JP2001296542A - Liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal display device with a small occupancy area. SOLUTION: In the liquid crystal display device provided with a liquid crystal display element having a cell constructed with lower and upper transparent substrates to contain a liquid crystal, a projecting edge projecting from at least one of the display plane out of the display planes of the lower and upper transparent substrates and an electrode pattern on the projecting edge, and a flexible connection member electrically connected with the electrode pattern and connected with a controlling circuit to control the liquid crystal display element, the flexible connection member is extended to the inside opposite to the lower surface of the lower transparent substrate and is connected to the liquid crystal display element.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a liquid crystal display device, and more particularly to a liquid crystal display device having a flexible connection member for connecting a liquid crystal display element and a control circuit for controlling the liquid crystal display element. .

[0002]

2. Description of the Related Art In a conventional liquid crystal display device, a flexible connecting member connected to a liquid crystal display element is connected with an end face facing inward of the liquid crystal display element, and a control circuit for controlling the liquid crystal display element is provided. In the case where the flexible connection member is provided on the rear surface of the liquid crystal display element, the flexible connection member extending toward the outside of the liquid crystal display element needs to be bent at 180 degrees. As such a conventional example, there is JP-A-10-333174.

FIG. 20 is a perspective view showing a schematic structure of a liquid crystal display device 801 in the above conventional example. In FIG. 20, a liquid crystal display device 801 has a cell composed of an upper transparent substrate 802 and a lower transparent substrate 803, and a liquid crystal is sealed inside the cell. A semiconductor integrated circuit chip 806 is fixed and a flexible connecting member 805 is connected. The flexible connection member 805 is installed on the back surface of the lower transparent substrate 803, and the connection end of the flexible connection member 805 is bent upward and passes outside the outer peripheral end surface of the lower transparent substrate 803, Further, it is bent inward of the lower transparent substrate 803 and is connected to a connection end of the lower transparent substrate 803.

[0004]

As described above, in the conventional liquid crystal display device, the flexible connecting member 805 connected to the upper transparent substrate 802 and the lower transparent substrate 803 has the end faces of the upper transparent substrate 802 and the lower transparent substrate 802. When the control circuit for controlling the liquid crystal display device 801 is connected to the inside of the liquid crystal display device 801 and is provided on the rear surface of the liquid crystal display device 801, the flexible circuit extends outward from the liquid crystal display device 801. The sexual connection member 805 needs to be turned 180 ° and bent,
The flexible connection member 805 protrudes from the outer periphery of the lower transparent substrate 803 by the dimension f, and has a disadvantage that the area occupied by the liquid crystal display device 801 increases.

An object of the present invention is to provide a liquid crystal display device having a small occupied area and sufficient reliability.

[0006]

In order to achieve the above object, according to the present invention, a cell for containing a liquid crystal is constituted by a lower transparent substrate and an upper transparent substrate, and at least one of the lower transparent substrate and the upper transparent substrate is provided. A liquid crystal display device comprising: a liquid crystal display element having a protruding side protruding from the display surface of (a) and having an electrode pattern on the protruding side; and a flexible connection member electrically connected to the electrode pattern. The characteristic connection member extends inward so as to face the lower surface of the lower transparent substrate and is connected to the liquid crystal display element.

The lower transparent substrate and the upper transparent substrate constitute a cell for accommodating liquid crystal, and have at least a protruding side protruding from one of the display surfaces of the lower transparent substrate and the upper transparent substrate. A liquid crystal display element having a pattern,
A liquid crystal display device having a flexible connection member electrically connected to the electrode pattern and connected to a control circuit for controlling the liquid crystal display element, wherein the flexible connection member faces the lower surface of the lower transparent substrate. And extending to the inside and connected to the liquid crystal display element.

The length of the connection surface of the flexible connection member connected to the electrode pattern is 1.2 mm to 1.
8 mm, the step of the flexible connection member facing the lower surface of the lower transparent substrate is 0.6 mm to 0.8 mm, and the length in the direction parallel to the connection surface until reaching the step is It is 1.8 mm to 2.0 mm.

Further, the position of the end of the flexible connecting member is matched with the position of the end face of the protruding side.

A semiconductor integrated circuit chip for operating the liquid crystal display element is fixed to the electrode pattern.
A position where the semiconductor integrated circuit chip is fixed is between an end surface of the upper transparent substrate or the lower transparent substrate and a connection surface of the flexible connection member connected to the electrode pattern. Things. Further, a distance between a side surface of the semiconductor integrated circuit chip and an end surface of the lower transparent substrate or the upper transparent substrate is 1.4 mm to 1.8 mm.

Further, a chamfered portion is formed at a corner of the end surface of the lower transparent substrate or the upper transparent substrate facing the flexible connection member.

Further, a surface of the flexible connection member facing the semiconductor integrated circuit chip is adhered to the semiconductor integrated circuit chip.
Further, a surface of the flexible connection member facing the semiconductor integrated circuit chip is bonded to the semiconductor integrated circuit chip by a double-sided adhesive tape. Further, a corner of the semiconductor integrated circuit chip facing the flexible connecting member is covered with a double-sided adhesive tape.

[0013] Further, the flexible connecting member is characterized in that a plurality of holes are provided along a bending line at a portion where the flexible connecting member bends while being connected to the electrode pattern.

Further, the flexible connection member is of a two-layer type comprising an electrode member and a coating material. Further, the flexible connection member has an electrode member having a thickness of 8 mm.
μm, and the thickness of the coating material is 10 μm to 15 μm. Further, the flexible connection member is characterized in that the electrode member is laminated with a coating material. Further, the flexible connection member is characterized in that the thickness of the coating material at a portion where a corner of another member abuts while being connected to the electrode pattern is thickened.

The flexible connecting member has a protection pattern formed on a portion facing the semiconductor integrated circuit chip to protect the semiconductor integrated circuit chip from disturbance and to radiate heat of the semiconductor integrated circuit chip. It is characterized by having been done.

Further, the flexible connection member is formed by a thermocompression bonding head with an anisotropic conductive adhesive film interposed between the flexible connection member and the upper transparent substrate or the lower transparent substrate. When the connection member is pressed and heated to adhere to the upper transparent substrate or the lower transparent substrate, the molten anisotropic conductive adhesive film leaks from between the semiconductor integrated circuit chip and the flexible connection member. The semiconductor integrated circuit chip is attached to the upper transparent substrate or the lower transparent substrate with a space between the semiconductor integrated circuit chip and the thermocompression bonding head so as not to adhere to the thermocompression bonding head. .

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on embodiments with reference to the drawings. FIG. 1 is a perspective view showing a first embodiment according to the present invention as viewed obliquely from above. FIG. 2 is a partial sectional view showing a schematic state of a section taken along line AA in FIG. FIG. 3 is a sectional view of a main part showing a detailed state of a portion B in FIG. FIG. 4 is an explanatory diagram illustrating a state in which the flexible connection member in FIG. 3 is bonded to the upper transparent substrate by a pressure bonding head. FIG. 5 is an explanatory diagram for explaining the dimensional relationship in FIG.

FIG. 6 is a perspective view showing a second embodiment of the present invention as viewed obliquely from above. FIG. 7 is a sectional view of an essential part showing a state similar to FIG. 3 in the third embodiment.
FIG. 8 is a cross-sectional view of a principal part showing a state similar to FIG. 3 in the fourth embodiment. FIG. 9 is a cross-sectional view of a principal part showing a state similar to FIG. 3 in the fifth embodiment. FIG. 10 is a cross-sectional view of a principal part showing a state similar to FIG. 3 in the sixth embodiment.
FIG. 11 is a cross-sectional view of a principal part showing a state similar to FIG. 3 in the seventh embodiment. FIG. 12 is a diagram showing the configuration of FIG.
It is a perspective view which shows the same state as. FIG. 13 is a detailed cross-sectional view showing a state similar to that of the portion C in FIG. 3 in the ninth embodiment. FIG. 14 is a detailed cross-sectional view showing a state similar to that of the part C in FIG. 3 in the tenth embodiment. FIG. 15 is a detailed cross-sectional view showing a state similar to the part C in FIG. 3 in the eleventh embodiment. FIG. 16 is a sectional view of a main part showing a state where the first embodiment according to the present invention is applied to a transmission type display device. FIG.
FIG. 4 is a sectional view showing a state where the first embodiment of the present invention is applied to a reflective display device. FIG. 18 is a perspective view showing a state similar to FIG. 1 in the twelfth embodiment. FIG.
FIG. 9 is a sectional view of a principal part showing a state similar to FIG. 3 in the twelfth embodiment.

Referring to FIG. 1, an outline of a first embodiment according to the present invention will be described. In the liquid crystal display device 1, a cell is constituted by a sealing member 4 interposed between both the upper transparent substrate 2 and the lower transparent substrate 3, and a liquid crystal is sealed inside the cell to constitute a liquid crystal display element. . An electrode pattern (not shown) is formed on the protruding side 2 a of the upper transparent substrate 2, a semiconductor integrated circuit chip 6 is fixed to the electrode pattern, and an end 5 a of the flexible connection member 5 is connected to the electrode pattern. Have been. The flexible connection member 5 is installed on the back surface of the lower transparent substrate 3, and the connection end of the flexible connection member 5 has a lower transparent surface with the end surface of the end 5 a facing the end surface of the upper transparent substrate 2. The connection is made to extend in the direction of the back surface of the substrate 3.

Referring to FIG. 2, a schematic state of a cross section taken along line AA in FIG. 1 will be described. Upper transparent substrate 2 and lower transparent substrate 3
Are fixed at intervals with a seal member 4 to form a cell, and a liquid crystal is sealed inside the cell. The semiconductor integrated circuit chip 6 is fixed to the upper transparent substrate 2, and the end 5a of the flexible connection member 5 is connected to the upper transparent substrate 2. The end 5 a of the flexible connection member 5 is connected with its end face toward the end face of the upper transparent substrate 2, is bent in a step shape, and extends toward the back surface of the lower transparent substrate 3. Therefore, even when the control circuit is disposed on the back surface of the liquid crystal display device 1, the flexible connecting member 5 extending to the outside of the liquid crystal display device 1 has a 180 ° angle as in the prior art shown in FIG.
There is no need to fold and bend, and the flexible connection member 5 does not protrude from the outer periphery of the lower transparent substrate 3, so that the occupied area of the liquid crystal display device can be reduced.

Referring to FIG. 3, the state of the portion B in FIG. 2 will be described. A cell is constituted by the upper transparent substrate 2, the lower transparent substrate 3, and the sealing member 4, and a liquid crystal is sealed inside the cell. A semiconductor integrated circuit chip 6 is connected to the upper transparent substrate 2 via a semiconductor anisotropic conductive adhesive film 7a, and an end 5a of the flexible connecting member 5 is connected via a connecting member anisotropic conductive adhesive film 7b. Connected. The semiconductor anisotropic conductive adhesive film 7a and the connecting member anisotropic conductive adhesive film 7b are bonded to the upper transparent substrate 2 by coating or sticking. The end 5 a of the flexible connection member 5 is connected with its end face toward the end face of the upper transparent substrate 2, is bent in a step shape, and extends toward the back surface of the lower transparent substrate 3. The surface of the upper transparent substrate 2 between the semiconductor anisotropic conductive adhesive film 7a connecting the semiconductor integrated circuit chip 6 and the sealing member 4 is covered with a first insulating film 9a. The surface of the upper transparent substrate 2 between the anisotropic conductive adhesive film for semiconductor 7a connecting the flexible connecting member 5 and the anisotropic conductive adhesive film 7b for connecting It is covered with the film 9b. Therefore, the electrode pattern formed on the surface of the upper transparent substrate 2 is not corroded and disconnected, and no foreign matter adheres to the surface of the upper transparent substrate 2 and leaks between the electrode patterns.

Referring to FIG. 4, a state in which the flexible connection member 5 in FIG. 3 is bonded to the upper transparent substrate 2 by the pressure bonding head 14 will be described. The flexible connecting member 5 is connected to the upper transparent substrate 2
In the operation step of connecting the anisotropic conductive adhesive film 7 b for a connection member on the upper transparent substrate 2, the flexible connection member 5 is mounted thereon, and the flexible connection is performed by the thermocompression bonding head 14. The member 5 is bonded to the upper transparent substrate 2 by pressing and heating the upper transparent substrate 2.

As described above, when connecting the flexible connecting member 5 to the upper transparent substrate 2, the anisotropic conductive adhesive film for the connecting member is placed between the flexible connecting member 5 and the upper transparent substrate 2. 7b, the flexible connection member 5 is pressed and heated by the thermocompression head 14 to adhere to the upper transparent substrate 2, and the flexible connection member 5 is connected to the semiconductor integrated circuit chip 6 and the thermocompression head. Since it is attached to the upper transparent substrate 2 with a gap therebetween, the melted anisotropic conductive adhesive film 7 b for the connection member leaks out from between the semiconductor integrated circuit chip 6 and the flexible connection member 5, and Even when it rises up along the integrated circuit chip 6, it does not adhere to the thermocompression bonding head because it is separated by the flexible connecting member 5.

Referring to FIG. 5, the dimensional relationship in FIG. 3 will be described. The length a in which the end 5a of the flexible connection member 5 is connected to the surface of the upper transparent substrate 2 via the anisotropic conductive adhesive film 7a for semiconductors is 1.2 mm to 1.8 m.
m, and the level difference b from the connected surface of the flexible connection member 5 to the lower surface of the lower transparent substrate 3 is 0.6 mm.
The length c in the direction parallel to the connection surface until reaching the step is 1.8 mm to 2.0 mm. The required strength of the connection between the flexible connecting member 5 and the electrode pattern formed on the surface of the upper transparent substrate 2 and the required strength of the bent portion of the flexible connecting member 5 can be secured.

As described above, in the present invention, the flexible connecting member extending outward from the liquid crystal display element does not need to be folded back at 180 ° as in the conventional example, and the flexible connecting member 5 is not required to be bent. Since the step from the connected surface to the lower surface of the lower transparent substrate 3 is reduced, it is suitable for a reflection type liquid crystal display device which does not require a backlight on the back surface of the liquid crystal display device.

Referring to FIG. 6, the configuration of the second embodiment will be described. As in the first embodiment described with reference to FIG. 1, the semiconductor integrated circuit chip 6 is fixed to the upper transparent substrate 2, and the end 105a of the flexible connecting member 105 is fixed.
Is connected. An opening 105 b is provided in a portion of the flexible connection member 105 facing the semiconductor integrated circuit chip 6 so that the back surface of the flexible connection member 105 does not hit a corner of the semiconductor integrated circuit chip 6. ing.
Therefore, the flexible connection member 105 does not repeatedly hit the corner of the semiconductor integrated circuit chip 6 and is not disconnected. In addition, the flexible connection member 105 may form the step “b” between the position connected to the surface of the upper transparent substrate 2 and the longitudinal direction from the position facing the lower surface of the lower transparent substrate 3, so that it is gentle. It is possible to bend at an appropriate curvature, and therefore, the bending stress is reduced and it is difficult to break.

Referring to FIG. 7, the configuration of the third embodiment will be described. A cell is constituted by the upper transparent substrate 2, the lower transparent substrate 103, and the sealing member 4 in the same manner as in the first embodiment described with reference to FIG. The end portion 5a of the flexible connection member 5 is connected to the upper transparent substrate 2. The end 5a of the flexible connection member 5 is connected with its end face toward the end face of the upper transparent substrate 2 and is bent in a step shape to form the lower transparent substrate 1.
03 extends in the direction of the back surface. Generally upper transparent substrate 2
In addition, since the lower transparent substrate 103 is formed by cutting a glass plate, an edge may be formed at a corner, and the flexible connecting member 5 may vibrate to abut and rub against the edge of the lower transparent substrate 103. And a flexible connecting member 5 to be described later.
There is a possibility that the coating material covering the electrode member is peeled off and exposed, and the exposed electrode member is corroded and disconnected, or the electrode member is damaged and broken due to breakage. In order to prevent such a failure, the lower transparent substrate 1 facing the flexible connecting member 5
A chamfered portion 103a is formed at the corner of 03. Therefore, the flexible connection member 5 does not repeatedly break on the corner of the lower transparent substrate 103 to be disconnected.

Referring to FIG. 8, the configuration of the fourth embodiment will be described. A cell is constituted by the upper transparent substrate 2, the lower transparent substrate 3, and the sealing member 4, similarly to the first embodiment described in FIG. The end portion 5a of the flexible connection member 5 is connected to the upper transparent substrate 2. The end 5 a of the flexible connection member 5 is connected with its end face toward the end face of the upper transparent substrate 2, is bent in a step shape, and extends toward the back surface of the lower transparent substrate 3. The flexible connection member 5 is adhered to the upper surface of the semiconductor integrated circuit chip 6 with an adhesive 11. Therefore, the flexible connecting member 5 does not move,
No large stress is applied to the connection boundary of the end portion 5a of the flexible connection member 5 connected to the upper transparent substrate 2, and there is no disconnection at the connection boundary.

Referring to FIG. 9, the configuration of the fifth embodiment will be described. As in the fourth embodiment described with reference to FIG. 8, a cell is constituted by the upper transparent substrate 2, the lower transparent substrate 3, and the sealing member 4. An end 205 a of a flexible connection member 205 is connected to the upper transparent substrate 2. The end 205 a of the flexible connection member 205 is connected with its end face toward the end face of the upper transparent substrate 2, is bent in a step shape, and extends toward the back surface of the lower transparent substrate 3. The flexible connection member 205 is adhered to the upper surface of the semiconductor integrated circuit chip 6 by a double-sided adhesive tape 11 so as to cover the corners of the semiconductor integrated circuit chip 6. Therefore, the flexible connection member 205 does not move, and the semiconductor integrated circuit chip 6 does not move.
While not hitting the corner repeatedly,
No large stress is applied to the connection boundary of the end 205a of the flexible connection member 205 connected to the upper transparent substrate 2, and there is no disconnection at the connection boundary.

Referring to FIG. 10, the configuration of the sixth embodiment will be described. A cell is constituted by the upper transparent substrate 2, the lower transparent substrate 3, and the sealing member 4, similarly to the first embodiment described in FIG. An end portion 5a of the flexible connection member 5 is provided on the upper transparent substrate 2 with an anisotropic conductive adhesive film 7 for the connection member.
b. End 5 of flexible connection member 5
“a” is connected with its end face toward the end face of the upper transparent substrate 2, is bent in a step shape, and extends toward the back surface of the lower transparent substrate 3. The connection member anisotropic conductive adhesive film 7b connecting the flexible connection member 5 to the electrode pattern of the upper transparent substrate 2 has a surface on which the flexible connection member 5 and the upper transparent substrate 2 are joined. The upper transparent substrate 2 is covered over the extending direction of the flexible connection member 5. Therefore, even when stress is applied to the connection boundary of the end portion 5 a of the flexible connection member 5 connected to the upper transparent substrate 2, the anisotropic conductive adhesive film 7 b for the connection member is located near this. Since there is no boundary between the connecting member anisotropic conductive adhesive film 7b, the connecting member anisotropic conductive adhesive film 7b is not easily peeled off from the upper transparent substrate 2.

Referring to FIG. 11, the configuration of the seventh embodiment will be described. A cell is constituted by the upper transparent substrate 2, the lower transparent substrate 3, and the sealing member 4, similarly to the first embodiment described in FIG. The end portion 5a of the flexible connection member 5 is connected to the upper transparent substrate 2. The end 5 a of the flexible connection member 5 is connected with its end face toward the end face of the upper transparent substrate 2, is bent in a step shape, and extends toward the back surface of the lower transparent substrate 3. The semiconductor integrated circuit chip 6 and the end 5a of the flexible connection member 5 are connected to the upper transparent substrate 2 via a shared anisotropic conductive adhesive film 7c formed integrally. The surface of the upper transparent substrate 2 between the shared anisotropic conductive adhesive film 7c and the sealing member 4 is covered with a first insulating film 9a. The space between the lower portion of the semiconductor integrated circuit chip 6 and the lower portion of the end portion 5a of the flexible connection member 5 is preferably covered with the second insulating film 9b as in the first embodiment, but may be omitted.

Therefore, the common anisotropic conductive adhesive film 7 c is connected to the end 5 of the flexible connecting member 5 connected to the upper transparent substrate 2.
Even when stress is applied to the boundary of the connection of a,
Since the boundary of the common anisotropic conductive adhesive film 7c does not exist in the vicinity, the common anisotropic conductive adhesive film 7c is not easily peeled off from the upper transparent substrate 2. Further, the common anisotropic conductive adhesive film 7c is adhered to the upper transparent substrate 2 by coating or sticking like the anisotropic conductive adhesive film 7a for semiconductor and the anisotropic conductive adhesive film 7b for connection member in the first embodiment. However, in the first embodiment, the operation step of applying or sticking is required twice, whereas in the seventh embodiment, one step is required.
With only one work process, it has the effect of improving work efficiency and reducing costs.

Referring to FIG. 12, the configuration of the eighth embodiment will be described. As in the first embodiment described with reference to FIG. 1, the semiconductor integrated circuit chip 6 is fixed to the upper transparent substrate 2 and the end portion 305 of the flexible connection member 305.
a is connected. A plurality of holes 305c are provided in the stepped portion of the flexible connection member 305, so that the flexible connection member 305 is easily bent.
Therefore, the flexible connection member 305 can be bent at a position determined to have a shape suitable for an object that interferes with the bending.

Referring to FIG. 13, the configuration of the ninth embodiment will be described. As in the first embodiment described with reference to FIG. 1, the semiconductor integrated circuit chip 6 is fixed to the upper transparent substrate 2 and the end portion 405 of the flexible connecting member 405.
a is connected. The flexible connection member 405 is formed by an electrode member 405e and a coating material 405f for covering and protecting the electrode member 405e. Therefore,
The flexible connection member 405 can be formed to have a small thickness, and can be easily bent without applying a large stress to the flexible connection member 405.

Referring to FIG. 14, the configuration of the tenth embodiment will be described. As in the first embodiment described with reference to FIG. 1, the semiconductor integrated circuit chip 6 is fixed to the upper transparent substrate 2 and the end 50 of the flexible connecting member 505 is provided.
5a is connected. The flexible connection member 505 includes a base material 505d, an electrode member 505e provided on the base material 505d, and a coating material 505f for covering and protecting the electrode member 505e. 505f is formed so as to cover at least a portion where another member may hit the electrode member 505e. Accordingly, the electrode member 505e is not damaged by hitting another member and is not disconnected.

Referring to FIG. 15, the configuration of the eleventh embodiment will be described. As in the ninth embodiment described with reference to FIG. 13, the semiconductor integrated circuit chip 6 is fixed to the upper transparent substrate 2 and the end 6 of the flexible connecting member 605 is fixed.
05a is connected. The flexible connection member 605 is formed of a base material 605d, an electrode member 605e provided on the base material 605d, and a coating material 605f for covering and protecting the electrode member 605e.
The coating material 605f is formed such that at least a portion where another member may hit the electrode member 605e is thick. Therefore, the electrode member 605e is not damaged by hitting another member and is not disconnected.

As described above, the flexible connecting members 505 and 605 that are connected to the upper transparent substrate 2 and are bent in a step shape and extend behind the lower transparent substrate 3 are provided with the base members 505d and 505d.
605d is located on the opposite side of the electrode members 505e, 605e, and the electrode members 505e, 605e face the rear surface of the lower transparent substrate 3, so that the electrode members 505e, 605e
Since 05e faces the substrate provided behind the lower transparent substrate 3, when connecting the flexible connection members 505, 605 to the substrate provided behind the lower transparent substrate 3,
The flexible connection members 505, 605 are processed to form the electrode member 50.
The connection can be made without exposing the back surfaces of 5e and 605e.

Referring to FIG. 16, a state in which the first embodiment according to the present invention is applied to a transmission type display device will be described. In the transmissive display device, a backlight 12 using a fluorescent lamp or an EL plate for illuminating the liquid crystal display element is mounted on the back surface of the lower transparent substrate 3 of the first embodiment shown in FIG. Flexible connection member 5 connected to upper transparent substrate 2
The end portion 5a of the backlight 12 is connected so that the end face is directed toward the end face of the upper transparent substrate 2, and the backlight 12 is bent in a step shape.
Extending in the direction of the back. The flexible connection member 5 shown by the imaginary line shows a state in which the end portion 5a is connected with the end face directed toward the center of the upper transparent substrate 2 for reference. As described above, in the transmissive display device, the method of connecting the flexible connection member 5 and the method of connecting the end 5a toward the center of the upper transparent substrate 2 in the present invention are described as follows. There is no significant difference in the stress and shape applied to No. 5.

Referring to FIG. 17, a state in which the first embodiment according to the present invention is applied to a reflection type display device will be described. In the reflective display device, a liquid crystal display element is provided on the back surface of the lower transparent substrate 3 of the first embodiment shown in FIG. Installed. The end 5a of the flexible connection member 5 connected to the upper transparent substrate 2
Are connected in the direction of the end face, and are bent in a step shape and extend in the direction of the back surface of the reflection member 13. The flexible connection member 5 shown by an imaginary line shows a state in which the end 5a is connected to the center of the upper transparent substrate 2 for reference, and the flexible connection member 5 has a large curvature. In this case, the flexible connection member 5 is disadvantageously swelled greatly by applying an excessive stress to the flexible connection member 5 because the flexible connection member 5 is bent 180 °.

As described above, the transmission type display device has an effect on the stress and the shape applied to the flexible connection member 5, but the reflection type display device particularly has an effect on the connection method of the flexible connection member 5 according to the present invention. According to the method, the flexible connection member 5 is not subjected to unreasonable deformation as compared with the method of connecting the end portion 5a toward the center of the upper transparent substrate 2,
When the present invention is configured as a reflective display device, the display device can be reduced in size, and the reliability of the flexible connection member 5 against breakage of the bent portion due to the size reduction can be improved and the flexible connection member 5 can be improved.
This has the effect of improving the reliability against peeling of the connection portion due to an external force applied to the wire.

Referring to FIGS. 18 and 19, the structure of the twelfth embodiment will be described. The first described in FIG.
Similarly to the embodiment, the semiconductor integrated circuit chip 6 is fixed to the upper transparent substrate 2 and the flexible connecting member 70
5 is connected to the end 705a. Flexible connection member 7
A protection pattern 705h for protecting the semiconductor integrated circuit chip 6 from external electromagnetism and light and dissipating the heat generated by the semiconductor integrated circuit chip 6 is formed in a portion of the semiconductor integrated circuit chip 6 which covers the semiconductor integrated circuit chip 05. I have. Therefore, the semiconductor integrated circuit chip 6 can dissipate the heat generated by the semiconductor integrated circuit chip 6 without disturbing the internal state of the semiconductor integrated circuit chip 6 due to electromagnetic disturbance and optical disturbance. Environmental conditions are improving.

As described above, the example in which the semiconductor integrated circuit chip 6 and the flexible connection member 5 are connected to the upper transparent substrate 2 has been described as an embodiment. The same effect can be obtained even when connected to the transparent substrate 3. Therefore, the same effect can be obtained when the flexible connection member 5 is connected to both the upper transparent substrate 2 and the lower transparent substrate 3. .

[0043]

According to the present invention, the end surface of the end of the flexible connecting member is connected to the direction of the end surface of the upper transparent substrate, bent in a step shape and extended toward the back surface of the lower transparent substrate. As a result, the flexible connection member extending outward from the liquid crystal display device does not need to be folded back at 180 ° and bent, and the flexible connection member does not protrude from the outer periphery of the lower transparent substrate. The occupied area of the device can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment according to the present invention as viewed obliquely from above.

FIG. 2 is a partial sectional view showing a state of a section taken along line AA in FIG. 1;

FIG. 3 is a sectional view of a main part showing a state of a part B in FIG. 2;

FIG. 4 is an explanatory diagram illustrating a state in which the flexible connection member in FIG. 3 is bonded to an upper transparent substrate by a pressure bonding head.

FIG. 5 is an explanatory diagram for explaining a dimensional relationship in FIG. 3;

FIG. 6 is a perspective view showing a second embodiment according to the present invention as viewed obliquely from above.

FIG. 7 is a sectional view of a principal part showing a state similar to FIG. 3 in a third embodiment.

FIG. 7 is a cross-sectional view of a principal part showing a state similar to FIG. 3 in the fourth embodiment.

FIG. 9 is a cross-sectional view of a principal part showing a state similar to FIG. 3 in the fifth embodiment.

FIG. 9 is a sectional view of a principal part showing a state similar to FIG. 3 in the sixth embodiment.

FIG. 11 is a sectional view of a principal part showing a state similar to FIG. 3 in the seventh embodiment;

FIG. 12 is a perspective view showing a state similar to FIG. 1 in an eighth embodiment.

FIG. 13 is a detailed sectional view showing a state similar to the part C in FIG. 3 in the ninth embodiment.

FIG. 14 is a detailed sectional view showing a state similar to the part C in FIG. 3 in the tenth embodiment.

FIG. 15 is a detailed sectional view showing a state similar to the part C in FIG. 3 in the eleventh embodiment.

FIG. 16 is a sectional view of a main part showing a state where the first embodiment according to the present invention is applied to a transmission type display device.

FIG. 17 is a sectional view of a main part showing a state in which the first embodiment according to the present invention is applied to a reflective display device.

FIG. 18 is a perspective view showing a state similar to FIG. 1 in the twelfth embodiment.

FIG. 19 is a sectional view of a main part showing a state similar to FIG. 3 in the twelfth embodiment.

FIG. 20 is a perspective view showing a schematic configuration of a liquid crystal display device in a conventional example.

[Explanation of symbols]

 Reference Signs List 1 liquid crystal display device 2 upper transparent substrate 2a projecting side 3, 103 lower transparent substrate 103a chamfered part 4 seal member 5, 105 to 705 flexible connection member 5a, 105a, 205a, 705a end 105b opening 305c hole 5d 505d, 605d, 605d Base material 5e, 405e, 505e, 605e Electrode member 5f, 405f 505f, 605f Coating material 605g Coat thick portion 705h Protective pattern 6 Semiconductor integrated circuit chip 7a Semiconductor anisotropic conductive adhesive film 7b Connecting member Anisotropic conductive adhesive film for use 7c Shared anisotropic conductive adhesive film 7d Protruding portion of anisotropic conductive adhesive film 8 Liquid crystal 9a First insulating film 9b Second insulating film 10 Adhesive material 11 Double-sided adhesive tape 12 Backlight 13 Reflecting member 14 Crimping head

Continued on the front page (72) Inventor Mitsutaka Okano 6-11-12, Honcho, Tanashi-shi, Tokyo F-term (reference) in the Tanashi Works of Citizen Watch Co., Ltd. 2H090 JA11 JA18 JC12 LA04 2H092 GA33 GA40 GA44 GA48 GA49 GA50 GA55 GA60 NA25 NA27 5G435 AA18 BB12 BB15 EE47

Claims (17)

[Claims] A lower transparent substrate and an upper transparent substrate constitute a cell for accommodating liquid crystal, and have at least a protruding side protruding from one of the display surfaces of the lower transparent substrate and the upper transparent substrate. In a liquid crystal display device having a liquid crystal display element having a pattern and a flexible connection member electrically connected to the electrode pattern, the flexible connection member is inwardly opposed to the lower surface of the lower transparent substrate. A liquid crystal display device, which extends toward and is connected to the liquid crystal display element. 2. A cell for accommodating liquid crystal is constituted by a lower transparent substrate and an upper transparent substrate, and has a projecting side projecting from at least one display surface of the lower transparent substrate and the upper transparent substrate. In a liquid crystal display device having a liquid crystal display element having a pattern and a flexible connection member electrically connected to the electrode pattern and connected to a control circuit that controls the liquid crystal display element, the flexible connection member is A liquid crystal display device, wherein the liquid crystal display device extends inward so as to face a lower surface of a transparent substrate and is connected to the liquid crystal display element. 3. The connection surface of the flexible connection member connected to the electrode pattern has a length of 1.2 mm to 1.8 m.
m, the step between the flexible connection member and the lower surface of the lower transparent substrate is 0.6 mm to 0.8 mm, and the length in the direction parallel to the connection surface until reaching the step is The liquid crystal display device according to claim 1, wherein the thickness is 1.8 mm to 2.0 mm. 4. The liquid crystal display device according to claim 1, wherein the position of the end of the flexible connection member is matched with the position of the end face of the protruding side. 5. A semiconductor integrated circuit chip for operating the liquid crystal display element is fixed to the electrode pattern, and a position where the semiconductor integrated circuit chip is fixed is fixed to an end surface of the upper transparent substrate or the lower transparent substrate. 5. The liquid crystal display device according to claim 2, wherein the liquid crystal display device is between a flexible connection member and a connection surface connected to the electrode pattern. 6. 6. The distance between a side surface of the semiconductor integrated circuit chip and an end surface of the lower transparent substrate or the upper transparent substrate is 1.4 mm.
The liquid crystal display device according to claim 5, wherein the distance is from 1.8 to 1.8 mm. 7. A chamfered part is formed at a corner of the end face of the lower transparent substrate or the upper transparent substrate facing the flexible connection member. Liquid crystal display device. 8. The semiconductor device according to claim 5, wherein a surface of the flexible connection member facing the semiconductor integrated circuit chip is adhered to the semiconductor integrated circuit chip. Liquid crystal display. 9. The semiconductor device according to claim 8, wherein the surface of the flexible connection member facing the semiconductor integrated circuit chip is adhered to the semiconductor integrated circuit chip by a double-sided adhesive tape. Liquid crystal display. 10. The semiconductor integrated circuit chip according to claim 8, wherein a corner of the semiconductor integrated circuit chip facing the flexible connection member is covered with a double-sided adhesive tape.
3. The liquid crystal display device according to 1. 11. The liquid crystal display according to claim 2, wherein the flexible connection member is provided with a plurality of holes along a bending line at a portion where the flexible connection member is bent while being connected to the electrode pattern. apparatus. 12. The liquid crystal display device according to claim 1, wherein the flexible connection member is a two-layer type including an electrode member and a coating material. 13. The flexible connection member, wherein the thickness of the electrode member is 8 μm and the thickness of the coating material is 10 μm to 15 μm.
13. The liquid crystal display device according to claim 12, wherein m is m. 14. The liquid crystal display device according to claim 12, wherein the electrode member of the flexible connection member is laminated with a coating material. 15. The coating material according to claim 12, wherein the flexible connection member is formed to have a thick coating material at a portion where a corner of another member abuts while being connected to the electrode pattern. 3. The liquid crystal display device according to 1. 16. The flexible connection member has a protection pattern formed at a portion facing the semiconductor integrated circuit chip to protect the semiconductor integrated circuit chip from disturbance and to radiate heat of the semiconductor integrated circuit chip. The liquid crystal display device according to claim 2, wherein the liquid crystal display device is provided. 17. The flexible connection member is formed by a thermocompression bonding head with an anisotropic conductive adhesive film interposed between the flexible connection member and the upper transparent substrate or the lower transparent substrate. When the connection member is pressed and heated to adhere to the upper transparent substrate or the lower transparent substrate, the molten anisotropic conductive adhesive film leaks from between the semiconductor integrated circuit chip and the flexible connection member. The semiconductor integrated circuit chip is attached to the upper transparent substrate or the lower transparent substrate with a space between the semiconductor integrated circuit chip and the thermocompression bonding head so as not to adhere to the thermocompression bonding head. The liquid crystal display device according to the above.