JPH07199207A - Liquid crystal display and tape carrier for liquid crystal display driver package - Google Patents

Liquid crystal display and tape carrier for liquid crystal display driver package

Info

Publication number
JPH07199207A
JPH07199207A JP5296442A JP29644293A JPH07199207A JP H07199207 A JPH07199207 A JP H07199207A JP 5296442 A JP5296442 A JP 5296442A JP 29644293 A JP29644293 A JP 29644293A JP H07199207 A JPH07199207 A JP H07199207A
Authority
JP
Japan
Prior art keywords
liquid crystal
tape carrier
tape
circuit board
crystal display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5296442A
Other languages
Japanese (ja)
Other versions
JP2732553B2 (en
Inventor
Kazunori Sakamoto
一紀 坂本
Kazuhiro Umemoto
一寛 梅本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to JP5296442A priority Critical patent/JP2732553B2/en
Priority to US08/345,109 priority patent/US5572346A/en
Publication of JPH07199207A publication Critical patent/JPH07199207A/en
Application granted granted Critical
Publication of JP2732553B2 publication Critical patent/JP2732553B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Abstract

PURPOSE: To prevent the damage of an input lead of a tape carrier due to distortion or creases which are caused on a TAB tape by the difference in thermal expansion coefficient between a printed circuit board and an LCD glass substrate with respect to an LCD driver package using the TAB tape carrier. CONSTITUTION: A TAB tape carrier 10 of the LCD driver package which has an input lead 12 connected to a printed circuit board 24, an output lead 14 connected to an LCD glass substrate 26, and a chip 22 is provided with at least a pair of anchor holes 40; and after the LCD driver package is mounted, anchor holes 40 are used to fix the tape carrier 10 to the circuit board 24 with solder or adhesive. By this fixing with anchor holes 40, distortion and creases of the tape are prevented from being propagated to the input lead 12.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、液晶デイスプレイ（Ｌ
ＣＤ）ドライバ・パッケージ用テープ・キャリアおよび
かかるテープ・キャリアを用いた液晶デイスプレイ関す
る。BACKGROUND OF THE INVENTION The present invention relates to a liquid crystal display (L
The present invention relates to a tape carrier for a CD) driver package and a liquid crystal display using the tape carrier.

【０００２】[0002]

【従来の技術】ＬＣＤデイスプレイは、プリント回路基
板と液晶パネルのガラス基板の電極とを接続する手段と
してＴＡＢテープ・キャリアを用いており、このＴＡＢ
テープ・キャリアにはＬＣＤドライバ・チップが装着さ
れる。図１は従来のＬＣＤドライバ・パッケージ用ＴＡ
Ｂテープ・キャリア１０を示し、図２はかかるテープ・
キャリアをプリント回路基板および液晶パネルのガラス
基板に接続した状態を示している。テープ・キャリア１
０は、ポリイミド層よりなる絶縁性フィルム・テープ１
１、その表面に設けられた入力リード導体１２、および
出力リード導体１４を有する。テープ・キャリア１０
は、チップ装着位置を与えるチップ装着開口１６を有す
る。入力リード１２は開口１６からテープの一方の縁に
向かって延び、そして、この縁にそって形成された細長
いスロット１８を横切って終端している。出力リード１
４は開口１６からテープの他方の縁に向かって延びてい
る。出力リード１４の側には、開口は形成されていな
い。ＬＣＤドライブ用のチップ２２は開口１６の位置に
おいて入力リード１２および出力リード１４に接続さ
れ、これによって、ＬＣＤドライバ・テープ・キャリア
・パッケージが形成される。2. Description of the Related Art An LCD display uses a TAB tape carrier as a means for connecting a printed circuit board and an electrode of a glass substrate of a liquid crystal panel.
An LCD driver chip is mounted on the tape carrier. Figure 1 shows the conventional TA for LCD driver package
B tape carrier 10 is shown in FIG.
The state where the carrier is connected to the printed circuit board and the glass substrate of the liquid crystal panel is shown. Tape carrier 1
0 is an insulating film tape consisting of a polyimide layer 1
1, an input lead conductor 12 and an output lead conductor 14 provided on the surface thereof. Tape carrier 10
Has a chip mounting opening 16 which provides a chip mounting position. The input lead 12 extends from the opening 16 toward one edge of the tape and terminates across an elongated slot 18 formed along the edge. Output lead 1
4 extends from the opening 16 toward the other edge of the tape. No opening is formed on the output lead 14 side. The LCD drive chip 22 is connected to the input lead 12 and the output lead 14 at the position of the opening 16, thereby forming an LCD driver tape carrier package.

【０００３】ＬＣＤドライバ・パッケージをＬＣＤ装置
上に実装する場合は、入力リード１２側のテープ縁が線
Ａ−Ａ（図１）に沿って切断され、入力リード１２の先
端がむき出しにされる。露出された入力リード１２の先
端はプリント回路基板２４の対応導体（図示せず）には
んだ接続され、出力リード１４はＬＣＤガラス基板２６
の対応パネル電極（図示せず）に接続される。出力リー
ド１４は一般に入力リード１２よりもはるかに高密度に
形成されるから、出力リード１４に対して開口を形成し
て出力リード１４をむき出しにした場合は、接続時にシ
ョートなどの問題が生じやすい。そのため、出力リード
１４は絶縁性フィルム・テープ１１上に支持された状態
でガラス基板に接続される。ガラス基板は平坦であり、
出力リードをフィルム・テープに取り付けたままでも接
続できる。一方、回路基板２４の接続位置の高さは必ず
しも一様でないため、入力リード１２は、この高さの差
に適応できるようにするためにむき出しにされる。When the LCD driver package is mounted on the LCD device, the tape edge on the input lead 12 side is cut along the line A--A (FIG. 1), and the tip of the input lead 12 is exposed. The exposed ends of the input leads 12 are soldered to corresponding conductors (not shown) of the printed circuit board 24, and the output leads 14 are connected to the LCD glass substrate 26.
Of the corresponding panel electrode (not shown). Since the output leads 14 are generally formed to have a much higher density than the input leads 12, when the openings are formed in the output leads 14 to expose the output leads 14, problems such as short circuit are likely to occur at the time of connection. . Therefore, the output lead 14 is connected to the glass substrate while being supported on the insulating film tape 11. The glass substrate is flat,
You can connect the output leads while they are still attached to the film tape. On the other hand, since the heights of the connection positions of the circuit board 24 are not always uniform, the input leads 12 are exposed so as to be able to accommodate this height difference.

【０００４】[0004]

【発明が解決しようとする課題】従来の構造では、回路
基板２４とＬＣＤガラス基板２６との間の熱膨脹係数の
差や、振動または回路基板の撓み、変形などにより、矢
印２８、３０の方向でテープ１０に繰り返し応力が加わ
る。テープ１０への応力は主として領域３２、３４にお
いてねじれあるいはしわを発生させ、特に、領域３６、
３８の付近の入力リード導体１２に損傷を与え、断線を
生じる可能性があることが判明した。出力リード１４は
絶縁性フィルム・キャリア１１によって裏打ちされ、機
械的強度が比較的高いため、ほとんど損傷を受けない。
液晶デイスプレイでは、ＬＣＤドライバ・アセンブリの
コンパクト化のためにテープ・キャリア１０の長さＬ
（図２）を小さくし、またデイスプレイの大画面化に応
じて幅Ｗを大きくするのが有利であるが、テープ・キャ
リア１０の長さＬが小さくなればなるほど、また幅Ｗが
大きくなればなるほど、応力による損傷を受けやすくな
る。In the conventional structure, due to the difference in the coefficient of thermal expansion between the circuit board 24 and the LCD glass board 26, the vibration, the bending or the deformation of the circuit board, the directions of the arrows 28 and 30 are increased. Repeated stress is applied to the tape 10. The stress on the tape 10 causes twists or wrinkles primarily in the regions 32, 34, especially in the regions 36,
It has been found that the input lead conductor 12 near 38 can be damaged and cause a wire break. The output leads 14 are lined by the insulating film carrier 11 and have relatively high mechanical strength, so that they are hardly damaged.
In the liquid crystal display, the length L of the tape carrier 10 is set to make the LCD driver assembly compact.
Although it is advantageous to make (FIG. 2) smaller and to make the width W larger in accordance with the increase in the screen size of the display, the smaller the length L of the tape carrier 10 is, the larger the width W becomes. The more it is, the more easily it is damaged by stress.

【０００５】従来この問題に対する対策として、入力リ
ードを樹脂被覆して補強する方法、入力リード・アレイ
の両側にダミー・リードを設ける方法、あるいはリード
導体を厚くする方法があるが。しかし、樹脂被覆する方
法では、硬化温度の関係からシリコーン樹脂が用いられ
るが、シリコーン樹脂では十分な強度を得ることができ
ない、面倒な樹脂被覆工程が必要になる、樹脂被覆後は
ドライバ・パッケージを交換できなくなるという問題が
ある。ダミー・リードを設ける方法はダミー・リードに
隣接するリードの損傷を防止できるが、内側のリードの
損傷を防止できない。リードを厚くする方法は、不経済
であり、微細加工も困難になる。Conventionally, as measures against this problem, there are a method of coating the input leads with a resin for reinforcement, a method of providing dummy leads on both sides of the input lead array, and a method of thickening the lead conductor. However, in the resin coating method, a silicone resin is used because of the curing temperature, but a sufficient strength cannot be obtained with the silicone resin, a troublesome resin coating process is required, and a driver package is required after the resin coating. There is a problem that it cannot be exchanged. The method of providing the dummy lead can prevent damage to the lead adjacent to the dummy lead, but cannot prevent damage to the inner lead. The method of thickening the leads is uneconomical and makes fine processing difficult.

【０００６】従って、本発明の目的は、上述したリード
損傷、リード断線の問題を簡単に解決できる液晶デイス
プレイ・ドライバ・パッケージ用テープ・キャリアおよ
びかかるテープ・キャリアを用いた液晶デイスプレイを
提供することである。Therefore, an object of the present invention is to provide a tape carrier for a liquid crystal display driver package which can easily solve the above-mentioned problems of lead damage and lead disconnection, and a liquid crystal display using such a tape carrier. is there.

【０００７】[0007]

【課題を解決するための手段】本発明の液晶デイスプレ
イ・ドライバ・パッケージ用テープ・キャリアは、入力
リードおよび出力リードが形成されていない領域に、テ
ープ・キャリアを回路基板に固定するための少なくとも
１対のアンカー・ホール有する。アンカー・ホールは、
チップを跨ぐように、チップの両側に設けられる。アン
カー・ホールを用いたテープ・キャリアの固定は、ＬＣ
Ｄドライバ・パッケージを実装した後に、はんだまたは
接着剤により行なうことができる。SUMMARY OF THE INVENTION A tape carrier for a liquid crystal display driver package according to the present invention has at least one part for fixing the tape carrier to a circuit board in a region where input leads and output leads are not formed. Has a pair of anchor holes. Anchor Hall is
It is provided on both sides of the chip so as to straddle the chip. Fixing the tape carrier using the anchor holes is LC
This can be done with solder or adhesive after mounting the D-driver package.

【０００８】[0008]

【作用】アンカー・ホールによってテープ・キャリアを
回路基板に固定することにより、テープのねじれまたは
しわが入力リードに伝わるのを防止することができる。By fixing the tape carrier to the circuit board by the anchor hole, it is possible to prevent the twist or the wrinkle of the tape from being transmitted to the input lead.

【０００９】[0009]

【実施例】図３は本発明のＬＣＤドライバ・パッケージ
用テープ・キャリアを示している。なお、図３〜図６に
おいて、図１および図２と対応する構成要素は、同じ番
号で示されている。本発明の特徴は、リードが形成され
ていないテープ領域であって、チップ装着開口１６の両
側の位置にアンカー・ホール４０を設けた点である。例
えば、アンカー・ホールは開口１６から０．２〜１０ｍ
ｍの所に形成されるが、これはＬＣＤドライバ・パッケ
ージの設計に応じて変わりうることは理解されよう。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT FIG. 3 shows a tape carrier for an LCD driver package according to the present invention. 3 to 6, constituent elements corresponding to those in FIGS. 1 and 2 are indicated by the same numbers. A feature of the present invention is that anchor holes 40 are provided at positions on both sides of the chip mounting opening 16 in a tape region where leads are not formed. For example, the anchor hole is 0.2-10m from the opening 16
It is formed at m, but it will be understood that this may vary depending on the design of the LCD driver package.

【００１０】図４はアンカー・ホール４０の断面構造を
示している。アンカー・ホール４０はポリイミド・フィ
ルム・テープ１１、およびその上に形成されたアンカー
・パッド４２を貫通して設けられている。アンカー・パ
ッド４２は、はんだ付けでテープ・キャリア１０を回路
基板に固着できるようにするためにアンカー・ホール４
０の位置に形成されている。アンカー・パッド４２の周
辺部および他のテープ表面は、はんだレジスト層４４で
覆われている。FIG. 4 shows a sectional structure of the anchor hole 40. The anchor hole 40 is provided so as to penetrate the polyimide film tape 11 and the anchor pad 42 formed thereon. Anchor pads 42 are provided in the anchor holes 4 to allow the tape carrier 10 to be secured to the circuit board by soldering.
It is formed at the position of 0. The periphery of the anchor pad 42 and other tape surfaces are covered with a solder resist layer 44.

【００１１】図５は本発明のＬＣＤドライバ・パッケー
ジを実装した状態を示し、図６ははんだ結合されたアン
カー・ホールの断面構造を示している。プリント回路基
板は２４はアンカー・ホール４０と対応する位置に、ス
ズめっきされた銅よりなる基板パッド４６を有し、テー
プ・キャリア１０はＬＣＤドライバ・パッケージの実装
後、はんだ４８によって回路基板に２４に固定される。FIG. 5 shows a state in which the LCD driver package of the present invention is mounted, and FIG. 6 shows a sectional structure of anchor holes soldered. The printed circuit board 24 has a board pad 46 made of tin-plated copper at a position corresponding to the anchor hole 40. The tape carrier 10 is mounted on the circuit board 24 by solder 48 after mounting the LCD driver package. Fixed to.

【００１２】アンカー・ホール４０を介してテープ１０
を回路基板２４に固定すると、図２に関して説明したテ
ープのねじれまたはしわが、リードが形成されていない
テープ縁の方向に発生し（領域３２' および３４' ）、
入力リードには伝わらなくなるため、上述したリード損
傷を防止することができる。テープのねじれまたはしわ
の発生方向がそらされて、入力リードに伝わらなくされ
るならば、アンカー・ホールの位置および数に制限はな
いが、チップ装着開口１６を跨ぐように少なくとも１対
設けるのが好ましい。Tape 10 through anchor hole 40
2 is fixed to the circuit board 24, the twisting or wrinkling of the tape described with reference to FIG. 2 occurs in the direction of the tape edges where no leads are formed (regions 32 'and 34'),
Since it is not transmitted to the input lead, the lead damage described above can be prevented. If the direction in which the tape is twisted or wrinkled is deflected so as not to be transmitted to the input lead, the position and number of anchor holes are not limited, but at least one pair should be provided so as to straddle the chip mounting opening 16. preferable.

【００１３】良好な実施例では、はんだでアンカー・ホ
ールを回路基板に固定したが、接着剤で固定してもよ
い。この場合は、テープのアンカー・パッド４２および
基板パッド４６は設けなくてもよい。しかし、はんだ結
合を用いた場合は、不良のドライバ・パッケージを簡単
に取り外し、交換または修理できる利点が得られる。ま
た、実施例では、チップ装着開口にチップが取り付けら
れているが、本発明はチップをテープ・キャリアにフェ
ースダウン・ボンデイングにより装着するドライバ・パ
ッケージ・テープ・キャリアにも適用することができ
る。In the preferred embodiment, the anchor holes are fixed to the circuit board with solder, but may be fixed with an adhesive. In this case, the tape anchor pad 42 and substrate pad 46 may not be provided. However, the use of solder joints has the advantage of easily removing, replacing or repairing a defective driver package. Further, although the chip is mounted in the chip mounting opening in the embodiment, the present invention can be applied to a driver package tape carrier in which the chip is mounted on the tape carrier by face down bonding.

【００１４】[0014]

【発明の効果】本発明によれば、回路基板とガラス基板
の熱膨脹係数の差や、振動または回路基板の撓み、変形
などによる応力によってリードが損傷を受けるのを防止
することができる。従って、一層大きなＬＣＤガラス基
板および回路基板を使用することが可能になり、液晶デ
イスプレイの大画面化が可能になる。本発明の解決方法
は、簡単で、経済的であり、実施容易である。また、ア
ンカー・ホールの固定にはんだを用いた場合は、パッケ
ージの交換を容易に行なうことができる。According to the present invention, it is possible to prevent the leads from being damaged due to the difference in coefficient of thermal expansion between the circuit board and the glass substrate, vibration, or stress due to bending or deformation of the circuit board. Therefore, it is possible to use a larger LCD glass substrate and circuit board, and it is possible to increase the screen size of the liquid crystal display. The solution of the present invention is simple, economical and easy to implement. Further, when solder is used to fix the anchor holes, the package can be easily replaced.

【００１５】[0015]

【図面の簡単な説明】[Brief description of drawings]

【図１】従来のＬＣＤドライバ・パッケージ用ＴＡＢテ
ープ・キャリアを示す図である。FIG. 1 is a diagram showing a conventional TAB tape carrier for an LCD driver package.

【図２】従来のＬＣＤドライバ・パッケージを実装した
状態を示す図である。FIG. 2 is a diagram showing a state in which a conventional LCD driver package is mounted.

【図３】本発明のＬＣＤドライバ・パッケージ用ＴＡＢ
テープ・キャリアを示す図である。FIG. 3 TAB for LCD driver package of the present invention
It is a figure which shows a tape carrier.

【図４】本発明のテープ・キャリアのアンカー・ホール
部分の断面図である。FIG. 4 is a sectional view of an anchor hole portion of the tape carrier of the present invention.

【図５】本発明によるＬＣＤドライバ・パッケージを実
装した状態を示す図である。FIG. 5 is a diagram showing a state where an LCD driver package according to the present invention is mounted.

【図６】はんだ結合されたアンカー・ホールの断面図で
ある。FIG. 6 is a cross-sectional view of solder-bonded anchor holes.

【符号の説明】[Explanation of symbols]

１０ ＴＡＢテープ・キャリア １１ 絶縁性フィルム・テープ １２ 入力リード １４ 出力リード １６ チップ装着開口 １８、２０ スロット ２２ チップ ２４ 回路基板 ２６ ＬＣＤガラス基板 ２８、３０ 応力方向 ３２ ３４ ３２' ３４' ねじれ発生領域 ３６ ３８ リード損傷領域 ４０ アンカー・ホール ４２ アンカー・パッド ４４ はんだレジスト層 ４６ 基板パッド ４８ はんだ 10 TAB tape carrier 11 Insulating film / tape 12 Input lead 14 Output lead 16 Chip mounting opening 18, 20 Slot 22 Chip 24 Circuit board 26 LCD glass substrate 28, 30 Stress direction 32 34 32 '34' Twist generation area 36 38 Lead damage area 40 Anchor hole 42 Anchor pad 44 Solder resist layer 46 Board pad 48 Solder

フロントページの続き (72)発明者 梅本 一寛 滋賀県野洲郡野洲町大字市三宅800番地 日本アイ・ビー・エム株式会社 野洲事業 所内Continued Front Page (72) Inventor Kazuhiro Umemoto 800 Miyake, Yasu-cho, Yasu-gun, Shiga Japan IBM Japan, Ltd. Yasu Plant

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】液晶パネル電極を有するガラス基板と、 回路基板と、 上記回路基板に接続された入力リード、上記液晶パネル
電極に接続された出力リード、および上記入力リードと
上記出力リードに接続された液晶ドライバ・チップを有
する液晶ドライバ・テープ・キャリア・パッケージとを
有し、 上記テープ・キャリアが、上記入力リードおよび出力リ
ードが形成されていない領域であって、上記チップを跨
ぐ位置に少なくとも１対のアンカー・ホールを有し、こ
のアンカー・ホールを介して上記回路基板に固定されて
いることを特徴とする液晶デイスプレイ。1. A glass substrate having a liquid crystal panel electrode, a circuit substrate, an input lead connected to the circuit substrate, an output lead connected to the liquid crystal panel electrode, and an input lead connected to the output lead. And a liquid crystal driver tape carrier package having a liquid crystal driver chip, wherein the tape carrier is an area in which the input lead and the output lead are not formed, and is at least 1 at a position straddling the chip. A liquid crystal display having a pair of anchor holes and being fixed to the circuit board through the anchor holes. 【請求項２】請求項１において、上記テープ・キャリア
が上記アンカー・ホールの位置に金属のアンカー・パッ
ドを有し、上記回路基板が上記アンカー・ホールと対応
する位置に金属の基板パッドを有し、上記アンカー・パ
ッドが上記基板パッドにはんだ結合されていることを特
徴とする液晶デイスプレイ。2. The tape carrier according to claim 1, wherein the tape carrier has a metal anchor pad at a position of the anchor hole, and the circuit board has a metal substrate pad at a position corresponding to the anchor hole. A liquid crystal display, wherein the anchor pad is soldered to the substrate pad. 【請求項３】請求項１において、上記テープ・キャリア
が接着剤により上記アンカー・ホールを介して上記回路
基板に固定されていることを特徴とする液晶デイスプレ
イ。3. The liquid crystal display according to claim 1, wherein the tape carrier is fixed to the circuit board through the anchor holes with an adhesive. 【請求項４】チップ装着位置を有する絶縁性フィルム・
テープと、上記チップ装着位置から上記テープの一方の
縁に延びるように上記テープ上に設けられ、上記一方の
縁において回路基板に接続されるための入力リードと、
上記チップ装着位置から上記テープの他方の縁に延びる
ように上記テープ上に設けられ、上記他方の縁において
液晶パネルのガラス基板の電極に接続されるための出力
リードとを有する液晶デイスプレイ・ドライバ・パッケ
ージ用テープ・キャリアにおいて、 上記入力リードおよび出力リードが形成されていない領
域であって、上記チップを跨ぐ位置に、上記テープ・キ
ャリアを上記回路基板に固定するための少なくとも１対
のアンカー・ホールを有することを特徴とする液晶ドラ
イバ・パッケージ用ＴＡＢテープ。4. An insulating film having a chip mounting position.
A tape, an input lead provided on the tape so as to extend from the chip mounting position to one edge of the tape, and an input lead for connecting to a circuit board at the one edge;
A liquid crystal display driver provided on the tape so as to extend from the chip mounting position to the other edge of the tape, and an output lead for connecting to the electrode of the glass substrate of the liquid crystal panel at the other edge. In the package tape carrier, at least one pair of anchor holes for fixing the tape carrier to the circuit board in a region where the input lead and the output lead are not formed and across the chip. A TAB tape for a liquid crystal driver package, which comprises: 【請求項５】請求項４において、上記テープ・キャリア
が上記アンカー・ホールの位置に金属のアンカー・パッ
ドを有し、上記回路基板にはんだ結合されるようになっ
ていることを特徴とする液晶ドライバ・パッケージ用テ
ープ・キャリア。5. The liquid crystal according to claim 4, wherein the tape carrier has a metal anchor pad at a position of the anchor hole and is soldered to the circuit board. Tape carrier for driver package.
JP5296442A 1993-11-26 1993-11-26 Liquid crystal display, connection method, thermal stress propagation prevention method Expired - Lifetime JP2732553B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP5296442A JP2732553B2 (en) 1993-11-26 1993-11-26 Liquid crystal display, connection method, thermal stress propagation prevention method
US08/345,109 US5572346A (en) 1993-11-26 1994-11-28 Tape carrier for LCD driver package with anchor holes on either side of and spaced 0.2 mm to 10 mm from the chip mounting site

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5296442A JP2732553B2 (en) 1993-11-26 1993-11-26 Liquid crystal display, connection method, thermal stress propagation prevention method

Publications (2)

Publication Number Publication Date
JPH07199207A true JPH07199207A (en) 1995-08-04
JP2732553B2 JP2732553B2 (en) 1998-03-30

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ID=17833598

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Country Status (2)

Country Link
US (1) US5572346A (en)
JP (1) JP2732553B2 (en)

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Also Published As

Publication number Publication date
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US5572346A (en) 1996-11-05

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