JP3747484B2 - Film wiring board and connection structure thereof - Google Patents

Film wiring board and connection structure thereof Download PDF

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Publication number
JP3747484B2
JP3747484B2 JP33953394A JP33953394A JP3747484B2 JP 3747484 B2 JP3747484 B2 JP 3747484B2 JP 33953394 A JP33953394 A JP 33953394A JP 33953394 A JP33953394 A JP 33953394A JP 3747484 B2 JP3747484 B2 JP 3747484B2
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connection
wiring board
film
base film
end portion
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JPH08186348A (en
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久 志村
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Casio Computer Co Ltd
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Casio Computer Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Description

【０００１】
【産業上の利用分野】
この発明はフィルム配線基板およびその接続構造に関する。
【０００２】
【従来の技術】
例えば液晶表示装置では、一般に、液晶表示パネル（表示素子）、この液晶表示パネルを駆動するための駆動回路用のＩＣチップ（半導体チップ）、このＩＣチップを制御するための制御回路用の回路基板、この回路基板に液晶表示パネルを導電接続するためのフィルム配線基板等を備えている。
【０００３】
図３は従来のこのような液晶表示装置の一例を示したものである。この液晶表示装置では、液晶表示パネル１、３つのＩＣチップ２〜４、フィルム配線基板５、制御回路用の回路基板６等を備えている。このうち液晶表示パネル１は、ガラス等からなる２枚の透明基板７、８間に液晶（図示せず）が封入されたものからなり、上側の透明基板７の、下側の透明基板８と対向する面に図示しない信号電極（透明電極）が設けられ、下側の透明基板８の、上側の透明基板７と対向する面に図示しない走査電極（透明電極）が設けられている。上側の透明基板７の一端部は下側の透明基板８の外側に突出され、この突出部の下面には所定の箇所に一端部が信号電極に接続する複数本で１組の接続用端子９が２組設けられ、他の所定の箇所に複数本で１組の外部接続用端子１０が２組設けられ、所定の２つのＩＣチップ２、３が異方導電性接着剤等の接続部材（図示せず）を介して接続用端子９の他端部と外部接続用端子１０の一端部とに導電接続されている。また、下側の透明基板８の一端部は上側の透明基板７の外側に突出され、この突出部の上面には所定の箇所に一端部が走査電極に接続する複数本で１組の接続用端子１１が設けられ、他の所定の箇所に複数本で１組の外部接続用端子１２が設けられ、残りの１つのＩＣチップ４が異方導電性接着剤等の接続部材（図示せず）を介して接続用端子１１の他端部と外部接続用端子１２の一端部とに導電接続されている。
【０００４】
フィルム配線基板５は、方形状の本体部分１３とこの本体部分１３の側面の所定の箇所からほぼ直交して分岐された方形状の分岐部分１４とからなるベースフィルム１５およびベースフィルム１５の上面に設けられた接続用配線１６、１７を備えている。本体部分１３のベースフィルム１５上には複数本で１組の接続用配線１６が２組設けられ、分岐部分１４およびその近傍の本体部分１３に７本で１組の接続用配線１７が設けられている。所定の２組の接続用配線１６の一端部は本体部分１３の一端部（接続端部）１３ａに配置され、他端部は本体部分１３の他端部１３ｂに配置されている。残りの１組の接続用配線１７の一端部は分岐部分１４の先端部（接続端部）１４ａに配置され、他端部は本体部分１３の他端部１３ｂに配置されている。そして、所定の２組の接続用配線１６の一端部は上側の透明基板７の突出部の下面に設けられた２組の外部接続用端子１０の他端部と異方導電性接着剤等の接続部材（図示せず）を介して導電接続され、他端部は回路基板６の一端部下面に導電接続されている。残りの１組の接続用配線１７の一端部は分岐部分１４を途中でほぼ９０度折り曲げて、下側の透明基板８の突出部の上面に設けられた１組の外部接続用端子１２の他端部と異方導電性接着剤等の接続部材（図示せず）を介して導電接続され、他端部は回路基板６の一端部下面に導電接続されている。なお、フィルム配線基板５の分岐部分１４の上面の折り曲げ箇所には絶縁膜（図示せず）を被覆する等によって絶縁処理が施され、接続用配線１７の短絡等を防止している。このようなフィルム配線基板５は、ベースフィルム１５の片面のみに配線を設けるだけで上面が互いに反対向きの接続端子に接続することができる。
【０００５】
【発明が解決しようとする課題】
しかしながら、従来のこのような液晶表示装置では、フィルム配線基板５の分岐部分１４およびその近傍の本体部分１３の上面に設けられた接続用配線１７の一端部は分岐部分１４を途中でほぼ９０度折り曲げて、下側の透明基板８の突出部の上面に設けられた外部接続用端子１２の他端部と異方導電性接着剤等の接続部材を介して導電接続されるので、液晶表示パネル１とフィルム配線基板５との組み立て工程において、折り曲げ工程が増えてしまい、また折り曲げる箇所がわずかでもずれると分岐部分１４の先端部１４ａの位置が大幅にずれてしまい、外部接続用端子１２に接続しにくくなってしまったり、折り曲げ箇所で断線するという問題があった。また、フィルム配線基板５の折り曲げ箇所に絶縁膜を被覆する工程が増えてしまっていた。
この発明の目的は、組み立て工程数を少なくすることができるとともに、容易かつ良好に電子部品の接続端子と接続することができるフィルム配線基板およびその接続構造を提供することにある。
【０００６】
【課題を解決するための手段】
請求項１記載の発明は、フィルム配線基板において、ベースフィルムの一の面に設けられ、電子部品の上側の基板の下面に配置された外部接続用端子に接続させるために、一端部を前記ベースフィルムの一の接続端部に配置された所定組の接続用配線と、前記ベースフィルムの前記一の面に設けられ、前記電子部品の下側の基板の上面に配置された外部接続用端子に接続させるために、一端部を前記ベースフィルムの他の接続端部に配置されるとともに前記接続端部に形成した開口部に掛け渡しまたは前記接続端部の一部を切欠して外側に突出させた残りの所定組の接続用配線と、が設けられたものである。
請求項３記載の発明は、前記所定組の接続用配線が接続部材を介して前記電子部品の上側の基板の前記外部接続用端子に導電接続され、前記残りの所定組の接続用配線が接続部材を介して前記電子部品の下側の基板の前記外部接続用端子に導電接続されたものである。
【０００７】
【作用】
請求項１記載の発明によれば、フィルム配線基板において、ベースフィルムの一の面に設けられ、電子部品の上側の基板の下面に配置された外部接続用端子に接続させるために、一端部を前記ベースフィルムの一の接続端部に配置された所定組の接続用配線と、前記ベースフィルムの前記一の面に設けられ、前記電子部品の下側の基板の上面に配置された外部接続用端子に接続させるために、一端部を前記ベースフィルムの他の接続端部に配置されるとともに前記接続端部に形成した開口部に掛け渡しまたは前記接続端部の一部を切欠して外側に突出させた残りの所定組の接続用配線と、が設けられたので、電子部品の上側の基板の外部接続用端子及び下側の基板の外部接続用端子に導電接続する場合、従来のようにフィルム配線基板の一部を折り曲げなくともそのまま導電接続することができ、組み立て工程数を少なくすることができるとともに、容易に位置合わせして接続することができる。
【０００８】
【実施例】
図１はこの発明の一実施例を適用した液晶表示装置を示したものである。この図において、図３と同一名称部分には同一の符号を付し、その説明を適宜省略する。この液晶表示装置では、フィルム配線基板５のベースフィルム１５が上下側の透明基板７、８の両突出部に沿うようにほぼＬ字状に形成されている。このベースフィルム１５の内側の所定の２箇所、つまり本体部分１３の一端部および分岐部分１４の先端部が接続端部１３ａ、１４ａとなっている。分岐部分１４の接続端部１４ａにおける下側の透明基板８の突出部の外部接続用端子１２に対応する箇所には帯状の開口部２１が形成され、この開口部２１に接続用配線１７の一端部が掛け渡されている。
【０００９】
次に、図２（Ａ）〜（Ｃ）を順に参照しながら、フィルム配線基板５の接続用配線１７と下側の透明基板８の突出部の外部接続用端子１２との導電接続について説明する。まず、図２（Ａ）に示すように、下側の透明基板８の外部接続用端子１２を含む接続部分の上面に異方導電性接着剤（接続部材）２２を介してフィルム配線基板５の接続端部１４ａを載置する。この場合、図３に示す従来のフィルム配線基板５のように、分岐部分１４を所定の箇所から折り曲げてベースフィルム１５の下面に接続用配線１７を配置しなくとも接続用配線１７の一端部を下側の透明基板８の外部接続用端子１２と開口部２１を介して容易に対向させることができる。次に、熱圧着ヘッド２３をフィルム配線基板５の接続用配線１７の一端部の上方に配置する。次に、図２（Ｂ）に示すように、熱圧着ヘッド２３をフィルム配線基板５の接続用配線１７の一端部の上から開口部２１を介して押し付け、加熱するとともに加圧し、その後冷却すると、図２（Ｃ）に示すように、下側の透明基板８の外部接続用端子１２とフィルム配線基板５の接続用配線１７とが異方導電性接着剤２２中の導電性粒子２４を介して導電接続される。
【００１０】
このように、２つの接続端部１３ａ、１４ａを有するベースフィルム１５の上面に３組の接続用配線１６、１７を設け、この３組の接続用配線１６、１７のうちの所定の２組の接続用配線１６の一端部を本体部分１３の接続端部１３ａに配置し、残りの１組の接続用配線１７の一端部を分岐部分１４の接続端部１４ａに配置したフィルム配線基板５であって、分岐部分１４の接続端部１４ａに配置した１組の接続用配線１７の一端部を分岐部分１４の接続端部１４ａに形成した開口部２１に掛け渡したので、上側の透明基板７の突出部の下面および下側の透明基板８の突出部の上面に外部接続用端子１０、１２が設けられた液晶表示パネル１の両外部接続用端子１０、１２にフィルム配線基板５の接続用配線１６、１７の一端部を導電接続する場合、従来のようにフィルム配線基板５の分岐部分１４の所定の箇所を折り曲げないので折り曲げることにより配線が断線することがなく、組み立て工程数を少なくすることができるとともに、容易に位置合わせして接続することができる。
【００１１】
なお、上記実施例では、フィルム配線基板５の分岐部分１４の接続端部１４ａに開口部２１を形成し、この開口部２１に接続用配線１７の一端部を掛け渡して下側の透明基板８の突出部の外部接続用端子１２と開口部２１を介して対向させたが、これに限定されず、フィルム配線基板５の分岐部分１４の接続端部１４ａの内側を切欠して接続用配線１７の一端部を外側に突出させて下側の透明基板８の突出部の外部接続用端子１２と対向させてもよい。
また、上記実施例では、液晶表示パネル１を駆動するＩＣチップ２〜４を上下側の透明基板７、８の突出部に搭載したが、これに限定されず、フィルム配線基板５または回路基板６に搭載してもよい。
また、上記実施例では、上側の透明基板７の、下側の透明基板８と対向する面に信号電極を設け、下側の透明基板８の、上側の透明基板７と対向する面に走査電極を設けたが、これに限定されず、上側の透明基板７の、下側の透明基板８と対向する面に走査電極を設け、下側の透明基板８の、上側の透明基板７と対向する面に信号電極を設けてもよい。
また、上記実施例では、ドットマトリックス型液晶表示装置について説明したが、これに限定されず、例えばセグメント型液晶表示装置であってもよい。この場合、セグメント電極およびコモン電極は相対向して設ければよく、２枚の透明基板７、８のいずれの透明基板７、８に設けてもよい。
さらに、上記実施例では、この発明を液晶表示パネル１とフィルム配線基板５との導電接続に適用したが、これに限定されず、例えばエレクトロ・ルミネッセント・ディスプレイやプラズマ・ディスプレイ等の他の表示素子を含む他の電子部品との接続に適用することができる。
【００１２】
【発明の効果】
以上説明したように、請求項１記載の発明によれば、フィルム配線基板において、ベースフィルムの一の面に設けられ、電子部品の上側の基板の下面に配置された外部接続用端子に接続させるために、一端部を前記ベースフィルムの一の接続端部に配置された所定組の接続用配線と、前記ベースフィルムの前記一の面に設けられ、前記電子部品の下側の基板の上面に配置された外部接続用端子に接続させるために、一端部を前記ベースフィルムの他の接続端部に配置されるとともに前記接続端部に形成した開口部に掛け渡しまたは前記接続端部の一部を切欠して外側に突出させた残りの所定組の接続用配線と、が設けられたので、電子部品の上側の基板の外部接続用端子及び下側の基板の外部接続用端子に導電接続する場合、従来のようにフィルム配線基板の一部を折り曲げなくともそのまま導電接続することができ、組み立て工程数を少なくすることができるとともに、自動化を容易にすることができる。
【図面の簡単な説明】
【図１】この発明の一実施例を適用した液晶表示装置を示す平面図。
【図２】（Ａ）〜（Ｃ）は液晶表示パネルの外部接続用端子とフィルム配線基板の接続用配線との熱圧着の工程を示す断面図。
【図３】従来の液晶表示装置を示す平面図。
【符号の説明】
１ 液晶表示パネル（表示素子）
２〜４ ＩＣチップ（半導体チップ）
５ フィルム配線基板
７、８ 透明基板
１０、１２ 外部接続用端子
１３ａ、１４ａ 接続端部
１５ ベースフィルム
１６、１７ 接続用配線
２１ 開口部
２２ 異方導電性接着剤（接続部材）[0001]
[Industrial application fields]
The present invention relates to a film wiring board and a connection structure thereof.
[0002]
[Prior art]
For example, in a liquid crystal display device, in general, a liquid crystal display panel (display element), an IC chip (semiconductor chip) for a drive circuit for driving the liquid crystal display panel, and a circuit board for a control circuit for controlling the IC chip The circuit board is provided with a film wiring board or the like for conductively connecting the liquid crystal display panel.
[0003]
FIG. 3 shows an example of such a conventional liquid crystal display device. This liquid crystal display device includes a liquid crystal display panel 1, three IC chips 2 to 4, a film wiring board 5, a circuit board 6 for a control circuit, and the like. Among these, the liquid crystal display panel 1 includes a liquid crystal (not shown) sealed between two transparent substrates 7 and 8 made of glass or the like, and the lower transparent substrate 8 of the upper transparent substrate 7 and A signal electrode (transparent electrode) (not shown) is provided on the facing surface, and a scanning electrode (transparent electrode) (not shown) is provided on the surface of the lower transparent substrate 8 facing the upper transparent substrate 7. One end of the upper transparent substrate 7 protrudes to the outside of the lower transparent substrate 8, and a plurality of sets of connection terminals 9 each having one end connected to a signal electrode at a predetermined position on the lower surface of the protrusion. Are provided, two sets of external connection terminals 10 are provided in a plurality of other predetermined locations, and two predetermined IC chips 2 and 3 are connected to connecting members (such as anisotropic conductive adhesive) ( The other end of the connection terminal 9 and one end of the external connection terminal 10 are conductively connected via a not-shown). Further, one end of the lower transparent substrate 8 protrudes outside the upper transparent substrate 7, and a plurality of sets of one end connected to the scanning electrode are connected to the upper surface of the protruding portion at a predetermined location. A terminal 11 is provided, a plurality of sets of external connection terminals 12 are provided at other predetermined locations, and the remaining one IC chip 4 is connected to a connecting member (not shown) such as an anisotropic conductive adhesive. The other end portion of the connection terminal 11 and one end portion of the external connection terminal 12 are conductively connected via each other.
[0004]
The film wiring board 5 is formed on a base film 15 including a rectangular main body portion 13 and a rectangular branch portion 14 branched substantially orthogonally from a predetermined portion on the side surface of the main body portion 13, and on the upper surface of the base film 15. Connection wirings 16 and 17 are provided. Two sets of connection wirings 16 are provided on the base film 15 of the main body portion 13, and seven sets of connection wirings 17 are provided on the branch portion 14 and the main body portion 13 in the vicinity thereof. ing. One end of the two predetermined sets of connection wirings 16 is disposed at one end (connection end) 13 a of the main body portion 13, and the other end is disposed at the other end 13 b of the main body portion 13. One end portion of the remaining set of connection wirings 17 is disposed at the tip end portion (connection end portion) 14 a of the branch portion 14, and the other end portion is disposed at the other end portion 13 b of the main body portion 13. One end of the two predetermined sets of connection wirings 16 is connected to the other end of the two sets of external connection terminals 10 provided on the lower surface of the projecting portion of the upper transparent substrate 7, and an anisotropic conductive adhesive or the like. Conductive connection is made via a connection member (not shown), and the other end is conductively connected to the lower surface of one end of the circuit board 6. One end of the remaining set of connection wirings 17 bends the branch portion 14 approximately 90 degrees in the middle, and in addition to the set of external connection terminals 12 provided on the upper surface of the protruding portion of the lower transparent substrate 8. The end portion is conductively connected through a connection member (not shown) such as an anisotropic conductive adhesive, and the other end portion is conductively connected to the lower surface of one end portion of the circuit board 6. It should be noted that an insulation process is applied to the bent portion of the upper surface of the branch portion 14 of the film wiring board 5 by covering an insulating film (not shown) to prevent the connection wiring 17 from being short-circuited. Such a film wiring board 5 can be connected to connection terminals whose upper surfaces are opposite to each other only by providing wiring on only one surface of the base film 15.
[0005]
[Problems to be solved by the invention]
However, in such a conventional liquid crystal display device, one end portion of the connection wiring 17 provided on the upper surface of the branch portion 14 of the film wiring board 5 and the main body portion 13 in the vicinity of the branch portion 14 is approximately 90 degrees in the middle of the branch portion 14. The liquid crystal display panel is bent and conductively connected to the other end portion of the external connection terminal 12 provided on the upper surface of the protruding portion of the lower transparent substrate 8 via a connecting member such as an anisotropic conductive adhesive. 1 and the film wiring board 5 in the assembly process, the number of folding steps increases, and the position of the distal end portion 14a of the branching portion 14 is greatly shifted when the bent portion is slightly shifted, and connected to the external connection terminal 12. There is a problem that it becomes difficult to do or breaks at the bent part. Moreover, the process of coating the insulating film on the bent portion of the film wiring board 5 has increased.
An object of the present invention is to provide a film wiring board that can reduce the number of assembly steps and can be easily and satisfactorily connected to a connection terminal of an electronic component and a connection structure thereof.
[0006]
[Means for Solving the Problems]
According to the first aspect of the present invention, in the film wiring board, one end portion of the base film is connected to an external connection terminal provided on one surface of the base film and disposed on the lower surface of the upper substrate of the electronic component. A predetermined set of connection wirings arranged at one connection end of the film, and external connection terminals provided on the one surface of the base film and arranged on the upper surface of the lower substrate of the electronic component In order to connect, one end portion is disposed on the other connection end portion of the base film, and spans over an opening formed in the connection end portion, or a part of the connection end portion is cut out to protrude outward. The remaining predetermined set of connection wirings are provided.
According to a third aspect of the present invention, the predetermined set of connection wirings are conductively connected to the external connection terminals of the board on the upper side of the electronic component via a connection member, and the remaining predetermined set of connection wirings are connected. It is conductively connected to the external connection terminal on the lower substrate of the electronic component through a member.
[0007]
[Action]
According to the first aspect of the present invention, in the film wiring board, one end portion is provided on one surface of the base film and connected to the external connection terminal disposed on the lower surface of the upper substrate of the electronic component. A predetermined set of connection wirings arranged at one connection end of the base film, and external connection provided on the one surface of the base film and disposed on the upper surface of the substrate below the electronic component In order to connect to the terminal, one end portion is disposed on the other connection end portion of the base film, and spans over an opening formed in the connection end portion, or a part of the connection end portion is cut out to the outside. The remaining predetermined set of connection wirings are provided, so when conducting conductive connection to the external connection terminal of the upper board of the electronic component and the external connection terminal of the lower board, as in the conventional case Part of film wiring board Without bending can be connected directly conductive, it is possible to reduce the number of assembling steps can be connected by easily aligned.
[0008]
【Example】
FIG. 1 shows a liquid crystal display device to which one embodiment of the present invention is applied. In this figure, parts having the same names as those in FIG. In this liquid crystal display device, the base film 15 of the film wiring substrate 5 is formed in an approximately L shape so as to extend along both protruding portions of the upper and lower transparent substrates 7 and 8. Two predetermined locations inside the base film 15, that is, one end portion of the main body portion 13 and the tip end portion of the branch portion 14 are connection end portions 13 a and 14 a. A strip-shaped opening 21 is formed at a position corresponding to the external connection terminal 12 of the protruding portion of the lower transparent substrate 8 at the connection end 14 a of the branch portion 14, and one end of the connection wiring 17 is formed in the opening 21. Department is stretched over.
[0009]
Next, the conductive connection between the connection wiring 17 of the film wiring substrate 5 and the external connection terminal 12 of the protruding portion of the lower transparent substrate 8 will be described with reference to FIGS. . First, as shown in FIG. 2A, the film wiring substrate 5 is formed on the upper surface of the connection portion including the external connection terminals 12 of the lower transparent substrate 8 via an anisotropic conductive adhesive (connection member) 22. The connecting end 14a is placed. In this case, as in the conventional film wiring substrate 5 shown in FIG. 3, one end portion of the connection wiring 17 is connected without bending the branch portion 14 from a predetermined position and disposing the connection wiring 17 on the lower surface of the base film 15. The external connection terminal 12 of the lower transparent substrate 8 and the opening 21 can be easily opposed to each other. Next, the thermocompression bonding head 23 is disposed above one end portion of the connection wiring 17 of the film wiring board 5. Next, as shown in FIG. 2B, when the thermocompression bonding head 23 is pressed from above one end of the connection wiring 17 of the film wiring substrate 5 through the opening 21, it is heated and pressurized, and then cooled. As shown in FIG. 2C, the external connection terminal 12 of the lower transparent substrate 8 and the connection wiring 17 of the film wiring substrate 5 are connected via conductive particles 24 in the anisotropic conductive adhesive 22. Are electrically connected.
[0010]
In this manner, three sets of connection wirings 16 and 17 are provided on the upper surface of the base film 15 having the two connection end portions 13a and 14a, and two predetermined sets of the three sets of connection wirings 16 and 17 are provided. The film wiring board 5 has one end portion of the connection wiring 16 disposed on the connection end portion 13 a of the main body portion 13 and one end portion of the remaining one set of connection wirings 17 disposed on the connection end portion 14 a of the branch portion 14. Since one end of the set of connection wirings 17 arranged at the connection end 14a of the branch portion 14 is spanned over the opening 21 formed at the connection end 14a of the branch portion 14, the upper transparent substrate 7 Wiring for connecting the film wiring board 5 to the external connection terminals 10 and 12 of the liquid crystal display panel 1 in which the external connection terminals 10 and 12 are provided on the lower surface of the protruding part and the upper surface of the protruding part of the lower transparent substrate 8. Conductive connection of one end of 16 and 17 In this case, since the predetermined portion of the branch portion 14 of the film wiring board 5 is not bent as in the conventional case, the wiring is not disconnected by bending, and the number of assembly steps can be reduced and the position can be easily aligned. Can be connected.
[0011]
In the above embodiment, the opening 21 is formed in the connection end 14 a of the branch portion 14 of the film wiring substrate 5, and one end of the connection wiring 17 is spanned over the opening 21, and the lower transparent substrate 8 is formed. However, the present invention is not limited to this, but the inner side of the connection end portion 14a of the branching portion 14 of the film wiring board 5 is cut out to connect the wiring 17 for connection. One end portion of the transparent substrate 8 may be protruded outward and may be opposed to the external connection terminal 12 of the protruding portion of the lower transparent substrate 8.
Further, in the above embodiment, the IC chips 2 to 4 for driving the liquid crystal display panel 1 are mounted on the protruding portions of the upper and lower transparent substrates 7 and 8, but the present invention is not limited to this, and the film wiring substrate 5 or the circuit substrate 6. May be installed.
In the above embodiment, the signal electrode is provided on the surface of the upper transparent substrate 7 facing the lower transparent substrate 8, and the scanning electrode is disposed on the surface of the lower transparent substrate 8 facing the upper transparent substrate 7. However, the present invention is not limited to this, and a scanning electrode is provided on the surface of the upper transparent substrate 7 facing the lower transparent substrate 8, and the lower transparent substrate 8 faces the upper transparent substrate 7. A signal electrode may be provided on the surface.
In the above embodiment, the dot matrix type liquid crystal display device has been described. However, the present invention is not limited to this. For example, a segment type liquid crystal display device may be used. In this case, the segment electrode and the common electrode may be provided so as to face each other, and may be provided on any one of the two transparent substrates 7 and 8.
Further, in the above embodiment, the present invention is applied to the conductive connection between the liquid crystal display panel 1 and the film wiring board 5, but the present invention is not limited to this. For example, other display elements such as an electroluminescent display and a plasma display It can be applied to connection with other electronic components including
[0012]
【The invention's effect】
As described above, according to the first aspect of the present invention, in the film wiring board, it is provided on one surface of the base film and connected to the external connection terminals disposed on the lower surface of the upper substrate of the electronic component. For this purpose, a predetermined set of connection wirings arranged at one connection end of the base film and one surface of the base film are provided on one surface of the base film, and on the upper surface of the lower substrate of the electronic component. In order to connect to the arranged external connection terminal, one end portion is disposed on the other connection end portion of the base film and is spanned over an opening formed in the connection end portion or a part of the connection end portion And a predetermined set of remaining connection wirings that are notched and protruded outward, so that they are conductively connected to the external connection terminals of the upper board and the external connection terminals of the lower board of the electronic component. If Without bending a part of Lum wiring board can be connected directly conductive, it is possible to reduce the number of assembling steps, it can facilitate automation.
[Brief description of the drawings]
FIG. 1 is a plan view showing a liquid crystal display device to which one embodiment of the present invention is applied.
2A to 2C are cross-sectional views showing a process of thermocompression bonding between an external connection terminal of a liquid crystal display panel and a connection wiring of a film wiring board.
FIG. 3 is a plan view showing a conventional liquid crystal display device.
[Explanation of symbols]
1 Liquid crystal display panel (display element)
2-4 IC chip (semiconductor chip)
5 Film wiring substrate 7, 8 Transparent substrate 10, 12 External connection terminals 13a, 14a Connection end 15 Base film 16, 17 Connection wiring 21 Opening 22 Anisotropic conductive adhesive (connection member)

Claims (4)

ベースフィルムの一の面に設けられ、電子部品の上側の基板の下面に配置された外部接続用端子に接続させるために、一端部を前記ベースフィルムの一の接続端部に配置された所定組の接続用配線と、One end is provided on one surface of the base film and is connected to an external connection terminal disposed on the lower surface of the upper substrate of the electronic component. Wiring for connection,
前記ベースフィルムの前記一の面に設けられ、前記電子部品の下側の基板の上面に配置された外部接続用端子に接続させるために、一端部を前記ベースフィルムの他の接続端部に配置されるとともに前記接続端部に形成した開口部に掛け渡しまたは前記接続端部の一部を切欠して外側に突出させた残りの所定組の接続用配線と、One end portion is disposed on the other connection end portion of the base film so as to be connected to an external connection terminal provided on the one surface of the base film and disposed on the upper surface of the lower substrate of the electronic component. And the remaining predetermined set of connection wirings that extend over the opening formed in the connection end or cut out a part of the connection end and protrude outward.
が設けられたことを特徴とするフィルム配線基板。  A film wiring board comprising: 前記ベースフィルムはほぼＬ字状に形成され、該ベースフィルムの内側の所定の２箇所に前記２つの接続端部が形成されていることを特徴とする請求項１記載のフィルム配線基板。  2. The film wiring board according to claim 1, wherein the base film is formed in an approximately L shape, and the two connection end portions are formed at two predetermined locations inside the base film. 前記所定組の接続用配線が接続部材を介して前記電子部品の上側の基板の前記外部接続用端子に導電接続され、前記残りの所定組の接続用配線が接続部材を介して前記電子部品の下側の基板の前記外部接続用端子に導電接続されたことを特徴とする請求項１または２記載のフィルム配線基板の接続構造。The predetermined set of connection wirings are conductively connected to the external connection terminals of the board on the upper side of the electronic component via a connection member, and the remaining predetermined set of connection wires are connected to the electronic component via the connection member. 3. The connection structure for a film wiring board according to claim 1, wherein the connection structure is conductively connected to the external connection terminal of the lower substrate. 前記電子部品は表示素子であることを特徴とする請求項３記載のフィルム配線基板の接続構造。 4. The connection structure for a film wiring board according to claim 3, wherein the electronic component is a display element.
JP33953394A 1994-12-29 1994-12-29 Film wiring board and connection structure thereof Expired - Fee Related JP3747484B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33953394A JP3747484B2 (en) 1994-12-29 1994-12-29 Film wiring board and connection structure thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33953394A JP3747484B2 (en) 1994-12-29 1994-12-29 Film wiring board and connection structure thereof

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JPH08186348A JPH08186348A (en) 1996-07-16
JP3747484B2 true JP3747484B2 (en) 2006-02-22

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JP3209219B2 (en) * 1999-01-18 2001-09-17 セイコーエプソン株式会社 Electro-optical devices and electronic equipment
EP1039788B1 (en) 1999-03-26 2006-04-19 Seiko Epson Corporation Flexible printed wiring board, electro-optical device, and electronic equipment
JP2005283815A (en) * 2004-03-29 2005-10-13 Seiko Epson Corp Electrooptical device and electronic equipment
JP2006294350A (en) * 2005-04-07 2006-10-26 Three M Innovative Properties Co Cable harness body
JP2007180221A (en) * 2005-12-27 2007-07-12 Optrex Corp Flexible circuit board

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