JP3532042B2 - Manufacturing method of liquid crystal display device and liquid crystal display device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method for a tape carrier package and a printed circuit board.

[0002]

2. Description of the Related Art Integrated circuits in a tape carrier package are used in electronic devices in various fields for the purpose of reducing the size and weight of the device. Specifically, it is also used in the field of liquid crystal display panels.

A display device using a liquid crystal has features such as low power consumption and light weight, which are not found in conventional displays, and the commercial power of the display device has increased due to the progress of peripheral technology, and it has been used in various products.

Liquid crystal display devices that perform matrix display are classified into an active matrix and a simple matrix because of their structure. An active matrix type liquid crystal display device that uses a thin film transistor as a switch for each pixel can be used for a notebook-type personal computer display or a car navigation display, etc., because a clear image display without crosstalk can be obtained. And the market is expanding rapidly.

In both the active matrix system and the simple matrix system, the configuration for supplying signals to the liquid crystal panel is shown in FIG.
And is configured as shown in FIG. The liquid crystal panel 1 is connected to an external circuit via a tape carrier package 2 and a printed board 3. Tape carrier package 2
Is configured by mounting a driving integrated circuit element (hereinafter abbreviated as an LSI element) 4 on a flexible substrate in which wiring and terminals are formed of a copper foil on a polyimide tape. 5 is an LSI element 4
A protective coating material is applied to the periphery of the coating material, 6 is a coating material that covers the exposed portion of the copper foil, and 7 is a portion that prevents the electrodes from coming loose.

The signal line connection terminal 8 of the liquid crystal panel 1 and the output signal electrode 9 of the tape carrier package 2 are electrically connected by using an anisotropic conductive material. The signal supply to the tape carrier package 2 is performed by electrically connecting the input signal electrode 11 of the tape carrier package 2 to the connection electrode 10 formed on the printed board 3 by soldering.

Soldering of the connection electrode 10 of the printed circuit board 3 and the input signal electrode 11 of the tape carrier package 2
As shown in FIG. 5, the input signal electrode 11 of the tape carrier package 2 is aligned with the connection electrode 10 of the printed circuit board 3 between the pressure bonding head 12 and the stage 13, and heat and pressure are applied between the pressure bonding head 12 and the stage 13. Connecting. At this time, the input signal electrode 11 of the tape carrier package 2
The connecting portion is provided with a connection opening portion 14 from which the polyimide tape is removed in order to increase the efficiency of heating and to secure the escape of the extruded solder.

[0008]

The portability of the notebook type personal computer is important, and the outer size of the personal computer main body is A4 size. The liquid crystal display device used for these has an initial screen diagonal dimension of about 22 cm (8
However, the diagonal size of the screen is currently shifting from 26 cm (10.4 ") to 29 cm (11.3") due to the demand for the largest screen while the size of the PC is A4 size. There is.

Therefore, efforts have been made to reduce the size of regions other than the screen of liquid crystal display devices. Up to now, as shown in FIG. 6, the drive signal is supplied from one of the upper, lower, left and right sides. However, as shown in FIG. 7, the LSI element 4, the tape carrier package 2, and the It has been considered to reduce the size of the printed circuit board 3 and further reduce the vertical dimension L by bringing the signal line connection terminals of the panel, which are in the two upper and lower directions, to one side.

However, when driving the same display line, it is necessary to supply the drive signal from one side, so the number of signal lines must be doubled, and the pitch of the signal line connection terminals and the connection electrode width are the same as in FIG. The wiring on the tape carrier package is extremely close to that of the adjacent wiring because it is about half the size of the wiring.

Therefore, when the printed circuit board and the tape carrier are to be connected by soldering, as shown in FIGS. 8A and 8B, the solder 15 melted at the time of connection is placed under the tape carrier package 2. There is a problem that it is easy to get into a short circuit with the adjacent electrode by submerging due to the capillary phenomenon.

As a countermeasure against this, as shown in FIGS. 9 (a) and 9 (b), the length of the connecting electrode 3 of the printed board 3 is such that the polyimide tape of the tape carrier is exposed and the connecting opening 1 is formed.
It may be shorter than 4 so that the connecting electrode 10 of the printed circuit board 3 is not under the tape carrier so that the capillary phenomenon does not occur. In that case, it is provided at the tip of the printed circuit board side connecting portion of the tape carrier. The floating prevention part 7 of the existing electrode floats without being connected, and depending on handling, the electrode of the floating prevention part may fall sideways and short-circuit with the adjacent electrode, or it may be torn.
Fillet 1 to be soldered on a row of exposed parts of the electrode not reinforced by the polyimide tape of the tape carrier
Since No. 5 is formed, when stress is applied to the soldered portion of the electrode due to a temperature cycle test or the like, stress concentration occurs, which causes a problem that the connection electrode portion is easily detached or broken.

According to the present invention, a tape carrier having a narrow pitch of signal line connection terminals of a tape carrier package and a narrow width of connection electrode is connected to a printed circuit board to improve the connection strength and short-circuit with an adjacent electrode. Liquid crystal display manufacturing method and liquid crystal display device capable of soldering in a difficult state
The purpose is to provide storage .

[0014]

This onset Akira [Summary of] is characterized in that a solder fillet is formed alternately or more every electrode side of the electrode side and the printed circuit board of the tape carrier package.

According to the present invention, the connection strength can be improved, and the soldering can be realized in a state where it is difficult to short-circuit with the adjacent electrode.

[0016]

DETAILED DESCRIPTION OF THE INVENTION A liquid crystal display according to claim 1 of the present invention.
The method of manufacturing the device is such that when the electrodes drawn from the tape carrier package on which the integrated circuit is mounted are soldered to the printed board, the electrodes are drawn from the tape carrier package.
The tips of the exposed electrodes are connected by a loosening prevention part, and the electrodes of the tape carrier package are attached to the printed circuit board.
A region connected to, and a longitudinal long electrode and short electrodes of the tape carrier package of the electrodes, contact alternately or more relative to the electrodes of the tape carrier package
Formed in can, before the electrodes of the tape carrier package
And soldered to electrodes of the serial PCB, the solder fillets
And forming alternately or more every electrode side of the printed circuit board and the electrode side of the tape carrier package.

A liquid crystal display device according to claim 2 of the present invention is
Via tape carrier package with integrated circuit
A liquid crystal display device in which a printed circuit board is connected to a liquid crystal panel, which is pulled out from the tape carrier package.
The electrode is the tip of the electrode on the side connected to the printed circuit board.
The ends are connected by the separation preventing portion, and the printed circuit board has
Areas connected to the electrodes of the tape carrier package
To the longitudinal long electrode and short electrodes of the tape carrier package of the electrodes are formed alternately to the electrodes of the tape carrier package, said tape carrier
Solder the package electrodes to the printed circuit board electrodes
It is characterized by being done.

A liquid crystal display device according to claim 3 of the present invention is
Via tape carrier package with integrated circuit
With a liquid crystal display device in which the printed circuit board is connected to the liquid crystal panel
Yes, it is pulled out from the tape carrier package
The electrode has a flat tip on the side connected to the printed circuit board.
The printed circuit board is connected to the printed circuit board with the
The area connected to the electrodes of the carrier package.
Serial and longitudinally long electrode and short electrodes of the tape carrier package of the electrodes are formed on the plurality every other electrode of the tape carrier package, said tape carrier
Solder the package electrodes to the printed circuit board electrodes
It is characterized by being done.

[0019]

The soldering method of the tape carrier package of the present invention will be described below with reference to the specific examples shown in FIGS. It should be noted that components having the same operation as that of the conventional example will be described with the same reference numerals.

Here, a case where the tape carrier package 2 attached to the liquid crystal panel 1 is soldered to the printed board 3 will be described as an example. As shown in FIG.
One end of the tape carrier package 2 mounting the SI element 4 is connected to the signal connection terminal of the liquid crystal panel 1, and the input signal electrode 11 formed at the other end is aligned with the electrodes 16 and 17 formed on the printed circuit board 3. Thermocompression bonding and solder connection.

Adjacent electrodes 16 and 17 on the printed circuit board 3
2A, long electrodes 16 and short electrodes 17 are alternately and repeatedly formed in the connection opening 14 of the input signal electrode 11 of the tape carrier package 2 as shown in FIG.

In this state, the electrodes 16 and 1 of the printed circuit board 3 are
7 and the input signal electrode 11 of the tape carrier package 2 are connected by soldering, as shown in FIGS.
The solder fillet is formed from the side of the electrode 16 as shown by 8, and the solder fillet is formed from the side of the input signal electrode 11 at the portion of the short electrode 17 as shown by reference numeral 19.
The solder fillets are alternately formed on the electrode side of the tape carrier package 2 and the electrode side of the printed circuit board 3. In addition, a part of the electrode in the electrode dislocation preventing portion 7 is also included in the electrode 1.
6 is soldered and fixed at the same time.

As described above, by making the electrode configuration of the printed circuit board longer and shorter, the fillets at the time of solder connection are alternately formed up and down, so that when stress such as temperature cycle is applied, the stress is linearly applied. Instead, stress concentration is avoided because they are applied alternately in the upper and lower directions, which leads to an improvement in reliability of soldering.

Further, since the dislocation preventing portion 7 that supports the electrode portion of the tape carrier package is also soldered to the electrode 16 of the printed board, the dislocation preventing portion 7 may be removed or bent by being touched during handling. It also solves the problem of short-circuiting.

The inventor conducted a temperature cycle test on the liquid crystal display device manufactured by the conventional connecting device and the liquid crystal display device manufactured by the connecting device having the soldering method structure according to the present invention, and confirmed the effect. Therefore, the results are shown in Table 1.

The test conditions were a thermal shock test in which one cycle consisted of leaving at -30 ° C. for 30 minutes and at 70 ° C. for 30 minutes to evaluate the number of cycles at which the input signal electrode of the tape carrier package was broken.

[0028]

[Table 1]

Although the above embodiment has been described as the substrate structure for connecting the tape carrier package in the liquid crystal display device, the present invention can be applied to other electronic devices which use the tape carrier package without being particular about the liquid crystal display device. is there.

Furthermore, although the electrodes of the printed circuit board are alternated in length and length, depending on the configuration, every two electrodes may be arranged, or more or more electrodes may be selected and constructed as required, and the effect can be obtained.
The same effect can be obtained even if the electrode shape on the tape carrier package side has a long or short configuration.

[0031]

According to the onset bright as the foregoing, by attaching a length in the electrode structure of the electrode or a printed circuit board of the tape carrier package, the solder fillets according to the pitch of its length, the side of the tape carrier package And because it is formed alternately at a predetermined pitch on the printed circuit board side,
The concentration of stress can be avoided, and the reliability of soldering can be improved.

[Brief description of drawings]

FIG. 1 is a plan view of a tape carrier package and a printed circuit board 3 soldered by a soldering method of the present invention.

FIG. 2 is a plan view of the printed circuit board according to the embodiment and cross-sectional views of the printed circuit board at long electrode positions and short electrode positions.

FIG. 3 is an enlarged plan view of a main part of a conventional liquid crystal display device.

FIG. 4 is an enlarged sectional view of a soldering portion in the conventional example.

FIG. 5 is a sectional view of the conventional example during soldering.

FIG. 6 is a plan view of a conventional liquid crystal display device.

FIG. 7 is a plan view of a conventional liquid crystal display device.

FIG. 8 is a sectional view and a plan view showing a conventional soldering failure.

FIG. 9 is a sectional view and a plan view of a soldered state in which all electrodes on the printed circuit board side are shortened.

[Explanation of symbols]

1 Liquid Crystal Panel 2 Tape Carrier Package 3 Printed Circuit Board 4 LSI Element 11 Input Signal Electrodes 16, 17 Printed Circuit Board Electrode 18 Solder Fillet 19 Formed on Electrode Side of Printed Circuit Board 19 Solder Fillet Formed on Electrode Side of Tape Carrier Package

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tsuyoshi Ishigame 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-2-301725 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01L 21/60 311 G02F 1/1345 G09F 9/00 348 H05K 1/02 H05K 1/18

Claims (3)

(57) [Claims] 1. When soldering electrodes drawn from a tape carrier package mounting an integrated circuit to a printed circuit board, electrodes drawn from the tape carrier package
The ends of the tape carrier package are attached to the printed circuit board by connecting the tips with a separation prevention unit.
A region connected to the electrodes, and a longitudinally long electrode and short electrodes of the tape carrier package of the electrode, alternating or multiple to the electrode of said tape carrier package
Formed in several intervals, the electrodes of the tape carrier package and soldered to the electrodes of the printed circuit board, the solder fillets electrode side of the printed circuit board and the electrode side of said tape carrier package
Manufacture of liquid crystal display devices that are formed alternately and every two or more
Build method . 2. A liquid in which a printed circuit board is connected to a liquid crystal panel via a tape carrier package having an integrated circuit mounted thereon.
Crystal display device , wherein the electrode is pulled out from the tape carrier package
Is the tip of the electrode on the side connected to the printed circuit board.
The tape carrier package is connected to the printed circuit board by an anti-leather part.
Of the region connected to the electrodes, and long electrodes and short electrode in the longitudinal direction of the tape carrier package of the electrodes are formed alternately to the electrodes of the tape carrier package
And the electrodes of the tape carrier package are
A liquid crystal display device soldered to the plate electrodes . 3. A liquid in which a printed circuit board is connected to a liquid crystal panel via a tape carrier package on which an integrated circuit is mounted.
Crystal display device, wherein the electrode is pulled out from the tape carrier package
Prevents the tip on the side connected to the printed circuit board from coming loose.
The tape carrier package is connected to the printed circuit board by a stopper.
A region connected to the electrodes, and the longitudinally long electrode and short electrodes of the electrode and the tape carrier package, the formed a plurality every other electrode of the tape carrier package, the electrodes of the tape carrier package The print base
A liquid crystal display device soldered to the plate electrodes .