JP3250000B2 - Terminal connection structure of liquid crystal display panel and terminal connection method - Google Patents
Terminal connection structure of liquid crystal display panel and terminal connection methodInfo
- Publication number
- JP3250000B2 JP3250000B2 JP12495795A JP12495795A JP3250000B2 JP 3250000 B2 JP3250000 B2 JP 3250000B2 JP 12495795 A JP12495795 A JP 12495795A JP 12495795 A JP12495795 A JP 12495795A JP 3250000 B2 JP3250000 B2 JP 3250000B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal display
- display panel
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
Description
【0001】[0001]
【産業上の利用分野】この発明はTCP(Tape Carrier
Package以下単にTCPという)、FPC(Flexible P
rinted Circuit以下単にFPCという)のようなフレキ
シブル回路基板の電極端子と液晶表示パネルの電極端子
との接続技術に関するものである。This invention relates to a TCP (Tape Carrier).
Package, hereinafter simply referred to as TCP), FPC (Flexible P
The present invention relates to a technique for connecting electrode terminals of a flexible circuit board such as a rinted circuit (hereinafter simply referred to as FPC) to electrode terminals of a liquid crystal display panel.
【0002】[0002]
【従来の技術】高度情報化社会の発展にともない液晶表
示パネルの分野の技術の進歩はめざましいものがある。
さらに近年液晶表示パネルの大型化、高精度化、高信頼
性化にともないその端子接続部の機械的な強度の向上、
および位置合わせ精度が非常に大きな課題となってきて
いる。以下に従来の液晶パネルの端子接続方法を説明す
る。2. Description of the Related Art With the development of a highly information-oriented society, there have been remarkable technological advances in the field of liquid crystal display panels.
In addition, with the recent increase in size, precision, and reliability of liquid crystal display panels, the mechanical strength of their terminal connections has been improved,
In addition, positioning accuracy has become a very important issue. Hereinafter, a conventional method of connecting terminals of a liquid crystal panel will be described.
【0003】図6は従来の液晶表示パネルの上面説明図
である。図において1は液晶パネルを構成するガラス基
板で、その外縁には多数の端子電極2がたとえばITO
(Indium Tin Oxside)、Cr、Alなどで形成されてい
る。3はポリイミドなどの樹脂フィルムに銅箔でパター
ンを形成し、駆動用LSI4を搭載したTCPである。
5は液晶パネルの電極端子2とTCP3とを接着させる
ために用いられる異方導電性接着剤である。また6はT
CP3に信号を入力させるための外部プリント基板であ
る。FIG. 6 is an explanatory top view of a conventional liquid crystal display panel. In the figure, reference numeral 1 denotes a glass substrate constituting a liquid crystal panel, and a plurality of terminal electrodes 2 are formed on its outer edge, for example, by ITO
(Indium Tin Oxside), Cr, Al or the like. Reference numeral 3 denotes a TCP in which a pattern is formed on a resin film of polyimide or the like with a copper foil and a driving LSI 4 is mounted.
Reference numeral 5 denotes an anisotropic conductive adhesive used for bonding the electrode terminal 2 of the liquid crystal panel to the TCP 3. 6 is T
This is an external printed board for inputting a signal to CP3.
【0004】ここで用いる異方導電性接着剤は主として
エポキシ系の絶縁性の熱硬化性成分の接着剤中に導電性
の粒子を混合させて含むものが多い。The anisotropic conductive adhesive used here often contains an epoxy-based insulating thermosetting component adhesive mixed with conductive particles.
【0005】導電性の粒子としてはプラスチック粒子に
Ni/Auをコートした直径5〜12μmのもの、金属
Ni粒子、またはハンダボール(直径約10μm)のよ
うなものがある。[0005] The conductive particles include plastic particles coated with Ni / Au having a diameter of 5 to 12 µm, metallic Ni particles, and solder balls (about 10 µm in diameter).
【0006】異方導電性という意味は3次元的にみてた
とえばXY方向には絶縁性、Z方向には導電性を示すこ
とを意味している。液晶表示パネルに用いる端子電極の
ようにその端子間ピッチが小さいために多数の端子電極
が近接しているばあいに従来のハンダ付けのような接続
方法を用いると、端子電極間でブリッジが生じてXYZ
方向の3方向ともショートしてしまうことがある。The meaning of anisotropic conductivity means that, for example, when viewed three-dimensionally, it exhibits insulating properties in the XY directions and conductivity in the Z directions. When a large number of terminal electrodes are close to each other due to the small pitch between the terminals, such as the terminal electrodes used in liquid crystal display panels, a bridge occurs between the terminal electrodes if a conventional connection method such as soldering is used. XYZ
In some cases, a short circuit may occur in all three directions.
【0007】異方導電性接着剤を用いるとZ方向、すな
わち、ここでのばあいのように液晶パネルの各電極と、
対応するTCPの各電極とをそれぞれ接続する方向にし
か導通が生じないので、液晶パネルの分野では大変有利
である。When the anisotropic conductive adhesive is used, each electrode of the liquid crystal panel is in the Z direction, that is, as in this case,
Since conduction occurs only in the direction in which each electrode of the corresponding TCP is connected, this is very advantageous in the field of liquid crystal panels.
【0008】また図7の上面説明図に示すように駆動用
LSI4が外部プリント基板6上にたとえばワイヤーボ
ンディング法、フリップチップ法などで搭載され、この
プリント基板と液晶表示パネルとを、ポリイミドの樹脂
フィルムに銅箔でパターン形成したFPC7を介して異
方導電性接着剤5で接続する方法も存在する。As shown in the top view of FIG. 7, a driving LSI 4 is mounted on an external printed circuit board 6 by, for example, a wire bonding method, a flip chip method, or the like. There is also a method of connecting the film with an anisotropic conductive adhesive 5 via an FPC 7 patterned with a copper foil.
【0009】接続方法としては、異方導電性接着剤を液
晶パネル上またはTCP上に貼り付けたのちTCP3ま
たはFPC7上に形成された電極端子もしくはアライメ
ントマークと、液晶表示パネルのガラス基板1上の電極
端子もしくはアライメントマークとを正確に位置合わせ
し、加熱加圧ツールでTCP側より熱圧着する方法が一
般的である。加熱加圧ツールとは請求項の表現における
熱圧着ツールを意味するものである。As a connection method, an anisotropic conductive adhesive is adhered on a liquid crystal panel or a TCP and then electrode terminals or alignment marks formed on a TCP 3 or an FPC 7 and on a glass substrate 1 of a liquid crystal display panel. In general, a method of accurately aligning an electrode terminal or an alignment mark, and performing thermocompression bonding from the TCP side with a heating and pressing tool. The heating and pressing tool means a thermocompression bonding tool in the expression of the claims.
【0010】加熱加圧ツールは、被圧着物をツールの圧
力面と定盤などとで上下からはさみこむ形で、加熱しな
がらエアシリンダなどを用いて圧力をかけることができ
るものである。The heating and pressurizing tool can apply pressure by using an air cylinder or the like while heating, in such a manner that an object to be pressed is sandwiched from above and below by a pressure surface of the tool and a surface plate or the like.
【0011】ツールの、被圧着物に当接させる面である
その圧力面の平行度、平坦度は均一な熱圧着のために重
要であるのでツールの上面に押ねじ、引ねじをならべて
配置し、その平行度、平坦度を調節することができる。Since the parallelism and flatness of the pressure surface of the tool, which is the surface to be brought into contact with the object to be crimped, is important for uniform thermocompression bonding, a set screw and a set screw are arranged on the upper surface of the tool. The degree of parallelism and flatness can be adjusted.
【0012】[0012]
【発明が解決しようとする課題】しかしながら、従来の
方法ではTCPと液晶表示パネルとはTCPの片面側で
しか接着されていない。図8の、TCPと液晶パネルと
の接続部の断面図に示すように、TCPの端子電極のピ
ッチが微細化してくるとエポキシ系の接着剤9などを用
いてポリイミドフィルム8上に銅箔を接着して形成され
ているフレキシブル回路基板の端子電極10とポリイミ
ドフィルム8との接着面積が減少してくるため、端子電
極の接着強度は急激に低下してポリイミドフィルムに剥
離力が加わると接着剤9および端子電極10間で簡単に
剥離が発生するという強度的に問題のある構造のものし
かえられなかった。また、電子回路技術の高精細化にと
もない端子電極のピッチが微細化してきているので、T
CPの製作精度、TCPの端子電極と液晶表示パネルの
端子電極との位置合わせ精度はもちろんのこと、熱圧着
時におけるTCPの熱膨張のばらつきによる端子間のず
れが無視できなくなってくる。本願発明者の実験による
と幅35mmのTCPの熱圧着時における長さ方向の熱
膨張量は60μm〜100μmとなり、熱圧着時におけ
る熱膨張量のばらつきが40μmにもなる。ばらつきが
大きいのは加熱加圧ツールの平坦度が一様でないことに
起因する。すなわち圧力が充分にかかる部分はTCPの
熱によるのびは小さく、圧力が不充分にしかかからない
部分は逆にのびは大きいということによる。このばらつ
きが大きいという欠点を防ぐための有効な方法として、
たとえば特開平5−95021号明細書および特開平5
−249479号明細書に開示される発明においてはT
CPの端子電極部にスリットをいれて熱圧着時に生じる
熱膨張量による液晶表示パネルの端子電極とのズレをス
リットの部分で吸収する方法が提案されている。しかし
この方法では熱圧着時にスリットを通して異方導電性接
着剤が流出して加熱加圧ツールに付着することにより加
熱加圧ツールの平坦度が損なわれ良好な圧着ができなく
なる。また加熱加圧ツールとTCPとのあいだに緩衝材
を挟む方法がある。緩衝材は厚さ0.2〜0.4mm程
度のシリコーンゴムを短冊状にしたものを加熱加圧ツー
ルに治具を装着して使用し、圧力のかかり方を一様にす
るものである。However, in the conventional method, the TCP and the liquid crystal display panel are bonded only on one side of the TCP. As shown in the sectional view of the connection portion between the TCP and the liquid crystal panel in FIG. 8, when the pitch of the terminal electrodes of the TCP becomes finer, a copper foil is formed on the polyimide film 8 using an epoxy-based adhesive 9 or the like. Since the bonding area between the terminal electrode 10 of the flexible circuit board formed by bonding and the polyimide film 8 is reduced, the bonding strength of the terminal electrode is rapidly reduced, and when a peeling force is applied to the polyimide film, the bonding strength is reduced. Only a structure having a problem in terms of strength, in which peeling easily occurs between the terminal electrode 9 and the terminal electrode 10, was obtained. In addition, the pitch of terminal electrodes is becoming finer as the electronic circuit technology becomes higher definition.
Not only the manufacturing accuracy of the CP, the positioning accuracy of the terminal electrodes of the TCP and the terminal electrodes of the liquid crystal display panel, but also the deviation between the terminals due to variations in the thermal expansion of the TCP during thermocompression bonding cannot be ignored. According to the experiment of the inventor of the present invention, the amount of thermal expansion in the length direction of the 35 mm wide TCP during thermocompression bonding is 60 μm to 100 μm, and the variation in the amount of thermal expansion during thermocompression bonding is as large as 40 μm. The large variation is due to the unevenness of the flatness of the heating and pressing tool. That is, the portion to which the pressure is sufficiently applied has a small spread due to the heat of the TCP, and the portion to which the pressure is insufficiently applied has a large spread. As an effective method to prevent the disadvantage that this variation is large,
For example, JP-A-5-95021 and JP-A-5-95021
In the invention disclosed in US Pat.
There has been proposed a method in which a slit is formed in a terminal electrode portion of a CP and a deviation from a terminal electrode of a liquid crystal display panel due to an amount of thermal expansion generated during thermocompression is absorbed by the slit portion. However, in this method, the anisotropic conductive adhesive flows out through the slit during thermocompression and adheres to the heating / pressing tool, so that the flatness of the heating / pressing tool is impaired and good crimping cannot be performed. Also there is a method of sandwiching the cushioning material's love between heating and pressing tool and TCP. As the cushioning material, a strip of silicone rubber having a thickness of about 0.2 to 0.4 mm is used by attaching a jig to a heating and pressing tool to make the pressure uniform.
【0013】しかし、異方導電性接着剤が緩衝材に密着
し緩衝材が破れることもあり、使用上の問題があった。
またFPCを使用するばあいについてもTCPを使用す
るばあいと全く同じ問題があった。[0013] However, the anisotropic conductive adhesive comes into close contact with the cushioning material, and the cushioning material may be broken, thus causing a problem in use.
Also, when using FPC, there is exactly the same problem as when using TCP.
【0014】本発明の目的はかかる問題点を解決し、高
強度でかつ位置ズレの生じない液晶表示パネルの端子接
続構造およびその端子接続方法を提供することにある。An object of the present invention is to solve the above problems, the terminal contact of the liquid crystal display panel that does not cause high strength and positional deviation
SUMMARY OF THE INVENTION An object of the present invention is to provide a connection structure and a method of connecting terminals thereof .
【0015】[0015]
【課題を解決するための手段】本発明の目的を達成する
ために、本発明の液晶表示パネルの端子接続構造は、液
晶表示パネルの電極端子とフレキシブル回路基板の電極
端子との接続に用いる異方導電性接着剤を用いて、前記
液晶表示パネルの電極端子および前記フレキシブル回路
基板および該フレキシブル回路基板上に設置される補強
材を熱圧着により同時に接着して一体として形成してお
り、前記フレキシブル回路基板における端子電極部の前
記電極端子間に、前記熱圧着時に溶融した異方導電性接
着剤が前記フレキシブル回路基板と前記補強材とのあい
だに向けて流出する位置にスリットが少なくとも1箇所
以上形成されてなることを特徴とする。In order to achieve the object of the present invention, a terminal connection structure of a liquid crystal display panel according to the present invention has a different structure used for connection between an electrode terminal of the liquid crystal display panel and an electrode terminal of a flexible circuit board. The electrode terminal of the liquid crystal display panel and the flexible circuit board and a reinforcing material provided on the flexible circuit board are simultaneously bonded by thermocompression bonding using a conductive adhesive to form an integral unit. An anisotropic conductive contact melted during the thermocompression bonding between the electrode terminals of the terminal electrode portion on the circuit board.
An adhesive is applied between the flexible circuit board and the reinforcing material.
At least one slit at the location where it flows out
It is characterized by being formed as described above .
【0016】なお、このときに使用する補強材として熱
圧着時にツールとTCPとのあいだにはさんで使用する
緩衝材を用いてもよい。As a reinforcing material used at this time, a cushioning material used between the tool and the TCP during thermocompression bonding may be used.
【0017】また、本発明の液晶表示パネルの端子接続
方法は、液晶表示パネルの電極端子に異方導電性接着剤
を貼り付け、この異方導電性接着剤上に複数のフレキシ
ブル回路基板を所定の隙間を隔てて配置したのち、前記
複数のフレキシブル回路基板上に補強材を設けて前期液
晶表示パネルと前記補強材でもって前記フレキシブル回
路基板を挟み込み、この状態で前記フレキシブル回路基
板の電極端子を接続させるとともに、前記異方導電性接
着剤を加熱し溶解させて、前記隙間から流出した異方導
電性接着剤によって前記補強材を前記液晶表示パネルに
接着することを特徴とする。Further , the terminal connection of the liquid crystal display panel of the present invention.
The method uses anisotropic conductive adhesive on the electrode terminals of the liquid crystal display panel.
Affixing multiple flex on this anisotropic conductive adhesive.
After arranging the circuit board with a predetermined gap,
Provide a reinforcing material on multiple flexible circuit boards and
Crystal display panel and the reinforcing member
Circuit board, and in this state the flexible circuit board
While connecting the electrode terminals of the plate, the anisotropic conductive contact
The adhesive is heated and dissolved, and the anisotropic conductive
The reinforcing material is attached to the liquid crystal display panel by an electrically conductive adhesive.
It is characterized by bonding .
【0018】[0018]
【作用】端子電極部のベースフィルム上にスリットを設
けたTCPやFPCを用いることにより、熱圧着時に溶
融した異方導電性接着剤がスリットのあいだから流出
し、TCPまたはFPCの上に載せていた補強材との隙
間にも接着剤がしみこむことによって、補強材をも接着
させるので結局TCPまたはFPCは液晶表示パネルと
補強材とに挟まれて上下方向から接着されるようにな
る。By using TCP or FPC having a slit formed on the base film of the terminal electrode portion, the anisotropic conductive adhesive melted at the time of thermocompression bonding flows out between the slits and is placed on the TCP or FPC. When the adhesive penetrates into the gap between the reinforcing member and the reinforcing member, the reinforcing member is also bonded, so that the TCP or the FPC is eventually sandwiched between the liquid crystal display panel and the reinforcing member and adheres from above and below.
【0019】また、加熱加圧ツールを用いて異方導電性
接着剤を硬化、接着させるばあいに加熱加圧ツールの下
にひく緩衝材を補強材として用いることにより、補強材
を緩衝材とは別に準備する必要がなくなる。Further, when the anisotropic conductive adhesive is cured and bonded by using a heating and pressing tool, a buffering material drawn under the heating and pressing tool is used as a reinforcing material, so that the reinforcing material is used as a buffering material. There is no need to prepare separately.
【0020】[0020]
【0021】[0021]
【実施例】本発明の実施例を図面を参照して説明する。An embodiment of the present invention will be described with reference to the drawings.
【0022】実施例1 図1は本発明の液晶表示パネルへのTCPの接続方法を
示す上面説明図である。あらかじめ、液晶表示パネル1
の端子電極部2に異方導電性接着剤を貼り付けておく。
異方導電性接着剤は普通は幅1.5〜3.0mm程度の
テープ状態で、両面接着テープにおけるようなセパレー
タをはさんだかたちで供給されるものを用いることがで
きる。11は端子電極部の電極端子間に少なくとも1箇
所以上スリット14を形成させたTCPである(実施例
の説明において以下単にTCPという)。TCPにスリ
ットを形成する方法としては、(1)機械的切削、
(2)化学的エッチング(3)レーザー切削などの加工
方法が挙げられる。このスリットを形成するにあたって
は液晶駆動用LSI4をフィルムキャリアに搭載する前
でも後でもとくに問題はない。TCPはTCP吸着ノズ
ルにて吸着し、液晶表示パネルの下方からカメラで各々
のアライメントマークを見ながら位置合わせを行う。位
置合わせが完了したところで吸着ノズルを下降させ、T
CPと液晶表示パネルが異方導電性接着剤のタック力で
仮接続される。Embodiment 1 FIG. 1 is an explanatory top view showing a method for connecting a TCP to a liquid crystal display panel according to the present invention. Liquid crystal display panel 1
An anisotropic conductive adhesive is adhered to the terminal electrode portion 2 of FIG.
The anisotropic conductive adhesive is usually in the form of a tape having a width of about 1.5 to 3.0 mm, and can be used provided with a separator as in a double-sided adhesive tape. Reference numeral 11 denotes a TCP in which at least one or more slits 14 are formed between the electrode terminals of the terminal electrode portion (hereinafter simply referred to as TCP in the description of the embodiment). Methods for forming a slit in TCP include (1) mechanical cutting,
(2) Chemical etching (3) Processing methods such as laser cutting. In forming this slit, there is no particular problem before or after the liquid crystal driving LSI 4 is mounted on the film carrier. The TCP is sucked by a TCP suction nozzle, and alignment is performed while viewing each alignment mark with a camera from below the liquid crystal display panel. When the positioning is completed, the suction nozzle is lowered and T
The CP and the liquid crystal display panel are temporarily connected by the tack force of the anisotropic conductive adhesive.
【0023】ここでいうタック力とは異方導電性接着材
が常温で弱い粘着性を有している粘着力のことを意味す
る。The term "tack force" as used herein means an adhesive force at which the anisotropic conductive adhesive has low tackiness at room temperature.
【0024】このタック力は温度を60〜80℃に上げ
ると粘着力が大きくなり、TCPがはずれることはなく
なる。When the temperature is increased to 60 to 80 ° C., the tack force increases, and the TCP does not come off.
【0025】12はTCPの上面にのせられた補強材で
ある。補強材の表面は±5μm以内程度の平坦度を要求
される。したがって補強材の材質は平坦度が出ており、
かつ300度程度の耐熱性があるものがよく、シリコー
ンゴム、ガラス、セラミックスなどが用いられる。また
その形状は図1で示すような短冊状のものが望ましく、
厚さは、加熱加圧ツールの熱が異方導電性接着剤に伝わ
り易いように0.2〜1mm程度のものがよい。補強材
を短冊状に加工する方法としては超硬合金やダイアモン
ドの歯を用いたカッターによる機械的な切断が最も安価
で望ましい。補強材をTCP上に載せる方法としては、
補強材を吸着ノズルで吸着しTCPのエッジをカメラで
認識させながらTCPと位置合せして載せる方法が望ま
しい。Numeral 12 is a reinforcing material placed on the upper surface of the TCP. The surface of the reinforcing material is required to have a flatness of about ± 5 μm or less. Therefore, the material of the reinforcement is flat.
Further, those having heat resistance of about 300 degrees are preferable, and silicone rubber, glass, ceramics and the like are used. The shape is preferably a strip shape as shown in FIG.
The thickness is preferably about 0.2 to 1 mm so that the heat of the heating and pressing tool is easily transmitted to the anisotropic conductive adhesive. As a method of processing the reinforcing material into a strip shape, mechanical cutting by a cutter using cemented carbide or diamond teeth is the most inexpensive and desirable. As a method of placing the reinforcing material on the TCP,
It is desirable to use a method in which the reinforcing material is suctioned by a suction nozzle and placed in alignment with TCP while the edge of TCP is recognized by a camera.
【0026】加熱加圧ツールの圧力面は幅2〜3.5m
m、長さ300〜350mmであり、材質としては熱伝
導がよく熱膨張係数の小さい、たとえばPSL、SKD
(超硬合金の一種)SUS 304ステンレスなどが適
している。加熱加圧の条件はおよそ温度250〜300
℃、圧力20〜40kgf/cm2、時間20〜30秒
である。The pressure surface of the heating and pressing tool has a width of 2 to 3.5 m.
m, length of 300 to 350 mm, and high thermal conductivity and small thermal expansion coefficient as the material, for example, PSL, SKD
(One kind of cemented carbide) SUS 304 stainless steel or the like is suitable. The condition of heating and pressing is about 250-300 temperature.
C., pressure 20 to 40 kgf / cm 2 , time 20 to 30 seconds.
【0027】補強材がTCP上に載せられたのち緩衝材
をその上に載せ、さらに加熱加圧ツールの圧力面が下降
して緩衝材に当接させられ、加熱加圧すると、図2の断
面説明図に示すように溶融した異方導電性接着材5がス
リットのあいだおよびTCPの両側から流出しTCP1
1と液晶表示パネルの端子電極部間だけでなく、液晶表
示パネルおよび補強材ならびにTCPおよび補強材とも
一体として接着され、結局TCPは上下から接着される
ようになる。After the reinforcing material is placed on the TCP, the cushioning material is placed thereon, and the pressure surface of the heating and pressing tool is further lowered to abut against the buffering material. As shown in the explanatory diagram, the melted anisotropic conductive adhesive 5 flows out between the slits and from both sides of the TCP and the TCP 1
The liquid crystal display panel and the reinforcing material, as well as the TCP and the reinforcing material, are integrally bonded not only between the terminal 1 and the terminal electrode portion of the liquid crystal display panel, but eventually the TCP is bonded from above and below.
【0028】このようにして一回の熱圧着で全ての接着
を完了するので位置ズレが生じることなく高強度の端子
接続が可能となった。In this way, all bonding is completed by one thermocompression bonding, so that a high-strength terminal connection can be made without any displacement.
【0029】熱圧着時に発生するTCPの熱膨張による
電極端子全体の伸びはTCPの電極端子間に形成された
スリットにより分割された各ブロックの熱膨張の和にな
る。The expansion of the entire electrode terminal due to the thermal expansion of the TCP generated during thermocompression bonding is the sum of the thermal expansion of each block divided by the slit formed between the electrode terminals of the TCP.
【0030】よって各ブロックの両端のズレはスリット
によって伸びが分割されるのでそのズレ量はスリットを
入れていないばあいのTCPの両側に現れるズレ量より
もはるかに小さくなるのでズレによる接続不良は生じな
い。Therefore, the displacement at both ends of each block is divided by the slit, and the amount of displacement is much smaller than the amount of displacement on both sides of the TCP when no slit is formed. Absent.
【0031】実施例2 図3は本発明の第2の実施例を示す断面説明図である。Embodiment 2 FIG. 3 is an explanatory sectional view showing a second embodiment of the present invention.
【0032】12は補強材であるが図で示すように、従
来は加熱加圧ツール13とTCP11のあいだに入れる
緩衝材を実施例1における補強材の代わりに補強材とし
て用いる。Numeral 12 denotes a reinforcing material. As shown in the figure, a buffering material inserted between the heating and pressing tool 13 and the TCP 11 is conventionally used as a reinforcing material instead of the reinforcing material in the first embodiment.
【0033】緩衝材と補強材とを両方とも用いて加熱加
圧ツールで熱圧着すると液晶表示素子に当接する面の平
坦度がわるくなることがあるが、この問題を解消するこ
とができる。When the thermocompression bonding is performed with a heating and pressing tool using both the buffer material and the reinforcing material, the flatness of the surface in contact with the liquid crystal display element may be deteriorated. However, this problem can be solved.
【0034】参考例 図4は本発明の参考例を示す断面説明図である。 Reference Example FIG. 4 is an explanatory sectional view showing a reference example of the present invention.
【0035】13は液晶表示素子とTCPとを熱圧着さ
せるための加熱加圧ツールであるが、図5の斜視図で示
すように圧着面に真空吸着孔を設けておく。吸着孔の大
きさはツール幅より小さければよくまたその形状は丸形
でも角形でもよくとくに問わない。この加熱加圧ツール
に緩衝材12を真空吸着させたのち、熱圧着させる。熱
圧着終了後、加熱加圧ツール13の真空吸着を解除した
のちにツールの圧力面を上昇させる。Reference numeral 13 denotes a heating / pressing tool for thermocompression-bonding the liquid crystal display element and the TCP. As shown in the perspective view of FIG. 5, a vacuum suction hole is provided on the crimping surface. The size of the suction hole may be smaller than the tool width, and its shape may be round or square. After the buffer material 12 is vacuum-adsorbed to the heating / pressing tool, thermocompression bonding is performed. After the completion of the thermocompression bonding, the vacuum surface of the heating and pressing tool 13 is released, and then the pressure surface of the tool is raised.
【0036】[0036]
【発明の効果】本発明は、以上説明したように構成され
ているので、以下に記載されたような効果を奏する。Since the present invention is configured as described above, it has the following effects.
【0037】液晶表示パネルの電極端子とTCP、FP
Cなどのフレキシブル回路基板の電極端子との、異方導
電性接着材を用いた接続において、フレキシブル基板が
液晶パネルと補強材の両面からはさまれて接着されてい
るので、フレキシブル基板の剥離強度が向上するため信
頼性の高い接続を実現させることができる。Electrode terminals of liquid crystal display panel, TCP, FP
In connection with an electrode terminal of a flexible circuit board such as C using an anisotropic conductive adhesive, since the flexible board is bonded and sandwiched from both sides of the liquid crystal panel and the reinforcing material, the peel strength of the flexible board is And a highly reliable connection can be realized.
【0038】またフレキシブル基板の上に貼り付けられ
る補強材として、フレキシブル基板と液晶表示パネルと
を異方導電性接着剤に熱圧着させる際に用いられる加熱
加圧ツールの緩衝材を用いることにより、新たに補強材
を準備する必要がなくなり製品のコストを下げることが
できる。As a reinforcing material to be attached on the flexible substrate, a buffer material of a heating / pressing tool used when the flexible substrate and the liquid crystal display panel are thermocompression bonded to an anisotropic conductive adhesive is used. It is not necessary to prepare a new reinforcing material, and the cost of the product can be reduced.
【0039】緩衝材と補強材とを両方とも用いて加熱加
圧ツールで熱圧着すると液晶表示素子に当接する面の平
坦度がわるくなることがあるが、この問題を解消するこ
とができる。When both the cushioning material and the reinforcing material are used and thermocompression bonding is performed by a heating and pressing tool, the flatness of the surface in contact with the liquid crystal display element may be deteriorated. However, this problem can be solved.
【0040】[0040]
【図1】本発明の第1の実施例を示した上面説明図であ
る。FIG. 1 is an explanatory top view showing a first embodiment of the present invention.
【図2】本発明の第1の実施例のフレキシブル基板と液
晶パネルの接続部の断面説明図である。FIG. 2 is an explanatory sectional view of a connection portion between the flexible substrate and the liquid crystal panel according to the first embodiment of the present invention.
【図3】本発明の第2の実施例を示した断面説明図であ
る。FIG. 3 is an explanatory sectional view showing a second embodiment of the present invention.
【図4】本発明の参考例を示した断面説明図である。FIG. 4 is an explanatory sectional view showing a reference example of the present invention.
【図5】本発明の参考例を実行するための加熱加圧ツー
ルの斜射図である。FIG. 5 is an oblique view of a heating and pressing tool for carrying out a reference example of the present invention.
【図6】従来技術による例を示した上面説明図である。FIG. 6 is an explanatory top view showing an example according to the related art.
【図7】従来技術による例を示した上面説明図である。FIG. 7 is an explanatory top view showing an example according to the related art.
【図8】従来技術による例のフレキシブル基板と液晶パ
ネル接続部の断面図である。FIG. 8 is a sectional view of a connection portion between a flexible substrate and a liquid crystal panel in an example according to the related art.
1 ガラス基板 2 液晶パネルの端子電極 3 TCP 4 駆動用LSI 5 異方導電性接着剤 6 外部プリント基板 7 FPC 8 ポリイミドフィルム 9 接着剤 10 フレキシブル基板の端子電極 11 端子電極間にスリットを形成させたTCP 12 補強材 13 加熱加圧ツール 14 スリット部 Reference Signs List 1 glass substrate 2 terminal electrode of liquid crystal panel 3 TCP 4 driving LSI 5 anisotropic conductive adhesive 6 external printed circuit board 7 FPC 8 polyimide film 9 adhesive 10 terminal electrode of flexible substrate 11 slit formed between terminal electrodes TCP 12 Reinforcement 13 Heat and pressure tool 14 Slit
フロントページの続き (56)参考文献 特開 平3−175427(JP,A) 特開 平6−202136(JP,A) 特開 昭50−68356(JP,A) 特開 平4−263220(JP,A) 特開 平4−324949(JP,A) 特開 平5−188389(JP,A) 特開 昭56−161586(JP,A) 特開 平8−234222(JP,A) 特開 平8−213721(JP,A) 特開 平7−175077(JP,A) 特開 平5−281564(JP,A) 実開 昭63−130733(JP,U) (58)調査した分野(Int.Cl.7,DB名) G02F 1/1345 Continuation of front page (56) References JP-A-3-175427 (JP, A) JP-A-6-202136 (JP, A) JP-A-50-68356 (JP, A) JP-A-4-263220 (JP) JP-A-4-324949 (JP, A) JP-A-5-188389 (JP, A) JP-A-56-161586 (JP, A) JP-A-8-234222 (JP, A) 8-213721 (JP, A) JP-A-7-175077 (JP, A) JP-A-5-281564 (JP, A) JP-A-63-130733 (JP, U) (58) Fields investigated (Int. Cl. 7, DB name) G02F 1/1345
Claims (3)
ル回路基板の電極端子との接続に用いる異方導電性接着
剤を用いて、前記液晶表示パネルの電極端子および前記
フレキシブル回路基板および該フレキシブル回路基板上
に設置される補強材を熱圧着により同時に接着して一体
として形成しており、前記フレキシブル回路基板におけ
る端子電極部の前記電極端子間に、前記熱圧着時に溶融
した異方導電性接着剤が前記フレキシブル回路基板と前
記補強材とのあいだに向けて流出する位置にスリットが
少なくとも1箇所以上形成されてなることを特徴とする
液晶表示パネルの端子接続構造。1. An electrode terminal of the liquid crystal display panel, the flexible circuit board, and the flexible circuit board, using an anisotropic conductive adhesive used for connection between the electrode terminal of the liquid crystal display panel and the electrode terminal of the flexible circuit board. forms integrally bonded simultaneously by thermocompression reinforcements installed above, between the electrode terminals of the terminal electrode portions of the flexible circuit board, melted during the thermal bonding
The anisotropic conductive adhesive is in front of the flexible circuit board
There is a slit at the position where it flows out between the reinforcing material
A terminal connection structure for a liquid crystal display panel formed at least at one or more locations .
けられる前記補強材が、前記フレキシブル回路基板と前
記液晶表示パネルとを前記異方導電性接着剤にて熱圧着
させる際に用いる熱圧着ツールの緩衝材である請求項1
記載の端子接続構造。2. The thermocompression bonding tool according to claim 2, wherein the reinforcing material attached to the flexible circuit board is used for thermocompression bonding the flexible circuit board and the liquid crystal display panel with the anisotropic conductive adhesive. Claim 1 which is a cushioning material.
The terminal connection structure described.
接着剤を貼り付け、この異方導電性接着剤上に複数のフ
レキシブル回路基板を所定の隙間を隔てて配置したの
ち、前記複数のフレキシブル回路基板上に補強材を設け
て前記液晶表示パネルと前記補強材でもって前記フレキ
シブル回路基板を挟み込み、この状態で前記フレキシブ
ル回路基板の電極端子を接続させるとともに、前記異方
導電性接着剤を加熱し溶解させて、前記隙間から流出し
た異方導電性接着剤によって前記補強材を前記液晶表示
パネルに接着することを特徴とする液晶表示パネルの端
子接続方法。3. An anisotropic conductive adhesive is attached to an electrode terminal of a liquid crystal display panel, and a plurality of flexible circuit boards are arranged on the anisotropic conductive adhesive with a predetermined gap therebetween. A reinforcing material is provided on a flexible circuit board, the flexible circuit board is sandwiched between the liquid crystal display panel and the reinforcing material, and the electrode terminals of the flexible circuit board are connected in this state, and the anisotropic conductive adhesive is applied. A method of connecting terminals of a liquid crystal display panel, wherein the reinforcing material is bonded to the liquid crystal display panel with an anisotropic conductive adhesive flowing out of the gap after heating and melting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12495795A JP3250000B2 (en) | 1995-05-24 | 1995-05-24 | Terminal connection structure of liquid crystal display panel and terminal connection method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12495795A JP3250000B2 (en) | 1995-05-24 | 1995-05-24 | Terminal connection structure of liquid crystal display panel and terminal connection method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08320498A JPH08320498A (en) | 1996-12-03 |
JP3250000B2 true JP3250000B2 (en) | 2002-01-28 |
Family
ID=14898409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12495795A Expired - Fee Related JP3250000B2 (en) | 1995-05-24 | 1995-05-24 | Terminal connection structure of liquid crystal display panel and terminal connection method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3250000B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003149665A (en) * | 2001-11-08 | 2003-05-21 | Hitachi Ltd | Liquid crystal display device |
KR20060008021A (en) | 2004-07-23 | 2006-01-26 | 삼성전자주식회사 | A printed circuit board and a flat display device using the same |
JPWO2007036999A1 (en) * | 2005-09-28 | 2009-04-02 | パナソニック株式会社 | Circuit board connection structure, electronic device, circuit board connection method, and pressure jig for circuit board connection |
CN102014571B (en) * | 2010-10-08 | 2013-01-09 | 友达光电(厦门)有限公司 | Flexible printed circuit board and liquid crystal display device |
JP7120812B2 (en) * | 2018-05-30 | 2022-08-17 | トライベイル テクノロジーズ, エルエルシー | electro-optical device |
CN110930866B (en) * | 2019-11-26 | 2021-07-06 | Tcl华星光电技术有限公司 | Chip on film and display device |
-
1995
- 1995-05-24 JP JP12495795A patent/JP3250000B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH08320498A (en) | 1996-12-03 |
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