thin film plate and the display panel is realized through the first conductive terminal and the second conductive terminal which are positioned on different sides of the substrate, so that the signal of the flip chip thin film plate is transmitted to the display area of the display panel through the first conductive terminal, meanwhile, the second conductive terminal, the binding terminal and the connecting wiring are arranged on the second surface of the substrate, the display area and the marginal area of the first surface cannot be occupied, the marginal area of the display panel can be reduced, the splicing seam after the display panel is spliced is reduced, and the display effect is improved.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a display device according to an embodiment of the invention.
Reference numerals:
11. a substrate; 111. a first surface; 1111. a display area; 1112. an edge region; 112. a second surface; 113. a first through hole; 114. a first substrate base plate; 115. a second substrate base plate; 116. a first display panel; 1161. a first side; 117. a second display panel; 1171. a second side; 12. a first conductive terminal; 118. gluing; 121. a second through hole; 13. binding the terminal; 14. a second conductive terminal; 141. a third through hole; 15. connecting wiring; 16. a chip on film board; 17. a conductive metal; 18. a display unit.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
The invention aims at the technical problems that in the existing display panel, in order to meet the binding requirement of a COF (chip on film), the area of an O L B area needs to reach a certain size, so that the edge area of the display panel is larger, the spliced seam is obvious, and the display effect is poorer.
A display panel is disclosed, as shown in FIG. 1, the display panel includes a substrate 11, a flip-chip film plate 16 and a plurality of display units 18, the substrate 11 has a first surface 111 and a second surface 112 disposed oppositely, the first surface 111 includes a display region 1111 and an edge region 1112 disposed on at least one side of the display region 1111, the display units 18 are disposed at the display region 1111.
It should be noted that the substrate 11 may be a flexible substrate or a rigid substrate, the substrate 11 may also be a glass substrate or a plastic substrate, the display unit 18 may be Mini L ED or/and micro L ED, the edge region 1112 may be disposed on only one side of the display region 1111, and the edge region 1112 may also be disposed on only multiple sides of the display region 1111 or around the display region 1111.
Specifically, the edge region 1112 is provided with a first conductive terminal 12, and the second surface 112 of the substrate 11 is provided with a binding terminal 13 electrically connected to the first conductive terminal 12.
It should be noted that the binding terminal 13 is used for binding the thin film on flip chip board 16 on the substrate 11 and electrically connecting the thin film on flip chip board 16 and the first conductive terminal 12, so that the signal of the thin film on flip chip board 16 is transmitted to the display area 1111 of the display panel through the first conductive terminal 12, and the binding terminal 13 is disposed on the second surface 112 of the substrate 11, and does not occupy the display area 1111 and the edge area 1112 of the first surface 111, so as to reduce the edge area 1112 of the display panel, reduce the splicing seams after the display panel is spliced, and improve the display effect.
Specifically, the second surface 112 of the substrate 11 is further provided with a second conductive terminal 14 electrically connected to the first conductive terminal 12, and the binding terminal 13 is electrically connected to the second conductive terminal 14.
It should be noted that the second conductive terminals 14 and the binding terminals 13 are both located on the second surface 112 of the substrate 11, and the second conductive terminals 14 are used to electrically connect the binding terminals 13 with the first conductive terminals 12, so that the binding terminals 13 do not need to be directly connected with the first conductive terminals 12 located on the first surface 111, thereby avoiding adverse effects on the binding of the flip chip film board 16.
The second conductive terminal 14 may be disposed on the second surface 112 of the substrate 11 at a region corresponding to the first conductive terminal 12, so as to facilitate connection between the first conductive terminal 12 and the second conductive terminal 14.
Specifically, the second conductive terminal 14 is electrically connected to the first conductive terminal 12 through a first through hole 113 penetrating through the substrate 11.
It should be noted that the cross-sectional shape of the first through hole 113 may be a circle, an ellipse, a square, or other polygon; the number of the first through holes 113 may be only one, or a plurality of the first through holes 113 may be provided, and a plurality of the first through holes 113 may be distributed in an array or in a discrete manner.
Specifically, the first through hole 113 is filled with a conductive metal 17 contacting with the first conductive terminal 12 and the second conductive terminal 14.
It should be noted that, the conductive metal 17 is filled in the first through hole 113 penetrating through the substrate 11, so as to achieve electrical connection between the first conductive terminal 12 and the second conductive terminal 14, the preparation materials of the first conductive terminal 12 and the second conductive terminal 14 may be the same as or different from the conductive metal 17, and the conductive metal 17 may be a metal material such as silver, copper, a silver alloy, or a copper alloy.
In an embodiment, the first conductive terminal 12 is provided with a second through hole 121 penetrating through upper and lower sides of the first conductive terminal 12, the second conductive terminal 14 is provided with a third through hole 141 penetrating through upper and lower sides of the second conductive terminal 14, and both the second through hole 121 and the third through hole 141 are communicated with the first through hole 113.
Further, the conductive metal 17 is filled in both the second via hole 121 and the third via hole 141.
The second through hole 121 and the third through hole 141 connected with the first through hole 113 are respectively formed in the first conductive terminal 12 and the second conductive terminal 14, and the conductive metal 17 is filled in all the through holes, so that the first conductive terminal 12 and the second conductive terminal 14 are fully contacted with the conductive metal 17, the first conductive terminal 12 and the second conductive terminal 14 are prevented from being contacted, meanwhile, the first conductive terminal 12 and the second conductive terminal 14 can be prevented from falling off, and the connection strength between the first conductive terminal 12 and the substrate 11 and the connection strength between the second conductive terminal 14 and the substrate 12 are improved.
Specifically, the second surface 112 includes a wire concentration area, a connection wire 15 electrically connected to the binding terminal 13 and the second conductive terminal 14 is disposed at the wire concentration area, the connection wire 15 is used to electrically connect the binding terminal 13 and the second conductive terminal 14, and the signal output by the chip on film board 16 is transmitted in a time-sharing and segmented manner.
The connection trace 15 may be disposed in a central region of the second surface 112, and the connection trace 15 may also be disposed in an edge region of the second surface 112.
In one embodiment, as shown in fig. 2, the base plate 11 includes at least two base plates disposed in a stacked arrangement.
It should be noted that, generally, since it is difficult to prepare metal routing layers on both sides of a single-layer substrate, the thickness of the substrate 11 is increased by using a double-sided substrate stack, which is convenient for preparing metal routing on both the first surface 111 and the second surface 112 of the substrate 11, and can also prevent the metal routing on both the first surface 111 and the second surface 112 of the substrate 11 from affecting each other.
It should be noted that, for example, the base plate 11 includes two base plates, the base plate 11 includes a first base plate 114 and a second base plate 115 which are stacked, the first surface 111 is a surface of the first base plate 114 away from the second base plate 115, and the second surface 112 is a surface of the second base plate 115 away from the first base plate 114; the first through hole 113 penetrates the first substrate board 114 and the second substrate board 115.
In practical implementation, the base plate 11 may further include a plurality of stacked substrate plates, and of all the substrate plates, the outer surfaces of two substrate plates located at the outermost layer are the first surface 111 and the second surface 111, respectively; the first through hole 113 penetrates all the substrate base plates.
It should be noted that, two adjacent substrate base plates may be bonded and fixed by a transparent bonding adhesive 118, taking the substrate 11 including two substrate base plates as an example, the display unit 18 and the first conductive terminal 12 may be formed on the front surface of the first substrate base plate, the second conductive terminal 14, the binding terminal 13 and the connecting trace 15 are formed on the front surface of the second substrate base plate, then the second substrate base plate is turned over, and the back surface of the second substrate base plate is bonded and fixed with the back surface of the first substrate base plate.
It should be noted that, in the preparation process, after the first through holes 113 are reserved at the preset positions on the two substrate boards, the first conductive terminals 12 and the second conductive terminals 14 are respectively formed on the two substrate boards, and then the second through holes 121 and the third through holes 141 communicated with the first through holes 113 are respectively formed in the areas of the first conductive terminals 12 and the second conductive terminals 14 corresponding to the first through holes 113; in the preparation process, after the first conductive terminal 12 and the second conductive terminal 14 are respectively formed on the two substrate base plates, a punching process can be performed on the first conductive terminal 12, the second conductive terminal 14 and the base plate 11.
Based on the display panel, the present invention further provides a display device, as shown in fig. 3, wherein the display device includes a plurality of display panels as described in any of the above embodiments, and the plurality of display panels are arranged side by side and at intervals.
Specifically, display device includes first display panel 116 and second display panel 117 of adjacent setting, first conductive terminal 12 on first display panel 116 set up in first display panel 116 is close to on the first limit 1161 of second display panel 117, second display panel 117 include with the adjacent second avris 1171 of first limit 1161, first conductive terminal 12 on the second display panel 117 set up in on the second display panel 117 adjacent with second avris 1171 or/and the relative avris.
It should be noted that, in two adjacent display panels, only one side of two adjacent sides of the two display panels is used for setting the first conductive terminal 12, and the other side is not provided with the first conductive terminal 12, so that the abutted seam of the display device is further reduced, and the display effect is improved.
The invention has the beneficial effects that: the electrical connection between the COF board 16 and the display area 1111 of the display panel is realized through the first conductive terminal 12 and the second conductive terminal 14 which are positioned on different sides of the substrate 11, so that the signal of the COF board 16 is transmitted to the display area 1111 of the display panel through the first conductive terminal 12, meanwhile, the second conductive terminal 14, the binding terminal 13 and the connecting wire 15 are all arranged on the second surface 112 of the substrate 11, the display area 1111 and the marginal area 1112 of the first surface 111 are not occupied, the marginal area 1112 of the display panel can be reduced, the splicing seam after the display panel is spliced is reduced, and the display effect is improved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

Claims (10)

1. A display panel is characterized by comprising a substrate and a plurality of display units, wherein the substrate is provided with a first surface and a second surface which are arranged oppositely, the first surface comprises a display area and an edge area arranged on at least one side of the display area, and the display units are arranged at the display area;
the edge region is provided with a first conductive terminal, and the second surface of the substrate is provided with a binding terminal electrically connected with the first conductive terminal.
2. The display panel of claim 1, wherein the second surface of the substrate further comprises a second conductive terminal electrically connected to the first conductive terminal, and the bonding terminal is electrically connected to the second conductive terminal.
3. The display panel of claim 2, wherein the second conductive terminal is electrically connected to the first conductive terminal through a first via that extends through the substrate.
4. The display panel of claim 3, wherein the first via hole is filled with a conductive metal in contact with the first conductive terminal and the second conductive terminal.
5. The display panel according to claim 4, wherein the first conductive terminal has a second through hole penetrating through upper and lower sides of the first conductive terminal, the second conductive terminal has a third through hole penetrating through upper and lower sides of the second conductive terminal, and the second through hole and the third through hole are both communicated with the first through hole.
6. The display panel according to claim 5, wherein the conductive metal is filled in each of the second through hole and the third through hole.
7. The display panel according to claim 2, wherein the second surface includes a wire concentration area, and a connection trace electrically connected to the binding terminal and the second conductive terminal is disposed at the wire concentration area.
8. The display panel according to claim 3, wherein the base plate comprises a first base plate and a second base plate which are stacked, the first surface being a surface of the first base plate away from the second base plate, and the second surface being a surface of the second base plate away from the first base plate; the first through hole penetrates through the first substrate base plate and the second substrate base plate.
9. A display device comprising a plurality of display panels as claimed in any one of claims 1 to 8, the plurality of display panels being arranged side by side and spaced apart.
10. The display device according to claim 9, wherein the display device comprises a first display panel and a second display panel which are adjacently arranged, the first conductive terminal on the first display panel is disposed on a first side of the first display panel close to the second display panel, the second display panel comprises a second side adjacent to the first side, and the first conductive terminal on the second display panel is disposed on a side of the second display panel adjacent to or/and opposite to the second side.
CN202010272555.7A 2020-04-09 2020-04-09 Display panel and display device Pending CN111463228A (en)

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Publication number Priority date Publication date Assignee Title
CN111951697A (en) * 2020-08-10 2020-11-17 Tcl华星光电技术有限公司 Spliced display screen
CN113488577A (en) * 2021-06-25 2021-10-08 深圳市华星光电半导体显示技术有限公司 Display panel and preparation method thereof
CN114038334A (en) * 2021-12-01 2022-02-11 厦门天马微电子有限公司 Spliced display panel and display device
CN114067694A (en) * 2021-12-08 2022-02-18 Tcl华星光电技术有限公司 Display mother board and preparation method thereof
WO2024103774A1 (en) * 2022-11-18 2024-05-23 武汉华星光电半导体显示技术有限公司 Display panel and fabricating method therefor

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CN107037647A (en) * 2017-05-27 2017-08-11 京东方科技集团股份有限公司 A kind of preparation method of display panel, display device and display panel
CN109449169A (en) * 2018-12-06 2019-03-08 京东方科技集团股份有限公司 Array substrate and its manufacturing method, display device
CN109509776A (en) * 2018-11-22 2019-03-22 武汉华星光电技术有限公司 A kind of OLED display
CN109727534A (en) * 2017-10-27 2019-05-07 京东方科技集团股份有限公司 Binding method and display device

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Publication number Priority date Publication date Assignee Title
CN107037647A (en) * 2017-05-27 2017-08-11 京东方科技集团股份有限公司 A kind of preparation method of display panel, display device and display panel
CN109727534A (en) * 2017-10-27 2019-05-07 京东方科技集团股份有限公司 Binding method and display device
CN109509776A (en) * 2018-11-22 2019-03-22 武汉华星光电技术有限公司 A kind of OLED display
CN109449169A (en) * 2018-12-06 2019-03-08 京东方科技集团股份有限公司 Array substrate and its manufacturing method, display device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111951697A (en) * 2020-08-10 2020-11-17 Tcl华星光电技术有限公司 Spliced display screen
US11979984B2 (en) 2020-08-10 2024-05-07 Tcl China Star Optoelectronics Technology Co., Ltd. Splicing display screen
CN113488577A (en) * 2021-06-25 2021-10-08 深圳市华星光电半导体显示技术有限公司 Display panel and preparation method thereof
CN114038334A (en) * 2021-12-01 2022-02-11 厦门天马微电子有限公司 Spliced display panel and display device
CN114038334B (en) * 2021-12-01 2023-11-17 厦门天马微电子有限公司 Spliced display panel and display device
CN114067694A (en) * 2021-12-08 2022-02-18 Tcl华星光电技术有限公司 Display mother board and preparation method thereof
WO2024103774A1 (en) * 2022-11-18 2024-05-23 武汉华星光电半导体显示技术有限公司 Display panel and fabricating method therefor

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Application publication date: 20200728