JPH0621603A - Circuit module - Google Patents
Circuit moduleInfo
- Publication number
- JPH0621603A JPH0621603A JP4176548A JP17654892A JPH0621603A JP H0621603 A JPH0621603 A JP H0621603A JP 4176548 A JP4176548 A JP 4176548A JP 17654892 A JP17654892 A JP 17654892A JP H0621603 A JPH0621603 A JP H0621603A
- Authority
- JP
- Japan
- Prior art keywords
- module
- terminal portion
- substrate
- spacer
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は各種電子機器等に使用さ
れる金属枠を有する回路モジュールの改善に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a circuit module having a metal frame used for various electronic devices and the like.
【０００２】[0002]
【従来の技術】従来の金属枠を有する回路モジュールを
図３（１）、（２）に示す。この図３（１）はモジュー
ル基板を搭載基板に搭載したものであり、図３（２）は
図１（１）のＢ−Ｂ線に沿う断面を示すものである。2. Description of the Related Art A conventional circuit module having a metal frame is shown in FIGS. 3 (1) and 3 (2). FIG. 3 (1) shows a module substrate mounted on a mounting substrate, and FIG. 3 (2) shows a cross section taken along line BB of FIG. 1 (1).
【０００３】すなわち、図３において、１は金属枠、２
はモジュール基板、３は搭載基板である。金属枠１に形
成された端子部１０はモジュール基板２との接続部６に
おいてディップ半田付け、手半田付け等により接続して
あり、さらに搭載基板３に搭載し搭載基板３との接続部
５において半田付け等により接続してある。このとき端
子部１０に設けられたスペーサ部４により搭載基板３と
モジュール基板２の間に隙間９が形成される。That is, in FIG. 3, 1 is a metal frame, 2
Is a module substrate, and 3 is a mounting substrate. The terminal portion 10 formed on the metal frame 1 is connected to the module substrate 2 at a connection portion 6 by dip soldering, hand soldering, or the like, and is further mounted on the mounting substrate 3 and at a connection portion 5 with the mounting substrate 3. It is connected by soldering or the like. At this time, a gap 9 is formed between the mounting substrate 3 and the module substrate 2 by the spacer portion 4 provided on the terminal portion 10.
【０００４】前記金属枠１は通常アースとしてシールド
機能を持たせることが多く、また金属枠１に設けられた
端子部１０により搭載基板３のアースとモジュール基板
２のアースを最短距離で接続することで回路モジュール
の性能を向上・安定化することができる。The metal frame 1 often has a shielding function as a normal earth, and the terminal portion 10 provided on the metal frame 1 connects the earth of the mounting substrate 3 and the earth of the module substrate 2 at the shortest distance. Can improve and stabilize the performance of the circuit module.
【０００５】このように上記従来の端子構造でも、その
端子部１０とモジュール基板２とを接続し、かつモジュ
ール基板２が搭載されるとき、その端子部１０が搭載基
板３にも接続され、さらに搭載基板３とモジュール基板
２の間に隙間９を形成するためのスペーサ部４も兼ねる
端子部１０を持つた金属枠１を有する回路モジュールを
形成することができる。As described above, also in the conventional terminal structure described above, when the terminal portion 10 is connected to the module substrate 2 and the module substrate 2 is mounted, the terminal portion 10 is also connected to the mounting substrate 3, and It is possible to form a circuit module having the metal frame 1 having the terminal portion 10 which also serves as the spacer portion 4 for forming the gap 9 between the mounting substrate 3 and the module substrate 2.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記従
来の端子構造を持つ回路モジュールにおいては、図３
（２）のＢ−Ｂ断面図からもわかるように、熱衝撃や温
度上昇等により搭載基板３に伸び縮みが発生したとき、
あるいは搭載基板３の穴位置のずれ等により端子部１０
を広げる方向のストレスがかかった場合、応力はモジュ
ール基板２と端子部１０の接続部６に集中し、半田付け
部が破壊されたり、モジュール基板２の銅箔が剥離する
等の問題点があった。However, in the circuit module having the above-mentioned conventional terminal structure, the circuit module shown in FIG.
As can be seen from the BB sectional view of (2), when the mounting substrate 3 expands or contracts due to thermal shock or temperature rise,
Alternatively, the terminal part 10
When stress is applied in the direction to spread the wire, the stress concentrates on the connecting portion 6 between the module substrate 2 and the terminal portion 10, and there are problems that the soldering portion is destroyed, the copper foil of the module substrate 2 is peeled off, and the like. It was
【０００７】このような問題点を解決するため、搭載基
板３とモジュール基板２の間の隙間９を広く取ることが
考えられるが、この場合スペース効率が悪化するという
問題がある。In order to solve such a problem, it is conceivable to widen the gap 9 between the mounting substrate 3 and the module substrate 2, but in this case, there is a problem that the space efficiency deteriorates.
【０００８】また、図４に示すように、金属枠１にモジ
ュール基板２と接続するためのツメ１１を形成し、端子
部１０ではモジュール基板２と接続しないような構造と
したときは、上記のストレスを受けても応力はモジュー
ル基板２とツメ１１の接続部に集中することなく分散さ
れ、半田付け部が破壊されたり、モジュール基板２の銅
箔が剥離する等の問題点は無くなる。Further, as shown in FIG. 4, when the claws 11 for connecting to the module substrate 2 are formed on the metal frame 1 and the terminal portion 10 is not connected to the module substrate 2, the above-mentioned structure is used. Even if a stress is applied, the stress is dispersed without being concentrated in the connecting portion between the module substrate 2 and the claw 11, and the problems such as the destruction of the soldered portion and the peeling of the copper foil of the module substrate 2 are eliminated.
【０００９】ところが、搭載基板３に搭載した場合、モ
ジュール基板２のアース配線と搭載基板３のアース配線
が最短距離で接続されず性能の劣化・不安定化の原因と
なるという問題点がある。However, when mounted on the mounting substrate 3, there is a problem that the ground wiring of the module substrate 2 and the ground wiring of the mounting substrate 3 are not connected in the shortest distance, which causes deterioration and instability of performance.
【００１０】また、図５に示す他の従来例では、端子部
１０のスペーサ部４にスリット１２を設け、スぺーサ部
４の強度を弱くし、上記のストレスを受けても応力はス
ペーサ部４がたわむことにより緩和するので半田付け部
が破壊されたり、モジュール基板２の銅箔が剥離する等
の問題点は無くなり、かつモジュール基板２と搭載基板
３間の接続が最短距離で実現できる。Further, in another conventional example shown in FIG. 5, a slit 12 is provided in the spacer portion 4 of the terminal portion 10 to weaken the strength of the spacer portion 4 so that even if the above-mentioned stress is applied, the stress is applied to the spacer portion. Since the bending is relaxed by the bending of the module 4, problems such as the destruction of the soldered portion and the peeling of the copper foil of the module substrate 2 are eliminated, and the connection between the module substrate 2 and the mounting substrate 3 can be realized in the shortest distance.
【００１１】ところが、回路モジュールを組み立てると
きディップ半田付けによりモジュール基板２と金属枠１
の端子部１０を半田付けすると、半田でスリット１２が
充填されてしまうためスペーサ部４の強度を弱くできな
い。そのため手半田付け等により半田付けするため工数
がかかるという問題点がある。However, when the circuit module is assembled, the module substrate 2 and the metal frame 1 are formed by dip soldering.
When the terminal portion 10 is soldered, the slits 12 are filled with the solder, so the strength of the spacer portion 4 cannot be weakened. Therefore, there is a problem that man-hours are required for soldering by hand soldering or the like.
【００１２】本発明はこのような従来の問題を解決する
ものであり、その目的とするところは、半田付け部が破
壊されたり、モジュール基板の銅箔が剥離する等の問題
点も無く、搭載基板のアースとモジュール基板のアース
を最短距離で接続することで性能を向上・安定化するこ
とができ、かつ組み立てるときディップ半田付けにより
モジュール基板と金属枠の端子部を半田付けすることが
できる回路モジュールを提供することである。The present invention is intended to solve such a conventional problem, and an object thereof is to mount it without any problems such as destruction of a soldered portion or peeling of a copper foil of a module substrate. A circuit that can improve and stabilize the performance by connecting the ground of the board and the ground of the module board at the shortest distance, and can solder the module board and the terminal part of the metal frame by dip soldering during assembly. To provide a module.
【００１３】[0013]
【課題を解決するための手段】本発明は上記目的を達成
するために、金属枠に形成された端子部に、この端子部
とモジュール基板とを接続し且つこの端子部が搭載基板
にも接続されたとき、搭載基板とモジュール基板の間に
隙間を形成するためのスペーサ部を設け、このスペーサ
部に、一方が解放されたスリットを形成するようにした
ものである。In order to achieve the above object, the present invention connects a terminal portion formed on a metal frame to this terminal portion and a module substrate, and this terminal portion is also connected to a mounting substrate. At this time, a spacer portion for forming a gap between the mounting substrate and the module substrate is provided, and a slit, one of which is opened, is formed in this spacer portion.
【００１４】[0014]
【作用】かかる構成により、半田ディップで半田付けし
たときにスリットに半田が充填されず、スペーサ部の強
度が弱くなり、搭載基板からの応力をスペーサ部が曲が
ることにより緩和するので半田付け部の破壊やモジュー
ル基板の銅箔の剥離の発生を防止できる。With this structure, when the solder dip is used for soldering, the slits are not filled with solder, the strength of the spacer portion is weakened, and the stress from the mounting substrate is relieved by bending the spacer portion. It is possible to prevent breakage and peeling of the copper foil of the module substrate.
【００１５】[0015]
【実施例】以下、本発明を図面を参照して説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.
【００１６】図１は本発明の一実施例を示すものであ
る。そして、図１（１）は本発明の回路モジュールを搭
載基板上に搭載したものであり、図１（２）はＡ−Ａ断
面を示すものである。なお、従来例を説明した図３、図
４、図５中のものと同一の、または対応する部分につい
てはそれぞれ同一の符号を付す。FIG. 1 shows an embodiment of the present invention. Then, FIG. 1 (1) shows the circuit module of the present invention mounted on a mounting board, and FIG. 1 (2) shows a cross section taken along the line AA. The same or corresponding portions as those in FIGS. 3, 4, and 5 for explaining the conventional example are denoted by the same reference numerals.
【００１７】そして、図１中１は金属枠、２はモジュー
ル基板、３は搭載基板である。金属枠１に形成された端
子部１０には開放端１３ａを持つスリット１３が設けて
あり、モジュール基板２との接続部６においてディップ
半田付け、手半田付け等により接続してある。さらに端
子部１０は搭載基板３との接続部５において半田付け等
により接続してある。このとき端子部１０に設けられた
スペーサ部４により搭載基板３とモジュール基板２の間
に隙間９が形成される。In FIG. 1, 1 is a metal frame, 2 is a module substrate, and 3 is a mounting substrate. The terminal portion 10 formed on the metal frame 1 is provided with a slit 13 having an open end 13a, and is connected to the module substrate 2 at a connecting portion 6 by dip soldering, hand soldering or the like. Further, the terminal portion 10 is connected to the mounting substrate 3 at the connecting portion 5 by soldering or the like. At this time, a gap 9 is formed between the mounting substrate 3 and the module substrate 2 by the spacer portion 4 provided on the terminal portion 10.
【００１８】上記の金属枠１を有する回路モジュールに
おいては、熱衝撃ストレスや搭載基板３の穴位置のずれ
等で端子部１０を押し広げる応力がかかった場合でも、
スペーサ部４に開放端１３ａを持つスリット１３が設け
てあって、このスリット１３は、ディップ半田付けによ
りモジュール基板２と端子部１０を半田付けしても、半
田が充填されることがないので、曲げ強度は弱くなって
いるため、応力はスペーサ部４が曲がることにより緩和
される。In the circuit module having the metal frame 1 described above, even when a stress that spreads the terminal portion 10 is applied due to thermal shock stress or displacement of the hole position of the mounting substrate 3,
A slit 13 having an open end 13a is provided in the spacer portion 4. Since the slit 13 is not filled with solder even when the module substrate 2 and the terminal portion 10 are soldered by dip soldering, Since the bending strength is weak, the stress is relieved by bending the spacer portion 4.
【００１９】このために、モジュール基板２と端子部１
０の接続部６の半田付け部が破壊されたり、モジュール
基板２の銅箔が剥離する等の問題は発生しない。また、
隙間９を広くして応力を緩和する必要もないのでスペー
ス効率を悪化させることもない。To this end, the module substrate 2 and the terminal portion 1
There is no problem that the soldering part of the connection part 6 of 0 is broken or the copper foil of the module substrate 2 is peeled off. Also,
Since it is not necessary to widen the gap 9 to relieve the stress, the space efficiency is not deteriorated.
【００２０】前記金属枠１は通常アースとして使用する
ことが多いが、本発明の回路モジュールにおいては開放
端１３ａを持つスリット１３によってスペーサ部４の強
度を弱めているので、モジュール基板２のアース配線と
搭載基板３のアース配線を最短距離で接続することが可
能となり、性能の向上・安定化を図ることができる。The metal frame 1 is usually used as a ground, but in the circuit module of the present invention, since the strength of the spacer portion 4 is weakened by the slit 13 having the open end 13a, the ground wiring of the module substrate 2 is used. And the ground wiring of the mounting substrate 3 can be connected at the shortest distance, and the performance can be improved and stabilized.
【００２１】さらに回路モジュールを組み立てるとき、
ディップ半田付けによりモジュール基板２と金属枠１の
端子部１０を半田付けしても、開放端１３ａを持つスリ
ット１３であるため半田でスリット１３が充填されるこ
とがない。これにより工数の安価なディップ半田付けを
適用することができる。When further assembling the circuit module,
Even if the module substrate 2 and the terminal portion 10 of the metal frame 1 are soldered by dip soldering, the slit 13 is not filled with solder because the slit 13 has the open end 13a. This makes it possible to apply dip soldering, which requires less man-hours.
【００２２】また、図２（１）、（２）は本発明の他の
実施例である。上記実施例ではＬ型のスリットを形成し
ているが、スリット１３は直線型でも、複数あっても良
い。すなわち、図２（１）に示すようにスペーサ部４の
下縁部４ａから上に直線型のスリット１３を形成しても
よいし、また、図２（２）に示すようにスペーサ部４の
側縁部４ｂから横に直線型のスリット１３を形成しても
よい。2 (1) and 2 (2) show another embodiment of the present invention. Although the L-shaped slit is formed in the above embodiment, the slit 13 may be linear or plural. That is, as shown in FIG. 2 (1), a linear slit 13 may be formed above the lower edge portion 4a of the spacer portion 4, or as shown in FIG. 2 (2). A linear slit 13 may be formed laterally from the side edge portion 4b.
【００２３】[0023]
【発明の効果】本発明は上記実施例により明らかなよう
に、金属枠に設けられた端子部のスペーサ部に、一方が
開放されたスリットを形成したものであり、搭載基板と
の間の隙間を広げることなく、以下に示す効果を有す
る。As is apparent from the above-described embodiment, the present invention is one in which a slit of which one side is opened is formed in the spacer portion of the terminal portion provided on the metal frame, and the gap between the mounting substrate and the mounting substrate is formed. The following effects can be obtained without expanding
【００２４】（１） スペーサ部は曲げ強度が弱くなる
ので、端子部にストレスがかかってもスペーサ部が曲が
ることにより応力を緩和するので、モジュール基板と金
属枠の端子部の接続部に不具合が生じることはない。(1) Since the spacer portion has a weak bending strength, the stress is relieved by bending the spacer portion even if stress is applied to the terminal portion, so that there is no problem in the connection portion between the module substrate and the terminal portion of the metal frame. It never happens.
【００２５】（２） 搭載基板のアース配線とモジュー
ル基板のアース配線を最短距離で接続することができる
ので、性能の向上・安定化が図れる。(2) Since the ground wiring of the mounting board and the ground wiring of the module board can be connected in the shortest distance, the performance can be improved and stabilized.
【００２６】（３） 半田がスリットの中に充填されな
いので工数の安価なディップ半田付けを適用でき、コス
トダウンが可能となる。(3) Since the solder is not filled in the slits, dip soldering, which requires a small number of steps, can be applied, and the cost can be reduced.
【図１】（１）は本発明の回路モジュールの一実施例の
断面図 （２）は（１）Ａ−Ａ線に沿う断面図FIG. 1 is a sectional view of an embodiment of a circuit module of the present invention. (2) is a sectional view taken along line (1) AA.
【図２】（１）は本発明の回路モジュールの他の実施例
の端子部の断面図 （２）は本発明の回路モジュールの他の実施例の端子部
の断面図FIG. 2 (1) is a sectional view of a terminal portion of another embodiment of the circuit module of the present invention. (2) is a sectional view of a terminal portion of another embodiment of the circuit module of the present invention.
【図３】（１）は従来の回路モジュールの断面図 （２）は（１）Ｂ−Ｂ線に沿う断面図FIG. 3A is a sectional view of a conventional circuit module, and FIG. 3B is a sectional view taken along line BB of FIG.
【図４】従来の他の実施例の端子部の断面図FIG. 4 is a sectional view of a terminal portion of another conventional example.
【図５】従来の他の実施例の端子部の断面図FIG. 5 is a sectional view of a terminal portion of another conventional example.
１ 金属枠 ２ モジュール基板 ３ 搭載基板 ４ スペーサ部 ５ 接続部 ６ 接続部 ９ 隙間 １０ 端子部 １１ ツメ １２ スリット １３ スリット １３ａ スリットの開放端 1 Metal Frame 2 Module Board 3 Mounting Board 4 Spacer Section 5 Connection Section 6 Connection Section 9 Gap 10 Terminal Section 11 Claw 12 Slit 13 Slit 13a Slit Open End
Claims (1)
部とモジュール基板とを接続し且つこの端子部が搭載基
板にも接続されたとき、搭載基板とモジュール基板の間
に隙間を形成するためのスペーサ部を設け、このスペー
サ部に、一方が解放されたスリットを形成したことを特
徴とする回路モジュール。1. When a terminal portion formed on a metal frame is connected to the terminal portion and a module substrate and the terminal portion is also connected to a mounting substrate, a gap is formed between the mounting substrate and the module substrate. A circuit module, characterized in that a spacer portion for forming the slit is provided, and a slit of which one side is opened is formed in the spacer portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176548A JP2650571B2 (en) | 1992-07-03 | 1992-07-03 | Circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176548A JP2650571B2 (en) | 1992-07-03 | 1992-07-03 | Circuit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0621603A true JPH0621603A (en) | 1994-01-28 |
| JP2650571B2 JP2650571B2 (en) | 1997-09-03 |
Family
ID=16015513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4176548A Expired - Fee Related JP2650571B2 (en) | 1992-07-03 | 1992-07-03 | Circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2650571B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10017774A1 (en) * | 2000-04-10 | 2001-10-18 | Epcos Ag | Mounting plate, mounting arrangement with the mounting plate and use of the mounting plate |
| US9897461B2 (en) | 2015-02-27 | 2018-02-20 | Electro Industries/Gauge Tech | Intelligent electronic device with expandable functionality |
| US10048088B2 (en) | 2015-02-27 | 2018-08-14 | Electro Industries/Gauge Tech | Wireless intelligent electronic device |
| WO2020213214A1 (en) | 2019-04-19 | 2020-10-22 | 株式会社三社電機製作所 | External terminal for semiconductor module |
| US11641052B2 (en) | 2015-02-27 | 2023-05-02 | El Electronics Llc | Wireless intelligent electronic device |
| US12131971B2 (en) | 2019-07-30 | 2024-10-29 | Sansha Electric Manufacturing Co., Ltd. | Semiconductor module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS564893A (en) * | 1979-06-22 | 1981-01-19 | Nittan Co Ltd | Gas alarm |
-
1992
- 1992-07-03 JP JP4176548A patent/JP2650571B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS564893A (en) * | 1979-06-22 | 1981-01-19 | Nittan Co Ltd | Gas alarm |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10017774A1 (en) * | 2000-04-10 | 2001-10-18 | Epcos Ag | Mounting plate, mounting arrangement with the mounting plate and use of the mounting plate |
| DE10017774B4 (en) * | 2000-04-10 | 2005-03-10 | Epcos Ag | Mounting plate, mounting arrangement with the mounting plate and use of the mounting plate |
| US9897461B2 (en) | 2015-02-27 | 2018-02-20 | Electro Industries/Gauge Tech | Intelligent electronic device with expandable functionality |
| US10048088B2 (en) | 2015-02-27 | 2018-08-14 | Electro Industries/Gauge Tech | Wireless intelligent electronic device |
| US10274340B2 (en) | 2015-02-27 | 2019-04-30 | Electro Industries/Gauge Tech | Intelligent electronic device with expandable functionality |
| US11641052B2 (en) | 2015-02-27 | 2023-05-02 | El Electronics Llc | Wireless intelligent electronic device |
| WO2020213214A1 (en) | 2019-04-19 | 2020-10-22 | 株式会社三社電機製作所 | External terminal for semiconductor module |
| US11791244B2 (en) | 2019-04-19 | 2023-10-17 | Sansha Electric Manufacturing Co., Ltd. | Semiconductor-module external terminal |
| US12131971B2 (en) | 2019-07-30 | 2024-10-29 | Sansha Electric Manufacturing Co., Ltd. | Semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2650571B2 (en) | 1997-09-03 |
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|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |