JPH05281529A - Mounting structure of display panel - Google Patents

Abstract

PURPOSE:To make a thin and light mounting structure by bonding a back light to a superposition of a carrier tape loaded with a semiconductor chip and a flexible circuit board and bonding a liquid crystal panel to the back light. CONSTITUTION:A top face side one out of a carrier tape 24 and a flexible circuit board 25 is bonded to the bottom face of a back light 22. The connecting terminals of a liquid crystal display terminal 21 and the output terminals of the carrier tape 24 are connected to each other. The connecting terminals of the back light 22 and the back light connecting terminals of the flexible circuit board 25 are connected to each other. The back light 22 is bonded to a superposition of the carrier tape 24 loaded with a semiconductor chip 23 and the flexible circuit board 25, and the liquid crystal display panel 21 is bonded to the back light 22. Thereby the parts can be formed into a module so that a structure can be this and light comparing with a conventional structure where the liquid crystal element display panel 21 and the back light 22 are sandwiched and held between a hard circuit board and a metal fixing frame.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display panel mounting structure in an electronic device having a display panel.

[0002]

2. Description of the Related Art In an electronic device having a display panel, a display panel, a backlight, a circuit board and the like may be modularized in order to facilitate handling at the time of assembly. FIG. 6 shows a conventional mounting structure of such a display panel. In this display panel mounting structure,
The mounting frame 1, the liquid crystal display panel 2, the backlight 3, the interconnector 4 and the circuit board 5 are modularized. Of these, the mounting frame 1 is made of metal, and has a structure in which substantially L-shaped locking pieces 12 are provided at predetermined two positions on both long side portions of a rectangular frame body 11. .. The liquid crystal display panel 2 includes two glass substrates 1
A liquid crystal (not shown) is enclosed between 3 and 14, one end of the upper glass substrate 13 is projected from one end of the lower glass substrate 14, and one end of the projected upper glass substrate 13 is It has a structure in which connection terminals (not shown) are provided on the lower surface. The backlight 3 is composed of a rectangular LED (light emitting diode) panel, an EC (electric luminescence) panel, or the like, and has two connection terminals 15 on one short side. The interconnector 4 is a zebra-type connector in which conductive rubber and insulating rubber are alternately arranged to form a rectangular rod shape. The circuit board 5 has wirings (not shown) formed on both surfaces of a hard substrate body 16 made of glass epoxy, ceramics, etc., and these wirings are appropriately connected through through holes (not shown), A semiconductor chip (not shown) such as an LSI chip for driving the liquid crystal display panel 2 is mounted at a predetermined position on the lower surface of the main body 16, and a portion corresponding to each of the four locking pieces 12 of the mounting frame 1 is mounted. The substrate main body 16 has a long hole 17 and the substrate main body 16 has a circular hole 18 at a portion corresponding to the two connection terminals 15 of the backlight 3.

Next, a case where the above components are modularized will be described. In this case, first, the backlight 3 is placed on the upper surface of the circuit board 5, and the two connection terminals 15 are inserted into the circular holes 18 of the circuit board 5, respectively, and then projected from the circular holes 18. Connection terminal 1
5 is soldered to the wiring on the lower surface side of the circuit board 5. next,
The interconnector 4 is placed at a predetermined position on the upper surface of the circuit board 5, then the liquid crystal display panel 2 is placed on the upper surface of the backlight 3, and the lower surface of one end of the glass substrate 13 on the upper side of the liquid crystal display panel 2 is placed. It is placed on the upper surface of the interconnector 4. Next, the mounting frame 1 is placed on the upper surface of the liquid crystal display panel 2, and the four locking pieces 12 thereof are respectively inserted into the long holes 17 of the circuit board 5, and thereafter, an appropriate pressure is applied to the interconnector. While appropriately compressing 4, the locking pieces 12 protruding from the long holes 17 are bent. In this state, the connection terminals on the lower surface of one end portion of the upper glass substrate 13 of the liquid crystal display panel 2 are connected to the wiring on the upper surface side of the circuit board 5 via the interconnector 4. Thus, the mounting frame body 1, the liquid crystal display panel 2, the backlight 3, the interconnector 4, the circuit board 5 and the semiconductor chip are modularized.

[0004]

However, in the conventional mounting structure of such a display panel, the liquid crystal display panel 2, the backlight 3 and the interconnector 4 are connected to the hard circuit board 5 and the metal mounting frame body 1. Since the semiconductor chip is mounted on the lower surface of the circuit board 5 and the semiconductor chip is mounted on the lower surface of the circuit board 5, there is a problem that the thickness is increased and the weight is increased. Further, the connection terminals 15 of the backlight 3 are inserted into the circular holes 18 of the circuit board 5 and soldered to the wiring on the lower surface side of the circuit board 5, and the lower surface of one end portion of the glass substrate 13 on the upper side of the liquid crystal display panel 2 is Since the connection terminal is connected to the wiring on the upper surface side of the circuit board 5 via the interconnector 4 and the semiconductor chip is mounted on the lower surface of the circuit board 5, the circuit board 5 must have a double-sided wiring structure with through holes. Therefore, there is a problem that the cost of the circuit board 5 increases. An object of the present invention is to provide a mounting structure of a display panel that can be made thin and lightweight.
Another object of the present invention is to provide a display panel mounting structure in which the circuit board can have a single-sided wiring structure.

[0005]

According to the present invention, there is provided a display panel, a backlight adhered to a lower surface of the display panel, a carrier tape on which a semiconductor chip for driving the display panel is mounted, and the carrier. A flexible circuit board which is superposed on the upper surface or the lower surface of the tape and whose carrier tape connection terminals are connected to the input terminals of the carrier tape, wherein the upper surface side of the carrier tape and the flexible circuit board is Bonding to the lower surface of the backlight, connecting the connection terminal of the display panel and the output terminal of the carrier tape, connecting the connection terminal of the backlight and the connection terminal for the backlight of the flexible circuit board. is there.

[0006]

According to the present invention, since the backlight is adhered on the one obtained by stacking the carrier tape on which the semiconductor chip is mounted and the flexible circuit board, and the display panel is adhered thereon, these The parts can be modularized and can be made thinner and lighter than the conventional structure in which the liquid crystal display panel and the backlight are held between the hard circuit board and the metal mounting frame. .. In this case, since the carrier tape on which the semiconductor chip is mounted and the flexible circuit board are used, the flexible circuit board can have a single-sided wiring structure.

[0007]

1 and 2 show a mounting structure of a display panel in a first embodiment of the present invention. In this display panel mounting structure, the liquid crystal display panel 21, the backlight 22, the carrier tape 24 on which the semiconductor chip 23 is mounted, and the flexible circuit board 25 are modularized. Of these, liquid crystal display panel 2
1 is a structure similar to the conventional one, and two glass substrates 3
The liquid crystal 33 is accommodated between the first and the second 32 in a state of being sealed by the sealing member 34, one end of the upper glass substrate 31 is projected from one end of the lower glass substrate 32, and the projected upper side Connection terminal 3 on the lower surface of one end of the glass substrate 31 of
5 is provided. Backlight 22
Has a structure similar to the conventional one, and is a rectangular LED
It is composed of a panel, an EC panel or the like, and has two connection terminals 36 on one short side.

The carrier tape 24 has a tape body 41 made of a resin tape. A lead pattern made of a metal foil such as copper is formed on the outer surface of the tape body 41,
As a result, the finger lead 43 is provided so as to project in the device hole 42 formed in the central portion of the tape body 41, the output terminal 44 is provided at one end of the tape body 41, and the other end of the tape body 41 is provided. An input terminal 46 is provided so as to bridge the openings 45 formed on both sides of the part. Bump electrodes (not shown) of the semiconductor chip 23 arranged in the device holes 42 are joined to the finger leads 43 by thermocompression bonding. This joint portion is sealed by a sealing member 47 made of resin. Accordingly, L for driving the liquid crystal display panel 2
A semiconductor chip 23 composed of an SI chip or the like is mounted on the carrier tape 24. The tape body 41 has a flat plate shape before assembling, but can be easily bent at two predetermined places at the time of assembling described later. For this reason, linear openings 48 and 49 (see FIG. 1) are formed over the entire area of the tape main body 41 at predetermined two positions, and the bridged leads 50 and 51 are formed at the openings 48 and 49. Are bound by only.

In the flexible circuit board 25, the wiring is made of a metal foil such as copper on the upper surface of a substrate body 61 made of polyimide or the like, and the insulating layer 62 is formed except for a part of the flexible circuit board 25. The backlight connection terminals 63 are exposed at the portions corresponding to the two connection terminals 36 of 22, and the carrier tape connection terminals 64 are exposed at the portions corresponding to the input terminals 46 of the carrier tape 24. It is a structure provided by. As shown in FIG. 2, both ends of the substrate body 61 are bent and adhered to the lower surface of the substrate body 61 with an adhesive (not shown). Therefore, the backlight connection terminal 63 is exposed on the lower surface side of the substrate body 61.

Next, a case where the above components are modularized will be described. In this case, first, the portion of the output terminal 44 of the flat tape body 41 of the carrier tape 24 and the portion of the connection terminal 35 of the glass substrate 31 on the upper side of the liquid crystal display panel 21 are sandwiched between the anisotropic conductive adhesive. The two terminals 44 and 35 are connected and the parts of both terminals 44 and 35 are bonded together by thermocompression bonding with 71 interposed. Next, the lower surface of the flat tape main body 41 of the carrier tape 24 and the upper surface of the substrate main body 61 of the flexible circuit board 25 are overlapped, and the input terminal 46 of the tape main body 41 and the carrier tape connection terminal 64 of the substrate main body 61 are formed. Are joined to one of them via solder plating (not shown) which is applied in advance.
Next, a guide plate 72 made of resin is adhered to the surface of the carrier tape 24 on the opposite side of the output terminal 44 of the flat tape body 41 via the double-sided adhesive tape 73. The guide plate 72 is used for the carrier tape 24 as described later.
This is for facilitating bending at two predetermined places. Next, the glass substrate 3 below the liquid crystal display panel 21.
The lengthwise both ends of the lower surface of 2 and the lengthwise both ends of the upper surface of the backlight 22 are adhered to each other via the double-sided adhesive tape 74.

Next, the tape body 4 of the carrier tape 24
1 along the predetermined side surface of the guide plate 72, the leads 50 and 51 in the two openings 48 and 49 of the tape body 41 are bent at the upper and lower edges of the predetermined side surface of the guide plate 72, and then, The predetermined surface of the tape body 41 and the predetermined surface of the semiconductor chip 23 are bonded to the lower surface of the backlight 22 via the double-sided adhesive tape 75. In this state, as shown in FIG. 1, the flexible circuit board 25 is superposed on the lower surface of the carrier tape 24 adhered to the lower surface of the backlight 22. Here, as shown in FIG. 1, an escape hole 76 for escaping the semiconductor chip 23 is formed at a predetermined portion of the flexible circuit board 25. Next, the two connection terminals 36 of the backlight 22 are bent along one edge of the flexible circuit board 25, and the two bent connection terminals 36 are soldered to the backlight connection terminals 63 of the flexible circuit board 25. Attach. Thus, the liquid crystal display panel 21 and the backlight 2
2. Carrier tape 24 with semiconductor chip 23 mounted
And the flexible circuit board 25 is modularized.

As described above, in this display panel mounting structure, the backlight 22 is adhered to the lower surface of the liquid crystal display panel 21, and the carrier tape 24 having the semiconductor chip 23 mounted thereon is adhered to the lower surface of the backlight 22. Since the flexible circuit board 25 is superposed on the lower surface of the tape 24, these parts can be modularized, and the liquid crystal display panel and the backlight can be held between the hard circuit board and the metal mounting frame. It can be made thinner and lighter than the conventional structure. Further, a carrier tape 24 on which the semiconductor chip 23 is mounted
Therefore, it is not necessary to mount the semiconductor chip 23 on the flexible circuit board 25, and even if wiring is formed only on the upper surface of the flexible circuit board 25, the end portion is bent to form the lower surface of the flexible circuit board 25. The backlight connection terminal 63 can be disposed on the side, so that the flexible circuit board 25 can have a single-sided wiring structure, and thus the flexible circuit board 2 can be formed.
The cost of 5 can be reduced.

In the above embodiment, the backlight 22 is used.
Although the carrier tape 24 having the semiconductor chip 23 mounted thereon is adhered to the lower surface of the above and the flexible circuit board 25 is superposed on the lower surface of the carrier tape 24, the present invention is not limited to this. For example, as shown in FIGS. 3 and 4, in which parts having the same names as those in FIGS. 1 and 2 have the same reference numerals, the flexible circuit board 2 is provided on the lower surface of the backlight 22.
Alternatively, the carrier tape 24 having the semiconductor chip 23 mounted thereon may be superposed on the lower surface of the flexible circuit board 25 by bonding 5 to each other. However, in this case, wiring is formed only on the lower surface of the flexible circuit board 25, and the connection terminals 36 of the backlight 22 are inserted into the circular holes 81 formed in the flexible circuit board 25 to allow the flexible circuit board 2 to be inserted.
5 is soldered to the backlight connection terminal 63 provided on the lower surface of the device 5.

Further, in the above embodiment, the carrier tape 2
Although the guide plate 72 is used in order to facilitate the bending at the predetermined two places of No. 4, it is not limited to this. For example, as shown in FIG. 5 in which parts having the same names as those in FIG. 2 have the same reference numerals, a resin case of the backlight 22 is provided to facilitate bending of the carrier tape 24 at two predetermined positions. The guide portion 82 may be integrally provided by molding or the like.

[0015]

As described above, according to the present invention, the backlight is adhered on the carrier tape having the semiconductor chip mounted thereon and the flexible circuit board, and the display panel is mounted thereon. Since they are adhered, the liquid crystal display panel and the backlight can be made thinner and lighter than the conventional structure in which the hard circuit board and the metal mounting frame sandwich the same. Also,
Since the carrier tape on which the semiconductor chip is mounted and the flexible circuit board are used, the flexible circuit board can have a single-sided wiring structure, and thus the cost of the flexible circuit board can be reduced.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a display panel mounting structure according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of the first embodiment.

FIG. 3 is a cross-sectional view of a display panel mounting structure according to a second embodiment of the present invention.

FIG. 4 is an exploded perspective view of the second embodiment.

FIG. 5 is an exploded perspective view of a display panel mounting structure according to a third embodiment of the present invention.

FIG. 6 is an exploded perspective view of a conventional display panel mounting structure.

[Explanation of symbols]

 21 liquid crystal display panel 22 backlight 23 semiconductor chip 24 carrier tape 25 flexible circuit board

Claims (2)

[Claims] 1. A display panel, a backlight adhered to a lower surface of the display panel, a carrier tape on which a semiconductor chip for driving the display panel is mounted, and an upper surface or a lower surface of the carrier tape. ,
A flexible circuit board having the carrier tape connection terminal connected to an input terminal of the carrier tape, wherein one of the carrier tape and the flexible circuit board on the upper surface side is bonded to the lower surface of the backlight. A mounting structure of a display panel, wherein a connection terminal of the display panel is connected to an output terminal of the carrier tape, and a connection terminal of the backlight is connected to a connection terminal for backlight of the flexible circuit board. 2. The display panel mounting structure according to claim 1, wherein the flexible circuit board has a single-sided wiring structure.