JPH0414889A - Circuit module - Google Patents
Circuit moduleInfo
- Publication number
- JPH0414889A JPH0414889A JP11842490A JP11842490A JPH0414889A JP H0414889 A JPH0414889 A JP H0414889A JP 11842490 A JP11842490 A JP 11842490A JP 11842490 A JP11842490 A JP 11842490A JP H0414889 A JPH0414889 A JP H0414889A
- Authority
- JP
- Japan
- Prior art keywords
- signal line
- pattern
- circuit board
- soldered
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
回路モジエールにおいて、別の回路基板との接続のため
のフレキシブル基板を有する回路モジ−一ルに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit module having a flexible board for connection with another circuit board.
[従来の技術]
従来の別の回路基板との接続のためのフレキシブル基板
を有する回路モジュールは、信号線のみパターンが形成
されていて、それぞれの対応するパターンが半田付され
ていた。[Prior Art] A conventional circuit module having a flexible board for connection with another circuit board has patterns formed only for signal lines, and the corresponding patterns are soldered.
[発明が解決しようとする課題]
従来の別の回路基板との接続のためのフレキシブル基板
を有する回路モジュールは、信号線のみパターンが半田
付されているため、別の回路基板に接続し、組み立てる
時に、該半田付部に応力が加わり、パターン断線が起こ
るという課題を有している。本発明は、該課題を解決し
、組み立て時等における応力程度ではパターン断線を起
こさない回路モジエールを提供することを目的とする。[Problem to be Solved by the Invention] In the conventional circuit module having a flexible board for connection with another circuit board, only the signal line pattern is soldered, so it is difficult to connect and assemble it to another circuit board. At times, stress is applied to the soldered portion, causing pattern breakage. SUMMARY OF THE INVENTION An object of the present invention is to solve this problem and provide a circuit module that does not cause pattern disconnection even under stress during assembly.
[課題を解決するための手段]
本発明の回路モジュールは、雅の回路基板との接続のた
めのフレキシブル基板を有する回路モジエールにおいて
、該フレキシブル基板に信号線と関係のないパターンと
それに対向する回路モジ一一ルの回路基板に信号線と関
係のないパターンとを有し、該パターンどうしが半田付
されることを特徴とする。[Means for Solving the Problems] The circuit module of the present invention is a circuit module having a flexible board for connection with a circuit board, in which a pattern unrelated to a signal line and a circuit opposite thereto are provided on the flexible board. It is characterized in that the circuit board of the module has patterns unrelated to signal lines, and the patterns are soldered to each other.
[実施例]
本発明による一実施例の斜視図を第1図に示す1は回路
基板、2は7レキシプル基板、5は信号線パターン、4
は信号線と関係のないパターンである。回路基板1上及
びフレキシブル基板2上の信号線パターン6は、それぞ
れ対応する信号線どうしを半田付する。さらに、回路基
板1上及びフレキシブル基板2上の信号線と関係のない
パターン4も、それぞれ半田付する。第2図は回路基板
1のフレキシブル基板半田付部の平面図である。信号線
と関係のないパターン4は、信号線パターン5より端面
が外形端に寄っている。また第3図はフレキシブル基板
20回路基板半田付部の平面図である。5は保護フィル
ムである。信号線と関係ないパターン4は、信号線パタ
ーン3の保護ィルム5より露出している部分より内側に
位置ぐ
している。このフレキシブル基板2を回路基板1に半田
付すると、信号線パターンの半田付は信号線と関係のな
いパターンの半田付に対し回路基板端面より内側になる
。このためフレキシブル基板2を回路基板1から引きは
がす方向に応力が加わったとき、信号線と関係のないパ
ターン40半田付部に応力が加わり、信号線パターン5
0半田付部には応力が加わらない。このように、信号線
と関係のないパターン4の半田付部のみに応力が加わり
、信号線パターン60半田付部には応力が加わらないの
で、パターン断線という不具合が起きない。また、信号
線に関係のないパターンを設け、そのパターンを半田付
することによるコストアップ分は小さ(、パターン断線
が起きないという大きな効果が得られる。[Embodiment] A perspective view of an embodiment according to the present invention is shown in FIG. 1. 1 is a circuit board, 2 is a lexical board, 5 is a signal line pattern, 4
is a pattern unrelated to signal lines. For the signal line patterns 6 on the circuit board 1 and the flexible board 2, corresponding signal lines are soldered to each other. Furthermore, patterns 4 unrelated to the signal lines on the circuit board 1 and the flexible board 2 are also soldered. FIG. 2 is a plan view of the flexible board soldering portion of the circuit board 1. FIG. The end surface of the pattern 4, which has no relation to the signal line, is closer to the outer edge than the signal line pattern 5. Further, FIG. 3 is a plan view of the circuit board soldering portion of the flexible board 20. 5 is a protective film. The pattern 4 unrelated to the signal line is located inside the portion of the signal line pattern 3 exposed from the protective film 5. When this flexible board 2 is soldered to the circuit board 1, the soldering of the signal line pattern is inside the end surface of the circuit board compared to the soldering of the pattern unrelated to the signal line. Therefore, when stress is applied in the direction of peeling off the flexible board 2 from the circuit board 1, stress is applied to the soldered portion of the pattern 40, which is unrelated to the signal line, and the signal line pattern 5
0 No stress is applied to the soldered part. In this way, stress is applied only to the soldered portions of the pattern 4 that are unrelated to the signal line, and stress is not applied to the soldered portions of the signal line pattern 60, so that the problem of pattern breakage does not occur. Further, the increase in cost due to providing a pattern unrelated to the signal line and soldering that pattern is small (and the large effect that pattern disconnection does not occur can be obtained).
[発明の効果コ
別の回路基板との接続のためのフレキシブル基板を有す
る回路モジエールにおいて、該フレキシブル基板に信号
線と関係のないパターンとそれに対向する回路モジ2−
ルの回路基板に信号線と関係のないパターンとを有し、
該パターンどうしが半田付されていることにより、応力
が信号線パターンの半田付部に加わることがなくなり、
パターン断線が起きないという効果がある。また、小さ
なコストアップのみで、パターン断線が起きないという
大きな効果が得られる回路モジュールを提供できるとい
う効果がある。[Effects of the Invention] In a circuit module having a flexible board for connection with another circuit board, the flexible board has a pattern unrelated to the signal line and the circuit module 2-
The circuit board of the module has a pattern unrelated to the signal line,
Since the patterns are soldered together, stress is not applied to the soldered portion of the signal line pattern.
This has the effect of preventing pattern breakage. Further, it is possible to provide a circuit module which has the great effect of preventing pattern disconnection with only a small increase in cost.
第1図は本発明の回路モジュールの一実施例の斜視図。
第2図は本発明の回路モジュールの回路基板の平面図。
第5図は本発明の回路モジュールの7レキシプル基板の
平面図。
第4図は従来の回路モジエールの斜視図。
1−m−回路基板
2−一一フレキシブル基板
5・・・−・−信号線パターン
4・・・−一信号線と関係のないパターン5°−・・・
・−保護フィルム
以上FIG. 1 is a perspective view of an embodiment of the circuit module of the present invention. FIG. 2 is a plan view of the circuit board of the circuit module of the present invention. FIG. 5 is a plan view of a 7-lexiple board of the circuit module of the present invention. FIG. 4 is a perspective view of a conventional circuit module. 1-m-Circuit board 2-11 Flexible board 5...--Signal line pattern 4...-1 Pattern unrelated to the signal line 5°--...
・-More than protective film
Claims (1)
する回路モジュールにおいて、該フレキシブル基板に信
号線と関係のないパターンとそれに対向する回路モジュ
ールの回路基板に信号線と関係のないパターンとを有し
、該パターンどうしが半田付されていることを特徴とす
る回路モジュール。In a circuit module having a flexible board for connection with another circuit board, the flexible board has a pattern unrelated to the signal line, and the circuit board of the circuit module opposite thereto has a pattern unrelated to the signal line. , a circuit module characterized in that the patterns are soldered together.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11842490A JPH0414889A (en) | 1990-05-08 | 1990-05-08 | Circuit module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11842490A JPH0414889A (en) | 1990-05-08 | 1990-05-08 | Circuit module |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0414889A true JPH0414889A (en) | 1992-01-20 |
Family
ID=14736301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11842490A Pending JPH0414889A (en) | 1990-05-08 | 1990-05-08 | Circuit module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0414889A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07199207A (en) * | 1993-11-26 | 1995-08-04 | Internatl Business Mach Corp <Ibm> | Liquid crystal display and tape carrier for liquid crystal display driver package |
US5717556A (en) * | 1995-04-26 | 1998-02-10 | Nec Corporation | Printed-wiring board having plural parallel-connected interconnections |
KR100696651B1 (en) * | 2000-04-14 | 2007-03-16 | 삼성에스디아이 주식회사 | Liquid crystal display module |
US7894082B2 (en) | 2003-03-20 | 2011-02-22 | Silverbrook Research Pty Ltd | Integrated printing and display device |
US7929179B2 (en) | 2003-03-20 | 2011-04-19 | Silverbrook Research Pty Ltd | Flat panel display |
-
1990
- 1990-05-08 JP JP11842490A patent/JPH0414889A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07199207A (en) * | 1993-11-26 | 1995-08-04 | Internatl Business Mach Corp <Ibm> | Liquid crystal display and tape carrier for liquid crystal display driver package |
US5717556A (en) * | 1995-04-26 | 1998-02-10 | Nec Corporation | Printed-wiring board having plural parallel-connected interconnections |
KR100696651B1 (en) * | 2000-04-14 | 2007-03-16 | 삼성에스디아이 주식회사 | Liquid crystal display module |
US7894082B2 (en) | 2003-03-20 | 2011-02-22 | Silverbrook Research Pty Ltd | Integrated printing and display device |
US7901068B2 (en) | 2003-03-20 | 2011-03-08 | Silverbrook Research Pty Ltd | Flat panel computer display |
US7929179B2 (en) | 2003-03-20 | 2011-04-19 | Silverbrook Research Pty Ltd | Flat panel display |
US7957027B2 (en) | 2003-03-20 | 2011-06-07 | Silverbrook Research Pty Ltd | Printing and display device |
US7963649B2 (en) | 2003-03-20 | 2011-06-21 | Silverbrook Research Pty Ltd | Computer monitor having inkjet printhead |
US8016500B2 (en) | 2003-03-20 | 2011-09-13 | Silverbrook Research Pty Ltd | Flat panel display unit with integrated printer |
US8025350B2 (en) | 2003-03-20 | 2011-09-27 | Silverbrook Research Pty Ltd | Printing and flat panel display device |
US8059308B2 (en) | 2003-03-20 | 2011-11-15 | Silverbrook Research Pty Ltd | Integrated printing and display device with replaceable ink cartridge |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0414889A (en) | Circuit module | |
JPH10162914A (en) | Circuit connecting device between printed boards and connecting method | |
JPS6298264U (en) | ||
JPH0651331A (en) | Lcd module | |
JP2674586B2 (en) | Printed wiring board mounting structure | |
JPH0627979Y2 (en) | Printed wiring board structure | |
JPH0711520Y2 (en) | Printed wiring board fixing structure | |
JP2530490Y2 (en) | Flexible connector | |
JPH0458584A (en) | Printed board structure | |
US4857375A (en) | Shielding of semiconductor module | |
JP3041932U (en) | Flexible circuit board connection structure | |
JPH06125170A (en) | External memory device | |
KR960006417Y1 (en) | Lead line of hybrid integrated circuit | |
JPH04107898A (en) | Printed wiring board | |
JPS6028294A (en) | Printed circuit board | |
JPH03171694A (en) | Printed wiring board | |
JPH04352488A (en) | Organic hybrid integrated circuit | |
JPH05304348A (en) | Installation structure of flexible printed board | |
JPH02113281U (en) | ||
JPH06350208A (en) | Flexible printed circuit board | |
JPH02304877A (en) | Flexible substrate | |
JPS59158104U (en) | Optical backboard substrate | |
JPH09205276A (en) | Component mounting structure | |
JPH0645769A (en) | Pin protective cover | |
JPS61207063U (en) |