JP2000236152A - Wiring connection member and liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure, which is capable of arranging outer terminals provided to various wiring connection members such as a flexible substrate or its connection member at an arbitrary position, restraining a liquid display device from increasing in occupancy area. SOLUTION: An flexible printed circuit(FPC) 50 is extended upward as shown in Figure from a connection terminal 51 along the board surface of a tape carrier package(TCP) board 40 toward the outer terminal 41 of the TCP board 40. An extension wiring pattern 52 is electrically connected to the connection terminal 51 and extended upward in the extension region of the FPC board 50. A projection 53 is provided to the upper edge of the FPC board 50, and an outer terminal 54 electrically connected to the extension wiring pattern 52 is provided to the tip of the projection 53. A reinforcing plate 55 is provided to the rear side of the outer terminal 54.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring connection member and a liquid crystal display device using the same, and more particularly, to a liquid crystal display device having a structure in which a flexible wiring substrate is conductively connected to a liquid crystal display panel. The present invention relates to a structure of a flexible wiring board and other wiring connection members.

[0002]

2. Description of the Related Art At present, liquid crystal display devices are widely used as constituents of display units of various devices. 2. Description of the Related Art A liquid crystal display device often includes a liquid crystal display panel and a flexible wiring board (flexible wiring board) conductively connected to panel terminals provided on the liquid crystal display panel. The flexible wiring board is for connecting the liquid crystal display panel to a circuit portion of a device-side main body on which the liquid crystal display panel is mounted.

[0003] The flexible wiring board is appropriately bent using the flexibility as it is, and is connected to an internal connector provided on a circuit board or the like of a main body of various devices. In this case, especially in portable devices, there is a need to reduce the space for accommodating the flexible wiring board due to the need to reduce the internal capacity of the housing. The panel may be installed so as to overlap behind the panel surface.

FIG. 6 shows an example of a configuration in which a flexible wiring board is arranged so as to overlap the panel surface of a liquid crystal display panel as described above. Here, a liquid crystal display panel 10 having a liquid crystal layer (not shown) sealed by a sealing material is provided between two panel substrates 11 and 12 made of glass or the like. At the end of the liquid crystal display panel 10, an overhang portion 11a is formed in which the panel substrate 11 extends beyond the opposing panel substrate 12. On the surface of the overhang portion 11a, a large number of panel terminals electrically connected to wiring patterns respectively drawn from internal electrodes (not shown) formed on the liquid crystal display portion of the liquid crystal display panel 10 are arranged at the end portions. Is formed. These panel terminals are connected to the overhang 11a.
And panel terminals 13 are arranged in parallel with each other on the surface.

The panel terminal 13 has a flexible T
An external terminal 21 formed at an end of a CP (tape carrier package) substrate 20 is conductively connected. A large number of external terminals arranged in the same manner as the panel terminals of the panel terminal unit 13 are formed in the external terminal unit 21. The panel terminal portion 13 and the external terminal portion 21 are generally electrically connected integrally by a heat and pressure treatment by a heat sealing structure via an anisotropic conductive film. On the TCP substrate 20, a wiring pattern 22 including a number of wirings extending from the external terminal portion 21 is formed. A terminal corresponding to the output of the integrated circuit chip 24 is mounted on the wiring pattern 22 of the TCP substrate 20 in a state where it is conductively connected. A terminal corresponding to the input of the integrated circuit chip 24 is conductively connected to the connection terminal portion 23. Therefore, these wiring patterns 22
Are electrically connected directly or indirectly as outputs of the integrated circuit chip 24 to a large number of connection terminals exposed at the connection terminal portion 23 formed at the opposite end of the external terminal portion 21.

The connection of each terminal of the connection terminal section 23 is performed by an FPC.
(Flexible Printed Circuit) Conductive connection is made by solder 25 or the like corresponding to the connection terminal portions 31 formed at one end of the substrate 30. Each connection terminal of the connection terminal section 31 is F
It is conductively connected to the extension wiring pattern 32 formed in the PC board 30. This extension wiring pattern 32 is an FPC
It extends in the extension direction of the substrate 30 and extends to a protruding portion 33 formed so as to protrude from an end of the FPC substrate 30 opposite to the connection terminal portion 31. A large number of external terminal portions 34 that are conductively connected to the extension wiring pattern 32 are formed at the tip of the projecting portion 33. The back surface side of the terminal surface of the external terminal portion 34 to be conductively connected is reinforced by a reinforcing plate 35, and is configured to be connected to an internal connector provided on a circuit board or the like of the various device-side main bodies. The FPC board 30 may include a circuit element or the like appropriately connected to the extension wiring pattern 32.

[0007] The TCP substrate 20 is bent from the panel terminal portion 13 of the liquid crystal display panel 10 and bent toward the rear side of the liquid crystal display panel 10, where it is connected to the FPC substrate 30. The FPC board 30 is disposed so as to substantially overlap the panel surface of the liquid crystal display panel 10 in a plane. In addition,
In this example, the FPC board 30 is connected via the TCP board 20. However, the FPC board may be electrically connected directly to the liquid crystal display panel 10.

[0008]

However, in the above-mentioned conventional liquid crystal display device, the wiring connecting member composed of the TCP substrate 20 and the FPC substrate 30 connected to the liquid crystal display panel 10 is provided at the panel terminal portion of the liquid crystal display panel 10. 13, it is bent so as to bend behind the panel surface after connecting to the external terminal portion 3 provided on the FPC board 30.
Reference numeral 4 denotes a direction in which the panel 4 is bent from the panel terminal portion 13 as shown in FIG.
Or at the side end of the FPC board 30, and it is physically difficult to provide the external terminal on the side opposite to the direction in which it is bent and extended. However, with the miniaturization of various devices, the installation position of the internal connector on the device to be connected to the external terminal portion provided on the wiring connection member of the liquid crystal display device tends to be limited, and various devices, particularly, portable devices There is an increasing demand for forming an external terminal on the side opposite to the direction in which it is bent and extended, depending on the internal structure of the electronic device.

In response to such a demand, for example, a method of arranging an external terminal portion on the panel terminal portion 13 side by miniaturizing the substrate itself can be considered, but this method cannot secure a sufficient substrate area. In particular, it becomes impossible to mount an integrated circuit chip including a liquid crystal driver circuit on a substrate. Conversely, it is conceivable that the substrate itself is enlarged and folded twice so that the tip of the substrate is brought to the panel terminal side. However, the size of the substrate increases, and the folded portion becomes thicker due to the folding of the substrate. The volume occupied by the display device increases, which is against the miniaturization of the device.

The present invention has been made to solve the above problem, and an object of the present invention is to provide a liquid crystal display device with various wiring connecting members such as a flexible substrate or a connecting member thereof while suppressing an increase in the occupied volume. It is an object of the present invention to provide a structure in which the provided external terminal portion can be arranged at an arbitrary position.

[0011]

According to another aspect of the present invention, there is provided a wiring connection member comprising: a first substrate having a first external terminal portion for conducting conductive connection with the outside and a first connection terminal portion; And a second substrate having a second connection terminal portion conductively connected to the first connection terminal portion and a second external terminal portion for performing external conductive connection. Wherein the second substrate has an extended region extending from the second connection terminal to the first external terminal, and the second external terminal is formed in the extended region. I do.

According to the present invention, a second substrate having a second connection terminal portion conductively connected to the first connection terminal portion of the first substrate is provided, and the second substrate is provided with a second connection terminal portion from the second connection terminal portion. (1) An extension region extending to the external terminal portion side is provided, and a second external terminal portion is formed in the extension region portion. Therefore, another connector portion is provided near an external connector portion to which the first external terminal portion is to be connected. However, the second external terminal portion can be arranged so as to be connectable to the connector portion. Further, although the first substrate and the extension region of the second substrate are arranged to overlap each other,
It suffices to partially overlap the two substrates and conduct conductive connection, so there is no need to fold the substrates themselves, making it possible to make a compact structure.Also, a sufficient board area can be secured in the overlapping area, so that a sufficient wiring area and circuit An area or a mounting area of an element, a chip, or the like can be obtained.

In the above invention, it is preferable that the second external terminal is provided particularly near the tip of the extension region.

In the present invention, a bent portion whose substrate surface is bent is provided between the first external terminal portion and the first connection terminal portion on the first substrate, and the second substrate is provided with the bent portion. It is preferable that the second connection terminal portion is configured to be conductively connected to the first connection terminal portion so as to be in contact with the surface of the first substrate disposed outside the first connection terminal portion. According to the present invention, since the second substrate is configured to be in contact with the surface arranged outside the bent first substrate, the second substrate is arranged outside the bent portion of the first substrate. Accordingly, the second external terminal portion can be freely arranged without being hindered by the bent portion of the first substrate.

In the present invention, the second substrate has an opposite extension region extending from the second terminal portion to a side opposite to the first external terminal portion, and the extension wiring is provided in the opposite extension region. It is preferable that a third external terminal portion conductively connected to the pattern is formed. According to the present invention, since the third external terminal is formed in the extension region on the side opposite to the extension region, the arrangement of the external connector connected to the wiring connection member can be designed more freely. be able to.

In the present invention, the first substrate and the second substrate
It is preferable that the first substrate and the second substrate are bonded to each other in at least a part of a region where the substrates overlap in a plane.

According to the present invention, at least a part of the overlapping region of the first substrate and the second substrate is bonded to each other, so that the posture between the substrates can be stabilized, and
The position accuracy of the first external terminal portion and the second external terminal portion can be improved, and further, stress can be suppressed from being applied to the conductive connection portions of the first connection terminal portion and the second connection terminal portion. The reliability of the conductive connection portion can be improved.

Next, a liquid crystal display device according to the present invention is a liquid crystal display having the above-mentioned wiring connection member and a panel terminal portion corresponding to the first connector portion conductively connected to the first external terminal portion at an end portion. And a display panel.

According to the present invention, the wiring area of the wiring connecting member, the circuit area,
The arrangement of the external terminals can be set more freely without reducing the mounting area.

In the present invention, the first substrate is bent between the first external terminal portion and the first connection terminal portion,
It is preferable that the first connection terminal is disposed so as to extend behind a panel surface of the liquid crystal display panel.
According to this means, the first substrate and the second substrate are arranged so as to extend behind the panel surface, so that the liquid crystal display device can be made compact.

In each of the above-mentioned inventions, it is preferable in terms of manufacturing that at least the bent portion is configured to be flexible. Also, the first
The entire substrate may be configured as a flexible substrate, and the second substrate may also be configured as a flexible substrate.

[0022]

Next, an embodiment according to the present invention will be described with reference to the accompanying drawings. Each of the embodiments described below relates to the structure of a liquid crystal display device for forming a display unit provided in a portable electronic device, but the present invention is not limited to this.
The present invention can be widely applied to liquid crystal display devices having various uses and structures, and can also be used as a wiring connection member of various electronic devices other than the liquid crystal display device.

[First Embodiment] FIG. 1 is a schematic partial sectional view showing the structure of a first embodiment of the liquid crystal display device according to the present invention. Since the liquid crystal display panel 10 is exactly the same as the above-described conventional example, the same portions are denoted by the same reference numerals and description thereof will be omitted. In the present embodiment, the external terminal 41 of the TCP substrate 40 is conductively connected to the panel terminal 13 of the liquid crystal panel 10. The resin mold 14 serves to reinforce the conductive connection between the panel terminal 13 and the external terminal 41 and to prevent electrolytic corrosion at the panel terminal 13. Unlike the above conventional example, the external terminal portion 41, the wiring pattern 42, and the connection terminal portion 4 formed on the surface of the resin base material 40b.
3 is outside the bent portion 40, and the TCP substrate 40
The external terminal portion 41 is formed at one end of the extension. Also, the TCP substrate 40
On the surface of the wiring pattern 42, an insulating coat (not shown), a solder resist and the like are formed.

The TCP substrate 40 has a wiring pattern 42 including a wiring conductively connected to the external terminal 41.
The wiring pattern 42 is mainly electrically connected to a bump electrode (not shown) corresponding to the output of the integrated circuit chip 44 mounted substantially at the center by metal eutectic. Some are conductively connected to the provided connection terminal portion 43. Also, the TCP substrate 40
The mounting position of the integrated circuit chip 44 in the liquid crystal display panel 1
In order to minimize enlargement of the area in the plane direction of 0 and the area in the thickness direction, it is mounted at a position after being bent. Similar to the external terminal portion 41, the connection terminal portion 43 is electrically connected to a bump electrode (not shown) corresponding to an input of the integrated circuit chip 44 by a metal eutectic. The connection terminal 43 is
At the other end of the CP substrate 40, an opening (slit) 43a in which the resin base material 40b of the TCP substrate 40 is opened
Is formed, whereby the connection terminal portion 43 is exposed,
It is conductively connected to a connection terminal 51 formed at an end of the FPC board 50 via solder 45 or the like.

The FPC board 50 is connected to
To trace back along the surface of the CP substrate 40, that is, TC
Toward the external terminal portion 41 side of the P substrate 40, the TCP substrate 4
A portion 50E corresponding to the extension region extends in the direction opposite to the bending direction of 0 upward. Connection terminal part 5
1 is electrically connected to an extension wiring pattern 52,
It is formed on the surface of the resin substrate 50b of the PC substrate 50 on the side where the TCP substrate 40 is arranged. The extension wiring pattern 52 also extends toward the extension area of the FPC board 50. A protrusion 53 is provided at an end of the FPC board 50 in the direction of the extension region, and an external terminal 54 electrically connected to the extension wiring pattern 52 is formed at the tip of the protrusion 53. A reinforcing plate 55 is adhered to the back surface side of the external terminal portion 54 via the resin base material 50b. That is,
In the FPC board 50, the extension wiring pattern 5 extending in the direction opposite to the side where the input terminals 43 are arranged with reference to the integrated circuit chip 44 mounted on the TCP board 40
An external terminal 54 is formed at the end of the second terminal.

A portion of the TCP substrate 40 slightly extending from the external terminal portion 41 to the connection terminal portion 43 becomes a bent portion 40A which is bent behind the liquid crystal display panel 10 so that the TCP substrate 40 and the FPC substrate 50 are wrapped around. ing. The TCP substrate 40 has flexibility over the entire surface of the plate, but the bent portion 40A is formed with an opening (slit) and a thin resin base material in order to further increase the flexibility. It is preferable that it is formed. In the TCP substrate 40, only the bent portion 40A may be configured as the above-described flexible region having flexibility.

FIG. 2 is a schematic perspective view showing the structure of the TCP board 40 and the FPC board 50 constituting the wiring connection member of the present embodiment. As shown, the TCP board 40 and the FPC board 50 are fixed to each other by conductive connection between the input terminal 43 and the connection terminal 51 at the opening (slit) 43a, and the conductive connecting portion at the opening 43a. The TCP substrate 40 and the FPC substrate 50 overlap with each other in an extended region extending from the side to the side where the integrated circuit chip 44 is mounted. Therefore, the integrated circuit chip 44 of the TCP substrate 40
The TCP substrate 50 is arranged on the back side where is disposed so as to overlap. TCP board 40 and FPC board 50
In the overlapping region with the above, the TCP substrate 40 and the FPC substrate 50 are bonded to each other by a fixing means 46 such as a double-sided adhesive tape. In addition, TCP substrate 40, FPC
Adhesive lands may be individually provided on both sides of the substrate 50 and may be fixed by soldering.

In this embodiment, in the FPC board 50, the opening 43a between the TCP board 40 and the FPC board 50 is formed.
From the conductive connection portion to the external terminal portion 41 of the TCP substrate.
Since the external terminal portion 54 is formed in the extended region portion extending to the side, and the external terminal portion 54 is formed in the extended region portion, the external terminal portion 54 can protrude toward the panel terminal portion 13 of the liquid crystal display panel 10. Also in this case, the TCP substrate 40 and the F
Since the PC board 50 only partially has an overlapping region that is in close contact with the PC board 50, a folded structure is not required, and the volume occupied by the liquid crystal display device is hardly increased. Further, the liquid crystal display panel 10
Since the TCP board 40 and the FPC board 50 can be arranged so as to overlap each other on the back side, the total area of both boards can be increased to almost twice the conventional size, and more circuit structures or mounting components can be provided. Can be formed and arranged on a substrate.

In the above embodiment, the TCP substrate 40 and the FPC
Since the overlapping regions of the substrates 50 are adhered to each other by the fixing means 46, the postures of both substrates can be more reliably held, the position of the external terminal portion can be accurately maintained, and the conductive connection between the connection terminal portions 43 and 51 can be achieved. Since stress can be prevented from being applied to the portion, the reliability of the conductive connection portion can be improved.

In this embodiment, the bent portion 4 is formed on the TCP substrate 40.
Although 0A is provided, it is not always necessary to use it in a bent state. For example, it is possible to cope with a case where another connector to which the external terminal 54 is to be connected is provided near the external terminal 41 connected to the external connector. That is, the bent portion 40A of the wiring connection member shown in FIG.
The external terminal portion 54 is connected to the external terminal portion 41 while securing the wiring area and the circuit area by installing the substrate 50 in an overlapping state.
Can be arranged in the vicinity of the external connector, and it is possible to cope with a case where two external connectors are arranged vertically.

In this embodiment, instead of the TCP substrate 40 on which the integrated circuit chip 44 is mounted, an integrated circuit chip is electrically connected by an ACF or solder drawing.
It may be a PC board.

The TCP board 40 and the FPC board 50 may be interchanged and connected in reverse. in this case,
If the FPC board 50 is provided with an opening through which the integrated circuit chip 44 of the TCP board 40 penetrates through the thickness of the FPC board 50, the overall thickness of the liquid crystal display device can be made thinner. preferable.

[Second Embodiment] Next, a second embodiment of the liquid crystal display device according to the present invention will be described with reference to FIG. This embodiment includes a liquid crystal display panel 10 similar to that of the first embodiment, a TCP substrate 60, and an FPC substrate 70. In this embodiment, unlike the first embodiment, the external terminal portions 61, the wiring patterns 62, and the connection terminal portions 63 formed on the surface of the resin base material 60b are formed on the liquid crystal display panel 10 side, and the TCP substrate 60 Is opposite to the liquid crystal display panel 1 in the first embodiment.
The liquid crystal display panel 10 extends to the rear side of the liquid crystal display panel 10 through a bent portion 60A described later toward the liquid crystal display area of zero.

The wiring pattern 62 of the TCP substrate 60
, An insulating coat, a solder resist, etc., not shown, are formed on the surface. The external terminal 61 is a wiring pattern 6
The wiring pattern 62 is electrically connected to an unillustrated bump electrode corresponding to an output by a metal eutectic on an integrated circuit chip 64 mounted on the way, and the opposite end of the external terminal portion 61. Connection terminal part 6 provided in the part
Some are also directly conductively connected to 3. Also, TCP
The mounting position of the integrated circuit chip 64 on the substrate 40 is set at a position after the bending in order to minimize enlargement of the area in the plane direction and the area in the thickness direction of the liquid crystal display panel 10. Similar to the external terminal 61, the connection terminal 63 is electrically connected to a bump electrode (not shown) corresponding to an input of the integrated circuit chip 64 by a metal eutectic. External terminal 6
3, at the other end of the TCP substrate 60, an opening (slit) 63 a in which the resin base material 60 b of the TCP substrate 60 is opened is formed, and the connection terminal portion 63 is exposed at an edge of the opening 63 a. Through the opening 63a.
It is conductively connected to a connection terminal 71 formed at an end of the PC board 70 via solder 65 or the like.

The FPC board 70 is connected to
Back along the surface of the CP substrate 60, that is, TC
Toward the external terminal portion 61 side of the P substrate 60, the TCP substrate 6
A portion 70E corresponding to the extension region extends in the direction opposite to the extension direction of 0 upward. An extension wiring pattern 72 is conductively connected to the connection terminal portion 51, and is formed on the surface of the resin base material 70b of the FPC board 70 on the side where the TCP board 60 is arranged. This extended wiring pattern 72
Also extends in the direction of the extension area of the FPC board 70. F
A protrusion 73 is provided at an end of the PC board 70 in the direction of the extension region, and an external terminal 74 electrically connected to the extension wiring pattern 72 is formed at the tip of the protrusion 73. A reinforcing plate 75 is attached to the back surface side of the external terminal portion 74 via the resin base material 70b. That is, FPC
On the substrate 70, an external terminal portion 74 is formed at an end of an extension wiring pattern 72 that extends in a direction opposite to a side where the input terminals 63 are arranged with reference to the integrated circuit chip 64 mounted on the TCP substrate 60. ing.

A portion of the TCP substrate 60 slightly extending from the external terminal portion 61 toward the connection terminal portion 63 has a bent portion 60A slightly bent to dispose the TCP substrate 60 and the FPC substrate 70 behind the liquid crystal display panel 10. Has become.
The TCP substrate 60 has flexibility over the entire surface of the plate, but the bent portion 60A is formed with openings (slits) and thinned resin base material to further increase flexibility. It is preferable that it is formed. Note that the TCP substrate 60
, Only the bent portion 60A may be configured as the above-mentioned flexible region having flexibility.

As shown, the TCP board 60 and the FPC board 70 are fixed to each other by conductive connection between the input terminal section 63 and the connection terminal section 71 at an opening (slit) 63a. The TCP board 60 and the FPC board 70 overlap each other in an extended area extending from the conductive connection portion to the side on which the integrated circuit chip 64 is mounted. Therefore, the TCP substrate 70 is arranged on the back side of the TCP substrate 60 where the integrated circuit chip 64 is arranged so as to overlap. In the overlapping region between the TCP substrate 60 and the FPC substrate 70, the TCP substrate 60 and the FPC substrate 70 are bonded to each other by a fixing means 66 such as a double-sided adhesive tape. In addition, bonding lands may be separately provided on both sides of the TCP board 60 and the FPC board 70, and may be bonded and fixed by soldering.

In this embodiment, in the FPC board 70, the opening 63a between the TCP board 60 and the FPC board 70 is formed.
From the conductive connection portion to the external terminal portion 61 of the TCP substrate.
Since the external terminal portion 74 is formed in the extension region portion extending to the side, and the external terminal portion 74 is formed in the extension region portion, the external terminal portion 74 can protrude toward the panel terminal portion 13 of the liquid crystal display panel 10. Also in this case, the TCP substrate 60 and the F
Since the PC board 70 only partially has an overlapping region that is in close contact with the PC board 70, a folded structure is not required and the volume occupied by the liquid crystal display device is hardly increased. Further, the liquid crystal display panel 10
Since the TCP board 60 and the FPC board 70 can be arranged so as to overlap each other on the rear side, the total area of both boards can be increased to almost twice the conventional area, and more circuit structures or mounting components can be provided. Can be formed and arranged on a substrate.

In the above embodiment, the TCP substrate 60 and the FPC
Since the overlapping regions of the substrates 70 are adhered to each other by the fixing means 66, the postures of the two substrates can be more reliably held, the positions of the external terminal portions can be accurately maintained, and the conductive connection between the connection terminal portions 63 and 71 can be achieved. Since stress can be prevented from being applied to the portion, the reliability of the conductive connection portion can be improved.

In this embodiment, instead of the TCP substrate 60 on which the integrated circuit chip 64 is mounted, the integrated circuit chip is conductively connected by ACF or soldering.
It may be a PC board.

Further, the TCP board 60 and the FPC board 70 may be interchanged and connected in reverse. in this case,
If the FPC board 50 is provided with an opening through which the integrated circuit chip 64 of the TCP board 60 penetrates through the thickness of the FPC board 70, the overall thickness of the liquid crystal display device can be reduced. More preferred.

Third Embodiment Next, a liquid crystal display device according to a third embodiment of the present invention will be described with reference to FIG. In this embodiment, since the same liquid crystal display panel 10 as described above is provided, the same portions are denoted by the same reference numerals and description thereof will be omitted. In this embodiment, contrary to the first embodiment, the resin base material 80b of the TCP substrate 80
Terminal portion 81 and wiring pattern 8 formed on the surface of
2, the connection terminal portion 83 is located inside the bent portion 80A, the wiring pattern 82 of the TCP substrate 80 is formed, and the external terminal portion 81 is formed at one end of the extension.
Also, on the surface of the wiring pattern 82 of the TCP substrate 80,
An insulating coat, a solder resist, and the like (not shown) are formed. The external terminal portion 81 is conductively connected to a wiring pattern 82, and the wiring pattern 82 is electrically connected to a bump electrode (not shown) corresponding to an output by a metal eutectic to an integrated circuit chip 84 mounted on the way. Part 81
Some are directly conductively connected to the connection terminal 83 provided at the end opposite to the above. In addition, the mounting position of the integrated circuit chip 84 on the TCP substrate 80 is set at a position after the bending in order to minimize enlargement of the area in the plane direction and the area in the thickness direction of the liquid crystal display panel 10. The connection terminal section 83 is, like the external terminal section 81, an integrated circuit chip 84.
And a conductive connection by a metal eutectic, which is not shown, corresponding to the input of FIG. The external terminal 83 is a TCP
At the other end of the substrate 80, an opening (slit) 83 a in which the resin base material 80 b of the TCP substrate 80 is opened is formed, and the connection terminal portion 83 is exposed at the edge of the opening 83 a, and the FPC substrate 90. Is electrically conductively connected to the connection terminal portion 91 formed at the end portion of the device through solder 85 or the like.

The FPC board 90 has an extension wiring pattern 92 formed along the plate surface. The connection terminal portion 91 and the extension wiring pattern 92 of the FPC board 90
The illustrated portion 90E corresponding to the side of the resin substrate of the C substrate 90 on which the TCP substrate 80 is arranged, that is, the extended region portion
Is formed. The FPC board 90 also has a protruding portion 93 at the end of the extension region extending from the connection terminal portion 91 to the external terminal portion 81 side of the TCP board 80, and the tip of the protruding portion 93 has an extension wiring pattern 92. A connector 95 having a connector terminal portion 94 that is conductively connected is attached. The connector 95 is configured to be attachable to an internal connector provided inside the device. That is, FPC
The substrate 90 has a protruding portion 83 in a direction opposite to the direction in which the connection terminal portions 83 are arranged with reference to the integrated circuit chip 84 mounted on the TCP substrate 80.

The FPC board 90 further includes an opposite extension region extending from the connection terminal portion 91 to the opposite side of the external terminal portion 81 (a portion corresponding to the opposite extension region is shown as 90AE). A projection 96 is formed at the end of the opposite extension region, and an external terminal 97 is provided at the tip of the projection 96. External terminal 97
Are reinforced by a reinforcing plate 98 adhered to the back surface. That is, in the FPC board 90, the TCP board 8
A protrusion 96 is provided at an end of the substrate which is further extended in a direction in which the connection terminal portion 83 is disposed with reference to the integrated circuit chip 84 mounted on the chip 0, and an external terminal portion 97 is formed at a tip of the protrusion 96. Have been.

This embodiment has the same effect as the first embodiment, and the connector 95 is connected to the panel terminal 13.
Can be arranged in the vicinity of. Further, in this embodiment, an external terminal portion 97 is formed at the end opposite to the connector 95. Such a configuration is required according to the wiring and circuit structure on the device side. For example, a liquid crystal display panel 10 is connected to a connector terminal 94 that is an external terminal in the connector 95.
, A control signal relating to the display control is supplied from an external control drive circuit, and power for display is supplied to the external terminal unit 97 from an external power supply circuit. By doing so, it is less necessary to consider the structural arrangement inside the device especially for the liquid crystal display device in designing, and thus the device can be designed more easily. Thus, it is possible to cope with a case where connection with the device main body is required in a plurality of different directions, and the degree of freedom in connection with various signals is improved.

In the above two embodiments, the FP is directed toward the surface of the TCP substrate disposed outside the bent portion.
Since the C substrate is bonded to the TCP substrate at the conductive connection portion, the external terminal portion of the FPC substrate is inevitably disposed outside the bent portion of the TCP substrate.
The external terminal portion can be formed without being hindered by a bent portion of the P substrate. However, conversely, even if the FPC board is bonded to the inner surface of the bent portion of the TCP board,
By protruding the FPC board sideways from the side end opening of the bent portion of the TCP board, it is possible to provide external terminals at the protruding portion.

Each of the above embodiments shows a liquid crystal display device including only a liquid crystal display panel and a wiring connection member.
As described above, actually, various supports, backlights, mounting frames, and the like configured to mount the liquid crystal display panel and the wiring connection member are appropriately mounted.

In each of the above configurations, the external terminal portion and the connector are formed so as to directly protrude directly to the panel terminal side of the liquid crystal display panel or to the opposite side thereof. Even when the external terminal portion is provided on the panel terminal side, the external terminal portion may not be formed so as to protrude straight, but may be formed so that the external terminal portion protrudes laterally on the panel terminal portion side.

Note that, instead of the TCP substrate 80 on which the integrated circuit chip 84 is mounted in the present embodiment, an integrated circuit chip is electrically connected by ACF or solder drawing.
It may be a PC board.

The TCP board 80 and the FPC board 90 may be interchanged and connected in reverse. in this case,
If the FPC board 90 is provided with an opening through which the integrated circuit chip 84 of the TCP board 80 passes through the thickness of the FPC board 90, the overall thickness of the liquid crystal display device can be reduced. More preferred.

[Fourth Embodiment] Next, a fourth embodiment according to the present invention will be described with reference to FIG. In this embodiment, a liquid crystal display panel 10 similar to the third embodiment is used.
, A TCP board 100, and an FPC board 110. In this embodiment, unlike the third embodiment, the external terminal portion 10 formed on the surface of the resin base material 100b is different.
1, the wiring pattern 102 and the connection terminal portion 103 are formed on the liquid crystal display panel 10 side, and the TCP substrate 100 is
Contrary to the embodiment, from the panel terminal portion 13 toward the liquid crystal display area of the liquid crystal display panel 10, a bent portion 100A described later
And extends to the rear side of the liquid crystal display panel 10.

The wiring pattern 1 of the TCP substrate 100
On the surface of No. 02, an unillustrated insulating coat, a solder resist, and the like are formed. The external terminal portion 101 is conductively connected to a wiring pattern 102, and the wiring pattern 102 is electrically connected to a not-shown bump electrode corresponding to an output by a metal eutectic to an integrated circuit chip 104 mounted on the way. Some are directly conductively connected to the connection terminal section 103 provided at the opposite end of the section 101. Further, the mounting position of the integrated circuit chip 104 on the TCP substrate 100 is mounted at a position after being bent in order to minimize the area in the plane direction and the area in the thickness direction of the liquid crystal display panel 10 as much as possible. Similar to the external terminal unit 101, the connection terminal unit 103 is electrically connected to a bump electrode (not shown) corresponding to an input of the integrated circuit chip 104 by a metal eutectic. The external terminal section 103 is connected to the TCP substrate 100
At the other end of the resin substrate 1 of the TCP substrate 100
An opening (slit) 103a having an opening 00b is formed. The connection terminal 103 is exposed at an edge of the opening 103a. The connection terminal 111 and the solder 105 are formed at the end of the FPC board 110. Conductively connected via

The FPC board 110 has an extension wiring pattern 112 formed along the plate surface. FPC
Connection terminal portion 111 of substrate 110, extension wiring pattern 11
2 is a TCP substrate 100 of a resin base material of the FPC substrate 110
Is formed on the side on which is disposed. The FPC board 110 also has a protrusion 113 at an end of an extension area extending from the connection terminal 111 to the external terminal 101 of the TCP board 100.
A connector 115 having a connector terminal portion 114 conductively connected to the extension wiring pattern 112 is attached to the tip of the protrusion 113. The connector 115 is configured to be attachable to an internal connector provided inside the device. That is, in the FPC board 110, the integrated circuit chip 10 mounted on the TCP
4, the projection 103 is provided in a direction opposite to the direction in which the connection terminal portion 103 is arranged.

The FPC board 110 further has an opposite extension region extending from the connection terminal portion 111 to a side opposite to the external terminal portion 101, and a protrusion 116 is formed at an end of the opposite extension region. An external terminal 117 is provided at the tip of the protrusion 116. The external terminal 117 is reinforced by a reinforcing plate 118 adhered to the back surface. In other words, on the FPC board 110, there is a protrusion 116 at the end of the board further extended in the direction in which the connection terminals 103 are arranged with reference to the integrated circuit chip 104 mounted on the TCP board 100. An external terminal portion 117 is formed at the tip of.

This embodiment has the same effect as the first embodiment, and the connector 115 is connected to the panel terminal 1.
3 in the vicinity. Further, in the present embodiment, an external terminal portion 117 is formed at the opposite end of the connector 115. Such a configuration is required according to the wiring and circuit structure on the device side. For example, a control signal relating to display control of the liquid crystal display panel 10 is supplied from an external control drive circuit to a connector terminal portion 114 which is an external terminal portion in the connector 115, and a display signal from an external power supply circuit is supplied to the external terminal portion 117. Can be configured to be supplied with power. By doing so, it is less necessary to consider the structural arrangement inside the device especially for the liquid crystal display device in designing, and thus the device can be designed more easily. Thus, it is possible to cope with a case where connection with the device main body is required in a plurality of different directions, and the degree of freedom in connection with various signals is improved.

In the above two embodiments, the FP is directed toward the surface of the TCP substrate disposed outside the bent portion.
Since the C substrate is bonded to the TCP substrate at the conductive connection portion, the external terminal portion of the FPC substrate is inevitably disposed outside the bent portion of the TCP substrate.
The external terminal portion can be formed without being hindered by a bent portion of the P substrate. However, conversely, even if the FPC board is bonded to the inner surface of the bent portion of the TCP board,
By protruding the FPC board sideways from the side end opening of the bent portion of the TCP board, it is possible to provide external terminals at the protruding portion.

Each of the above embodiments shows a liquid crystal display device including only a liquid crystal display panel and a wiring connection member.
As described above, actually, various supports, backlights, mounting frames, and the like configured to mount the liquid crystal display panel and the wiring connection member are appropriately mounted.

In each of the above-described structures, the external terminal portion and the connector are formed so as to protrude straight to the panel terminal side of the liquid crystal display panel or to the opposite side thereof. Even when the external terminal portion is provided on the panel terminal side, the external terminal portion may not be formed so as to protrude straight, but may be formed so that the external terminal portion protrudes laterally on the panel terminal portion side.

Note that instead of the TCP substrate 100 on which the integrated circuit chip 104 is mounted in the present embodiment, an FPC substrate in which the integrated circuit chip is conductively connected by ACF or soldering may be used.

The TCP board 100 and the FPC board 11
0 may be interchanged and connected in reverse. In this case, if the FPC board 110 is provided with an opening through which the integrated circuit chip 104 of the TCP board 100 passes through the thickness of the FPC board 110, the overall thickness of the liquid crystal display device should be reduced. Is more preferred.

[0061]

As described above, according to the present invention, the second substrate having the second connection terminal portion conductively connected to the first connection terminal portion of the first substrate is provided. Since an extension region extending from the second connection terminal to the first external terminal is provided and the second external terminal is formed in the extension region,
Even if an external second connector is provided near the external first connector to which the first external terminal is to be connected, the second external terminal can be arranged so as to be connectable to the second connector. Further, although the first substrate and the extension region of the second substrate are arranged so as to overlap each other, it is sufficient if both substrates are partially overlapped and conductively connected. In addition to the configuration, a sufficient board area can be secured in the overlapping region, so that a sufficient wiring area, circuit area, or mounting area for elements, chips, and the like can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic partial cross-sectional view showing a schematic structure of a first embodiment of a liquid crystal display device according to the present invention.

FIG. 2 is a schematic perspective view showing the appearance of the wiring connection member of the first embodiment.

FIG. 3 is a schematic partial cross-sectional view illustrating a schematic structure of a liquid crystal display device according to a second embodiment of the present invention.

FIG. 4 is a schematic partial sectional view showing a schematic structure of a third embodiment of the liquid crystal display device according to the present invention.

FIG. 5 is a schematic partial cross-sectional view showing a schematic structure of a fourth embodiment of the liquid crystal display device according to the present invention.

FIG. 6 is a schematic partial cross-sectional view showing a schematic structure of a conventional liquid crystal display device.

[Explanation of symbols]

Reference Signs List 10 liquid crystal display panel 11, 12 panel substrate 13 panel terminal portion (first connector portion) 20, 40, 60, 80, 100 TCP substrate (first substrate) 21, 41, 61, 81, 101 external terminal portion (first External terminal part) 22, 42, 62, 82, 102 Wiring pattern 23, 43, 63, 83, 103 Connection terminal part (first connection terminal part) 24, 44, 64, 84, 104 Integrated circuit chip 30, 50, 70, 90, 110 FPC board (second board) 31, 51, 71, 90, 111 Connection terminal section (second connection terminal section) 32, 52, 72, 92, 112 Extension wiring patterns 33, 53, 73, 93 , 96, 113, 116 Projecting portions 34, 54, 74 External terminal portions (second external terminal portions) 35, 55, 75, 98, 108 Reinforcing plates 40A, 60A Bending portions 94, 114 Nectar terminal (second external terminal) 95, 115 Connector 97, 117 external terminal (third external terminal)

Claims (6)

[Claims] A first substrate having a first external terminal portion for making a conductive connection with the outside and a first connection terminal portion; a second connection terminal portion conductively connected to the first connection terminal portion;
And a second substrate having a second external terminal portion for performing external conductive connection, wherein the second substrate is formed from the second connection terminal portion to the first external terminal. A wiring connection member, comprising: an extension region extending toward a portion, wherein the second external terminal portion is formed in the extension region. 2. The device according to claim 1, wherein a bent portion having a bent substrate surface is provided between the first external terminal portion and the first connection terminal portion on the first substrate.
The second connection terminal portion is configured to be conductively connected to the first connection terminal portion so as to be in contact with the surface of the first substrate disposed outside the bent portion. Wiring connection members. 3. The second substrate according to claim 1, wherein the second substrate has an opposite-side extension region extending from the second connection terminal to an opposite side to the first external terminal. A wiring connection member, wherein a third external terminal portion is formed in the side extension region. 4. One of claims 1 to 3
3. The wiring connection member according to claim 1, wherein the first substrate and the second substrate are bonded to each other in at least a part of a region where the first substrate and the second substrate overlap in a plane. 5. The method according to claim 1, wherein:
13. A liquid crystal display device comprising: the wiring connection member according to claim 12; and a liquid crystal display panel including a panel terminal portion conductively connected to the first external terminal portion. 6. The liquid crystal display panel according to claim 5, wherein the first substrate is bent between the first external terminal portion and the first connection terminal portion, and the first connection terminal portion is a panel surface of the liquid crystal display panel. A liquid crystal display device, wherein the liquid crystal display device is disposed so as to be wrapped around the liquid crystal display.