JP3013433B2 - Wiring connection structure and electro-optical device - Google Patents

Wiring connection structure and electro-optical device

Info

Publication number
JP3013433B2
JP3013433B2 JP2302929A JP30292990A JP3013433B2 JP 3013433 B2 JP3013433 B2 JP 3013433B2 JP 2302929 A JP2302929 A JP 2302929A JP 30292990 A JP30292990 A JP 30292990A JP 3013433 B2 JP3013433 B2 JP 3013433B2
Authority
JP
Japan
Prior art keywords
wiring
groups
optical device
electro
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2302929A
Other languages
Japanese (ja)
Other versions
JPH04176183A (en
Inventor
邦雄 丸山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2302929A priority Critical patent/JP3013433B2/en
Publication of JPH04176183A publication Critical patent/JPH04176183A/en
Application granted granted Critical
Publication of JP3013433B2 publication Critical patent/JP3013433B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Liquid Crystal (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、フレキシブルプリンティッドサーキット等
の可撓性配線接続部材を用いた配線接続構造およびその
配線接続構造を用いた電気光学装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring connection structure using a flexible wiring connection member such as a flexible printed circuit and an electro-optical device using the wiring connection structure.

〔従来の技術〕[Conventional technology]

例えば液晶表示装置等における部品相互間の配線接続
部材として、合成樹脂等よりなる可撓性基材フィルム上
に配線を施してなるフレキシブルプリンティッドサーキ
ット(以下、FPCという)が用いられている。特に液晶
表示装置における液晶表示パネルと駆動制御回路基板と
の間には、上記のようなFPC上に、LSI等の液晶駆動用の
半導体チップをTAB(Tape Automated Bonding)方式等
で実装した可撓性配線接続部材が用いられ、その可撓性
配線接続部材と液晶表示パネルとは異方性導電膜(異方
性導電接着剤)等を介して導電接続されている。
For example, as a wiring connection member between components in a liquid crystal display device or the like, a flexible printed circuit (hereinafter, referred to as FPC) in which wiring is provided on a flexible base film made of synthetic resin or the like is used. In particular, between a liquid crystal display panel and a drive control circuit board in a liquid crystal display device, a flexible chip in which a semiconductor chip for driving a liquid crystal such as an LSI is mounted on the above FPC by a TAB (Tape Automated Bonding) method or the like. A flexible wiring connection member is used, and the flexible wiring connection member and the liquid crystal display panel are conductively connected via an anisotropic conductive film (anisotropic conductive adhesive) or the like.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

ところが、上記のような可撓性配線接続部材におい
て、例えば1つの半導体チップに対する複数本の入出力
用配線群を1単位とし、これを前記基材フィルム上に複
数単位並列させて設け、それ等の配線群を他の部材、例
えば液晶表示パネルに、異方性導電膜等で導電接続する
場合、隣り合う配線群間の間隔があいていると、上記の
導電接続を行った際に隣り合う配線群間の基材フィルム
に歪み等が生じやすい。特に上記の可撓性配線接続部材
を屈曲させて取付ける場合には、上記配線群間に応力が
集中して基材フィルムが浮き上がり傾向となり、その近
傍の配線にラインミッシング(接続不良)が生じて抵抗
値が増大する等のおそれがあった。
However, in the flexible wiring connection member as described above, for example, a plurality of input / output wiring groups for one semiconductor chip are set as one unit, and a plurality of input / output wiring groups are provided in parallel on the base film. In the case where the wiring group is electrically connected to another member, for example, a liquid crystal display panel by an anisotropic conductive film or the like, if there is an interval between the adjacent wiring groups, the wiring group becomes adjacent when the above-described conductive connection is performed. Distortion or the like is likely to occur in the base film between the wiring groups. In particular, when the flexible wiring connection member is bent and attached, stress concentrates between the wiring groups and the base film tends to float, and line missing (poor connection) occurs in the wiring in the vicinity. There was a risk that the resistance value would increase.

本発明は簡単な構成により上記従来の問題点を解消す
ることを目的とする。
An object of the present invention is to solve the above-mentioned conventional problems with a simple configuration.

〔課題を解決するための手段〕[Means for solving the problem]

上記の目的を達成するために本発明による配線接続構
造および電気光学装置は、以下の構成としたものであ
る。
In order to achieve the above object, a wiring connection structure and an electro-optical device according to the present invention have the following configurations.

即ち、本発明による配線接続構造は、可撓性配線接続
部材の基材フィルム上に複数の配線群を形成し、それ等
の配線群を他の部材に異方性導電膜を介して導電接続す
る配線接続構造において、前記複数の配線群が上記基板
に異方性導電膜を介して導電接続される部分の、隣り合
う前記配線群間の前記基材フィルム上にダミー配線を形
成したことを特徴とする。
That is, in the wiring connection structure according to the present invention, a plurality of wiring groups are formed on the base film of the flexible wiring connection member, and the wiring groups are electrically connected to other members via the anisotropic conductive film. In the wiring connection structure, the plurality of wiring groups are formed by forming dummy wirings on the base film between adjacent wiring groups in a portion conductively connected to the substrate via an anisotropic conductive film. Features.

また本発明による電気光学装置は、可撓性配線接続部
材の基材フィルム上に複数の配線群を形成し、それ等の
配線群を電気光学装置の基板に異方性導電膜を介して導
電接続するようにした電気光学装置において、前記複数
の配線群が上記基板に異方性導電膜を介して導電接続さ
れる部分の、隣り合う前記配線群間の前記基材フィルム
上にダミー配線を形成したことを特徴とする。
Further, in the electro-optical device according to the present invention, a plurality of wiring groups are formed on the base film of the flexible wiring connection member, and the wiring groups are electrically connected to the substrate of the electro-optical device via the anisotropic conductive film. In the electro-optical device configured to be connected, in the portion where the plurality of wiring groups are conductively connected to the substrate via an anisotropic conductive film, dummy wirings are provided on the base film between the adjacent wiring groups. It is characterized by having been formed.

〔作 用〕(Operation)

上記のように隣り合う配線群間の基材フィルム上にダ
ミーの配線を施したことにより、上記配線群を他の部材
に異方性導電膜等で導電接続する際に、上記隣り合う配
線群間の基材フィルムが、ダミーの配線により保形され
て歪みや浮き上がり等が生じるのを防止することが可能
となる。
By providing dummy wiring on the base film between the adjacent wiring groups as described above, when the wiring group is conductively connected to another member by an anisotropic conductive film or the like, the adjacent wiring group It is possible to prevent the base film between them from being deformed or lifted due to shape retention by the dummy wiring.

〔実施例〕〔Example〕

以下、液晶表示装置における液晶表示パネルと駆動制
御回路基板とを可撓性配線接続部材を介して接続する場
合を例にして本発明による配線接続構造および電気光学
装置を具体的に説明する。
Hereinafter, the wiring connection structure and the electro-optical device according to the present invention will be specifically described by taking, as an example, a case where a liquid crystal display panel and a drive control circuit board in a liquid crystal display device are connected via a flexible wiring connection member.

第1図は本発明による配線接続構造に用いる可撓性配
線接続部材の一例を示す平面図、第2図・第3図はその
可撓性配線接続部材を用いて液晶表示パネルと駆動制御
回路基板とを接続した状態の側面図である。
FIG. 1 is a plan view showing an example of a flexible wiring connection member used in the wiring connection structure according to the present invention, and FIGS. 2 and 3 are a liquid crystal display panel and a drive control circuit using the flexible wiring connection member. It is a side view in the state where it connected with a substrate.

図示例の可撓性配線接続部材1は、合成樹脂等の可撓
性基材フィルム11上に2組の配線群12・12を形成すると
共に、その各配線群12のインナーリード部にLSI等の液
晶駆動用の半導体チップ13をTAB(Tape Automated Bond
ing)方式等により実装した構成である。
The flexible wiring connection member 1 of the illustrated example has two sets of wiring groups 12 and 12 formed on a flexible base film 11 made of a synthetic resin or the like, and the inner lead portion of each wiring group 12 is provided with an LSI or the like. Of the semiconductor chip 13 for driving liquid crystal of TAB (Tape Automated Bond
ing) This is a configuration implemented by a method or the like.

そして上記配線群12・12間の基材フィルム11上にダミ
ーの配線14を施したもので、図の場合は配線群12の液晶
表示パネル2との接続側端部と略平行かつ略同ピッチに
形成され、反対側の端部は一体に連結されている。なお
上記ダミー配線14の形状は全長に亙って平行な線状にす
る等その他適宜である。またダミー配線14の材質も適宜
であるが、好ましくは配線群12と同材質の銅箔等を用
い、配線群12を形成する際に同時に形成するとよい。
The dummy wirings 14 are formed on the base film 11 between the wiring groups 12 and 12. In the case of the drawing, the wiring groups 12 are substantially parallel to and substantially equal to the end of the wiring group 12 on the connection side with the liquid crystal display panel 2. And the opposite ends are integrally connected. The shape of the dummy wiring 14 may be any other suitable shape such as a parallel linear shape over the entire length. The material of the dummy wiring 14 is also appropriate, but it is preferable to use a copper foil or the like of the same material as the wiring group 12 and to form the dummy wiring 14 at the same time as forming the wiring group 12.

上記の構成において、可撓性配線接続部材1を液晶表
示パネル2等に導電接続するに当たっては、各配線群12
とダミー配線14の端部に異方性導電膜(不図示)等を連
続的に貼着して第2図・第3図のように液晶表示パネル
2の基板21上の端子(不図示)に圧接させて接続するも
ので、第2図は配線群を内側にして接続した例、第3図
は配線群を外側にして接続した例を示す。なお可撓性配
線接続部材1と駆動制御回路基板3とは、本例において
は半田付け等によって接続されているが、上記と同様の
要領で接続することもある。
In the above configuration, when the flexible wiring connection member 1 is conductively connected to the liquid crystal display panel 2 or the like, each wiring group 12
And an anisotropic conductive film (not shown) is continuously adhered to the end of the dummy wiring 14 and terminals (not shown) on the substrate 21 of the liquid crystal display panel 2 as shown in FIGS. FIG. 2 shows an example in which the wiring group is set inside, and FIG. 3 shows an example in which the wiring group is set outside. Although the flexible wiring connection member 1 and the drive control circuit board 3 are connected by soldering or the like in this example, they may be connected in the same manner as described above.

上記のように隣り合う配線群12・12間の基材フィルム
上にダミー配線14を施すことにより、その間の基材フィ
ルムが補強されて歪みや浮き上がりが防止され、確実に
導電接続できるものである。
By providing the dummy wirings 14 on the base film between the adjacent wiring groups 12 and 12 as described above, the base film therebetween is reinforced, distortion and floating are prevented, and reliable conductive connection can be achieved. .

なお図示例は1つの可撓性配線接続部材上に2組の配
線群を有するものを例示したが、3組以上の配線群を有
するものにも適用できる。また可撓性配線接続部材上の
半導体チップのボンディング面が裏側に形成されている
ものや、可撓性配線接続部材上に半導体チップ等を実装
しないものにも適用可能である。
In the illustrated example, the one having two sets of wiring groups on one flexible wiring connection member is illustrated, but the present invention can be applied to the one having three or more sets of wiring groups. Further, the present invention is also applicable to a device in which the bonding surface of the semiconductor chip on the flexible wiring connection member is formed on the back side, or a device in which a semiconductor chip or the like is not mounted on the flexible wiring connection member.

さらに実施例は液晶表示装置に適用したが、例えばプ
ラズマディスプレイやELディスプレイその他各種の電気
光学装置等にも適用できる。特に多ピン高密度端子接続
に有効である。
Further, although the embodiment is applied to the liquid crystal display device, it can be applied to, for example, a plasma display, an EL display, and various other electro-optical devices. In particular, it is effective for multi-pin high-density terminal connection.

〔発明の効果〕〔The invention's effect〕

以上説明したように本発明によれば、隣り合う配線群
間の基材フィルム上にダミー配線を施したから、上記配
線群を他の部材に異方性導電膜等で導電接続する際に、
上記隣り合う配線群間の基材フィルムが、ダミー配線に
より保形されて歪みや浮き上がり等が生じるのを簡単か
つ確実に防止することが可能となる。またダミー配線を
可撓性配線接続部材の屈曲部分に渡って延伸させること
で、屈曲部が補強されて該屈曲部での配線群の切断を防
止することも可能となり、安定性のよい配線接続構造お
よび電気光学装置が安価に得られる等の効果がある。
As described above, according to the present invention, since dummy wiring is provided on the base film between adjacent wiring groups, when the wiring group is conductively connected to another member by an anisotropic conductive film or the like,
It is possible to easily and surely prevent the substrate film between the adjacent wiring groups from being deformed or raised due to the shape retention by the dummy wiring. In addition, by extending the dummy wiring over the bent portion of the flexible wiring connection member, the bent portion is reinforced, and it is possible to prevent the disconnection of the wiring group at the bent portion, thereby providing a stable wiring connection. There are effects such as that the structure and the electro-optical device can be obtained at low cost.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明による配線接続構造に用いる可撓性配線
接続部材の一例を示す平面図、第2図・第3図はその可
撓性配線接続部材を用いて導電接続を行った状態の側面
図である。 1は可撓性配線接続部材、11は基材フィルム、12は配線
群、13は半導体チップ、14はダミー配線、2は液晶表示
パネル、3は駆動制御回路基板。
FIG. 1 is a plan view showing an example of a flexible wiring connection member used in the wiring connection structure according to the present invention, and FIGS. 2 and 3 show a state in which conductive connection is performed using the flexible wiring connection member. It is a side view. 1 is a flexible wiring connection member, 11 is a base film, 12 is a wiring group, 13 is a semiconductor chip, 14 is a dummy wiring, 2 is a liquid crystal display panel, and 3 is a drive control circuit board.

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H05K 1/14 G02F 1/1345 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 1/14 G02F 1/1345

Claims (8)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】可撓性配線接続部材の基材フィルム上に複
数の配線群を形成し、それ等の配線群を他の部材に異方
性導電膜を介して導電接続する配線接続構造において、 前記複数の配線群が他の部材に異方性導電膜を介して導
電接続される部分の、隣り合う前記配線群間の前記基材
フィルム上にダミー配線を形成したことを特徴とする配
線接続構造。
1. A wiring connection structure in which a plurality of wiring groups are formed on a base film of a flexible wiring connecting member, and the wiring groups are conductively connected to other members via an anisotropic conductive film. A wiring in which the plurality of wiring groups are conductively connected to another member via an anisotropic conductive film, wherein dummy wirings are formed on the base film between the adjacent wiring groups. Connection structure.
【請求項2】前記ダミー配線は、前記配線群の前記他の
部材との接続側端部と略平行かつ略同ピッチに形成され
ている請求項1記載の配線接続構造。
2. The wiring connection structure according to claim 1, wherein said dummy wirings are formed substantially in parallel with and substantially at the same pitch as the connection side end of said wiring group with said another member.
【請求項3】前記ダミー配線は、前記配線群の接続側端
部における隣り合う配線群間に複数本形成され、その複
数本のダミー配線の上記接続側端部と反対側の端部が一
体に連結されている請求項1または2に記載の配線接続
構造。
3. A plurality of dummy wirings are formed between adjacent wiring groups at connection-side ends of the wiring groups, and ends of the plurality of dummy wirings opposite to the connection-side ends are integrally formed. The wiring connection structure according to claim 1, wherein the wiring connection structure is connected to the wiring connection structure.
【請求項4】前記ダミー配線は、前記配線群の接続側端
部から前記可撓性配線接続部材の屈曲部分に渡って延伸
して形成されている請求項1、2または3に記載の配線
接続構造。
4. The wiring according to claim 1, wherein the dummy wiring extends from a connection side end of the wiring group to a bent portion of the flexible wiring connection member. Connection structure.
【請求項5】可撓性配線接続部材の基材フィルム上に複
数の配線群を形成し、それ等の配線群を電気光学装置の
基板に異方性導電膜を介して導電接続するようにした電
気光学装置において、前記複数の配線群が上記基板に異
方性導電膜を介して導電接続される部分の、隣り合う前
記配線群間の前記基材フィルム上にダミー配線を形成し
たことを特徴とする電気光学装置。
5. A plurality of wiring groups are formed on a base film of a flexible wiring connection member, and these wiring groups are conductively connected to a substrate of an electro-optical device via an anisotropic conductive film. In the electro-optical device, the dummy wirings may be formed on the base film between the adjacent wiring groups at a portion where the plurality of wiring groups are conductively connected to the substrate via an anisotropic conductive film. Electro-optical device characterized.
【請求項6】前記ダミー配線は、前記配線群の前記基板
との接続側端部と略平行かつ略同ピッチに形成されてい
る請求項5記載の電気光学装置。
6. The electro-optical device according to claim 5, wherein the dummy wirings are formed substantially in parallel with the end of the wiring group on the connection side with the substrate and at substantially the same pitch.
【請求項7】前記ダミー配線は、前記配線群の接続側端
部における隣り合う配線群間に複数本形成され、その複
数本のダミー配線の上記接続側端部と反対側の端部が一
体に連結されている請求項5または6に記載の電気光学
装置。
7. A plurality of dummy wirings are formed between adjacent wiring groups at connection-side ends of the wiring groups, and ends of the plurality of dummy wirings opposite to the connection-side ends are integrally formed. The electro-optical device according to claim 5, wherein the electro-optical device is connected to the electro-optical device.
【請求項8】前記ダミー配線は、前記配線群の接続側端
部から前記可撓性配線接続部材の屈曲部分に渡って延伸
して形成されている請求項5、6または7に記載の電気
光学装置。
8. The electric device according to claim 5, wherein the dummy wiring extends from a connection end of the wiring group to a bent portion of the flexible wiring connection member. Optical device.
JP2302929A 1990-11-08 1990-11-08 Wiring connection structure and electro-optical device Expired - Fee Related JP3013433B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2302929A JP3013433B2 (en) 1990-11-08 1990-11-08 Wiring connection structure and electro-optical device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2302929A JP3013433B2 (en) 1990-11-08 1990-11-08 Wiring connection structure and electro-optical device

Publications (2)

Publication Number Publication Date
JPH04176183A JPH04176183A (en) 1992-06-23
JP3013433B2 true JP3013433B2 (en) 2000-02-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2302929A Expired - Fee Related JP3013433B2 (en) 1990-11-08 1990-11-08 Wiring connection structure and electro-optical device

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Country Link
JP (1) JP3013433B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69330074T2 (en) * 1992-12-10 2001-09-06 Sharp K.K., Osaka Flat display device, its control method and method for its production
JP3648838B2 (en) * 1996-04-23 2005-05-18 ソニー株式会社 Video display device
JP2020025033A (en) * 2018-08-08 2020-02-13 株式会社Joled Flexible wiring board and display device

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