JPH04176183A - Wiring connection device and electro-optical device provided therewith - Google Patents
Wiring connection device and electro-optical device provided therewithInfo
- Publication number
- JPH04176183A JPH04176183A JP30292990A JP30292990A JPH04176183A JP H04176183 A JPH04176183 A JP H04176183A JP 30292990 A JP30292990 A JP 30292990A JP 30292990 A JP30292990 A JP 30292990A JP H04176183 A JPH04176183 A JP H04176183A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- base film
- groups
- wiring connection
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 15
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 3
- 229920003002 synthetic resin Polymers 0.000 abstract description 3
- 239000000057 synthetic resin Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
本発明は、フレキシブルプリンティノドサーキット等の
可撓性配線接続部材を用いた配線接続装置およびその配
線接続装置を用いた電気光学装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a wiring connection device using a flexible wiring connection member such as a flexible printed node circuit, and an electro-optical device using the wiring connection device.
゛例えば液晶表示装置等における部品相互間の配線接続
部材として、合成樹脂等よりなる可撓性基材フィルム上
に配線を施してなるフレキシブルプリンティノドサーキ
ット（以下、ＦＰＣという）が用いられている。特に液
晶表示装置における液晶表示パネルと駆動制御回路基板
との間には、上記のようなＦＰＣ上に、ＬＳＩ等の液晶
駆動用の半導体チップをＴ Ａ Ｂ （Ｔａｐｅ Ａｕ
ｔｏｍａｔｅｃｌ Ｂｏｎｄｉｎｇ）方式等で実装した
可撓性配線接続部材が用いられ、その可撓性配線接続部
材と液晶表示パネルとは異方性導電膜（異方性導電接着
剤）等を介して導電接続されている。For example, a flexible printed circuit (hereinafter referred to as FPC), which is made by wiring on a flexible base film made of synthetic resin or the like, is used as a wiring connection member between components in liquid crystal display devices, etc. . In particular, in a liquid crystal display device, between the liquid crystal display panel and the drive control circuit board, a semiconductor chip for driving the liquid crystal, such as an LSI, is mounted on the above-mentioned FPC using T A B (Tape Au).
A flexible wiring connection member mounted using a tomatecl bonding method or the like is used, and the flexible wiring connection member and the liquid crystal display panel are electrically connected via an anisotropic conductive film (anisotropic conductive adhesive), etc. has been done.
ところが、上記のような可撓性配線接続部材において、
例えば１つの半導体チップに対する複数本の入出力用配
線群を１単位とし、これを前記基材フィルム上に複数単
位並列させて設け、それ等の配線群を他の部材、例えば
液晶表示パネルに、異方性導電膜等で導電接続する場合
、隣り合う配線群間の、間隔がおいていると、上記の導
電接続を行った際に隣り合う配線群間の基材フィルムに
歪み等が生じやすい。特に上記の可撓性配線接続部材を
屈曲させて取付ける場合には、−Ｊ−記配線群間に応力
が集中して基材フィルムが浮き上がり傾向となり、その
近傍の配線にラインミッシング（接続不良）が生じて抵
抗値が増大する等のおそれがあった。However, in the flexible wiring connection member as described above,
For example, a plurality of input/output wiring groups for one semiconductor chip are considered as one unit, and a plurality of these are arranged in parallel on the base film, and the wiring groups are connected to other members, such as a liquid crystal display panel. When making conductive connections using an anisotropic conductive film, etc., if there is a gap between adjacent wiring groups, distortion etc. may easily occur in the base film between adjacent wiring groups when making the above conductive connections. . In particular, when the above-mentioned flexible wiring connection member is bent and installed, stress is concentrated between the -J- wiring groups and the base film tends to lift up, causing line missing (poor connection) to the wiring in the vicinity. There was a risk that this would cause the resistance value to increase.
本発明は簡単な構成により上記従来の問題点を解消する
ことを目的とする。It is an object of the present invention to solve the above-mentioned conventional problems with a simple configuration.
（課題を解決するための手段）
上記の目的を達成するために本発明による配線接続装置
は、以下の構成としたものである。(Means for Solving the Problems) In order to achieve the above object, a wiring connection device according to the present invention has the following configuration.
即ち、可撓性配線接続部材の基材フィルム上に複数の配
線群を形成し、それ等の配線群を他の部材に異方性導電
膜等の導電部材を介して導電接続するものにおいて、隣
り合う配線群間の基材フィルム上にダミーの配線を形成
したことを特徴とする。That is, in a flexible wiring connection member in which a plurality of wiring groups are formed on the base film and the wiring groups are conductively connected to other members via a conductive member such as an anisotropic conductive film, A feature is that dummy wiring is formed on the base film between adjacent wiring groups.
また上記のような配線接続装置を用いて、基板上に形成
された端子電極群と前記配線群とを導電部材で導電接続
したことを特徴とする電気光学装置を要旨とする。Another gist of the present invention is an electro-optical device characterized in that a terminal electrode group formed on a substrate and the wiring group are conductively connected by a conductive member using the wiring connecting device as described above.
上記のように隣り合う配線群間の基材フィルム上にダミ
ーの配線を施したことにより、」＝記配線群を他の部材
に異方性導電膜等で導電接続する際に、上記隣り合う配
線群間の基材フィルムが、ダミーの配線により保形され
て歪みや浮き上がり等が生じるのを防止することが可能
となる。By providing dummy wiring on the base film between adjacent wiring groups as described above, when connecting the wiring groups to other members with an anisotropic conductive film etc., it is possible to It becomes possible to prevent the base film between the wiring groups from being distorted or raised due to the shape being maintained by the dummy wiring.
（実施例］
以下、液晶表示装置における液晶表示パネルと駆動制御
回路基板とを可撓性配線接続部材を介して接続する場合
を例にして本発明による配線接続装置および電気光学装
置を具体的に説明する。(Example) Hereinafter, the wiring connection device and electro-optical device according to the present invention will be specifically explained using an example in which a liquid crystal display panel and a drive control circuit board in a liquid crystal display device are connected via a flexible wiring connection member. explain.
第１図は本発明による配線接続装置に用いる可撓性配線
接続部材の一例を示す平面図、第２図・第３図はその可
撓性配線接続部材を用いて液晶表示パネルと駆動制御回
路基板とを接続した状態の側面図である。FIG. 1 is a plan view showing an example of a flexible wiring connection member used in a wiring connection device according to the present invention, and FIGS. 2 and 3 show a liquid crystal display panel and a drive control circuit using the flexible wiring connection member. FIG. 3 is a side view of the device connected to the substrate.
図示例の可撓性配線接続部材１は、合成樹脂等の可撓性
基材フィルム１１上に２組の配線群１２・１２を形成す
ると共に、その各配線群１２のインナーリード部にＬＳ
Ｉ等の液晶駆動用の半導体チップ１３をＴ Ａ Ｂ （
Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎｇ）方式
等により実装した構成である。The illustrated flexible wiring connection member 1 has two wiring groups 12, 12 formed on a flexible base film 11 made of synthetic resin, etc., and an LS in the inner lead portion of each wiring group 12.
T A B (
This configuration is implemented using a Tape Automated Bonding (Tape Automated Bonding) method or the like.
そして上記配線群１２・１２間の基材フィルム１１上に
ダミーの配線１４を施したもので、図の場合は配線群１
２の液晶表示パネル２との接続側端部と略平行かつ略同
ピツチに形成され、反対側の端部は一体に連結されてい
る。なお上記ダミー配線１４の形状は全長に亙って平行
な線状にする等その他適宜である。またダミー配線１４
の材質も適宜であるが、好ましくは配線群１２と同材質
の銅箔等を用い、配線群１２を形成する際に同時に形成
するとよい。Then, dummy wiring 14 is provided on the base film 11 between the wiring groups 12 and 12, and in the case of the figure, wiring group 1
It is formed substantially parallel to and at substantially the same pitch as the end on the side connected to the liquid crystal display panel 2 of No. 2, and the end on the opposite side is integrally connected. The shape of the dummy wiring 14 may be any other suitable shape, such as a parallel linear shape over the entire length. Also, dummy wiring 14
Although the material for the wiring group 12 is also suitable, it is preferable to use copper foil or the like made of the same material as the wiring group 12, and to form the wiring group 12 at the same time as the wiring group 12.
上記の構成において、可撓性配線接続部材１を液晶表示
パネル２等に導電接続するに当たっては、各配線群１２
とダミー配線】４の端部に異方性導−へ −
電膜（不図示）等を連続的に貼着して第２図・第３図の
ように液晶表示パネル２の基板２１上の端子（不図示）
に圧接させて接続するもので、第２図は配線群を内側に
して接続した例、第３図は配線群を外側にして接続した
例を示す。なお可撓性配線接続部材１と駆動制御回路基
板３とは、本例においては半田付は等によって接続され
ているが、上記と同様の要領で接続することもある。In the above configuration, when electrically connecting the flexible wiring connection member 1 to the liquid crystal display panel 2 etc., each wiring group 12
and dummy wiring] 4, an anisotropic conductive film (not shown), etc. is continuously pasted on the end of the substrate 21 of the liquid crystal display panel 2 as shown in FIGS. 2 and 3. Terminal (not shown)
Fig. 2 shows an example in which the wiring group is connected to the inside, and Fig. 3 shows an example in which the wiring group is connected to the outside. Although the flexible wiring connection member 1 and the drive control circuit board 3 are connected by soldering or the like in this example, they may be connected in the same manner as described above.
上記のように隣り合う配線群１２・１２間の基材フィル
ム上にダミー配線１４を施すことにより、その間の基材
フィルムが補強されて歪みや浮き上がりが防止され、確
実に導電接続できるものである。By providing the dummy wiring 14 on the base film between the adjacent wiring groups 12 as described above, the base film between them is reinforced, distortion and lifting are prevented, and conductive connection can be ensured. .
なお図示例は１つの可撓性配線接続部材上に２組の配線
群を有するものを例示したが、３組以上の配線群を有す
るものにも適用できる。また可撓性配線接続部材上の半
導体チップのボンディング面が裏側に形成されているも
のや、可撓性配線接続部材上に半導体チップ等を実装し
ないものにも適用可能である。Although the illustrated example has two wiring groups on one flexible wiring connection member, it is also applicable to an example having three or more wiring groups. Further, it is also applicable to a structure in which the bonding surface of a semiconductor chip on a flexible wiring connection member is formed on the back side, or a structure in which a semiconductor chip or the like is not mounted on a flexible wiring connection member.
＝６−
さらに実施例は液晶表示装置に適用したが、例えばプラ
ズマデイスプレィやＥ Ｌデイスプレィその他各種の電
気光学装置等にも適用できる。特に多ビン高密度端子接
続に有効である。=6-Furthermore, although the embodiment is applied to a liquid crystal display device, it can also be applied to, for example, a plasma display, an EL display, and various other electro-optical devices. It is particularly effective for multi-bin high-density terminal connections.
以上説明したように本発明によれば、隣り合う配線群間
の基材フィルム上にダミー配線を施したから、上記配線
群を他の部材に異方性導電膜等で導電接続する際に、」
二足隣り合う配線群間の基材フィルムが、ダミー配線に
より保形されて歪みや浮き」−かり等が生じるのを簡単
かつ確実に防止することが可能となり、安定性のよい配
線接続装置および電気光学装置が安価に得られる等の効
果がある。As explained above, according to the present invention, since dummy wiring is provided on the base film between adjacent wiring groups, when the wiring groups are electrically connected to other members with an anisotropic conductive film or the like, ”
It is possible to easily and reliably prevent the base film between two adjacent wiring groups from being distorted or floating due to the dummy wiring retaining its shape, resulting in a highly stable wiring connection device and There are effects such as the ability to obtain an electro-optical device at low cost.
第１図は本発明による配線接続装置に用いる可撓性配線
接続部材の一例を示す平面図、第２図第３図はその可撓
性配線接続部材を用いて導電接続を行った状態の側面図
である。
１は可撓性配線接続部材、ＩＨＪ基材フィルム、１２は
配線群、１３は半導体チップ、１４はダミー配線、２は
液晶表示パネル、３は駆動制御回路基板。Fig. 1 is a plan view showing an example of a flexible wiring connection member used in the wiring connection device according to the present invention, and Fig. 2 and 3 are side views of a state in which conductive connection is made using the flexible wiring connection member. It is a diagram. 1 is a flexible wiring connection member, IHJ base film, 12 is a wiring group, 13 is a semiconductor chip, 14 is a dummy wiring, 2 is a liquid crystal display panel, and 3 is a drive control circuit board.
Claims (2)
線群を形成し、それ等の配線群を他の部材に導電部材を
介して導電接続するものにおいて、隣り合う配線群間の
基材フィルム上にダミーの配線を形成したことを特徴と
する配線接続装置。(1) In the case where multiple wiring groups are formed on the base film of a flexible wiring connection member and the wiring groups are conductively connected to other members via conductive members, the distance between adjacent wiring groups is A wiring connection device characterized in that dummy wiring is formed on a base film.
線群を形成し、隣り合う配線群間の基材フィルム上にダ
ミーの配線を形成した配線接続装置を用いて、基板上に
形成された端子電極群と前記配線群とを導電部材で導電
接続したことを特徴とする電気光学装置。(2) Using a wiring connection device in which multiple wiring groups are formed on the base film of the flexible wiring connection member and dummy wiring is formed on the base film between adjacent wiring groups, An electro-optical device characterized in that the formed terminal electrode group and the wiring group are conductively connected by a conductive member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2302929A JP3013433B2 (en) | 1990-11-08 | 1990-11-08 | Wiring connection structure and electro-optical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2302929A JP3013433B2 (en) | 1990-11-08 | 1990-11-08 | Wiring connection structure and electro-optical device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04176183A true JPH04176183A (en) | 1992-06-23 |
| JP3013433B2 JP3013433B2 (en) | 2000-02-28 |
Family
ID=17914834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2302929A Expired - Fee Related JP3013433B2 (en) | 1990-11-08 | 1990-11-08 | Wiring connection structure and electro-optical device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3013433B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0803858A1 (en) * | 1996-04-23 | 1997-10-29 | Sony Corporation | Display apparatus and assembly of its driving circuit |
| EP0909975A2 (en) * | 1992-12-10 | 1999-04-21 | Sharp Kabushiki Kaisha | Flat type display device and driving method and assembling method therefore |
| JP2020025033A (en) * | 2018-08-08 | 2020-02-13 | 株式会社Ｊｏｌｅｄ | Flexible wiring board and display device |
-
1990
- 1990-11-08 JP JP2302929A patent/JP3013433B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0909975A2 (en) * | 1992-12-10 | 1999-04-21 | Sharp Kabushiki Kaisha | Flat type display device and driving method and assembling method therefore |
| EP0909975A3 (en) * | 1992-12-10 | 1999-05-06 | Sharp Kabushiki Kaisha | Flat type display device and driving method and assembling method therefore |
| EP0803858A1 (en) * | 1996-04-23 | 1997-10-29 | Sony Corporation | Display apparatus and assembly of its driving circuit |
| JP2020025033A (en) * | 2018-08-08 | 2020-02-13 | 株式会社Ｊｏｌｅｄ | Flexible wiring board and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3013433B2 (en) | 2000-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5893623A (en) | Structure and method for mounting semiconductor devices, and liquid crystal display | |
| US6738123B1 (en) | Drive circuit connection structure including a substrate, circuit board, and semiconductor device, and display apparatus including the connection structure | |
| KR100689681B1 (en) | Film substrate, manufacturing method thereof and substrate for displaying image | |
| JPH11142871A (en) | Wiring board | |
| JP3533519B2 (en) | Manufacturing method of TFT substrate, film carrier and liquid crystal display element | |
| JP2008130803A (en) | Board device and substrate | |
| JPH04216589A (en) | Connecting structure of electronic circuit | |
| US5555116A (en) | Liquid crystal display having adjacent electrode terminals set equal in length | |
| JPH04176183A (en) | Wiring connection device and electro-optical device provided therewith | |
| JPH11305250A (en) | Picture display device | |
| JP3269128B2 (en) | Liquid crystal display device, electronic printing device, and semiconductor element mounting method | |
| JP3769979B2 (en) | Display panel and display device including the same | |
| JPH05145209A (en) | Connection structure of terminal | |
| JP2828829B2 (en) | LCD module | |
| JPH04282618A (en) | Liquid crystal display device | |
| JPH0412389A (en) | Display device | |
| JPH11109403A (en) | Liquid crystal display device | |
| JPH0827595B2 (en) | Display device | |
| JPH04254826A (en) | Connection structure of circuit board | |
| JP3987288B2 (en) | Semiconductor element mounting structure and liquid crystal display device | |
| JP2001201757A (en) | Liquid crystal display device and its manufacturing method | |
| JP2004177578A (en) | Electronic module | |
| JPH04340928A (en) | Mounting structure for semiconductor element, electrooptic device, and electronic printing device | |
| JP2816281B2 (en) | Liquid crystal display | |
| KR19980050043U (en) | TPS structure of LCD |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081217 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081217 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091217 Year of fee payment: 10 |
|
| LAPS | Cancellation because of no payment of annual fees |