JPH06202136A - Liquid crystal device - Google Patents

Abstract

PURPOSE:To prevent a driving circuit and an electric wiring form being damaged and to improve reliability for a liquid crystal device by providing a removing part from which a film base material is removed between an inner lead an output side outer lead. CONSTITUTION:The removing parts 11 are provided at two places of the film base material between the inner lead 10 and the output side outer lead 6 of a zonal film carrier 5 on which the driving circuit 2 is loaded. Also, the outer lead 6 of the carrier 5 is connected electrically and mechanically to the electrode of a display device 1 with anisotropic conductive film, etc., and the input side outer lead 7 of the carrier 5 is connected electrically and mechanically to a bus substrate 3 by soldering, etc. In such a case, when impact or vibration is applied from the outside to a module, the carrier 5 receives stress by trying to displace the bus substrate 3, however, the stress can be relaxed by providing the removing part 11 of the film base material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal device in which a display device, a drive circuit unit and a unit substrate are connected by a file carrier, and more particularly to a liquid crystal device in which the connection is prevented from being damaged by vibration or shock from the outside.

[0002]

2. Description of the Related Art Conventionally, a display device is driven by an external drive circuit (drive circuit unit) or the like. FIG. 8 is a schematic diagram showing this state, 2 is a drive circuit, and 3 is a bus board (unit board) for supplying power and signals to the drive circuit 2. And these constitute a module and are fixed to the chassis 4 as shown in FIG. The bus substrate 3 is electrically and mechanically connected to the flexible film carrier 5 at the input side outer lead 7, and the display device 1 is electrically connected to the flexible film carrier 5 at the output side outer lead 6.
Is connected electrically and mechanically. The drive circuit 2 is mounted on the film carrier 5.

With this structure, when vibration or shock is applied to the module from the outside, the relative position between the display device 1 and the bus board 3 changes, and stress is applied to the input outer lead portion 7 and the output outer lead portion 6. It is becoming concentrated, causing disconnection. Therefore, as shown in FIG. 10, a method of forming a stepped forming portion 8 in a part of the input side outer lead 7 of the film carrier 5 to absorb the stress, or as shown in FIG. A method has been proposed in which a removed portion 9 of the film base material (insulating base material) is provided between the lead 10 and the output side outer lead 6, and the stress is absorbed by bending the removed portion 9 of the film base material (insulation base material).

[0004]

However, as shown in FIG.
In the method described in (1), since the display device 1 and the chassis 4 generally have different thermal expansion coefficients, when the large display device 1 is subjected to thermal shock, the relative position between the display device 1 and the bus board 3 is greatly changed, and the input There is a problem in that the amount of displacement may not be completely absorbed by only the stepped forming portion 8 formed in a part of the side outer lead 7.

In addition, in the method shown in FIG. 11, when the exposed copper foil is bent by providing the removed portion 9 on the film base material, cracks are likely to occur and the strength of the film carrier 5 is remarkably reduced, so that handling is very careful. There was a problem requiring attention.

Therefore, an object of the present invention is to provide a liquid crystal device having a film carrier which is strong against external stress and is easy to assemble.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and includes a display device for displaying information,
A liquid crystal device in which a drive circuit unit that drives the display device and a unit substrate that supplies power and signals to the drive circuit unit are connected by strip-shaped film carriers made of a conductor covered with an insulating base material. In the above, the first removing portion from which the insulating base material has been removed is provided in a part of the film carrier that connects the display device and the drive circuit unit to expose the conductor,
Absorbs external vibrations and shocks at the
It is characterized by

Further, a second removing portion, from which the insulating base material is removed, is provided in a part of the film carrier connecting the drive circuit unit and the unit substrate to expose the conductor, It absorbs vibrations and shocks from the outside.

Further, a connecting portion for connecting the drive circuit unit and the unit substrate with the film carrier is provided on a side portion of the strip-shaped film carrier.

Further, polyimide is applied to the first removed portion or the second removed portion, and the applied thickness of the polyimide is 3
It is from 0 μm to 40 μm.

Further, the first of the film carriers.
The exposed portion of the conductor or the second exposed portion is formed into a lightning bolt shape or a meandering shape to absorb vibrations and impacts applied from the outside.

[0012]

According to the above construction, the first and second removing portions from which the insulating base material is removed are provided in a part of the film carrier that connects the display device, the drive circuit unit and the unit substrate, and vibrations and impacts applied from the outside are provided. It absorbs the stress caused by and prevents the damage of the connection part.

[0013]

【Example】

<First Embodiment> A first embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic diagram in which an external drive circuit is mounted on the display device, and the drive circuit 2 is mounted on the film base material between the inner lead 10 and the output side outer lead 6 of the strip-shaped film carrier 5 at two positions. A removed portion 11 (first removed portion) that has been removed is provided. The removed portion 11 is formed at the initial stage of manufacturing the film carrier 5 by a punching die as in the formation of the device hole for mounting the drive circuit 2 and the input side outer lead 7 for soldering.
Further, it is formed by etching using photosensitive polyimide.

The output side outer leads 6 of the film carrier 5 are electrically and mechanically connected to the electrodes of the display device 1 by an anisotropic conductive film or the like, and the input side outer leads 7 of the film carrier 5 are bus substrates. 3 is electrically and mechanically connected by soldering or the like. The display device 1 is fixed to the chassis 4 by adhesion or the like, and the bus substrate 3 is semi-fixed to the chassis 4 by the method shown in FIG.

When an external impact or vibration is applied to the module constructed as described above, the film carrier 5 receives stress due to the displacement of the bus substrate 3, but as described above, the film base material is removed. By providing the portion 11, the stress can be relieved, and FIG.
Since the step-like forming portion 8 as in the conventional example shown in (3) is not provided, the bus board 3 is not excessively displaced. Therefore, damage to the drive circuit 2 and the electric wiring can be prevented.

Further, as shown in FIG. 3, the resinous polyimide 12 having a thickness of 30 μm or more and 40 μm or less is applied to the removed portion 11 of the film base material to enhance the ease of handling without impairing the stress relaxation effect. Is also possible. Further, as shown in FIG. 4, the copper foil 1 of the removed portion 11
The effect of stress relaxation can be further improved by forming 3 (conductor) in a lightning shape or a meandering shape. <Second Embodiment> A second embodiment of the present invention will be described with reference to the drawings.
FIG. 5 is a schematic diagram in which an external drive circuit is mounted on the display device. Two film base materials are removed between the inner lead 10 and the input outer lead 7 of the film carrier 5 having the drive circuit 2 mounted thereon. A removed portion 12 (second removed portion) is provided.

Also in the above structure, as in the first embodiment, the external stress can be relaxed and the drive circuit 2 and the electric wiring can be prevented from being damaged. <Third Embodiment> A third embodiment of the present invention will be described with reference to the drawings.
FIG. 6 is a schematic diagram in which an external drive circuit is mounted on the display device. The input side outer lead 7 of the film carrier 5 having the drive circuit 2 mounted thereon is perpendicular to the output side outer lead 6 and the bus substrate 3 in the lateral direction. Is formed in.

As a result, the film carrier 5 and the bus substrate 3 are firmly connected to each other, and the amount of displacement of the bus substrate 3 can be regulated. In particular, it is used in a large display device 1 having a diagonal of 20 inches or more. This is effective because the bus board 3 is large and heavy. <Fourth Embodiment> A fourth embodiment of the present invention will be described with reference to the drawings.
FIG. 7 is a schematic diagram in which an external drive circuit is mounted on the display device, and the fixing member 13 bridges the display device 1 and the bus substrate 3 by adhesion or the like. As a result, the bus board 3
Are fixed to the display device 1 in the plane direction of the bus substrate 3.

When an external impact or vibration is applied to the module constructed as described above, the bus board 3 is not easily displaced in the X and Y directions shown in FIG. 7, but is displaced in the Q direction (rotational direction). It tends to be easy to do. At this time, by providing the removed portion 11 on the film carrier 5, it is possible to maintain the flexibility of the film carrier 5 with respect to the displacement in the θ direction and prevent the drive circuit 2 and the electric wiring from being damaged.

[0020]

As described above, according to the present invention, the removal portion for removing the film base material is provided between the inner lead and the output outer lead or between the inner lead and the input outer lead. As a result, the stress applied to the film carrier due to external shocks and vibrations can be relaxed and damage to the drive circuit and electrical wiring can be prevented. Therefore, the reliability of the liquid crystal device is significantly improved.

[Brief description of drawings]

FIG. 1 is a diagram showing a state in which a removed portion is provided on a film carrier applied to the description of Embodiment 1 of the present invention.

FIG. 2 is a diagram showing the mounting of the bus board applied to the description of the first embodiment of the present invention.

FIG. 3 is a diagram showing a state in which polyimide is applied to a removed portion applied to the description of the first embodiment of the present invention.

FIG. 4 is a diagram showing the shape of a copper foil applied to the description of the first embodiment of the present invention.

FIG. 5 is a diagram showing a state in which a removed portion is provided on a film carrier applied to the description of Embodiment 2 of the present invention.

FIG. 6 is a diagram showing a connection between a film carrier and a bus substrate applied to the description of the third embodiment of the present invention.

FIG. 7 is a schematic diagram showing a connection of a display device, a drive circuit, and a bus substrate applied to the description of Example 4 of the present invention.

FIG. 8 is a diagram showing a connection of a display device, a drive circuit, and a bus substrate applied to the description of the conventional technique.

FIG. 9 is a cross-sectional view showing a connection of a display device, a drive circuit, and a bus substrate applied to the description of the conventional technique.

FIG. 10 is a cross-sectional view showing a connection between a display device, a drive circuit, and a bus substrate applied to the description of the conventional technique.

FIG. 11 is a cross-sectional view showing a connection of a display device, a drive circuit, and a bus substrate applied to the description of the conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 display device 2 drive circuit (drive circuit unit) 3 bus substrate (unit substrate) 5 film carrier 11 removed portion (first removed portion) 12 removed portion (second removed portion) 13 copper foil (conductor)

 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Toshiaki Itazawa 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Hiroshi Takabayashi 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Within the corporation

Claims (5)

[Claims] 1. A conductor for which a display device for displaying information, a drive circuit unit for driving the display device, and a unit substrate for supplying power and signals to the drive circuit unit are covered with an insulating base material. A liquid crystal device connected by strip-shaped film carriers, wherein the insulating base material is removed from a part of the film carrier that connects the display device and the drive circuit unit.
Is provided to expose the conductor, and vibrations and shocks applied from the outside by the first removal unit are absorbed. 2. A second removing portion, from which the insulating base material is removed, is provided in a part of the film carrier connecting the drive circuit unit and the unit substrate to expose the conductor, The liquid crystal device according to claim 1, wherein the removing section absorbs vibrations and impacts applied from the outside. 3. The liquid crystal device according to claim 1, wherein a connection portion for connecting the drive circuit unit and the unit substrate with the film carrier is provided on a side portion of the strip-shaped film carrier. 4. The liquid crystal device according to claim 1, wherein a polyimide is applied to the first removal portion or the second removal portion, and a coating thickness of the polyimide is 30 μm or more and 40 μm or less. 5. The conductor exposed in the first removing portion or the second removing portion of the film carrier is formed into a lightning bolt shape or a meandering shape to absorb vibration and impact applied from the outside. 3. The liquid crystal device according to 1 or 2.