JP2588134Y2 - Display panel mounting structure - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a mounting structure of a display panel in a liquid crystal display device or the like.

[0002]

2. Description of the Related Art For example, in a reflection type liquid crystal display device, a liquid crystal display panel, a reflection plate, a circuit board and the like are sometimes modularized in order to facilitate handling during assembly and the like. FIG. 4 shows a conventional mounting structure of such a display panel. In this display panel mounting structure, the mounting frame 1, the liquid crystal display panel 2, the reflection plate 3, the interconnector 4, and the circuit board 5 are modularized. The mounting frame 1 is formed of metal,
The rectangular frame body 11 has a structure in which substantially L-shaped locking pieces 12 are provided at two predetermined positions on both long sides. The liquid crystal display panel 2 has two glass substrates 13 and 14.
A liquid crystal (not shown) is sealed in between, and one end of the upper glass substrate 13 protrudes from one end of the lower glass substrate 14 and is connected to the lower surface of one end of the protruded upper glass substrate 13. It has a structure provided with terminals (not shown). The interconnector 4 is made of a zebra type having a square rod shape in which conductive rubber and insulating rubber are alternately arranged. In the circuit board 5, wirings (not shown) are formed on both sides of a hard substrate body 15 made of glass epoxy, ceramic, or the like, and these wirings are appropriately connected via through holes (not shown). A semiconductor chip (not shown) such as an LSI chip for driving the liquid crystal display panel 2 is mounted at a predetermined location on the lower surface of the main body 15.
A long hole 16 is provided in the substrate main body 15 at a portion corresponding to each of the four locking pieces 12 of the mounting frame 1.

Next, a case where the above components are modularized will be described. In this case, first, the reflection plate 3 is bonded to the lower surface of the glass substrate 14 below the liquid crystal display panel 2 via a transparent adhesive (not shown). Next, the interconnector 4 is placed at a predetermined location on the upper surface of the circuit board 5.
Next, the liquid crystal display panel 2 is mounted on the upper surface of the circuit board 5 together with the reflector 3, and the lower surface of one end of the glass substrate 13 on the upper side of the liquid crystal display panel 2 is mounted on the upper surface of the interconnector 4. Next, the mounting frame 1 is placed on the upper surface of the liquid crystal display panel 2, and the four locking pieces 12 are inserted into the long holes 16 of the circuit board 5, respectively. While appropriately compressing 4, the locking pieces 12 protruding from the long holes 16 are bent. In this state, the connection terminal on the lower surface of one end of the glass substrate 13 on the upper side of the liquid crystal display panel 2 is connected to the circuit board 5 via the interconnector 4.
Is connected to the wiring on the upper surface side. Thus, the mounting frame 1,
The liquid crystal display panel 2, the reflector 3, the interconnector 4, the circuit board 5, and the semiconductor chip are modularized.

[0004]

However, in such a conventional display panel mounting structure, the liquid crystal display panel 2, the reflection plate 3, and the interconnector 4 are connected to a hard circuit board 5, a metal mounting frame 1, and the like. And the circuit board 5
Since the semiconductor chip is mounted on the lower surface of the semiconductor device, there is a problem that the thickness is increased and the weight is increased. A connection terminal on the lower surface of one end of the glass substrate 13 on the upper side of the liquid crystal display panel 2 is connected to the wiring on the upper surface side of the circuit board 5 via the interconnector 4, and a semiconductor chip is mounted on the lower surface of the circuit board 5. Therefore, the circuit board 5 must have a double-sided wiring structure having through holes, and there is a problem that the cost of the circuit board 5 increases. An object of the present invention is to provide a display panel mounting structure that can be made thinner and lighter. Another object of the present invention is to provide a display panel mounting structure in which a circuit board can have a single-sided wiring structure.

[0005]

SUMMARY OF THE INVENTION The present invention provides an upper substrate and a lower substrate.
A substrate, and the upper substrate is outside the lower substrate.
Protruding, and the lower surface of the protruding portion of the upper substrate is
A display panel on which a panel-side connection terminal is formed , a reflection plate adhered to a lower surface of the lower substrate, and a carrier tape on which a semiconductor chip for driving the display panel is mounted;
Superimposed on the upper or lower surface of the carrier tape,
A flexible circuit board having the connection terminals connected to the input terminals of the carrier tape, wherein at least one of the carrier tape and the flexible circuit board is adhered to a lower surface of the reflection plate, and a panel of the display panel is provided.
Connection Le side connection terminal and the output terminal of the carrier tape
And the protruding part of the upper substrate and the lower substrate
The guide member is arranged along the step formed by the above.

[0006]

According to this invention, the protruding part of the upper substrate and the lower part
Arrange the guide member along the step formed by the substrate
The guide member is bent on the carrier tape
Upper base that facilitates inside and protrudes outward from lower substrate
Has the effect of reinforcing the board with guide members, reinforcing the strength
Can be made into a thin structure without the need for a special frame
it can. In addition , a reflective plate is adhered on a carrier tape on which a semiconductor chip is mounted and a flexible circuit board, and a display panel is adhered thereon, so that these components can be modularized. Can do it,
Compared with the conventional structure in which the display panel and the reflector are sandwiched between a hard circuit board and a metal mounting frame, the thickness and weight can be reduced. In this case, since the carrier tape and the flexible circuit board on which the semiconductor chips are mounted are used, the flexible circuit board can have a single-sided wiring structure.

[0007]

1 and 2 show a mounting structure of a display panel according to a first embodiment of the present invention. In this display panel mounting structure, the carrier tape 2 on which the liquid crystal display panel 21, the reflection plate 22, and the semiconductor chip 23 are mounted
4 and the flexible circuit board 25 are modularized. Among them, the liquid crystal display panel 21
The liquid crystal 33 is housed between the two glass substrates 31 and 32 in a state sealed by the sealing member 34, and one end of the upper glass substrate 31 protrudes from one end of the lower glass substrate 32, A connection terminal 35 is provided on the lower surface of one end of the protruding upper glass substrate 31, and the upper glass substrate 3
A polarizing plate 36 is adhered to the upper surface of the device 1 via a transparent adhesive (not shown). The reflection plate 22 is bonded to the lower surface of the glass substrate 32 below the liquid crystal display panel 21 via a transparent adhesive (not shown).

The carrier tape 24 has a tape body 41 made of a resin tape. A lead pattern made of metal foil such as copper is formed on the outer surface of the tape body 41,
Thus, a finger lead 43 is provided so as to protrude from a device hole 42 formed at the center of the tape main body 41, an output terminal 44 is provided at one end of the tape main body 41, and the other end of the tape main body 41 is provided. Input terminals 46 are provided to bridge the openings 45 formed on both sides of the unit. A bump electrode (not shown) of the semiconductor chip 23 arranged in the device hole 42 is bonded to the finger lead 43 by thermocompression. This joint is sealed by a sealing member 47 made of resin. As a result, L for driving the liquid crystal display panel 2 is adjusted.
A semiconductor chip 23 composed of an SI chip or the like is mounted on a carrier tape 24. The tape main body 41 has a flat plate shape before being assembled, but can be easily bent at two predetermined positions at the time of assembling described later. For this reason, linear openings 48 and 49 (see FIG. 1) are formed in the tape main body 41 at predetermined two locations from one end to the other end, and bridged leads 50 and 51 are formed at these openings 48 and 49. Are only joined by. The flexible circuit board 25 has a structure in which wiring made of metal foil such as copper is formed on the upper surface of a substrate body 61 made of polyimide or the like, and an insulating layer 62 is formed except for a part thereof, so that the input of the carrier tape 24 is prevented. The connection terminals 63 are exposed at portions corresponding to the terminals 46, respectively.

Next, a case where the above components are modularized will be described. In this case, first, the portion of the output terminal 44 of the flat tape body 41 of the carrier tape 24 and the portion of the connection terminal 35 of the glass substrate 31 on the upper side of the liquid crystal display panel 21 are placed between the anisotropic conductive adhesive. The two terminals 44 and 35 are connected by thermocompression bonding with the interposition of 71, and the parts of both terminals 44 and 35 are bonded. Next, the lower surface of the flat tape main body 41 of the carrier tape 24 and the upper surface of the substrate main body 61 of the flexible circuit board 25 are overlapped, and the input terminal 46 of the tape main body 41 and the connection terminal 63 of the substrate main body 61 are connected to each other. One of them is joined via a pre-applied solder plating (not shown). Next, a rectangular bar-shaped guide plate 72 made of resin is provided on the surface of the carrier tape 24 opposite to the output terminal 44 of the flat tape body 41.
Is bonded via a double-sided adhesive tape 73. Guide plate 72
Is for facilitating folding of the carrier tape 24 at two predetermined positions, as described later.

Next, the tape body 4 of the carrier tape 24
1 is bent along the predetermined side of the guide plate 72, and the leads 50, 51 in the two openings 48, 49 of the tape body 41 are bent at the upper and lower edges of the predetermined side of the guide plate 72, A predetermined surface of the tape main body 41 and a predetermined surface of the semiconductor chip 23 are bonded to the lower surface of the reflection plate 22 via a double-sided adhesive tape 74. In this state, as shown in FIG. 1, the flexible circuit board 25 is superposed on the lower surface of the carrier tape 24 adhered to the lower surface of the reflection plate 22. Here, as shown in FIG. 1, an escape hole 75 for escaping the semiconductor chip 23 is formed at a predetermined location of the flexible circuit board 25. Thus,
The liquid crystal display panel 21, the reflection plate 22, the carrier tape 24 on which the semiconductor chip 23 is mounted, and the flexible circuit board 25 are modularized.

As described above, in this display panel mounting structure, the reflection plate 22 is adhered to the lower surface of the liquid crystal display panel 21,
Since the carrier tape 24 on which the semiconductor chip 23 is mounted is adhered to the lower surface of the reflection plate 22 and the flexible circuit board 25 is superposed on the lower surface of the carrier tape 24, these components can be modularized, and Compared with the conventional structure in which the display panel and the reflector are sandwiched between a hard circuit board and a metal mounting frame, the thickness and weight can be reduced. Also, the semiconductor chip 23
Is used, the semiconductor chip 23 does not need to be mounted on the flexible circuit board 25, and the wiring may be formed only on the upper surface of the flexible circuit board 25. The wiring structure can be used, and the cost of the flexible circuit board 25 can be reduced.

In the above embodiment, the carrier tape 24 on which the semiconductor chip 23 is mounted is adhered to the lower surface of the reflection plate 22 and the flexible circuit board 25 is superposed on the lower surface of the carrier tape 24. It is not something to be done. For example, a flexible circuit board 25 is adhered to the lower surface of the reflection plate 22 as shown in FIG.
The carrier tape 24 on which the semiconductor chip 23 is mounted may be superimposed on the lower surface of 5. However, in this case, the wiring is formed only on the lower surface of the flexible circuit board 25.

[0013]

As described above, according to the present invention, the guide for bending the carrier tape is made easy, and
The upper substrate protruding outward from the plate is reinforced with a guide member and displayed.
The strength of the display panel can be reinforced. Therefore, the frame
A thin display panel can be used without any need for a special body.
Can be. That is, according to the present invention, the reflection plate is adhered on the carrier tape on which the semiconductor chip is mounted and the flexible circuit board, and the display panel is adhered thereon. Compared with the conventional structure in which the board is sandwiched between a hard circuit board and a metal mounting frame, the thickness and weight can be reduced. Furthermore , since the carrier tape and the flexible circuit board on which the semiconductor chips are mounted are used, the flexible circuit board can have a single-sided wiring structure,
Therefore, the cost of the flexible circuit board can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view of a mounting structure of a display panel according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of the first embodiment.

FIG. 3 is a sectional view of a mounting structure of a display panel according to a second embodiment of the present invention.

FIG. 4 is an exploded perspective view of a conventional display panel mounting structure.

[Explanation of symbols]

 Reference Signs List 21 LCD panel 22 Reflector 23 Semiconductor chip 24 Carrier tape 25 Flexible circuit board

Claims (1)

(57) [Scope of request for utility model registration] An upper substrate and a lower substrate;
A plate protruding outward from the lower substrate and the upper substrate
A display panel having a panel-side connection terminal formed on the lower surface of a protruding portion of the display panel; a reflector adhered to a lower surface of the lower substrate ; and a semiconductor chip for driving the display panel. A carrier tape, a flexible circuit board superposed on the upper or lower surface of the carrier tape, and a connection terminal connected to an input terminal of the carrier tape; and at least one of the carrier tape and the flexible circuit board Is adhered to the lower surface of the reflection plate to connect the panel-side connection terminal of the display panel to the output terminal of the carrier tape, and the protruding portion of the upper substrate
Guide member along the step formed by the lower substrate and the lower substrate
The mounting structure of the display panel, wherein the display panel is disposed .