JP2000269608A - Flexible wiring board and display device provided therewith - Google Patents
Flexible wiring board and display device provided therewithInfo
- Publication number
- JP2000269608A JP2000269608A JP6984499A JP6984499A JP2000269608A JP 2000269608 A JP2000269608 A JP 2000269608A JP 6984499 A JP6984499 A JP 6984499A JP 6984499 A JP6984499 A JP 6984499A JP 2000269608 A JP2000269608 A JP 2000269608A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- display panel
- reinforcing plate
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明はフレキシブル配線
基板及びそれを備えた表示装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible wiring board and a display device having the same.
【０００２】[0002]
【従来の技術】例えば、液晶表示装置には、液晶表示パ
ネルとこの液晶表示パネルにデータ信号等を供給する回
路基板とをフレキシブル配線基板を介して接続したもの
がある。ところで、このような液晶表示装置におけるフ
レキシブル配線基板では、折り曲げて組込むことが多
い。そこで、フレキシブル配線基板のベースとなるフィ
ルム基板の厚さを２５μｍ程度とかなり薄くし、フレキ
シブル配線基板を容易に折り曲げることができるように
している。2. Description of the Related Art For example, there is a liquid crystal display device in which a liquid crystal display panel and a circuit board for supplying data signals and the like to the liquid crystal display panel are connected via a flexible wiring board. By the way, flexible wiring boards in such a liquid crystal display device are often folded and incorporated. Therefore, the thickness of the film substrate serving as the base of the flexible wiring board is considerably reduced to about 25 μm so that the flexible wiring board can be easily bent.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
このようなフレキシブル配線基板では、フィルム基板の
厚さが２５μｍ程度とかなり薄いので、フィルム基板が
柔らかすぎて腰もなく、このため取り扱い時にフレキシ
ブル配線基板に大きな反りや撓みが発生しやすく、この
結果特にフレキシブル配線基板を液晶表示パネルに接合
する際における作業性が悪くなってしまうという問題が
あった。この発明の課題は、フィルム基板の厚さがかな
り薄くても、取り扱い時にフレキシブル配線基板の所定
の接合部に大きな反りや撓みが発生しにくいようにする
ことである。However, in such a conventional flexible wiring board, since the thickness of the film substrate is as thin as about 25 μm, the film substrate is too soft and stiff, and therefore, the flexible wiring board is difficult to handle. There is a problem that large warpage or bending is likely to occur in the substrate, and as a result, workability particularly when the flexible wiring substrate is joined to the liquid crystal display panel is deteriorated. SUMMARY OF THE INVENTION It is an object of the present invention to prevent a large warp or bending from being generated at a predetermined joint portion of a flexible wiring board during handling even when the thickness of the film substrate is considerably small.
【０００４】[0004]
【課題を解決するための手段】請求項１記載の発明は、
配線を有するフィルム基板の一の面の一端部を他の電子
部品との接合部とされたフレキシブル配線基板におい
て、前記フィルム基板の他の面において前記接合部に対
応する部分の近傍に樹脂フィルムからなる補強板を設け
たものである。請求項２記載の発明は、配線を有するフ
ィルム基板の一の面の一端部を他の電子部品との接合部
とされたフレキシブル配線基板において、前記フィルム
基板の一の面において前記接合部の近傍に樹脂フィルム
からなる補強板を設けたものである。請求項３記載の発
明は、請求項２記載の発明において、前記補強板の表面
に接着層を設けたものである。請求項４記載の発明は、
表示パネル及び該表示パネルの所定の接合面に一の面の
一端部からなる接合部を接合されたフレキシブル配線基
板を備えた表示装置において、前記フレキシブル配線基
板の他の面において前記接合部に対応する部分の近傍に
樹脂フィルムからなる補強板を設け、前記フレキシブル
配線基板を前記補強板の近傍においてほぼＵ字状に折り
曲げて前記表示パネルの所定の接合面とは反対側の面に
沿わせたものである。請求項５記載の発明は、表示パネ
ル及び該表示パネルの所定の接合面に一の面の一端部か
らなる接合部を接合されたフレキシブル配線基板を備え
た表示装置において、前記フレキシブル配線基板の一の
面において前記接合部の近傍に樹脂フィルムからなる補
強板を設け、前記フレキシブル配線基板を前記補強板の
近傍においてほぼＵ字状に折り曲げて前記表示パネルの
所定の接合面とは反対側の面に沿わせると共に、前記補
強板の所定の側面を前記表示パネルの所定の端面に当接
させたものである。請求項６記載の発明は、表示パネル
及び該表示パネルの所定の接合面に一の面の一端部から
なる接合部を接合されたフレキシブル配線基板を備えた
表示装置において、前記フレキシブル配線基板の一の面
において前記接合部の近傍に樹脂フィルムからなる補強
板を設け、前記フレキシブル配線基板を前記補強板の近
傍においてほぼＵ字状に折り曲げて前記表示パネルの所
定の接合面とは反対側の面に沿わせると共に、前記補強
板の表面を前記表示パネルの所定の接合面とは反対側の
面に接着したものである。以上の発明によれば、フレキ
シブル配線基板の所定の接合部の近傍に補強板を設けて
いるので、フィルム基板の厚さがかなり薄くても、取り
扱い時にフレキシブル配線基板の所定の接合部に大きな
反りや撓みが発生しにくいようにすることができる。According to the first aspect of the present invention,
In a flexible wiring board in which one end of one surface of a film substrate having wiring is a joining portion with another electronic component, a resin film is used near the portion corresponding to the joining portion on the other surface of the film substrate. A reinforcing plate is provided. The invention according to claim 2 is a flexible wiring board in which one end of one surface of a film substrate having a wiring is a bonding portion with another electronic component, and the vicinity of the bonding portion on one surface of the film substrate. Provided with a reinforcing plate made of a resin film. According to a third aspect of the present invention, in the second aspect, an adhesive layer is provided on a surface of the reinforcing plate. The invention according to claim 4 is
In a display device including a display panel and a flexible wiring board in which a bonding portion including one end of one surface is bonded to a predetermined bonding surface of the display panel, the other surface of the flexible wiring substrate corresponds to the bonding portion. A reinforcing plate made of a resin film was provided in the vicinity of the portion to be formed, and the flexible wiring board was bent substantially in a U-shape in the vicinity of the reinforcing plate and along the surface opposite to the predetermined bonding surface of the display panel. Things. According to a fifth aspect of the present invention, there is provided a display device including a display panel and a flexible wiring board in which a predetermined bonding surface of the display panel is bonded to a bonding portion including one end of one surface. A reinforcing plate made of a resin film is provided in the vicinity of the joining portion on the surface of the display panel, and the flexible wiring board is bent substantially in a U-shape in the vicinity of the reinforcing plate, and a surface opposite to a predetermined joining surface of the display panel is provided. And a predetermined side surface of the reinforcing plate is brought into contact with a predetermined end surface of the display panel. According to a sixth aspect of the present invention, there is provided a display device including a display panel and a flexible wiring board in which a bonding portion including one end of one surface is bonded to a predetermined bonding surface of the display panel. A reinforcing plate made of a resin film is provided in the vicinity of the joining portion on the surface of the display panel, and the flexible wiring board is bent substantially in a U-shape in the vicinity of the reinforcing plate, and a surface opposite to a predetermined joining surface of the display panel is provided. And a surface of the reinforcing plate is adhered to a surface of the display panel opposite to a predetermined bonding surface. According to the above invention, since the reinforcing plate is provided in the vicinity of the predetermined joint of the flexible wiring board, even if the thickness of the film substrate is considerably thin, the predetermined joint of the flexible wiring board is largely warped during handling. And bending can be suppressed.
【０００５】[0005]
【発明の実施の形態】（第１実施形態）図１はこの発明
の第１実施形態における液晶表示装置の要部の平面図を
示し、図２は図１のＸ−Ｘ線に沿う断面図を示したもの
である。この液晶表示装置における液晶表示パネル１
は、セグメント基板２とコモン基板３とがほぼ枠状のシ
ール材（図示せず）を介して貼り合わされ、シール材の
内側における両基板２、３間に液晶（図示せず）が封入
されたものからなっている。この場合、セグメント基板
２の図１における下辺部はコモン基板３の下辺から突出
され、この突出部２ａの下面には複数の接続端子（セグ
メント端子及びコモン端子）４が設けられている。(First Embodiment) FIG. 1 is a plan view of a main part of a liquid crystal display device according to a first embodiment of the present invention, and FIG. 2 is a sectional view taken along line XX of FIG. It is shown. Liquid crystal display panel 1 in this liquid crystal display device
In this, the segment substrate 2 and the common substrate 3 are bonded together via a substantially frame-shaped sealing material (not shown), and a liquid crystal (not shown) is sealed between the two substrates 2 and 3 inside the sealing material. Is made of things. In this case, the lower side of the segment substrate 2 in FIG. 1 protrudes from the lower side of the common substrate 3, and a plurality of connection terminals (segment terminals and common terminals) 4 are provided on the lower surface of the protrusion 2a.
【０００６】一方、この液晶表示装置におけるフレキシ
ブル配線基板(Chip On Film)５は、所定の形状のフィル
ム基板６を備えている。この場合、フィルム基板６はポ
リイミド等の樹脂フィルムからなり、その厚さは２５μ
ｍ程度となっている。フィルム基板６の上面中央部の各
所定の箇所には、液晶表示パネル１を駆動するためのＬ
ＳＩ等からなる半導体チップ７及び液晶表示パネル１の
駆動に必要なコンデンサや抵抗等からなるチップ部品８
が搭載されている。On the other hand, a flexible wiring board (Chip On Film) 5 in this liquid crystal display device includes a film substrate 6 having a predetermined shape. In this case, the film substrate 6 is made of a resin film such as polyimide and has a thickness of 25 μm.
m. An L for driving the liquid crystal display panel 1 is provided at each predetermined location in the center of the upper surface of the film substrate 6.
A semiconductor chip 7 made of SI or the like and a chip component 8 made of capacitors, resistors, etc. necessary for driving the liquid crystal display panel
Is installed.
【０００７】フィルム基板６の上面には所定の配線９が
半導体チップ７及びチップ部品８に適宜に接続されて設
けられている。配線９を含むフィルム基板６の上面にお
いて、半導体チップ７搭載領域、チップ部品８搭載領
域、図１における上辺部及び下辺部を除く部分にはソル
ダーレジストからなる保護膜１０が設けられている。そ
して、配線９のうち保護膜１０によって覆われずに図１
の上辺部及び下辺部にそれぞれ露出された部分によって
複数の出力側接続端子９ａ及び複数の入力側接続端子９
ｂが形成されている。On the upper surface of the film substrate 6, predetermined wirings 9 are provided appropriately connected to the semiconductor chip 7 and the chip components 8. On the upper surface of the film substrate 6 including the wiring 9, a protective film 10 made of a solder resist is provided on a region other than the mounting region of the semiconductor chip 7, the mounting region of the chip component 8, and the upper side and the lower side in FIG. 1. 1 without being covered by the protective film 10 in the wiring 9.
The plurality of output-side connection terminals 9a and the plurality of input-side connection terminals 9 are formed by portions exposed to the upper side and the lower side, respectively.
b is formed.
【０００８】フィルム基板６の下面において、保護膜１
０の図１における上辺の上下部に対応する部分には第１
の補強板１１が接着剤（図示せず）によって接着されて
設けられている。フィルム基板６の下面において、半導
体チップ７搭載領域とチップ部品８搭載領域及びその近
傍には第２の補強板１２が接着剤（図示せず）によって
接着されて設けられている。フィルム基板６の下面にお
いて、入力側接続端子９ｂ配置領域に対応する部分及び
その近傍には第３の補強板１３が接着剤（図示せず）に
よって接着されて設けられている。これらの補強板１１
〜１３はポリエチレンテレフタレート等の樹脂フィルム
からなり、その厚さは５０〜７０μｍ程度となってい
る。On the lower surface of the film substrate 6, the protective film 1
0 corresponds to the upper and lower portions of the upper side in FIG.
Is provided by bonding with an adhesive (not shown). On the lower surface of the film substrate 6, a second reinforcing plate 12 is provided in an area where the semiconductor chip 7 is mounted, a chip component 8 is mounted and in the vicinity thereof by an adhesive (not shown). On the lower surface of the film substrate 6, a third reinforcing plate 13 is provided by bonding (not shown) to a portion corresponding to the area where the input-side connection terminals 9b are arranged and in the vicinity thereof. These reinforcing plates 11
13 are made of a resin film such as polyethylene terephthalate and have a thickness of about 50 to 70 μm.
【０００９】そして、フレキシブル配線基板５の出力側
接続端子９ａの部分からなる接合部は液晶表示パネル１
の接続端子４の部分からなる接合部に異方性導電接着剤
（図示せず）を介して接合されている。この状態では、
保護膜１０の図１における上辺はセグメント基板２の突
出部２ａの突出端面から所定の間隔だけ離間されてい
る。また、第１の補強板１１の図１における上辺もセグ
メント基板２の突出部２ａの突出端面から所定の間隔だ
け離間されている。[0009] Then, the bonding portion composed of the portion of the output side connection terminal 9a of the flexible wiring board 5 is connected to the liquid crystal display panel 1.
Are connected via an anisotropic conductive adhesive (not shown). In this state,
The upper side of the protective film 10 in FIG. 1 is separated from the projecting end surface of the projecting portion 2a of the segment substrate 2 by a predetermined distance. The upper side of the first reinforcing plate 11 in FIG. 1 is also separated from the projecting end surface of the projecting portion 2a of the segment substrate 2 by a predetermined distance.
【００１０】ところで、この液晶表示装置では、フレキ
シブル配線基板５の出力側接続端子９ａの部分からなる
接合部の近傍に第１の補強板１１を設けているので、フ
ィルム基板６の厚さが２５μｍ程度とかなり薄くても、
取り扱い時にフレキシブル配線基板５の当該接合部に大
きな反りや撓みが発生しにくいようにすることができ、
ひいてはフレキシブル配線基板５を液晶表示パネル１に
接合する際における作業性の向上を図ることができる。In this liquid crystal display device, since the first reinforcing plate 11 is provided in the vicinity of the joint portion of the flexible wiring board 5 including the output connection terminal 9a, the thickness of the film substrate 6 is 25 μm. Even if it is quite thin,
It is possible to prevent large warpage or bending from occurring at the joint portion of the flexible wiring board 5 during handling,
As a result, workability in joining the flexible wiring board 5 to the liquid crystal display panel 1 can be improved.
【００１１】次に、液晶表示パネル１及びフレキシブル
配線基板５を図示しないケース内にフレキシブル配線基
板５を折り曲げて組込む場合について、図３を参照して
説明する。まず、図示していないが、ケース内に先に組
込まれた回路基板の雌型コネクタにフレキシブル配線基
板５の第３の補強板１３の部分からなるコネクタ部を挿
入する。次に、第１と第２の補強板１１、１２間におけ
るフレキシブル配線基板５を、第１及び第２の補強板１
１、１２が外側となるようにして、ほぼＵ字状に折り曲
げ、第２の補強板１２の部分から第３の補強板１３の部
分までの間におけるフレキシブル配線基板５をセグメン
ト基板２の下面に沿わせる状態とし、そしてこの状態で
ケース内に組込む。Next, a case in which the liquid crystal display panel 1 and the flexible wiring board 5 are folded and incorporated in a case (not shown) will be described with reference to FIG. First, although not shown, a connector portion including the third reinforcing plate 13 of the flexible wiring board 5 is inserted into the female connector of the circuit board previously incorporated in the case. Next, the flexible wiring board 5 between the first and second reinforcing plates 11 and 12 is attached to the first and second reinforcing plates 1 and 12.
The flexible wiring board 5 between the portion of the second reinforcing plate 12 and the portion of the third reinforcing plate 13 is bent on the lower surface of the segment substrate 2 so that the flexible wiring board 5 is bent substantially in a U-shape so that the first and second portions are on the outside. It is set to the state where it is along, and it is assembled in the case in this state.
【００１２】ところで、この液晶表示装置におけるフレ
キシブル配線基板５では、フィルム基板６の半導体チッ
プ７及びチップ部品８の搭載面とは反対側の面であっ
て、半導体チップ７及びチップ部品８搭載領域と対応す
る部分及びその近傍に第２の補強板１２を設けているの
で、フレキシブル配線基板５を折り曲げて組込むとき、
半導体チップ７及びチップ部品８とフィルム基板６との
接合部に発生する応力を小さくすることができ、ひいて
は半導体チップ７及びチップ部品８がフィルム基板６か
ら剥がれにくいようにすることができる。なお、第３の
補強板１３は、入力側接続端子９ｂの部分からなるコネ
クタ部を補強するためのものである。Meanwhile, in the flexible wiring board 5 of this liquid crystal display device, the surface of the film substrate 6 opposite to the surface on which the semiconductor chip 7 and the chip component 8 are mounted, and the area where the semiconductor chip 7 and the chip component 8 are mounted Since the second reinforcing plate 12 is provided at the corresponding portion and in the vicinity thereof, when the flexible wiring board 5 is bent and assembled,
The stress generated at the joint between the semiconductor chip 7 and the chip component 8 and the film substrate 6 can be reduced, and the semiconductor chip 7 and the chip component 8 can be hardly peeled off from the film substrate 6. The third reinforcing plate 13 is used to reinforce the connector portion including the input-side connection terminal 9b.
【００１３】（第２実施形態）図４はこの発明の第２実
施形態における液晶表示装置の要部の平面図を示し、図
５は図３のＸ−Ｘ線に沿う断面図を示したものである。
この液晶表示装置におけるフレキシブル配線基板５にお
いて、図１及び図２に示す場合と異なる点は、フィルム
基板６の上面において、保護膜１０の図４における上辺
部からセグメント基板２の突出部２ａの突出端面に対応
する部分までの間に第１の補強板１１が接着剤（図示せ
ず）によって接着されて設けられている点である。この
場合、第１の補強板１１の厚さは第２及び第３の補強板
１２、１３の厚さよりも適宜に厚くなっている。(Second Embodiment) FIG. 4 is a plan view of a main part of a liquid crystal display device according to a second embodiment of the present invention, and FIG. 5 is a sectional view taken along line XX of FIG. It is.
The difference between the flexible wiring board 5 of this liquid crystal display device and the case shown in FIGS. 1 and 2 is that the protrusion 2a of the segment substrate 2 projects from the upper side of the protective film 10 in FIG. The point is that the first reinforcing plate 11 is provided so as to be bonded to the portion corresponding to the end face by an adhesive (not shown). In this case, the thickness of the first reinforcing plate 11 is appropriately larger than the thickness of the second and third reinforcing plates 12 and 13.
【００１４】そして、この場合には、図６に示すよう
に、第１と第２の補強板１１、１２間におけるフレキシ
ブル配線基板５を、第１の補強板１１が内側となるよう
にして、ほぼＵ字状に折り曲げ、第２の補強板１２の部
分から第３の補強板１３の部分までの間におけるフレキ
シブル配線基板５をセグメント基板２の下面に沿わせる
状態とする。この状態では、第１の補強板１１の図６に
おける左側面がセグメント基板２の突出部２ａの突出端
面に当接することにより、この部分における出力側接続
端子９ａがセグメント基板２の突出部２ａの突出端縁
（エッジ）で曲がらないようにすることができ、ひいて
は当該部分における出力側接続端子９ａにエッジ断線が
生じにくいようにすることができる。In this case, as shown in FIG. 6, the flexible wiring board 5 between the first and second reinforcing plates 11 and 12 is set so that the first reinforcing plate 11 is on the inside. The flexible wiring board 5 is bent substantially in a U-shape so as to be along the lower surface of the segment board 2 from the portion of the second reinforcing plate 12 to the portion of the third reinforcing plate 13. In this state, the left side surface of the first reinforcing plate 11 in FIG. 6 abuts on the protruding end surface of the protruding portion 2 a of the segment substrate 2, and the output-side connection terminal 9 a in this portion is It is possible to prevent bending at the protruding edge (edge), and it is possible to prevent the output-side connection terminal 9a in that portion from being easily broken.
【００１５】（第３実施形態）図７はこの発明の第２実
施形態における液晶表示装置の要部の平面図を示し、図
８は図７のＸ−Ｘ線に沿う断面図を示したものである。
この液晶表示装置におけるフレキシブル配線基板５にお
いて、図１及び図２に示す場合と異なる点は、保護膜１
０の上面において、保護膜１０の図７における上辺と第
２の補強板１２の図７における上辺との間の所定の箇所
に第１の補強板１１が接着剤（図示せず）によって接着
された設けられ、且つ、第１の補強板１１の上面に両面
接着テープ（接着層）１４が設けられている点である。
この場合、第１の補強板１１の厚さは第２及び第３の補
強板１２、１３の厚さよりも適宜に厚くなっている。(Third Embodiment) FIG. 7 is a plan view of a main part of a liquid crystal display device according to a second embodiment of the present invention, and FIG. 8 is a sectional view taken along line XX of FIG. It is.
The difference between the flexible wiring board 5 of this liquid crystal display device and the case shown in FIGS.
The first reinforcing plate 11 is bonded by an adhesive (not shown) at a predetermined position between the upper side of the protective film 10 in FIG. 7 and the upper side of the second reinforcing plate 12 in FIG. And a double-sided adhesive tape (adhesive layer) 14 is provided on the upper surface of the first reinforcing plate 11.
In this case, the thickness of the first reinforcing plate 11 is appropriately larger than the thickness of the second and third reinforcing plates 12 and 13.
【００１６】そして、この場合には、図９に示すよう
に、保護膜１０の図７における上辺部の部分におけるフ
レキシブル配線基板５を、第１の補強板１１が内側とな
るようにして、ほぼＵ字状に折り曲げ、第１の補強板１
１の部分から第３の補強板１３の部分までの間における
フレキシブル配線基板５をセグメント基板２の下面に沿
わせると共に、第１の補強板１１の上面を両面接着テー
プ１４を介してセグメント基板２の突出部２ａの突出端
面近傍の下面に接着した状態とする。この状態では、フ
レキシブル配線基板５のほぼＵ字状に折り曲げられた部
分の形状が安定し、この部分における出力側接続端子９
ａにエッジ断線が生じにくいようにすることができる。In this case, as shown in FIG. 9, the flexible wiring board 5 at the upper side of the protective film 10 in FIG. Bent into a U-shape, the first reinforcing plate 1
The flexible wiring board 5 between the portion 1 and the portion of the third reinforcing plate 13 extends along the lower surface of the segment substrate 2, and the upper surface of the first reinforcing plate 11 is attached to the segment substrate 2 via the double-sided adhesive tape 14. Is bonded to the lower surface near the protruding end surface of the protruding portion 2a. In this state, the shape of the portion of the flexible wiring board 5 bent substantially in a U-shape is stable, and the output-side connection terminals 9 in this portion are stable.
It is possible to prevent the occurrence of edge disconnection at a.
【００１７】なお、上記実施形態では、フレキシブル配
線基板を液晶表示パネルに接合する場合について説明し
たが、エレクトロルミネセンスパネル等の他の表示パネ
ルやその他の電子部品に接合するようにしてもよい。In the above embodiment, the case where the flexible wiring board is joined to the liquid crystal display panel has been described. However, the flexible wiring board may be joined to another display panel such as an electroluminescence panel or other electronic parts.
【００１８】[0018]
【発明の効果】以上説明したように、この発明によれ
ば、フレキシブル配線基板の所定の接合部の近傍に補強
板を設けているので、フィルム基板の厚さがかなり薄く
ても、取り扱い時にフレキシブル配線基板の所定の接合
部に大きな反りや撓みが発生しにくいようにすることが
でき、ひいてはフレキシブル配線基板を液晶表示パネル
に接合する際における作業性の向上を図ることができ
る。As described above, according to the present invention, since the reinforcing plate is provided in the vicinity of the predetermined joint portion of the flexible wiring board, even if the thickness of the film substrate is considerably thin, the flexible board can be used in handling. It is possible to prevent a large warp or bending from being generated at a predetermined joint portion of the wiring board, thereby improving the workability when the flexible wiring board is joined to the liquid crystal display panel.
【図１】この発明の第１実施形態における液晶表示装置
の要部の平面図。FIG. 1 is a plan view of a main part of a liquid crystal display device according to a first embodiment of the present invention.
【図２】図１のＸ−Ｘ線に沿う断面図。FIG. 2 is a sectional view taken along line XX of FIG. 1;
【図３】第１実施形態においてフレキシブル配線基板を
折り曲げた状態における一部の断面図。FIG. 3 is a partial cross-sectional view of the first embodiment in a state where the flexible wiring board is bent.
【図４】この発明の第２実施形態における液晶表示装置
の要部の平面図。FIG. 4 is a plan view of a main part of a liquid crystal display device according to a second embodiment of the present invention.
【図５】図４のＸ−Ｘ線に沿う断面図。FIG. 5 is a sectional view taken along line XX of FIG. 4;
【図６】第２実施形態においてフレキシブル配線基板を
折り曲げた状態における一部の断面図。FIG. 6 is a partial cross-sectional view illustrating a state where a flexible wiring board is bent in the second embodiment.
【図７】この発明の第３実施形態における液晶表示装置
の要部の平面図。FIG. 7 is a plan view of a main part of a liquid crystal display device according to a third embodiment of the present invention.
【図８】図７のＸ−Ｘ線に沿う断面図。FIG. 8 is a sectional view taken along the line XX of FIG. 7;
【図９】第３実施形態においてフレキシブル配線基板を
折り曲げた状態における一部の断面図。FIG. 9 is a partial cross-sectional view illustrating a state in which a flexible wiring board is bent in the third embodiment.
１ 液晶表示パネル ５ フレキシブル配線基板 ６ フィルム基板 ９ 配線 ９ａ 出力側接続端子 １１ 第１の補強板 DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 5 Flexible wiring board 6 Film board 9 Wiring 9a Output side connection terminal 11 First reinforcing plate
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2H092 GA50 NA27 5E338 AA12 AA16 BB72 BB75 CD33 CD40 EE28 5G435 AA07 BB12 EE40 EE47 GG42 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H092 GA50 NA27 5E338 AA12 AA16 BB72 BB75 CD33 CD40 EE28 5G435 AA07 BB12 EE40 EE47 GG42
Claims (6)
端部を他の電子部品との接合部とされたフレキシブル配
線基板において、前記フィルム基板の他の面において前
記接合部に対応する部分の近傍に樹脂フィルムからなる
補強板が設けられていることを特徴とするフレキシブル
配線基板。1. A flexible wiring board in which one end of one surface of a film substrate having wiring is joined to another electronic component, wherein a portion of the other surface of the film substrate corresponding to the joining portion is formed. A flexible wiring board, wherein a reinforcing plate made of a resin film is provided in the vicinity.
端部を他の電子部品との接合部とされたフレキシブル配
線基板において、前記フィルム基板の一の面において前
記接合部の近傍に樹脂フィルムからなる補強板が設けら
れていることを特徴とするフレキシブル配線基板。2. A flexible wiring board in which one end of one surface of a film substrate having wiring is joined to another electronic component, and a resin film is provided on one surface of the film substrate near the joint. A flexible wiring board, comprising a reinforcing plate made of:
板の表面に接着層が設けられていることを特徴とするフ
レキシブル配線基板。3. The flexible wiring board according to claim 2, wherein an adhesive layer is provided on a surface of the reinforcing plate.
合面に一の面の一端部からなる接合部を接合されたフレ
キシブル配線基板を備えた表示装置において、前記フレ
キシブル配線基板の他の面において前記接合部に対応す
る部分の近傍に樹脂フィルムからなる補強板が設けら
れ、前記フレキシブル配線基板が前記補強板の近傍にお
いてほぼＵ字状に折り曲げられて前記表示パネルの所定
の接合面とは反対側の面に沿わされていることを特徴と
する表示装置。4. A display device comprising: a display panel; and a flexible wiring board in which a bonding portion including one end of one surface is bonded to a predetermined bonding surface of the display panel. A reinforcing plate made of a resin film is provided near a portion corresponding to the bonding portion, and the flexible wiring board is bent substantially in a U-shape near the reinforcing plate and is opposite to a predetermined bonding surface of the display panel. A display device characterized by being along a side surface.
合面に一の面の一端部からなる接合部を接合されたフレ
キシブル配線基板を備えた表示装置において、前記フレ
キシブル配線基板の一の面において前記接合部の近傍に
樹脂フィルムからなる補強板が設けられ、前記フレキシ
ブル配線基板が前記補強板の近傍においてほぼＵ字状に
折り曲げられて前記表示パネルの所定の接合面とは反対
側の面に沿わされていると共に、前記補強板の所定の側
面が前記表示パネルの所定の端面に当接されていること
を特徴とする表示装置。5. A display device comprising: a display panel; and a flexible wiring board in which a bonding portion consisting of one end of one surface is bonded to a predetermined bonding surface of the display panel. A reinforcing plate made of a resin film is provided in the vicinity of the joining portion, and the flexible wiring board is bent substantially in a U-shape in the vicinity of the reinforcing plate, and is formed on a surface opposite to a predetermined joining surface of the display panel. A display device, wherein a predetermined side surface of the reinforcing plate is in contact with a predetermined end surface of the display panel.
合面に一の面の一端部からなる接合部を接合されたフレ
キシブル配線基板を備えた表示装置において、前記フレ
キシブル配線基板の一の面において前記接合部の近傍に
樹脂フィルムからなる補強板が設けられ、前記フレキシ
ブル配線基板が前記補強板の近傍においてほぼＵ字状に
折り曲げられて前記表示パネルの所定の接合面とは反対
側の面に沿わされていると共に、前記補強板の表面が前
記表示パネルの所定の接合面とは反対側の面に接着され
ていることを特徴とする表示装置。6. A display device comprising: a display panel; and a flexible wiring board in which a bonding portion including one end of one surface is bonded to a predetermined bonding surface of the display panel. A reinforcing plate made of a resin film is provided in the vicinity of the joining portion, and the flexible wiring board is bent substantially in a U-shape in the vicinity of the reinforcing plate, and is formed on a surface opposite to a predetermined joining surface of the display panel. A display device, wherein the display panel is adhered to a surface of the display panel opposite to a predetermined bonding surface of the display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6984499A JP2000269608A (en) | 1999-03-16 | 1999-03-16 | Flexible wiring board and display device provided therewith |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6984499A JP2000269608A (en) | 1999-03-16 | 1999-03-16 | Flexible wiring board and display device provided therewith |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000269608A true JP2000269608A (en) | 2000-09-29 |
Family
ID=13414534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6984499A Pending JP2000269608A (en) | 1999-03-16 | 1999-03-16 | Flexible wiring board and display device provided therewith |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000269608A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100332439B1 (en) * | 2000-07-20 | 2002-04-13 | 윤종용 | Flexible circuit board of a liquid crystal display device |
| JP2003005667A (en) * | 2001-06-21 | 2003-01-08 | Pioneer Electronic Corp | Display device |
| JP2003017818A (en) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | Flexible circuit board and display unit |
| JP2003198070A (en) * | 2001-12-26 | 2003-07-11 | Iwaki Electronics Corp | Flexible printed wiring board |
| JP2004246351A (en) * | 2003-01-22 | 2004-09-02 | Semiconductor Energy Lab Co Ltd | Semiconductor device and electronic equipment |
| CN104123902A (en) * | 2013-04-29 | 2014-10-29 | 三星显示有限公司 | Display panel, electronic device including same, and bonding method thereof |
| US9974175B2 (en) | 2013-04-29 | 2018-05-15 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
| JP2020013108A (en) * | 2018-07-12 | 2020-01-23 | 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． | Display |
| CN111479383A (en) * | 2020-05-15 | 2020-07-31 | 武汉华星光电技术有限公司 | Flexible printed circuit board and display panel |
| US11457531B2 (en) | 2013-04-29 | 2022-09-27 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
-
1999
- 1999-03-16 JP JP6984499A patent/JP2000269608A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100332439B1 (en) * | 2000-07-20 | 2002-04-13 | 윤종용 | Flexible circuit board of a liquid crystal display device |
| JP2003005667A (en) * | 2001-06-21 | 2003-01-08 | Pioneer Electronic Corp | Display device |
| JP2003017818A (en) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | Flexible circuit board and display unit |
| JP4587607B2 (en) * | 2001-06-28 | 2010-11-24 | 京セラ株式会社 | Flexible circuit board and display device |
| JP2003198070A (en) * | 2001-12-26 | 2003-07-11 | Iwaki Electronics Corp | Flexible printed wiring board |
| JP2004246351A (en) * | 2003-01-22 | 2004-09-02 | Semiconductor Energy Lab Co Ltd | Semiconductor device and electronic equipment |
| JP4689168B2 (en) * | 2003-01-22 | 2011-05-25 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
| US9894792B2 (en) | 2013-04-29 | 2018-02-13 | Samsung Display Co., Ltd. | Display panel, electronic device including the same, and bonding method thereof |
| CN104123902A (en) * | 2013-04-29 | 2014-10-29 | 三星显示有限公司 | Display panel, electronic device including same, and bonding method thereof |
| US9974175B2 (en) | 2013-04-29 | 2018-05-15 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
| US10306763B2 (en) | 2013-04-29 | 2019-05-28 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
| US11457531B2 (en) | 2013-04-29 | 2022-09-27 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
| US11696402B2 (en) | 2013-04-29 | 2023-07-04 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
| US11979987B2 (en) | 2013-04-29 | 2024-05-07 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
| JP2020013108A (en) * | 2018-07-12 | 2020-01-23 | 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． | Display |
| JP7398872B2 (en) | 2018-07-12 | 2023-12-15 | 三星ディスプレイ株式會社 | display device |
| CN111479383A (en) * | 2020-05-15 | 2020-07-31 | 武汉华星光电技术有限公司 | Flexible printed circuit board and display panel |
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