JP2003198070A - Flexible printed wiring board - Google Patents
Flexible printed wiring boardInfo
- Publication number
- JP2003198070A JP2003198070A JP2001393613A JP2001393613A JP2003198070A JP 2003198070 A JP2003198070 A JP 2003198070A JP 2001393613 A JP2001393613 A JP 2001393613A JP 2001393613 A JP2001393613 A JP 2001393613A JP 2003198070 A JP2003198070 A JP 2003198070A
- Authority
- JP
- Japan
- Prior art keywords
- side end
- wiring board
- printed wiring
- flexible printed
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プラズマディスプ
レイパネル（ＰＤＰ）や液晶パネルなどの電子機器に組
み込まれるフレキシブルプリント配線板（ＦＰＣ）に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed wiring board (FPC) incorporated in electronic equipment such as a plasma display panel (PDP) and a liquid crystal panel.
【０００２】[0002]
【従来の技術】従来この種のフレキシブルプリント配線
板としては、ベース基材の表面に導体パターンを形成
し、この導体パターンをその入力側端部および出力側端
部を残してカバーフィルムで被覆し、この導体パターン
の出力側端部に表面処理を施したものが広く用いられて
いる。そして、このフレキシブルプリント配線板をプラ
ズマディスプレイパネルなどの電子機器に組み込む際に
は、フレキシブルプリント配線板の導体パターンを電子
機器の導体パターンに貼り合わせてＡＣＦ接続（異方性
導電フィルムによる接続）することが多い。2. Description of the Related Art Conventionally, as a flexible printed wiring board of this type, a conductor pattern is formed on the surface of a base material, and the conductor pattern is covered with a cover film leaving its input side end and output side end. The conductor pattern whose output side end is surface-treated is widely used. When the flexible printed wiring board is incorporated in an electronic device such as a plasma display panel, the conductor pattern of the flexible printed wiring board is attached to the conductor pattern of the electronic device to perform ACF connection (connection by anisotropic conductive film). Often.
【０００３】[0003]
【発明が解決しようとする課題】しかし、これでは、フ
レキシブルプリント配線板がその可撓性（フレキシビリ
ティ）を確保すべく薄く形成されていることから、次の
ような不都合があった。However, in this case, since the flexible printed wiring board is formed thin so as to ensure its flexibility, there are the following disadvantages.
【０００４】第１に、導体パターンの出力側端部にうね
り、反りが生じやすく、寸法精度および貼り合わせ精度
が低下してしまう。第２に、導体パターンの出力側端部
のコーナーがカールすることにより、位置合わせ用のア
ライメントマークが隠れてしまい、電子機器とのＡＣＦ
接続が困難となる。First, waviness and warp are likely to occur at the output side end of the conductor pattern, and the dimensional accuracy and the bonding accuracy are reduced. Secondly, the curl of the corner of the output side end of the conductor pattern hides the alignment mark for alignment, and the ACF with the electronic device is hidden.
Connection becomes difficult.
【０００５】本発明は、このような事情に鑑み、寸法精
度および貼り合わせ精度の低下を防ぐと同時に、アライ
メントマークの認識性を確保して電子機器に容易にＡＣ
Ｆ接続することが可能なフレキシブルプリント配線板を
提供することを目的とする。In view of such circumstances, the present invention prevents deterioration of the dimensional accuracy and the bonding accuracy and at the same time secures the recognizability of the alignment mark and facilitates the AC operation in electronic equipment.
An object of the present invention is to provide a flexible printed wiring board that can be F-connected.
【０００６】[0006]
【課題を解決するための手段】まず、本発明のうち請求
項１に係る発明は、ベース基材（２）の表面に導体パタ
ーン（３）を形成し、この導体パターンをその入力側端
部（３ａ）および出力側端部（３ｂ）を残してカバーフ
ィルム（６）で被覆し、この導体パターンの出力側端部
に表面処理を施したフレキシブルプリント配線板（１）
において、少なくとも前記導体パターンの出力側端部の
裏側に補強フィルム（１１）を貼設して構成される。First, in the invention according to claim 1 of the present invention, a conductor pattern (3) is formed on the surface of a base material (2), and the conductor pattern is formed on the input side end portion thereof. (3a) and the output side end (3b) are left to be covered with a cover film (6), and the output side end of this conductor pattern is surface-treated on a flexible printed wiring board (1).
In, a reinforcing film (11) is attached to at least the back side of the output side end of the conductor pattern.
【０００７】こうした構成を採用することにより、導体
パターンの出力側端部の剛性が向上し、この出力側端部
にうねり、反りが生じにくくなるように作用する。By adopting such a structure, the rigidity of the output side end of the conductor pattern is improved, and the output side end is prevented from waviness and warpage.
【０００８】また、本発明のうち請求項２に係る発明
は、上記補強フィルム（１１）の貼設に熱硬化型接着剤
（１０）を用いて構成される。かかる構成により、フレ
キシブルプリント配線板をガラスパネルにＡＣＦ接続す
べく異方性導電フィルム（１５）で熱圧着するとき、そ
の圧着力が熱硬化型接着剤を介して異方性導電フィルム
側に十分に伝わるように作用する。In the invention according to claim 2 of the present invention, a thermosetting adhesive (10) is used to attach the reinforcing film (11). With this configuration, when the flexible printed wiring board is thermocompression-bonded with the anisotropic conductive film (15) for ACF connection to the glass panel, the pressure bonding force is sufficient on the anisotropic conductive film side via the thermosetting adhesive. Acts to be transmitted to.
【０００９】また、本発明のうち請求項３に係る発明
は、上記補強フィルム（１１）として透明なものを用い
て構成される。ここで、「透明」は半透明も含む広義の
概念である。かかる構成により、補強フィルム側から導
体パターンおよびアライメントマークを透視することが
可能となり、補強フィルムの貼設に起因して熱圧着時の
位置合わせに支障を来すことがなくなるように作用す
る。The invention according to claim 3 of the present invention is constructed by using a transparent reinforcing film (11). Here, "transparent" is a broad concept including translucency. With this configuration, the conductor pattern and the alignment mark can be seen through from the reinforcing film side, and the bonding of the reinforcing film does not hinder the alignment during thermocompression bonding.
【００１０】また、本発明のうち請求項４に係る発明
は、上記補強フィルム（１１）の熱膨張係数を上記ベー
ス基材（２）の熱膨張係数に合致させて構成される。か
かる構成により、各種の熱工程においてフレキシブルプ
リント配線板が熱膨張しても反りを伴わなくなるように
作用する。In the invention according to claim 4 of the present invention, the coefficient of thermal expansion of the reinforcing film (11) is made to match the coefficient of thermal expansion of the base material (2). With such a configuration, the flexible printed wiring board does not warp even when it is thermally expanded in various thermal processes.
【００１１】さらに、本発明のうち請求項５に係る発明
は、上記補強フィルム（１１）の貼設幅（Ｗ１）を上記
導体パターン（３）の出力側端部（３ｂ）の露呈幅（Ｗ
２）より大きくして構成される。かかる構成により、フ
レキシブルプリント配線板の取扱い中に導体パターンの
出力側端部の露呈基部が応力集中によって切断する事態
の発生を抑制できるようになる。Further, in the invention according to claim 5 of the present invention, the adhering width (W1) of the reinforcing film (11) is the exposed width (W) of the output side end portion (3b) of the conductor pattern (3).
2) It is made larger. With this configuration, it is possible to suppress the occurrence of a situation where the exposed base portion of the output side end portion of the conductor pattern is cut due to stress concentration during handling of the flexible printed wiring board.
【００１２】なお、括弧内の符号は図面において対応す
る要素を表す便宜的なものであり、したがって、本発明
は図面上の記載に限定拘束されるものではない。このこ
とは「特許請求の範囲」の欄についても同様である。Note that the reference numerals in parentheses are for convenience of representing corresponding elements in the drawings, and therefore the present invention is not limited to the description in the drawings. This also applies to the "Claims" section.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて説明する。図１は本発明に係るフレキシブルプ
リント配線板の一実施形態を示す図であって、（ａ）は
その平面図、（ｂ）は（ａ）のＢ−Ｂ線による断面図、
図２は図１に示すフレキシブルプリント配線板をガラス
パネルにＡＣＦ接続するときの様子を示す正面図、図３
は図１に示すフレキシブルプリント配線板の導体パター
ンとガラスパネルの導体パターンとの位置合わせ方法を
示す平面図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1A and 1B are views showing an embodiment of a flexible printed wiring board according to the present invention, in which FIG. 1A is a plan view thereof, FIG. 1B is a sectional view taken along line BB of FIG.
2 is a front view showing a state in which the flexible printed wiring board shown in FIG. 1 is ACF-connected to a glass panel, FIG.
FIG. 2 is a plan view showing a method of aligning the conductor pattern of the flexible printed wiring board shown in FIG. 1 with the conductor pattern of the glass panel.
【００１４】このフレキシブルプリント配線板１は、図
１に示すように、ポリイミド系の合成樹脂からなる電気
絶縁性のベース基材２を有しており、ベース基材２の表
面には銅箔からなる複数の細長い導体パターン３が互い
に所定の間隔を置いて形成されている。これら導体パタ
ーン３の上側には、その入力側端部３ａおよび出力側端
部３ｂを除き、ポリイミド系の合成樹脂からなる電気絶
縁性のカバーフィルム６が接着層５を介して貼設されて
おり、入力側端部３ａ、出力側端部３ｂはそれぞれニッ
ケル層７および金層９で二重に表面処理が施されてい
る。さらに、導体パターン３の出力側端部３ｂの裏側に
はポリイミド系の合成樹脂からなる透明な補強フィルム
１１がエポキシ樹脂などの熱硬化型接着剤１０を介して
貼設されている。ここで、補強フィルム１１の貼設幅Ｗ
１は導体パターン３の出力側端部３ｂの露呈幅Ｗ２より
１〜３ｍｍほど大きくなっている。なお、導体パターン
３の出力側端部３ｂの両端にはそれぞれ、図１（ａ）に
示すように、位置合わせ用のアライメントマーク１２が
付設されている。As shown in FIG. 1, this flexible printed wiring board 1 has an electrically insulating base material 2 made of a polyimide-based synthetic resin, and the surface of the base material 2 is made of copper foil. A plurality of elongated conductor patterns 3 are formed at a predetermined interval from each other. An electrically insulating cover film 6 made of a polyimide-based synthetic resin is pasted on the upper side of these conductor patterns 3 except for the input side end 3a and the output side end 3b via an adhesive layer 5. The input side end 3a and the output side end 3b are doubly surface-treated with the nickel layer 7 and the gold layer 9, respectively. Further, a transparent reinforcing film 11 made of a polyimide-based synthetic resin is attached to the back side of the output side end 3b of the conductor pattern 3 via a thermosetting adhesive 10 such as an epoxy resin. Here, the attachment width W of the reinforcing film 11
1 is larger than the exposed width W2 of the output side end 3b of the conductor pattern 3 by about 1 to 3 mm. In addition, as shown in FIG. 1A, alignment marks 12 for alignment are attached to both ends of the output side end 3b of the conductor pattern 3, respectively.
【００１５】フレキシブルプリント配線板１は以上のよ
うな構成を有するので、このフレキシブルプリント配線
板１をプラズマディスプレイパネルなどの電子機器に組
み込む際には、図２に示すように、その電子機器のガラ
スパネル１３にフレキシブルプリント配線板１をＡＣＦ
接続する。すなわち、ガラスパネル１３の導体パターン
１４とフレキシブルプリント配線板１の導体パターン３
の出力側端部３ｂとの間に異方性導電フィルム１５を挟
み込み、図３に示すように、フレキシブルプリント配線
板１の各アライメントマーク１２をガラスパネル１３の
各アライメントマーク１７に合わせた後、熱圧着治具１
６でフレキシブルプリント配線板１をガラスパネル１３
側に押圧して熱圧着する。Since the flexible printed wiring board 1 has the above-mentioned structure, when the flexible printed wiring board 1 is incorporated into an electronic device such as a plasma display panel, as shown in FIG. 2, the glass of the electronic device is used. The flexible printed wiring board 1 is ACF mounted on the panel 13.
Connecting. That is, the conductor pattern 14 of the glass panel 13 and the conductor pattern 3 of the flexible printed wiring board 1
The anisotropic conductive film 15 is sandwiched between the output side end 3b of the above and the alignment marks 12 of the flexible printed wiring board 1 are aligned with the alignment marks 17 of the glass panel 13 as shown in FIG. Thermocompression bonding jig 1
6 and the flexible printed wiring board 1 to the glass panel 13
Press to the side and perform thermocompression bonding.
【００１６】このとき、フレキシブルプリント配線板１
の導体パターン３の出力側端部３ｂの裏側には補強フィ
ルム１１が設けられているので、この出力側端部３ｂは
高い剛性を持っている。そのため、導体パターン３の出
力側端部３ｂにうねり、反りが生じにくくなり、寸法精
度および貼り合わせ精度の低下を防ぐことができるとと
もに、フレキシブルプリント配線板１の導体パターン３
の出力側端部３ｂのコーナーがカールしてアライメント
マーク１２が隠れる事態は生じにくくなるので、ガラス
パネル１３との貼り合わせを支障なく行うことが可能と
なる。At this time, the flexible printed wiring board 1
Since the reinforcing film 11 is provided on the back side of the output side end 3b of the conductor pattern 3, the output side end 3b has high rigidity. Therefore, the output side end portion 3b of the conductor pattern 3 is less likely to be undulated or warped, and it is possible to prevent a decrease in dimensional accuracy and bonding accuracy, and at the same time, to form the conductor pattern 3 of the flexible printed wiring board 1.
Since it is unlikely that the corner of the output side end portion 3b of the optical disc curls and the alignment mark 12 is hidden, the bonding with the glass panel 13 can be performed without any trouble.
【００１７】しかも、補強フィルム１１は熱硬化型接着
剤１０を介して導体パターン３の出力側端部３ｂの裏側
に貼設されているので、フレキシブルプリント配線板１
を異方性導電フィルム１５でガラスパネル１３に熱圧着
するとき、その圧着力が熱硬化型接着剤１０を介して異
方性導電フィルム１５側に十分に伝わることとなるた
め、ＡＣＦ接続を確実に実施して歩留まりを向上させる
ことができる。Moreover, since the reinforcing film 11 is attached to the back side of the output side end 3b of the conductor pattern 3 via the thermosetting adhesive 10, the flexible printed wiring board 1
When thermocompression bonding is performed on the glass panel 13 with the anisotropic conductive film 15, the pressure bonding force is sufficiently transmitted to the anisotropic conductive film 15 side through the thermosetting adhesive 10, so that the ACF connection is ensured. Can be carried out to improve the yield.
【００１８】また、補強フィルム１１は透明であるた
め、補強フィルム１１側から導体パターン３およびアラ
イメントマーク１２を透視することが可能となり、補強
フィルム１１を貼設したからといって熱圧着時の光学的
な位置合わせに支障を来すことはない。Further, since the reinforcing film 11 is transparent, it is possible to see through the conductor pattern 3 and the alignment mark 12 from the reinforcing film 11 side. It does not hinder the automatic alignment.
【００１９】さらに、補強フィルム１１とベース基材２
の材質は同一であり、補強フィルム１１の熱膨張係数は
ベース基材２の熱膨張係数に合致しているので、各種の
熱工程においてフレキシブルプリント配線板１が熱膨張
しても反りを伴う恐れはない。Further, the reinforcing film 11 and the base material 2
Since the same material is used, and the coefficient of thermal expansion of the reinforcing film 11 matches the coefficient of thermal expansion of the base material 2, there is a possibility that the flexible printed wiring board 1 may be warped even when it is thermally expanded in various thermal processes. There is no.
【００２０】その上、補強フィルム１１の貼設幅Ｗ１は
導体パターン３の出力側端部３ｂの露呈幅Ｗ２より大き
いので、フレキシブルプリント配線板１の取扱い中に導
体パターン３の出力側端部３ｂの露呈基部が応力集中に
よって切断する事態も発生しない。Moreover, since the adhering width W1 of the reinforcing film 11 is larger than the exposed width W2 of the output side end 3b of the conductor pattern 3, the output side end 3b of the conductor pattern 3 during the handling of the flexible printed wiring board 1. There is no possibility that the exposed base of the machine will break due to stress concentration.
【００２１】[0021]
【発明の効果】以上説明したように、本発明のうち請求
項１に係る発明によれば、導体パターンの出力側端部の
剛性が向上し、この出力側端部にうねり、反りが生じに
くくなることから、寸法精度および貼り合わせ精度の低
下を防ぐと同時に、アライメントマークの認識性を確保
して電子機器に容易にＡＣＦ接続することが可能なフレ
キシブルプリント配線板を提供することができる。As described above, according to the invention of claim 1 of the present invention, the rigidity of the output side end portion of the conductor pattern is improved, and the output side end portion is less prone to waviness and warpage. As a result, it is possible to provide a flexible printed wiring board that can prevent the deterioration of the dimensional accuracy and the bonding accuracy and at the same time ensure the recognizability of the alignment mark and easily perform the ACF connection to the electronic device.
【００２２】また、本発明のうち請求項２に係る発明に
よれば、フレキシブルプリント配線板をガラスパネルに
ＡＣＦ接続すべく異方性導電フィルム（１５）で熱圧着
するとき、その圧着力が熱硬化型接着剤を介して異方性
導電フィルム側に十分に伝わることから、ＡＣＦ接続を
確実に実施して歩留まりを向上させることが可能とな
る。According to the second aspect of the present invention, when the flexible printed wiring board is thermocompression-bonded with the anisotropic conductive film (15) for ACF connection to the glass panel, the pressure-bonding force is heat. Since it is sufficiently transmitted to the anisotropic conductive film side through the curable adhesive, it is possible to reliably perform the ACF connection and improve the yield.
【００２３】また、本発明のうち請求項３に係る発明に
よれば、補強フィルム側から導体パターンおよびアライ
メントマークを透視することが可能となり、補強フィル
ムの貼設に起因して熱圧着時の光学的な位置合わせに支
障を来すことがなくなるため、従来どおりの位置合わせ
手法をそのまま適用することができる。According to the invention of claim 3 of the present invention, the conductor pattern and the alignment mark can be seen through from the reinforcing film side, and due to the attachment of the reinforcing film, the optics at the time of thermocompression bonding can be obtained. Since it does not hinder the automatic alignment, the conventional alignment method can be applied as it is.
【００２４】また、本発明のうち請求項４に係る発明に
よれば、各種の熱工程においてフレキシブルプリント配
線板が熱膨張しても反りを伴わなくなるため、信頼性の
高いフレキシブルプリント配線板を提供することができ
る。Further, according to the invention of claim 4 of the present invention, since the flexible printed wiring board is not warped even when it is thermally expanded in various heating steps, a flexible printed wiring board having high reliability is provided. can do.
【００２５】さらに、本発明のうち請求項５に係る発明
によれば、フレキシブルプリント配線板の取扱い中に導
体パターンの出力側端部の露呈基部が応力集中によって
切断する事態の発生を抑制できるようになるため、信頼
性の高いフレキシブルプリント配線板を提供することが
できる。Further, according to the invention of claim 5 of the present invention, it is possible to suppress the occurrence of a situation where the exposed base portion of the output side end portion of the conductor pattern is cut due to stress concentration during handling of the flexible printed wiring board. Therefore, it is possible to provide a highly reliable flexible printed wiring board.
【図１】本発明に係るフレキシブルプリント配線板の一
実施形態を示す図であって、（ａ）はその平面図、
（ｂ）は（ａ）のＢ−Ｂ線による断面図である。FIG. 1 is a diagram showing an embodiment of a flexible printed wiring board according to the present invention, in which (a) is a plan view thereof,
(B) is sectional drawing by the BB line of (a).
【図２】図１に示すフレキシブルプリント配線板をガラ
スパネルにＡＣＦ接続するときの様子を示す正面図であ
る。FIG. 2 is a front view showing a state in which the flexible printed wiring board shown in FIG. 1 is ACF-connected to a glass panel.
【図３】図１に示すフレキシブルプリント配線板の導体
パターンとガラスパネルの導体パターンとの位置合わせ
方法を示す平面図である。FIG. 3 is a plan view showing a method of aligning the conductor pattern of the flexible printed wiring board shown in FIG. 1 with the conductor pattern of the glass panel.
１……フレキシブルプリント配線板 ２……ベース基材 ３……導体パターン ３ａ……入力側端部 ３ｂ……出力側端部 ６……カバーフィルム １０……熱硬化型接着剤 １１……補強フィルム Ｗ１……貼設幅 Ｗ２……露呈幅 1 ... Flexible printed wiring board 2 ... Base material 3 ... Conductor pattern 3a ... End of input side 3b ... Output end 6 ... Cover film 10 ... Thermosetting adhesive 11 ... Reinforcing film W1 …… Attached width W2 ... Exposure width
Claims (5)
（３）を形成し、この導体パターンをその入力側端部
（３ａ）および出力側端部（３ｂ）を残してカバーフィ
ルム（６）で被覆し、この導体パターンの出力側端部に
表面処理を施したフレキシブルプリント配線板（１）に
おいて、 少なくとも前記導体パターンの出力側端部の裏側に補強
フィルム（１１）を貼設したことを特徴とするフレキシ
ブルプリント配線板。1. A conductor film (3) is formed on the surface of a base material (2), and the cover film (6) is formed by leaving the conductor pattern (3) with its input side end (3a) and output side end (3b). ), And in the flexible printed wiring board (1) having the output side end of the conductor pattern surface-treated, a reinforcing film (11) is attached to at least the back side of the output side end of the conductor pattern. Flexible printed wiring board characterized by.
接着剤（１０）を用いたことを特徴とする請求項１に記
載のフレキシブルプリント配線板。2. The flexible printed wiring board according to claim 1, wherein a thermosetting adhesive (10) is used to attach the reinforcing film (11).
を用いたことを特徴とする請求項１または請求項２に記
載のフレキシブルプリント配線板。3. The flexible printed wiring board according to claim 1, wherein the reinforcing film (11) is transparent.
ース基材（２）の熱膨張係数に合致させたことを特徴と
する請求項１から請求項３までのいずれかに記載のフレ
キシブルプリント配線板。4. The flexible print according to claim 1, wherein the coefficient of thermal expansion of the reinforcing film (11) matches the coefficient of thermal expansion of the base material (2). Wiring board.
を導体パターン（３）の出力側端部（３ｂ）の露呈幅
（Ｗ２）より大きくしたことを特徴とする請求項１から
請求項４までのいずれかに記載のフレキシブルプリント
配線板。5. The pasting width (W1) of the reinforcing film (11)
Is larger than the exposed width (W2) of the output side end portion (3b) of the conductor pattern (3), the flexible printed wiring board according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001393613A JP2003198070A (en) | 2001-12-26 | 2001-12-26 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001393613A JP2003198070A (en) | 2001-12-26 | 2001-12-26 | Flexible printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003198070A true JP2003198070A (en) | 2003-07-11 |
Family
ID=27600568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001393613A Pending JP2003198070A (en) | 2001-12-26 | 2001-12-26 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003198070A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007013018A (en) * | 2005-07-04 | 2007-01-18 | Nitto Denko Corp | Wiring circuit board |
| US7316939B2 (en) | 2003-11-14 | 2008-01-08 | Seiko Epson Corporation | Semiconductor device manufacturing method and manufacturing apparatus |
| JP2008122382A (en) * | 2006-11-10 | 2008-05-29 | Ajuhitek Inc | Optical inspection system and optical inspection method |
| JP2009283500A (en) * | 2008-05-19 | 2009-12-03 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board |
| JP2011258816A (en) * | 2010-06-10 | 2011-12-22 | Toshiba Corp | Television apparatus and electronic equipment |
| JP2016146230A (en) * | 2016-03-14 | 2016-08-12 | 大日本印刷株式会社 | Suspension flexure substrate, suspension, suspension with head, hard disk drive, method for manufacturing the suspension flexure substrate, and method for inspecting the suspension flexure substrate |
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| JPH05323347A (en) * | 1992-05-22 | 1993-12-07 | Alps Electric Co Ltd | Liquid crystal display device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7316939B2 (en) | 2003-11-14 | 2008-01-08 | Seiko Epson Corporation | Semiconductor device manufacturing method and manufacturing apparatus |
| JP2007013018A (en) * | 2005-07-04 | 2007-01-18 | Nitto Denko Corp | Wiring circuit board |
| JP4619214B2 (en) * | 2005-07-04 | 2011-01-26 | 日東電工株式会社 | Printed circuit board |
| JP2008122382A (en) * | 2006-11-10 | 2008-05-29 | Ajuhitek Inc | Optical inspection system and optical inspection method |
| JP2009283500A (en) * | 2008-05-19 | 2009-12-03 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board |
| JP2011258816A (en) * | 2010-06-10 | 2011-12-22 | Toshiba Corp | Television apparatus and electronic equipment |
| JP2016146230A (en) * | 2016-03-14 | 2016-08-12 | 大日本印刷株式会社 | Suspension flexure substrate, suspension, suspension with head, hard disk drive, method for manufacturing the suspension flexure substrate, and method for inspecting the suspension flexure substrate |
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