JPH04340928A - Mounting structure for semiconductor element, electrooptic device, and electronic printing device - Google Patents

Abstract

PURPOSE:To enable low-cost, high-reliability, and high-density mounting by connecting an input/output terminal and an electronic circuit element by facedown mounting, and connecting a terminal which is lead out of an electronic circuit element and a driving control circuit substrate by an FPC. CONSTITUTION:As for the electronic circuit element 1, the semiconductor element 2, and the driving control circuit board 3 which controls the semiconductor element 2, the electronic circuit element electrode terminal 6 constituted on the electrode substrate of the electronic circuit element 1 and the input/output terminal of the semiconductor element 2 are positioned and the facedown mounting is performed. Then the electronic circuit element electrode terminal 6 which is led out of the electronic circuit element 1 and becomes the input of the semiconductor element and the equal-direction surface of the driving control circuit board electrode 7 of the driving control circuit board 3 are connected by the flexible print circuit(FPC) 5.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure using semiconductor elements.

0002

[Prior Art] Figure 8 shows an example of a conventional semiconductor device mounting structure.
Shown below.

[0003] A conventional semiconductor device mounting method includes an electronic circuit device 1, a semiconductor device 2 for driving the electronic circuit device 1, and a drive control circuit board 3 for controlling the semiconductor device 2. Wire bonding mounting using metal wires 8 is used for the connection of the electronic circuit element 1 and the wiring between the electronic circuit element 1 and the drive control circuit board 3 that controls the semiconductor element 2.

0004

[Problems to be Solved by the Invention] However, in the above-mentioned conventional technology, each element and the board are connected by wire bonding, and the number of connections is 20-30 on the input side and 160-30 on the output side. The number of connections is 200, which is a large number. Moreover, the connection wire material has a wire diameter of φ28μ.
m metal wire is used, and the connection pitch is 100 μm to 200 μm.
Since the mounting density is high (μm), the connection strength is very weak at around 10 g. Further, in the wire connection between the semiconductor element 2 and the drive control circuit board 3, since there is a step difference in the mounting structure, long wire bonding occurs, causing wire flow and wire short-circuiting, which causes a decrease in yield.

SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned problems, and an object of the present invention is to provide a mounting structure for semiconductor elements with improved reliability and durability.

[0006]

[Means for Solving the Problems] A semiconductor device mounting structure of the present invention includes a semiconductor device having an input terminal and an output terminal,
It has an input electrode terminal and an output electrode terminal formed on a substrate of an electronic circuit element, and the input terminal and the input electrode terminal, and the output terminal and the output electrode terminal face each other and are mounted face-down. , the input electrode terminal and a drive control circuit electrode formed on a drive control circuit board for controlling the semiconductor element are electrically connected by a flexible printed circuit.

[0007]

[Embodiments] Hereinafter, embodiments of the present invention will be explained in detail with reference to the drawings.

[Embodiment 1] FIG. 1 is a sectional view showing an embodiment of a semiconductor element mounting structure of the present invention.

In this embodiment, in the electronic circuit element 1, the semiconductor element 2, and the drive control circuit board 3 for controlling the semiconductor element 2 shown in FIG. Face-down mounting is performed by aligning the element electrode terminals 6 and the input/output terminals of the semiconductor element 2. Then, an electronic circuit element electrode terminal 6 and a drive control circuit board 3 that can serve as an input for a semiconductor element derived from the electronic circuit element 1
The same direction surfaces of the drive control circuit board electrodes 7 are connected by a flexible printed circuit (hereinafter referred to as FPC) 5.

[Embodiment 2] FIG. 2 is a sectional view showing an embodiment of a semiconductor element mounting structure of the present invention.

This embodiment is a cross-sectional view showing a semiconductor element mounting structure in a modification of the first embodiment in which the drive control circuit board 3 has a larger external shape than the electronic circuit element 1. FPC to the input terminal of the semiconductor element 2 connected to the electronic circuit element electrode 6 of the electronic circuit element 1 by face-down mounting.
5. In order to make the connection, a through opening h is provided in the drive control circuit board 3 by cutting out the base material with a width that allows the FPC 5 for connection to be inserted, leaving a connection part, and the opening h is FPC5
The input terminal of the semiconductor 2 and the drive control circuit are connected to each other through the passthrough. The drive control circuit board 3 is fixed to the electronic circuit element 1 with an adhesive 9.

[Embodiment 3] FIG. 3 is a sectional view showing an embodiment of a semiconductor element mounting structure of the present invention.

This embodiment is an embodiment in which the position of the FPC 5 of the second embodiment is changed, and the FP from the drive control circuit board 3 is
The position C5 is connected from the drive control circuit board 3 located outside the electronic circuit element 1.

[Embodiment 4] FIG. 4 is a perspective view showing an embodiment of an electro-optical device using the semiconductor element mounting structure of the present invention, and FIG. 5 is a sectional view thereof. In FIG. 5, the electro-optical device is a liquid crystal display element 1a, and the liquid crystal display element 1a is
A transparent electrode 11 made of ITO is formed on a glass substrate 10. The semiconductor element 2 also has an output terminal electrode 12.
There are 160 bumps with a pitch of 80 μm and an input terminal electrode 13.
25 bumps are formed at a pitch of 100 μm. Face-down mounting is performed by aligning the transparent electrode 11 formed on the liquid crystal display element 1a with the input terminal electrode 13 and output terminal electrode 12 of the semiconductor element 2. Next, the transparent electrode 11, which can serve as an input for the semiconductor element 2 formed on the liquid crystal display element 1a, and the drive control circuit electrode 7 of the drive control circuit board 3 are patterned using 35 μm copper foil on a polyimide film base material. The FPC 5 is coated with an anisotropic conductive film 14.
Connected with. In addition, the semiconductor mounting structure based on the above embodiment is used in four places on the common electrode side and three places on the control electrode side, and the display pixel pitch is 0.33 mm to 0.28 mm compared to the conventional one.
The display density became high definition, and a liquid crystal display device with 400 x 640 pixels was realized. Furthermore, wire bonding defects such as wire breakage, which conventionally occur when manufacturing this liquid crystal display device, can be reduced, and the device can be manufactured at a high yield. Furthermore, we evaluated this liquid crystal display device by subjecting it to an aging test.
0 minutes) 400 cycles and humidity test (60℃90%R
H) Normal operation was confirmed even after 400 hours, demonstrating high reliability and durability.

[Embodiment 5] FIG. 6 is a perspective view showing an embodiment of an electronic printing device using the semiconductor element mounting structure of the present invention, and FIG. 7 is a sectional view thereof. In FIG. 7, the electronic printing device is a thermal head element 1b, and the thermal head element 1b has a thin film conductor electrode 16 formed of Au on a ceramic substrate 15. Further, on the semiconductor element 2, output terminal electrodes 12 are formed with 64 bumps at a pitch of 100 μm, and input terminal electrodes 13 are formed with 10 bumps at a pitch of 250 μm. Face-down mounting is performed by aligning the thin film conductor electrode 16 formed on the thermal head element 1b with the input terminal electrode 13 and output terminal electrode 12 of the semiconductor element 2. Next, the thin film conductor electrode 16, which can be an input to the semiconductor element 2, is formed on the thermal head element 1b.
and the drive control circuit electrodes 7 of the drive control circuit board 3 were connected to an FPC 5 in which electrodes were patterned with 35 μm copper foil on a polyimide film base material with an anisotropic conductive film 14 . By using the semiconductor mounting structure based on the above embodiment at 32 locations and arranging 2048 dot heating resistors 17 in a row on the heat sink 18, high-definition 8 dots/mm can be achieved.
, and compact implementation was possible, making it possible to realize a B4 size thermal head printing device.

[0016]

As explained above, the present invention connects the input/output terminals of a semiconductor element and an electronic circuit element by face-down mounting, and connects the input/output terminals of a semiconductor element to a drive for controlling the semiconductor element. FP wiring between control circuit boards
The C connection has the effect of providing an electronic optical device and an electronic printing device that are inexpensive, highly reliable, and have a compact packaging structure that allows high-density packaging.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of a semiconductor packaging structure of the present invention.

FIG. 2 is a sectional view showing an embodiment of the semiconductor packaging structure of the present invention.

FIG. 3 is a sectional view showing an embodiment of the semiconductor packaging structure of the present invention.

FIG. 4 is a perspective view showing an embodiment of an electro-optical device using the semiconductor mounting structure of the present invention.

FIG. 5 is a sectional view showing an embodiment of an electro-optical device using the semiconductor packaging structure of the present invention.

FIG. 6 is a perspective view showing an embodiment of an electronic printing device using the semiconductor packaging structure of the present invention.

FIG. 7 is a sectional view showing an embodiment of an electronic printing device using the semiconductor packaging structure of the present invention.

FIG. 8 is a cross-sectional view showing a conventional semiconductor packaging structure.

[Explanation of symbols]

1. electronic circuit element 1a. liquid crystal display element 1b. thermal head element 2. semiconductor element 3. Drive control circuit board 4. Reinforcement plate 5. flexible printed circuit 6. Electronic circuit element electrode terminal 7. Drive control circuit electrode 8. metal wire 9. glue 10. glass substrate 11. transparent electrode 12. Output terminal electrode 13. Input terminal electrode 14. Anisotropic conductive film (ACF) 15. ceramic substrate 16. thin film conductor electrode 17. heating resistor 18. heat sink h. Aperture

Claims (3)

[Claims] 1. A semiconductor element having an input terminal and an output terminal, and an input electrode terminal and an output electrode terminal formed on a substrate of an electronic circuit element, the input terminal, the input electrode terminal, and the output terminal. and the output electrode terminal face each other and are mounted face-down, and the input electrode terminal and a drive control circuit electrode formed on a drive control circuit board for controlling the semiconductor element are electrically connected by a flexible printed circuit. A semiconductor element mounting structure characterized by: 2. An electro-optical device characterized by using the semiconductor element mounting structure according to claim 1. 3. An electronic printing device characterized by using the semiconductor element mounting structure according to claim 1.