JPH0425523B2 - - Google Patents
Info
- Publication number
- JPH0425523B2 JPH0425523B2 JP58237574A JP23757483A JPH0425523B2 JP H0425523 B2 JPH0425523 B2 JP H0425523B2 JP 58237574 A JP58237574 A JP 58237574A JP 23757483 A JP23757483 A JP 23757483A JP H0425523 B2 JPH0425523 B2 JP H0425523B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- board
- driving
- drive
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004973 liquid crystal related substance Substances 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000011159 matrix material Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 241000283070 Equus zebra Species 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Description
【発明の詳細な説明】
本発明は、多数の文字および絵などの情報を表
示する大容量液晶表示装置の構造に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of a large-capacity liquid crystal display device that displays information such as a large number of characters and pictures.
従来、この種のドツトマトリツクス液晶表示装
置の表示パネルと、駆動回路および基板との電極
接続の方法の一例としては、第１図に断面図とし
て示すものがあげられる。 An example of a conventional method for connecting electrodes between a display panel, a drive circuit, and a substrate of this type of dot matrix liquid crystal display device is shown in a cross-sectional view in FIG.
すなわち、表示パネル１とプラスチツクモール
ドされた駆動用IC（フラツトパツクIC）３が登載
されたリジツドな基板２との間に、ゼブラゴム４
を挟んで固定具５で圧接するものである。 That is, a zebra rubber 4 is placed between the display panel 1 and a rigid substrate 2 on which a plastic-molded driving IC (flat pack IC) 3 is mounted.
The fixing member 5 is used to sandwich and press the holder 5 into contact with each other.
また、別の例として第２図に示すものがある。 Another example is shown in FIG.
第２図ａはその平面図で、フラツトパツクIC
８を登載したリジツドな基板７とパネル６の電極
との間が、シート状コネクタ９（フレキシブル基
板または導電樹脂を縞状に印刷したヒートシー
ル）を会して半田付けまたは熱圧着などの手段に
より電気的に接続されている。そして、これを第
２図ｂに示すようにパネルの裏側に折り畳んでい
た。 Figure 2a is a plan view of the flatpack IC.
A sheet-like connector 9 (a flexible substrate or a heat seal printed with conductive resin in stripes) is connected between the rigid substrate 7 on which 8 is mounted and the electrodes of the panel 6 by means of soldering or thermocompression bonding. electrically connected. This was then folded onto the back side of the panel as shown in Figure 2b.
しかし、このような従来の構造では、大規模化
し、高密度化していく近年のドツトマトリツクス
液晶表示装置における液晶駆動用ICの実装構造
としては、満足なものとはいえなくなつてきた。 However, such conventional structures are no longer satisfactory as mounting structures for liquid crystal driving ICs in dot matrix liquid crystal display devices, which have become larger and more dense in recent years.
すなわち、第１図のように、ゼブラゴム４で電
気的接続を取る場合、液晶パネルおよび基板の電
極ピツチとしては0.5mmが限界である。また、第
２図のようにシート状コネクタ９で電気的接続を
取る場合も、シート状コネクタ９がフレキシブル
基板の場合は、半田によりリフロー接合するた
め、接続電極数が100本以上になると電極ピツチ
0.5mmは無理であり、また、ヒートシールの場合
は、導電材がスクリーン印刷によつて縞状に形成
されているため、同様に0.5mmが限界である。 That is, when electrical connections are made using zebra rubber 4 as shown in FIG. 1, the electrode pitch of the liquid crystal panel and substrate is limited to 0.5 mm. Also, when electrical connection is made using the sheet-like connector 9 as shown in Figure 2, if the sheet-like connector 9 is made of a flexible board, reflow bonding is performed by soldering, so if the number of connected electrodes exceeds 100, the electrode pitch will increase.
0.5 mm is impossible, and in the case of heat sealing, the conductive material is formed into stripes by screen printing, so 0.5 mm is also the limit.
ところが、近年のドツトマトリツクス液晶表示
装置に対する市場の要求としては、低消費電力、
薄型であることを理由に事務機器、コンピユータ
の周辺機器、液晶ポケツトテレビ、さらには壁掛
けテレビというように現行のブラウン管テレビに
置き変わる程の強いものがあり、この要求に応え
るためには、液晶パネルの駆動用電極ピツチとし
ては、0.2〜0.3mmが必要となる。 However, in recent years, market demands for dot matrix liquid crystal display devices include low power consumption,
Due to their thinness, there are office equipment, computer peripherals, LCD pocket TVs, and even wall-mounted TVs that are strong enough to replace current CRT TVs. The driving electrode pitch of 0.2 to 0.3 mm is required.
しかし、上述したように、従来の装置では、上
記要件を満足できないという問題点があつた。 However, as mentioned above, conventional devices have a problem in that they cannot satisfy the above requirements.
さらに、第１図、第２図の構造では、別の問題
も起こる。つまり、液晶表示装置を反射型のパネ
ルとして使用する分には問題がないが、ブラウン
管方式テレビに抵抗する鮮明さをもつ液晶テレビ
を構成しようとする場合である。このとき、液晶
表示装置は透過型のパネルとする必要がある。 Furthermore, another problem occurs with the structures shown in FIGS. 1 and 2. In other words, although there is no problem when using a liquid crystal display device as a reflective panel, there is a case where an attempt is made to construct a liquid crystal television with a sharpness that rivals that of a cathode ray tube type television. At this time, the liquid crystal display device needs to be a transmissive panel.
その場合、駆動用基板ICと登載した基板は、
第１図、第２図に示すように液晶パネルの裏側に
配置することはできないので、液晶パネルと同じ
平面に展開せざるを得ず、基板が大きくなつてし
まう。 In that case, the driving board IC and the board mounted on it are
Since it cannot be placed on the back side of the liquid crystal panel as shown in FIGS. 1 and 2, it has to be developed on the same plane as the liquid crystal panel, resulting in an increase in the size of the substrate.
したがつて、携帯用機器、例えば、ポケツトテ
レビの表示装置としては不適当になる。 Therefore, it is unsuitable as a display device for portable equipment, such as a pocket television.
本発明は、上記欠点を除去した装置を提供する
ことを目的とし、具体的には液晶パネルの高密度
大容量化と透過型表示方式に対応した液晶駆動
ICの実装構造を提供することにある。 The purpose of the present invention is to provide a device that eliminates the above-mentioned drawbacks, and specifically, it is an object of the present invention to provide a device that eliminates the above-mentioned drawbacks.
The purpose is to provide an IC mounting structure.
以下、本発明の実施例を図面とともに説明す
る。 Embodiments of the present invention will be described below with reference to the drawings.
第３図は、本発明の一実施例を示す模式断面図
である。１１は液晶パネルで、下側基板の周縁に
は駆動電極１９が設けられている。１２はガラス
エポキシなどの樹脂製絶縁基板で、その表面には
電極パターン１４と半導体チツプからなる駆動用
IC１３が上記基板に配置されており、両者はワ
イヤーボンドなどの方法で電気的接続が取られて
いる。上記チツプ状の駆動用IC１３は樹脂１５
により封止されている。 FIG. 3 is a schematic cross-sectional view showing one embodiment of the present invention. 11 is a liquid crystal panel, and drive electrodes 19 are provided on the periphery of the lower substrate. Reference numeral 12 denotes an insulating substrate made of resin such as glass epoxy, and on its surface is a drive circuit consisting of an electrode pattern 14 and a semiconductor chip.
An IC 13 is placed on the substrate, and the two are electrically connected by wire bonding or the like. The above chip-shaped driving IC 13 is made of resin 15.
It is sealed by.
接続基板は、樹脂ベースフイルム１６、銅箔パ
ターン１７、導電性樹脂層１８からなり、上記液
晶パネルの駆動電極パターン１９と上記基板１２
に設けられている電極１４との上にまたがつて置
かれる。駆動電極１９と基板１２の各電極と、接
続基板の電極とは、接続基板のベースフイルム１
６（25μ程度と薄いポリイミドなどの耐熱性樹
脂）を通して精密に位置合わせした後、加熱押圧
板２０によつて同一平面上で相互に接続される。
上記液晶パネル１１と上記基板１２との隙間２１
はパネル１１と基板１２を同一平面に配置する関
係から１mm以下とする。 The connection board is made up of a resin base film 16, a copper foil pattern 17, and a conductive resin layer 18, and is connected to the drive electrode pattern 19 of the liquid crystal panel and the board 12.
It is placed astride the electrode 14 provided in the. The drive electrode 19, each electrode of the substrate 12, and the electrode of the connection substrate are connected to the base film 1 of the connection substrate.
6 (heat-resistant resin such as polyimide, which is as thin as about 25 μm), and after precise positioning, they are connected to each other on the same plane by a heating press plate 20.
Gap 21 between the liquid crystal panel 11 and the substrate 12
is set to 1 mm or less in order to arrange the panel 11 and the substrate 12 on the same plane.
次に、上記本発明に用いる接続板について第４
図に基づいて説明する。 Next, regarding the connection plate used in the above-mentioned present invention, the fourth
This will be explained based on the diagram.
第４図において、ベースフイルム２５上に銅箔
パターン２２が配置され、上記銅箔パターン２２
上には、シート状の異方性導電性樹脂２４がパタ
ーンの全面に亘つて重ねられている。 In FIG. 4, a copper foil pattern 22 is arranged on a base film 25, and the copper foil pattern 22
A sheet-shaped anisotropic conductive resin 24 is overlaid on the entire surface of the pattern.
シート状の異方性導電性樹脂２４を形成する異
方性導電性樹脂中には、炭素繊維片が含まれてお
り、樹脂は半硬化状態である。この樹脂２４は、
異方性導電性樹脂であるので、重ね合わされた液
晶駆動基板と接続基板との間、および液晶駆動用
IC取付基板と接続基板との間に挟まれた異方性
導電性樹脂部のみが押圧力で導通し、同一基板の
隣接パターン間は高絶縁抵抗を保持し、短絡を防
止している。 The anisotropic conductive resin forming the sheet-like anisotropic conductive resin 24 contains pieces of carbon fiber, and the resin is in a semi-cured state. This resin 24 is
Since it is an anisotropic conductive resin, it can be used between the overlapping liquid crystal drive board and connection board, and for liquid crystal drive.
Only the anisotropic conductive resin sandwiched between the IC mounting board and the connection board is electrically conductive due to the pressing force, maintaining high insulation resistance between adjacent patterns on the same board and preventing short circuits.
第５図は、本発明の他の実施例で、３１は多重
マトリツクス高密度液晶パネル、３２はチツプ状
の駆動用IC３３が複数個登載された液晶駆動用
IC取付基板で、液晶パネル３１の電極３７に対
応した電極パターン３４を有している。３５は第
４図に示す導電性樹脂付きの接続基板、３６はマ
トリツクス駆動用の走査回路を接続するための接
続用フレキシブル基板である。 FIG. 5 shows another embodiment of the present invention, where 31 is a multi-matrix high-density liquid crystal panel, and 32 is a liquid crystal drive device on which a plurality of chip-shaped drive ICs 33 are mounted.
It is an IC mounting board and has an electrode pattern 34 corresponding to the electrode 37 of the liquid crystal panel 31. 35 is a connection board with conductive resin shown in FIG. 4, and 36 is a connection flexible board for connecting a scanning circuit for driving the matrix.
以上により透過型多重マトリツクス液晶基板を
用いた携帯型液晶テレビのデイスプレイユニツト
が構成されている。 As described above, a display unit of a portable liquid crystal television using a transmissive multi-matrix liquid crystal substrate is constructed.
本実施例における接続基板３５と液晶パネル３
１、および、接続基板３５と液晶駆動用IC取付
基板３２との接続方法は、第３図に示したように
同時に接続するものとは異なり２段階に分けて接
続される。 Connection board 35 and liquid crystal panel 3 in this embodiment
1, and the method of connecting the connection board 35 and the liquid crystal driving IC mounting board 32 is different from the method of connecting them at the same time as shown in FIG. 3, in that they are connected in two steps.
すなわち、最初にチツプ状の液晶駆動用IC３
３が実装されて電気特性のチエツクがなされたド
ライバーユニツトとしての液晶駆動用IC取付基
板３２と接続基板３５とを接合し、次いで接続基
板３５と液晶パネル３１とを接合している。 In other words, first a chip-shaped liquid crystal driving IC3
3 is mounted and whose electrical characteristics have been checked, the liquid crystal driving IC mounting board 32 as a driver unit and the connection board 35 are bonded together, and then the connection board 35 and the liquid crystal panel 31 are bonded together.
本実施例の接続部の電極ピツチは0.25mm、約
200本の高密度であり、５〜６mm短手方向の幅の
接続基板を用いて透過型デイスプレイとして平面
サイズをかなり小さく押さえている。 The electrode pitch of the connection part in this example is 0.25 mm, approximately
It has a high density of 200 lines, and uses a connecting board with a transverse width of 5 to 6 mm to keep the planar size quite small as a transmissive display.
上述したように、本実施例では、チツプ状の液
晶駆動用ICを直接基板に登載し、IC用電極と基
板パターンとを接続し、良否の検査をした後、導
電性樹脂層がついた接続基板を介して液晶パネル
と接続し、各々を平面状に配置しているため、大
容量、高密度の透過型液晶デイスプレイを実現で
きる効果を有する。 As described above, in this example, a chip-shaped liquid crystal driving IC is mounted directly on a substrate, the IC electrodes and the substrate pattern are connected, and after inspection for quality, the connection with a conductive resin layer is made. Since it is connected to a liquid crystal panel via a substrate and arranged in a flat manner, it has the effect of realizing a large-capacity, high-density transmissive liquid crystal display.
本発明は、以上説明したように、従来のフラツ
トパツクICよりも大幅に小型なチツプ状の駆動
用ICをIC取付基板上に形成したので、液晶駆動
用IC取付基板の小型化、高密度化が可能となり、
さらに、液晶パネルの電極と液晶駆動用IC取付
基板の電極とを、それぞれ絶縁フイルム上に配線
パターンと上記配線パターンの上に異方性導電性
樹脂層を重ねて形成した接続基板により電気的に
接続したので、大容量、高密度の透過型液晶デイ
スプレイをコンパクトにまとめることができる効
果を有する。 As explained above, the present invention forms a chip-shaped drive IC, which is significantly smaller than conventional flat pack ICs, on an IC mounting board, so that it is possible to downsize and increase the density of the LCD drive IC mounting board. It becomes possible,
Furthermore, the electrodes of the liquid crystal panel and the electrodes of the liquid crystal drive IC mounting board are electrically connected by a wiring pattern on an insulating film and a connection board formed by overlaying an anisotropic conductive resin layer on the wiring pattern. Since they are connected, a large capacity, high density transmissive liquid crystal display can be made compact.
第１図は従来の例を示す模式断面図である。第
２図は別の従来の例を示す模式図で、ａはその平
面図、ｂはその断面を示している。第３図は本発
明の一実施例において、その製作工程を示す模式
断面図である。第４図は本発明に用いる接続基板
の例を示す模式断面図を示すものである。第５図
は本発明の別の実施例を示す模式平面図である。
１，６，１１，３１……液晶パネル、３，８…
…液晶駆動用フラツトパツクIC、１３，３３…
…液晶駆動用IC、２，７，１２，３２……液晶
駆動用IC取付基板、１６，２５……ベースフイ
ルム、１７，２２……銅箔パターン、１８，２
３，２４……導電性樹脂層、３５……接続基板。
FIG. 1 is a schematic sectional view showing a conventional example. FIG. 2 is a schematic diagram showing another conventional example, in which a shows a plan view thereof and b shows a cross section thereof. FIG. 3 is a schematic sectional view showing the manufacturing process in an embodiment of the present invention. FIG. 4 is a schematic sectional view showing an example of a connection board used in the present invention. FIG. 5 is a schematic plan view showing another embodiment of the present invention. 1, 6, 11, 31...LCD panel, 3, 8...
...Flat pack IC for LCD drive, 13, 33...
...LCD drive IC, 2,7,12,32...LCD drive IC mounting board, 16,25...Base film, 17,22...Copper foil pattern, 18,2
3, 24... Conductive resin layer, 35... Connection board.
Claims (1)
一方の基板の周縁に液晶駆動電極を設けた液晶パ
ネルと、 上記液晶表示パネルを駆動するチツプ状の駆動
用ICを実装するとともに、上記チツプ状の駆動
用IC用の電極パターンが設けられた液晶駆動用
IC取付基板と、 絶縁フイルム上に形成された配線パターンと、
上記配線パターンの全面に亘つてシート状の異方
性導電樹脂を重ねてなる接続基板とからなり、 上記液晶駆動用IC取付基板は、上記液晶パネ
ルの外側方に配置され、 上記液晶パネルの液晶駆動電極と上記液晶駆動
用IC取付基板の電極パターンとは、両者にまた
がつて上記接続基板の配線パターンが載置され、 上記接続基板の配線パターンと上記液晶駆動電
極、および、上記接続基板の配線パターンと上記
液晶駆動用IC取付基板の電極パターンが重なる
ように配置して押圧処理されて電気的に接続され
ていることを特徴とする液晶表示装置。[Claims] 1. Of the two substrates constituting the liquid crystal display panel,
A liquid crystal panel with a liquid crystal drive electrode provided on the periphery of one substrate, a chip-shaped drive IC for driving the liquid crystal display panel, and a liquid crystal panel provided with an electrode pattern for the chip-shaped drive IC. For driving
An IC mounting board, a wiring pattern formed on an insulating film,
It consists of a connection board made by overlapping sheet-like anisotropic conductive resin over the entire surface of the wiring pattern, and the liquid crystal driving IC mounting board is arranged on the outside of the liquid crystal panel, and the liquid crystal driving IC mounting board is arranged on the outside of the liquid crystal panel. The wiring pattern of the connection board is placed across the drive electrode and the electrode pattern of the liquid crystal drive IC mounting board, and the wiring pattern of the connection board, the liquid crystal drive electrode, and the electrode pattern of the connection board A liquid crystal display device characterized in that a wiring pattern and an electrode pattern of the liquid crystal driving IC mounting board are arranged so as to overlap and are pressed and electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23757483A JPS60129729A (en) | 1983-12-16 | 1983-12-16 | Liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23757483A JPS60129729A (en) | 1983-12-16 | 1983-12-16 | Liquid crystal display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60129729A JPS60129729A (en) | 1985-07-11 |
| JPH0425523B2 true JPH0425523B2 (en) | 1992-05-01 |
Family
ID=17017329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23757483A Granted JPS60129729A (en) | 1983-12-16 | 1983-12-16 | Liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60129729A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60125617U (en) * | 1984-02-02 | 1985-08-24 | シャープ株式会社 | Connection structure between liquid crystal display element and circuit board |
| JPH067238B2 (en) * | 1986-03-28 | 1994-01-26 | 松下電器産業株式会社 | Liquid crystal display |
| JPS63316885A (en) * | 1987-06-19 | 1988-12-26 | キヤノン株式会社 | External circuit connection structure for liquid crystal panel |
| JPH02137822A (en) * | 1988-11-18 | 1990-05-28 | Matsushita Electric Ind Co Ltd | Liquid crystal display device |
| JPH0518789Y2 (en) * | 1988-12-19 | 1993-05-18 | ||
| DE3910963A1 (en) * | 1989-04-05 | 1990-10-11 | Licentia Gmbh | CIRCUIT ARRANGEMENT |
| US5526563A (en) * | 1994-03-10 | 1996-06-18 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing an electronic component |
| JPH08429U (en) * | 1995-07-25 | 1996-02-27 | セイコーエプソン株式会社 | LCD panel structure |
| JPH09120080A (en) * | 1996-10-03 | 1997-05-06 | Seiko Epson Corp | Liquid crystal panel structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5762029A (en) * | 1980-09-30 | 1982-04-14 | Sharp Corp | Terminal treating system for multilayered liquid-crystal panel |
-
1983
- 1983-12-16 JP JP23757483A patent/JPS60129729A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5762029A (en) * | 1980-09-30 | 1982-04-14 | Sharp Corp | Terminal treating system for multilayered liquid-crystal panel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60129729A (en) | 1985-07-11 |
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