JP2745709B2 - Flexible printed wiring board - Google Patents
Flexible printed wiring boardInfo
- Publication number
- JP2745709B2 JP2745709B2 JP1215344A JP21534489A JP2745709B2 JP 2745709 B2 JP2745709 B2 JP 2745709B2 JP 1215344 A JP1215344 A JP 1215344A JP 21534489 A JP21534489 A JP 21534489A JP 2745709 B2 JP2745709 B2 JP 2745709B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- flexible printed
- film
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はフレキシブルプリント配線板に関し、特にそ
の接続部の強化構造に関する。Description: TECHNICAL FIELD The present invention relates to a flexible printed wiring board, and more particularly to a strengthened structure of a connection portion thereof.
［従来の技術］ フレキシブルプリント配線板は、ポリエステルあるい
はポリイミド等の絶縁樹脂フィルム間に銅の導体膜を挟
んだもので、薄くかつ曲げ易いため、プリント配線板間
の回路接続等の用途に多用されている。[Prior art] Flexible printed wiring boards are obtained by sandwiching a copper conductive film between insulating resin films such as polyester or polyimide, and are thin and easily bent, and thus are often used for applications such as circuit connection between printed wiring boards. ing.
例えば第８図に示す如く、表示器Ｄとその直下に設け
た制御回路プリント配線板Ｐとをフレキシブルプリント
配線板１で接続する。この場合、フレキシブルプリント
配線板１と制御回路プリント配線板Ｐとはコネクタ４に
より接続され、表示器Ｄとは半田Ｓにより接続される。
すなわち、第９図において、フレキシブルプリント配線
板１の一端部ではベースフィルム12上の導体膜11がカバ
ーフィルム13より露出せしめてあり、表示器Ｄより突出
するリード電極３に、上記露出した導体膜11を半田付け
接続してある。For example, as shown in FIG. 8, a display D is connected to a control circuit printed wiring board P provided immediately below the display D by a flexible printed wiring board 1. In this case, the flexible printed wiring board 1 and the control circuit printed wiring board P are connected by the connector 4 and the display D is connected by the solder S.
That is, in FIG. 9, at one end of the flexible printed wiring board 1, the conductor film 11 on the base film 12 is exposed from the cover film 13, and the lead electrode 3 protruding from the display D is connected to the exposed conductor film. 11 is connected by soldering.
［発明が解決しようとする課題］ 上記構造において、フレキシブルプリント配線板１は
その柔軟性故に、半田付けによりリード電極３に強固に
固定される一端部から、第10図に示す如く、かなり大き
な曲率で下方へ屈曲し、特に半田付け部との境界ａ付近
で導体膜11に応力が集中して亀裂断線が生じ易いおそれ
があった。[Problems to be Solved by the Invention] In the above structure, the flexible printed wiring board 1 has a considerably large curvature from one end portion which is firmly fixed to the lead electrode 3 by soldering, as shown in FIG. In this case, stress may concentrate on the conductor film 11 near the boundary a with the soldered portion, and cracks may be easily broken.
本発明はかかる課題を解決するもので、半田接続部に
おいて断線を生じるおそれがないフレキシブルプリント
配線板を提供することを目的とする。An object of the present invention is to solve such a problem and to provide a flexible printed wiring board in which there is no possibility of disconnection at a solder connection portion.
［課題を解決するための手段］ 本発明の構成を説明すると、ベースフィルム12上にカ
バーフィルム13で覆って導体膜11を形成し、カバーフィ
ルム13より露出せしめた上記導体膜11の一端部を、電子
機器Ｄのリード電極３に半田Ｓ付け接続してなるフレキ
シブルプリント配線板１は、半田付け部との境界ａを含
むベースフィルム12表面に対応するその裏面に、ベース
フィルム12よりも曲げ剛性の大きい弾性支持板２を接合
し、かつ弾性支持板２のカバーフィルム13側の端部に、
端縁に沿って複数の肉抜き部21を形成したものである。[Means for Solving the Problems] To explain the configuration of the present invention, a conductor film 11 is formed by covering a base film 12 with a cover film 13, and one end of the conductor film 11 exposed from the cover film 13 is The flexible printed wiring board 1 connected to the lead electrode 3 of the electronic device D by soldering S has a flexural rigidity higher than that of the base film 12 on the back surface corresponding to the surface of the base film 12 including the boundary a with the soldering portion. Large elastic support plate 2 and, at the end of the elastic support plate 2 on the cover film 13 side,
A plurality of lightening portions 21 are formed along the edge.
［作用］ 上記構成のフレキシブルプリント配線板において、配
線時に該プリント配線板１に大きな曲げ力が作用して
も、ベースフィルム12裏面に上記支持板２が接合してあ
るから、半田Ｓ付け部との境界ａを含む領域で配線時に
おけるプリント配線板１の曲率は十分小さな値となる。
したがって、半田接続部付近の導体膜11に発生する応力
は小さなものとなる。しかも弾性支持板２のカバーフィ
ルム13側の端部が、肉抜き部21を形成したことにより曲
げ剛性が適度に低下し、応力の集中が緩和する。かくし
て断線は効果的に防止される。[Operation] In the flexible printed wiring board having the above configuration, even if a large bending force is applied to the printed wiring board 1 during wiring, the support plate 2 is bonded to the back surface of the base film 12, so that the solder S attaching portion In the region including the boundary a, the curvature of the printed wiring board 1 at the time of wiring has a sufficiently small value.
Therefore, the stress generated in the conductor film 11 near the solder connection becomes small. In addition, since the end portion of the elastic support plate 2 on the cover film 13 side has the lightening portion 21, the bending rigidity is appropriately reduced, and the concentration of stress is reduced. Thus, disconnection is effectively prevented.
［第１実施例］ 第２図において、Ｄは表示器であり、上面が表示面と
なっている。表示器Ｄの下方には制御回路を形成したプ
リント配線板Ｐが一体に設けてあり、かかる表示器Ｄと
プリント配線板Ｐ間をフレキシブルプリント配線板１で
接続してある。すなわち、プリント配線板Ｐには下面の
側縁にコネクタ４が設けてあり、上記フレキシブルプリ
ント配線板１は一端のコネクタ接続部14（第３図）を上
記コネクタ４に挿入接続し、他端は表示器Ｄの側面に多
数突設された金属リード電極３に半田Ｓ付けにより接続
してある。First Embodiment In FIG. 2, D is a display, and the upper surface is a display surface. A printed wiring board P on which a control circuit is formed is integrally provided below the display D, and the display D and the printed wiring board P are connected by a flexible printed wiring board 1. That is, the printed wiring board P is provided with a connector 4 on the side edge of the lower surface, and the flexible printed wiring board 1 has a connector connection portion 14 (FIG. 3) at one end inserted and connected to the connector 4 and the other end connected to the other end. It is connected by soldering S to a number of metal lead electrodes 3 projecting from the side surface of the display D.
フレキシブルプリント配線板１は、第１図に示す如
く、ポリエステルやポリイミド等の絶縁性樹脂よりなる
ベースフィルム12上に必要数のリード導体膜11を形成
し、これら導体膜11を上記ベースフィルム12と同質のカ
バーフィルム13で覆ったものである。このカバーフィル
ム13はフレキシブルプリント配線板１の両端部には形成
されておらず、この部分で導体膜11は露出している。As shown in FIG. 1, the flexible printed wiring board 1 has a required number of lead conductor films 11 formed on a base film 12 made of an insulating resin such as polyester or polyimide. It is covered with a cover film 13 of the same quality. The cover film 13 is not formed on both ends of the flexible printed wiring board 1, and the conductor film 11 is exposed at this portion.
フレキシブルプリント配線板１は、表示器Ｄ側の端部
で、露出した上記導体膜11を上記金属リード電極３に直
接半田Ｓ付け接続してあり（第１図）、上記端部のベー
スフィルム12裏面には、支持板２が接合してある。支持
板２は上記ベースフィルム12等と同様、ポリエステル等
の樹脂材よりなり、その肉厚はベースフィルム12等の厚
みに比して十分に厚く、大きな曲げ剛性を有している。
そして、その接合範囲は、ベースフィルム12の端面よ
り、半田Ｓ付け部の境界ａに対応する裏面部を越えて延
びている。支持板２には、第４図に示すように、半田Ｓ
付け部の境界ａよりもカバーフィルム13側へ離れた端部
に、端縁に沿って等間隔で長穴21が形成してある。In the flexible printed wiring board 1, the exposed conductor film 11 is directly connected to the metal lead electrode 3 by solder S at the end on the display D side (FIG. 1), and the base film 12 at the end is provided. The support plate 2 is joined to the back surface. The support plate 2 is made of a resin material such as polyester similarly to the base film 12 and the like, and has a sufficiently large thickness compared to the thickness of the base film 12 and the like, and has a large bending rigidity.
Then, the joining range extends from the end surface of the base film 12 beyond the back surface corresponding to the boundary a of the solder S attachment portion. As shown in FIG. 4, the support plate 2 has a solder S
Elongated holes 21 are formed at equal intervals along the edge at the end portion that is further away from the boundary a of the attachment portion toward the cover film 13 side.
かかる構造において、フレキシブルプリント配線板１
は、上記端部を半田Ｓで固定した後、第２図に示す如
く、略楕円形状に湾曲せしめられて他方の端部がコネク
タ４に接続される。ここにおいて、上記境界部ａは、曲
げ剛性の大きい支持板２によりその曲率が過大となるこ
とが防止され、この部分への応力集中が分散される。ま
た支持板２は長穴21を形成した部分で曲げ剛性が適度に
低下し、配線時には、第５図に示す如く、上記境界ａよ
り離れた長穴形成部が適度な曲率で湾曲する。これによ
り、導体膜11の断線は効果的に防止される。In such a structure, the flexible printed wiring board 1
After the above-mentioned ends are fixed with the solder S, they are bent into a substantially elliptical shape as shown in FIG. Here, the boundary portion a is prevented from having an excessive curvature by the support plate 2 having high bending rigidity, and stress concentration on this portion is dispersed. The bending rigidity of the support plate 2 at the portion where the elongated hole 21 is formed is appropriately reduced, and at the time of wiring, as shown in FIG. 5, the elongated hole forming portion apart from the boundary a is curved with an appropriate curvature. Thereby, disconnection of the conductor film 11 is effectively prevented.
［第２実施例］ 第６図および第７図において、支持板２は先端側縁が
波形22に成形してあり、この部分で曲げ剛性が適度に低
下している。しかして、配線時には、支持板２が波形成
形部で適度な曲率を有して湾曲し、これにより導体膜11
の断線が防止される。[Second Embodiment] In FIGS. 6 and 7, the support plate 2 has a tip side edge formed into a corrugated shape 22, and the bending rigidity is appropriately reduced at this portion. Thus, at the time of wiring, the support plate 2 is curved with an appropriate curvature at the corrugated portion, whereby the conductor film 11 is bent.
Disconnection is prevented.
［発明の効果］ 以上の如く、本発明のフレキシブルプリント配線板
は、配線時に、半田付け接続部付近で応力集中が緩和さ
れて曲率が過大となることがなく、したがって導体膜の
断線を効果的に防止することができる。しかも、ベース
フィルムの裏面に、単層の支持板を設けるだけでよいか
ら対費用効果が優れている。[Effects of the Invention] As described above, in the flexible printed wiring board of the present invention, during wiring, the stress concentration is reduced near the soldered connection portion, and the curvature does not become excessively large. Can be prevented. In addition, since it is only necessary to provide a single-layer support plate on the back surface of the base film, cost effectiveness is excellent.
第１図ないし第５図は本発明の第１実施例を示し、第１
図は半田接続部の拡大断面図、第２図はフレキシブルプ
リント配線板の配線状態を示す側面図、第３図はフレキ
シブルプリント配線板の概略斜視図、第４図はフレキシ
ブルプリント配線板の下面図、第５図は半田接続部の別
の拡大断面図、第６図および第７図は本発明の第２実施
例を示し、第６図はフレキシブルプリント配線板の部分
断面側面図、第７図はその平面図で、第６図のＢ矢視
図、第８図ないし第10図は従来例を示し、第８図はフレ
キシブルプリント配線板の配線状態を示す側面図、第９
図および第10図は半田接続部の拡大断面図である。 １……フレキシブルプリント配線板 11……導体膜 12……ベースフィルム 13……カバーフィルム ２……支持板 21……長穴 22……波形 23、24……板材 ３……リード電極 ４……コネクタ ａ……境界 Ｄ……表示器（電子機器） Ｐ……プリント配線板 Ｓ……半田1 to 5 show a first embodiment of the present invention.
FIG. 2 is an enlarged cross-sectional view of the solder connection portion, FIG. 2 is a side view showing a wiring state of the flexible printed wiring board, FIG. 3 is a schematic perspective view of the flexible printed wiring board, and FIG. , FIG. 5 is another enlarged sectional view of the solder connection portion, FIGS. 6 and 7 show a second embodiment of the present invention, FIG. 6 is a partial sectional side view of a flexible printed wiring board, FIG. 6 is a plan view thereof, as viewed in the direction of arrow B in FIG. 6, FIGS. 8 to 10 show a conventional example, FIG. 8 is a side view showing a wiring state of the flexible printed wiring board, and FIG.
FIG. 10 and FIG. 10 are enlarged sectional views of the solder connection portion. DESCRIPTION OF SYMBOLS 1 ... Flexible printed wiring board 11 ... Conductive film 12 ... Base film 13 ... Cover film 2 ... Support plate 21 ... Long hole 22 ... Waveform 23, 24 ... Plate material 3 ... Lead electrode 4 ... Connector a: Boundary D: Display (electronic device) P: Printed wiring board S: Solder
───────────────────────────────────────────────────── フロントページの続き (72)発明者 長谷川 淳一 愛知県刈谷市昭和町１丁目１番地 日本 電装株式会社内 (72)発明者 蒔田 和秀 愛知県刈谷市昭和町１丁目１番地 日本 電装株式会社内 (56)参考文献 実開 昭63−172164（ＪＰ，Ｕ) 実開 昭63−162559（ＪＰ，Ｕ) 実開 昭61−63862（ＪＰ，Ｕ) ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Junichi Hasegawa 1-1-1, Showa-cho, Kariya-shi, Aichi Japan Inside Denso Corporation (72) Inventor Kazuhide Makita 1-1-1, Showa-cho, Kariya-shi, Aichi Japan Japan Denso Stock In-house (56) References JP-A 63-172164 (JP, U) JP-A 63-162559 (JP, U) JP-A 61-63862 (JP, U)
Claims (1)
て導体膜を形成し、カバーフィルムより露出せしめた上
記導体膜の一端部を、電子機器のリード電極に半田接続
してなるフレキシブルプリント配線板において、半田付
け部との境界を含むベースフィルム表面に対応するその
裏面にベースフィルムよりも曲げ剛性の大きい弾性支持
板を接合し、かつ弾性支持板のカバーフィルム側の端部
に、端縁に沿って複数の肉抜き部を形成したことを特徴
とするフレキシブルプリント配線板。1. A flexible printed wiring board comprising: a conductive film formed on a base film by covering the cover film with a cover film; and one end of the conductive film exposed from the cover film is soldered to a lead electrode of an electronic device. An elastic support plate having a greater bending rigidity than the base film is bonded to the back surface corresponding to the base film surface including the boundary with the soldering portion, and the end of the elastic support plate on the cover film side, along the edge. A flexible printed wiring board characterized by forming a plurality of lightening portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1215344A JP2745709B2 (en) | 1989-08-22 | 1989-08-22 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1215344A JP2745709B2 (en) | 1989-08-22 | 1989-08-22 | Flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0378286A JPH0378286A (en) | 1991-04-03 |
| JP2745709B2 true JP2745709B2 (en) | 1998-04-28 |
Family
ID=16670747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1215344A Expired - Lifetime JP2745709B2 (en) | 1989-08-22 | 1989-08-22 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2745709B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3579649B2 (en) * | 2000-11-21 | 2004-10-20 | ペンタックス株式会社 | Ultrasound endoscope |
| JP2003069164A (en) * | 2001-08-22 | 2003-03-07 | Nitto Denko Corp | Flexible wiring circuit board for flat panel display |
| JP2003198070A (en) * | 2001-12-26 | 2003-07-11 | Iwaki Electronics Corp | Flexible printed wiring board |
| JP2004090481A (en) * | 2002-08-30 | 2004-03-25 | Konica Minolta Holdings Inc | Flexible wiring board and inkjet head comprising it |
| JP4209762B2 (en) * | 2003-12-12 | 2009-01-14 | パナソニック株式会社 | Imaging device |
| JP6253541B2 (en) * | 2014-07-30 | 2017-12-27 | 株式会社ジャパンディスプレイ | Display device |
| JP6804243B2 (en) * | 2016-09-08 | 2020-12-23 | 株式会社ジャパンディスプレイ | Display device |
| KR101740006B1 (en) * | 2016-11-23 | 2017-06-09 | 지스마트 주식회사 | Flexible circuit board for transparent display board improved durability and the assembling method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0223001Y2 (en) * | 1984-09-29 | 1990-06-21 | ||
| JPS63162559U (en) * | 1987-04-14 | 1988-10-24 | ||
| JPS63172164U (en) * | 1987-04-28 | 1988-11-09 |
-
1989
- 1989-08-22 JP JP1215344A patent/JP2745709B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0378286A (en) | 1991-04-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100213 Year of fee payment: 12 |