WO2010046948A1

WO2010046948A1 - Plasma display

Info

Publication number: WO2010046948A1
Application number: PCT/JP2008/002991
Authority: WO
Inventors: 雄二稲場
Original assignee: 日立プラズマディスプレイ株式会社
Priority date: 2008-10-22
Filing date: 2008-10-22
Publication date: 2010-04-29

Abstract

A plasma display which is made thin while maintaining the cooling effect of a scanning driver (70) in the display. The scanning driver (70) mounted on a TCP (100) is arranged at the end on the backside of a front substrate (1). The scanning driver (70) is connected with a scanning electrode extending to the end of the front substrate (1). A heat dissipation plate (80) having fins is arranged on the scanning driver (70) through adhesive (71) in order to dissipate to the outside heat generated from the scanning driver (70) formed of an IC. Since the heat dissipation plate (80) is arranged on the front substrate (1), upper portion of the heat dissipation plate (80) is lower than the circuit board (60) and the thickness of the plasma display is not increased by the heat dissipation plate (80).

Description

Plasma display device

The present invention relates to a display device, and more particularly to a plasma display device capable of partially reducing the thickness of the display device.

Demand for plasma display devices using a plasma display panel (PDP) is increasing as a thin display capable of displaying a particularly large screen. The plasma display device includes a plasma display panel, a front panel disposed on the front surface of the plasma display panel, a drive circuit disposed on the back surface of the plasma display panel, and a frame for housing them.

The plasma display panel is composed of a front substrate and a rear substrate, and a drive circuit, a control circuit, a power circuit, etc. are arranged on the rear substrate side. In the plasma display device, in order to perform gradation display, one frame is divided into a plurality of subframes, and lighting or non-lighting of each pixel is controlled in each subframe. For this reason, it is necessary to control lighting and non-lighting of each pixel at high speed.

The control signal for each pixel is sent via a scan electrode, a discharge sustain electrode, an address electrode, and the like. Therefore, the drive circuit for controlling these electrodes, particularly the IC, generates heat, and heat dissipation from the IC becomes a problem. In “Patent Document 1”, in order to more efficiently dissipate heat from the drive circuit, the drive IC is not placed on the circuit board, but is placed on a metal plate placed on the lower side of the circuit board. The configuration is described.

JP 2006-308622 A

In many cases, a heat sink having fins is used as a method of placing an IC on a circuit board and cooling the IC. A heat sink having fins requires a height of fins, the number of fins, a distance between fins, and the like in order to obtain a predetermined heat dissipation effect, and therefore the height of the heat sink increases. This causes a problem that the overall thickness of the plasma display device increases.

The technique described in “Patent Document 1” is characterized in that a heat generating component is arranged on a metal flat plate without arranging a heat sink having fins on the circuit board. According to this configuration, since there are no fins on the circuit board, a good effect can be obtained with respect to the thickness of the plasma display device.

However, in the configuration of “Patent Document 1”, it is necessary to establish electrical connection between the circuit board and the heat generating component. Further, in order to obtain a sufficient heat dissipation effect, the metal flat plate needs a predetermined thickness or area. When there are a lot of heat dissipating parts, the weight of the metal flat plate increases, and as a result, the weight of the plasma display device increases.

On the other hand, a heat dissipation plate having fins is excellent in heat dissipation effect if the fin height, the number of fins, and the spacing between the fins can be taken as required. However, if the height of the fins, the number of fins, and the spacing between the fins are sufficiently taken, the thickness of the entire plasma display device increases.

Since the plasma display device is driven by dividing one frame into a plurality of sub-frames, the heat generated from the scanning driver formed by an IC is particularly large. The subject of this invention is using the heat sink which has a fin with respect to the heat | fever from the scanning driver formed with IC, and suppressing that the thickness of a plasma display apparatus becomes thick.

The present invention solves the above-described problems, and specific means are as follows.

(1) Front surface in which scan electrodes extend in the first direction at a specific pitch and arranged in the second direction, and discharge sustain electrodes extend in the first direction at a specific pitch and arranged in the second direction A plasma display panel having a substrate, a back substrate having address electrodes extending in a second direction and arranged in the first direction, and a circuit substrate disposed on the back of the plasma display panel. A scan driver connected to the scan electrode is disposed on the front substrate, the scan driver is connected to a circuit formed on the circuit board by a flexible wiring board, and the scan driver is a metallic heat dissipation plate The plasma display device is characterized by being bonded to each other by an adhesive.

(2) The plasma display device according to (1), wherein the flexible wiring board is tape carrier packaging.

(3) The plasma display device according to (1), wherein the flexible wiring board is connected to a scanning drive circuit disposed on the circuit board.

(4) The plasma display device according to (1), wherein the heat dissipation plate is a heat dissipation plate having fins.

(5) Front surface in which scan electrodes extend in the first direction at a specific pitch and arranged in the second direction, and discharge sustain electrodes extend in the first direction at a specific pitch and arranged in the second direction A plasma display panel having a substrate, a back substrate in which address electrodes extend in a second direction and arranged in the first direction, and a chassis made of metal on the back surface of the plasma display panel are disposed, and the chassis Is a plasma display device in which a scanning wiring circuit is disposed on the printed wiring board, and a scanning electrode is disposed on the front substrate. The scanning driver is connected to a circuit formed on the circuit board by a flexible wiring board, and the scanning driver is connected to a metal heat sink. A plasma display apparatus characterized by being bonded by Chakuzai.

(6) The plasma display device according to (5), wherein the flexible wiring board is tape carrier packaging.

(7) The plasma display device according to (5), wherein the heat dissipation plate is a heat dissipation plate having fins.

According to the present invention, the scan driver formed of IC is arranged on the front substrate of the plasma display panel, and the heat radiating plate formed of metal is bonded to the scan driver by the adhesive, so that the heat dissipation of the scan driver is achieved. In addition, the increase in the thickness of the plasma display device can be suppressed even if a heat sink having a high fin is used as the heat sink.

In addition, according to the present invention, the connection with the circuit board disposed on the back surface of the plasma display panel and having the scanning drive circuit is performed by the TCP having the wiring formed on the front substrate side. An increase in the outer shape can be prevented.

DETAILED DESCRIPTION Before describing specific embodiments of the present invention, problems of the prior art will be described in detail with reference to the drawings. FIG. 7 is a schematic diagram of a plasma display device having a conventional configuration. In FIG. 7, the plasma display panel 200 is arranged with the display area facing downward. The plasma display panel 200 is configured by bonding a front substrate 1 and a rear substrate 2 via a seal portion 3. On the back side of the back substrate 2, a chassis 50 made of metal is attached via an adhesive.

A post 55 is formed on the chassis 50, and a printed wiring board 60 (PCB) is fixed to the post 55. On the printed wiring board 60, a scanning driver 70, a scanning driving circuit (hereinafter also referred to as Y driving circuit 26), a discharge sustaining driving circuit (hereinafter also referred to as X driving circuit 16), a power supply circuit 40, a control circuit 45, and the like are formed. Yes.

In FIG. 7, the scanning electrode 20 extends from the inside of the plasma display panel 200 at the end of the front substrate 1 to form a scanning electrode terminal 130. A flexible wiring board 90 is connected to the scanning electrode terminal 130, and is connected to a scanning driver 70 disposed on the printed wiring board 60 via the flexible wiring board 90. A connector 110 is disposed at the tip of the flexible wiring board 90 and is connected to the scanning driver 70. In this specification, the term “scan driver 70” refers to a chip of the scan driver 70 formed of an IC, or a block of the scan driver 70 in which a plurality of scan drivers 70 formed of an IC are collected. is there.

An adhesive 71 is formed so as to cover the scanning driver 70 formed of IC, and a heat radiating plate 80 having fins is disposed via the adhesive 71. The heat sink 80 has a bottom surface of 15 mm × 15 mm and a height of about 20 mm in order to provide a sufficient heat dissipation effect. Note that a plurality of, for example, about 10 scanning drivers 70 are arranged in the direction perpendicular to the paper surface in FIG. Therefore, about 10 fins for cooling the scanning driver 70 are also arranged.

FIG. 8 is a detailed view of the vicinity shown by the arrow B in FIG. The configuration is as described in FIG. In FIG. 8, the sealing material is omitted. A flexible wiring substrate 90 is connected to the scan electrode 20 extending from the inside of the plasma display panel 200 via an anisotropic conductive film 120 (Anisotropic Conductive Film, ASC).

In FIG. 8, a scanning driver 70 formed of an IC is disposed on a printed wiring board 60, an adhesive 71 is formed so as to cover the scanning driver 70, and a heat radiating plate 80 having fins is bonded to the adhesive 71. . For the adhesive 71, a silicon resin having good thermal conductivity is used. Since the heat sink 80 having fins has a height of about 20 mm, the overall thickness is increased by about 20 mm in the configuration of FIG. As will be described in the following embodiments, the present invention suppresses the increase in the thickness of the plasma display device while using the heat dissipation plate 80 having fins with high heat dissipation efficiency for cooling the scanning driver 70. I can do it.

FIG. 1 is a side view of a plasma display device to which the present invention is applied, and FIG. 2 is a detailed view of a portion indicated by an arrow A in FIG. FIG. 1 is a side view of the plasma display device as viewed from the long side. In FIG. 1, the front substrate 1 and the rear substrate 2 of the plasma display panel 200 are bonded via a seal portion 3. The internal structure of the plasma display panel 200 will be described later.

The chassis 50 is attached to the back side of the back substrate 2 of the plasma display panel 200 via an adhesive 51, and the printed wiring board 60 is fixed by the support 55 formed on the chassis 50 according to the prior art. This is the same as FIG. The chassis 50 is made of Fe or Al.

1, the front substrate 1 of the plasma display panel 200 is formed to be larger than the rear substrate 2. In particular, on the left side surface in FIG. 1, the front substrate 1 is formed larger than the rear substrate 2 than on the right side surface in FIG. 1. As will be described later, the scan driver 70 is formed on one side of the plasma display panel 200, and the present invention is characterized by a configuration for cooling the scan driver 70. The scanning driver 70 is formed of an IC, and specifically has a feature in a configuration for cooling the IC driver.

In FIG. 1, a scanning driver 70 is mounted on a TCP 100 (tape carrier packaging), unlike FIG. The wiring of the TCP 100 is formed on the lower surface and can be directly connected to the terminal of the front substrate 1. The TCP 100 extends over the printed wiring board 60 and is connected to the Y drive circuit 26 and the like disposed on the printed wiring board 60 via the connector 110.

FIG. 2 is a detailed view of a portion indicated by an arrow A in FIG. In FIG. 2, the scan driver 70 is mounted on the TCP 100, and the TCP 100 is connected to the scan electrode 20 formed on the front substrate 1 of the plasma display panel 200 via the ASC. Scan electrode 20 and TCP 100 are connected by anisotropic conductive film 120. The TCP 100 has a wiring whose lower surface is connected to a terminal of the scanning electrode 20 of the front substrate 1. Therefore, as shown in FIG. 8, a configuration in which the film protrudes to the side surface of the plasma display panel 200 can be avoided.

An adhesive 71 is formed so as to cover the scanning driver 70 and the TCP 100. As the adhesive 71, a silicon adhesive 71 having a good thermal conductivity is used. When importance is attached to the adhesive force, an epoxy resin is used for the adhesive 71. A heat radiating plate 80 having fins is arranged via an adhesive 71. As for the size of the heat sink 80 having fins, the area of the bottom surface is 15 mm × 15 mm and the height is about 20 mm, as in the conventional example.

Thus, even if the height of the heat sink 80 having fins is high, in the present invention, since the heat sink 80 having fins is disposed on the front substrate 1, the heat sink 80 having fins causes the plasma display device. The thickness does not increase.

The thickness of each part is as follows, for example. The thickness of the back substrate 2 is 2.8 mm to 1.8 mm, the thickness of the chassis 50 is 1.2 mm to 0.8 mm, the height of the support 55 is 20 mm, and the printed wiring board 60 is about 1.2 mm. The total thickness of these members is about 25.2 mm to 23.8 mm. Therefore, the apex of the heat sink 80 having fins is at a position lower than the height of the printed wiring board 60. That is, the heat sink 80 having fins for cooling the scan driver 70 does not affect the thickness of the plasma display device.

In other words, since the height of the heat sink 80 having fins can be increased to about 25.2 mm to 23.8 mm as necessary, the cooling efficiency can be increased accordingly. In FIG. 2, about 10 scanning drivers 70 are arranged in the direction perpendicular to the paper surface. However, about 10 heat sinks 80 having fins are also arranged corresponding to the scanning driver 70 and arranged in the direction perpendicular to the paper surface. ing. For the heat sink 80 having fins, Al whose surface is blackened is used.

Thus, according to the present invention, the heat sink 80 having fins with good cooling efficiency can be used for cooling the scanning driver 70, and the increase in the thickness of the plasma display device can be suppressed. I can do it.

In the above description, the scanning driver 70 and the printed wiring board 60 are connected by the TCP 100, but the connection between the scanning driver 70 and the printed wiring board 60 is not limited to the TCP 100. Any flexible wiring board may be used as long as the wiring faces downward and is directly connected to the scanning electrode 20 of the front substrate 1.

Hereinafter, the structure of the plasma display panel 200 to which the present invention is applied will be described. FIG. 3 is an exploded perspective view of the display area of the plasma display panel 200. The plasma display panel 200 is composed of two glass substrates, a front substrate 1 and a back substrate 2. On the front substrate 1, scanning electrodes 20 and discharge sustaining electrodes 10 that generate discharge for image formation are arranged in parallel.

The scan electrode 20 further includes a scan discharge electrode 21 formed of ITO (Indium Tin Oxide) that actually becomes a discharge electrode, and a scan bus electrode 22 that supplies a voltage from a terminal portion. Hereinafter, the scan bus electrode 22 is also referred to as a Y bus electrode, and the scan discharge electrode 21 is also referred to as a Y discharge electrode. The Y electrode includes a Y bus electrode and a Y discharge electrode.

The discharge sustaining electrode 10 further includes a discharge sustaining discharge electrode 11 formed of ITO (Indium Tin Oxide) that actually becomes a discharge electrode, and a discharge sustaining bus electrode 12 that supplies a voltage from the terminal portion. Hereinafter, the sustaining bus electrode 12 is also referred to as an X bus electrode, and the sustaining discharge electrode 11 is also referred to as an X discharge electrode. The X electrode includes an X bus electrode and an X discharge electrode.

Both the X bus electrode and the Y bus electrode have a metal laminated structure, and have a laminated structure of chromium, copper, and chromium from the front substrate 1 side. Chromium formed on the front substrate 1 has excellent adhesion to glass, and has a black surface, which has an effect of improving contrast. Copper is used to reduce the resistance of the bus electrode. Copper is further coated on the copper, and this chromium is used to prevent the copper surface from being oxidized and changing its resistance.

The chromium on the front glass may further have a laminated structure of chromium oxide and chromium. Since the chromium oxide is black and has a smaller reflectance than the chromium, the contrast of the image can be further improved. Chromium oxide also has excellent adhesion to glass. Moreover, since the contact surface with copper is chromium, copper is not oxidized.

In FIG. 3, the discharge electrode uses ITO, which is a transparent conductive film, and the bus electrode uses a metal laminated film with low resistance. This is because when the transparent conductive film is used, more light emitted from the phosphor 8 can be extracted outside. On the other hand, the discharge electrode may be formed of the same metal as the bus electrode. In this case, the process is completed once and the manufacturing cost is greatly reduced.

The dielectric layer 5 is formed so as to cover the X electrode and the Y electrode. For the dielectric layer 5, a low-melting glass having a softening point of about 500 ° C. is used. A protective film 6 is formed thereon. The protective film 6 is mainly made of magnesium oxide (MgO) and is formed by sputtering or vapor deposition.

The address electrode 30 is formed on the rear substrate 2 so as to be orthogonal to the X bus electrode or the Y bus electrode. The structure of the address electrode 30 is the same as that of the X bus electrode or the Y bus electrode, and is a laminated structure of chromium, copper, and chromium. The dielectric layer 5 covers the address electrode 30. Generally, the same material as that of the dielectric layer 5 formed on the front substrate 1 is used for the dielectric layer 5 formed on the rear substrate 2.

On the dielectric layer 5 of the rear substrate 2, the partition wall 7 is formed to extend in the same direction as the address electrode 30 so as to sandwich the address electrode 30. In this embodiment, the partition walls 7 are also formed in a direction perpendicular to the address electrodes 30 to form a space for generating BOX-like plasma in each subpixel. A phosphor 8 is applied to the inside of the partition wall 7. The phosphor 8 is applied in parallel with the recesses formed by the partition walls 7 of FIG.

A space surrounded by the front substrate 1, the rear substrate 2, and the partition walls 7 is a discharge space for enclosing a discharge gas. A space between the pair of bus wirings and the partition wall 7 corresponds to one display cell (subpixel), and in the case of color display, three subpixels correspond to three primary colors (R, B, G), and one pixel (R, B, G). Pixel).

The principle of light emission of the plasma display panel 200 is as follows. First, a voltage (discharge start voltage) of about 100 to 200 V is applied between the address electrode 30 corresponding to the cell to emit light and the scan electrode 20 corresponding to the cell. Since the address electrode 30 and the bus wiring are orthogonal to each other, a single cell at the intersection can be selected. In the selected cell, a weak discharge is generated between the discharge electrode to which voltage is applied (in this case, the Y electrode) and the address electrode 30, and charges are formed on the protective film 6 on the dielectric layer 5 on the front substrate 1 side. (Wall charge) is accumulated. In this way, writing by charges is performed on all cells in the display area. This period is a writing period, and no image is formed.

Subsequently, a sustain discharge is performed by applying a high frequency pulse between the X electrode and the Y electrode in the sustain period. At this time, the sustain discharge is generated only in the cells in which the wall charges are accumulated. Ultraviolet rays are generated by the sustain discharge, and the phosphor 8 emits light by the ultraviolet rays. Visible light emitted from the phosphor 8 is emitted from the front substrate 1 and is visually recognized by a human. Since the phosphor 8 emits light only in the cells in which charges are accumulated during the writing period, an image is formed.

FIG. 4 is a plan view of the plasma display panel 200. In FIG. 4, the back substrate 2 is disposed under the front substrate 1 with a sealing material 3 interposed therebetween. On the rear substrate 2, address electrodes 30 indicated by dotted lines extend in the vertical direction and are arranged in the horizontal direction. The address electrode 30 extends to the end portion of the back substrate 2 to become an address electrode terminal 140, and an address signal is supplied from this portion. The address electrode 30 is connected to the address driver 35 at the end portion of the rear substrate 2 by reducing the inter-electrode pitch to become the address electrode terminal 140.

In FIG. 4, a discharge sustaining electrode 10 and a scanning electrode 20 extend in the lateral direction on the front substrate 1. The sustaining electrode 10 is supplied with a sustaining pulse from the left side of the front substrate 1 during the sustaining period, but is not shown in FIG. A scanning signal is supplied to the scanning electrode 20 from the terminal portion 130 of the right front substrate 1 in the writing period, and a discharge sustaining pulse is supplied in the discharge sustaining period. The terminal portion 130 and the Y electrode are connected by a Y bus electrode lead line. Since the pitch of the terminal portion 110 is smaller than the pitch of the Y bus electrode, the Y bus electrode lead line has an inclined portion outside the display area.

FIG. 5 is a schematic diagram showing a driving system of the plasma display device. In FIG. 5, in the plasma display panel 200, the discharge sustaining electrode 10 extends to the right side from the X driving circuit 16 existing on the left side. Further, in the plasma display panel 200, the scanning electrode 20 extends from the scanning driver 70 existing on the right side to the left side. The scanning driver 70 is further connected to the Y drive circuit 26 arranged on the right side. Although the scan driver 70 is collectively shown in FIG. 5, it is actually formed by about 10 ICs. And the heat sink 80 which has a fin for every IC is arrange | positioned correspondingly.

In FIG. 5, in the plasma display panel 200, address electrodes 30 extend upward from an address driver 35 existing on the lower side. The address driver 35 is connected to the address drive circuit 36. A subpixel is formed at the intersection of the address electrode 30, the scan electrode 20, and the discharge sustaining electrode 10. In FIG. 5, the address driving circuit 36 exists only on the lower side of the plasma display panel 200. However, in this embodiment, the address driving circuit 36 exists above and below the plasma display panel 200 as shown in FIG. Yes.

In FIG. 5, the scan electrode 20 is supplied with a scan signal from the scan driver 70 in the writing period and supplied with a discharge sustain pulse in the discharge sustain period. On the other hand, a sustaining pulse is supplied to the sustaining electrode 10 during the sustaining period. Further, an address signal is supplied to the address electrode 30 in the writing period, and the position of the sub-pixel to be lit is determined together with the scanning signal of the scanning electrode 20. The control circuit 45 in FIG. 5 causes the X drive circuit 16, the Y drive circuit 26, the address drive circuit 36, and the like to perform the above-described operation.

The scanning driver 70 in the present invention is disposed on the front substrate 1 of the plasma display panel 200. On the other hand, in the conventional example, the scanning driver 70 is formed on the printed wiring board 60 disposed on the back surface of the plasma display panel 200. In the present invention, since the heat sink 80 having fins for cooling the scanning driver 70 is disposed on the front substrate 1, it is possible to prevent the thickness of the plasma display device from increasing.

FIG. 6 is a schematic back view of the plasma display device of the present invention. Since the plasma display device is viewed from the back side in FIG. 6, the positions of the X drive circuit 16 and the Y drive circuit 26 are reversed left and right as compared with FIG. 5. In FIG. 6, the printed circuit board 60 has a Y drive circuit 26 on the left side and an X drive circuit 16 on the right side. From the X driving circuit 16, a discharge sustaining pulse for maintaining the discharge is supplied to the sustaining electrode 10 during the sustaining period. Further, the Y drive circuit 26 supplies a discharge sustain pulse for maintaining the discharge to the scan electrode 20 in the discharge sustain period.

The scanning driver 70 that supplies a scanning signal to the scanning electrode 20 during the writing period does not exist on the printed wiring board 60 side, but exists on the front substrate 1 of the plasma display panel 200 (not shown). On the other hand, in the conventional example, the scan driver 70 exists on the Y drive circuit 26 side.

6, the address drive circuit 36 is arranged above and below the Y drive circuit 26 and the X drive circuit 16. In FIG. 5, the address drive circuit 36 exists only on the lower side, but also exists on the upper side in FIG. Whether the address driving circuit 36 is arranged on the upper side and the lower side, or only on the lower side or the upper side can be determined by the pitch of the address electrodes 30, the layout requirements of the entire printed wiring board 60, and the like.

In FIG. 6, a plurality of address drivers 35 are arranged on the upper and lower sides of the address drive circuit 36, respectively. The address driver 35 and the address electrode 30 are connected by an address driver wiring film 37.

A control circuit 45 for controlling the X drive circuit 16, the Y drive circuit 26, the drive circuit, and the like is disposed in the center of the printed wiring board 60. A power supply circuit 40 is disposed adjacent to the control circuit 45.

Thus, in the present invention, since the scan driver 70 is arranged on the front substrate 1 of the plasma display panel 200, the scan driver 70 does not exist on the printed wiring board 60 side, and the scan driver 70 is cooled. Since the heat sink 80 having the fins does not exist in the printed wiring board 60, the thickness of the plasma display device in this portion can be reduced.

In the above description, the heat radiating plate 80 has been described as the heat radiating plate 80 having fins. However, the heat radiating plate 80 is not limited thereto, and has no fins, for example, on a block or a plate-shaped heat radiating plate 80. Can also be used.

It is a side view of the plasma display apparatus in this invention. FIG. 2 is a detailed view of part A in FIG. 1. It is a disassembled perspective view of the display area of a plasma display panel. It is a top view of a plasma display panel. It is a block diagram of the drive circuit of a plasma display apparatus. It is a rear view of a plasma display apparatus. It is a side view of the plasma display apparatus in a prior art example. FIG. 8 is a detailed view of part B in FIG. 7.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Front substrate, 2 ... Back substrate, 3 ... Seal part, 5 ... Dielectric layer, 6 ... Protective film, 7 ... Partition, 8 ... Phosphor, 10・・・ Discharge sustain electrode, 11 ・・・ Discharge sustain discharge electrode, 12 ・・・ Discharge sustain bus electrode, 16 ・・・ X drive circuit, 20 ・・・ Scan electrode, 21 ・・・ Scan discharge electrode, 22. ..Scanning bus electrode, 26 ... Y drive circuit, 30 ... address electrode, 35 ... address driver, 36 ... address drive circuit, 37 ... wiring film for address driver, 40 ... Power circuit 45 ... Control circuit 50 ... Chassis 51 ... Adhesive material 55 ... Stand 60 ... Printed circuit board 70 ... Scanning driver 71 ... Adhesive 80 ... Radiating plate, 90 ... Flexible wiring board, 10 DESCRIPTION OF SYMBOLS 0 ... TCP, 110 ... Connector, 120 ... Anisotropic conductive film, 130 ... Scan electrode terminal, 140 ... Address electrode terminal, 200 ... Plasma display panel.

Claims

A front substrate having scan electrodes extending in a first direction at a specific pitch and arranged in a second direction, and discharge sustaining electrodes extending in a first direction at a specific pitch and arranged in a second direction; A plasma display panel having a back substrate with address electrodes extending in a second direction and arranged in the first direction;
A plasma display device having a circuit board disposed on the back surface of the plasma display panel,
The front substrate is provided with a scan driver connected to the scan electrode, and the scan driver is connected to a circuit formed on the circuit board by a flexible wiring board,
The plasma display device, wherein the scanning driver is bonded to a metallic heat sink by an adhesive.
2. The plasma display device according to claim 1, wherein the flexible wiring board is tape carrier packaging.
2. The plasma display device according to claim 1, wherein the flexible wiring board is connected to a scanning drive circuit disposed on the circuit board.
2. The plasma display device according to claim 1, wherein the heat radiating plate is a heat radiating plate having fins.
A front substrate having scan electrodes extending in a first direction at a specific pitch and arranged in a second direction, and discharge sustaining electrodes extending in a first direction at a specific pitch and arranged in a second direction; A plasma display panel having a back substrate with address electrodes extending in a second direction and arranged in the first direction;
A chassis made of metal is disposed on the back surface of the plasma display panel, a support is formed on the chassis, a printed wiring board is fixed to the support, and a scanning drive circuit is disposed on the printed wiring board. A plasma display device,
The front substrate is provided with a scan driver connected to the scan electrode, and the scan driver is connected to a circuit formed on the circuit board by a flexible wiring board,
The plasma display device, wherein the scanning driver is bonded to a metallic heat sink by an adhesive.
6. The plasma display device according to claim 5, wherein the flexible wiring board is tape carrier packaging.
6. The plasma display apparatus according to claim 5, wherein the heat radiating plate is a heat radiating plate having fins.