JPH0651331A - Lcd module - Google Patents

Abstract

PURPOSE:To suppress the disconnection and cracking of the outer lead input terminal part of a tape carrier package(TCP) and the cracking and connection disengagement of an IC chip from the inner lead part by forming fixation patterns on the TCP and pads for fixation on a wired circuit board, and soldering them. CONSTITUTION:The patterns 14 are formed at the two sides of the TCP1 where the outer lead output terminal part 9 and outer lead input terminal part 10 are not present, i.e., at both the side parts. On the wired circuit board 2, the pads 15 for fixation which are a little larger in area than the patterns 14 for fixation are formed corresponding to the patterns 14 for fixation. Then the outer lead output terminal part 9 and LCD panel 3 are thermally pressed against each other and the outer lead input terminal 10 is soldered to the wired circuit board 2; and then the film substrate of the TCP1 is extended flatly so that the reverse surface of the TCP1, i.e., the reverse surface of the IC chip 7 does not float over the wired circuit board 2, and then the patterns 14 for fixation are soldered to the pads 15 for fixation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LCD module, and more particularly to a TCP damage prevention structure thereof.

[0002]

2. Description of the Related Art T used in a conventional LCD module
As shown in FIG. 3, the CP forms a copper-based wiring pattern 5 on a film substrate 4 made of Kapton or Iupilex, and further forms an insulating film with a resist 6 so as to cover the wiring pattern 5. I am giving it. Wiring pattern 5 is LCD
Inner lead portion 8 for connecting the IC chip 7 for driving the panel by the TAB technology, outer lead output terminal portion 9 for making thermocompression contact with the LCD panel 3, and wiring board 2
The outer lead input terminal portion 10 for soldering to the connection pad 11 of FIG.

Further, TCP1 in the LCD module
As shown in FIG. 4, the outer lead output end portions are arranged in a concentrated manner on one side so as to correspond to the panel terminal portion 12 of the LCD panel 3, and are thermally pressed against the LCD panel 3. Further, the outer lead input terminal portions are arranged on one side opposite to the outer lead output terminal portions 6 in a concentrated manner, and the outer lead input terminal portions are soldered to the wiring board 2. It has been deleted to be 13.

[0004]

In the structure of mounting around the TCP in the conventional LCD module, the LCD panel, the TCP, the handling to the next process after connecting the TCP and the wiring board, the shield case, the backlight, etc. At the time of assembly work in a later process, the wiring board is shaken and stress is likely to occur in the TCP outer lead input terminal portion soldered to the wiring board. Cracks and disconnections were likely to occur. Further, since the wiring board is largely shaken or the LCD panel and the wiring board are twisted or distorted, the IC on the TCP and the inner lead portion are easily cracked or disconnected. In particular, in an LCD module in which the TAB is mounted by bending, TCP rises from the wiring board,
There is a problem that cracks and disconnection are likely to occur remarkably in the IC and the inner lead portion.

[0005]

The LCD module of the present invention is provided with TCP fixing patterns on two sides of the TCP without the outer lead input terminal portion and the outer lead output terminal portion, that is, on both sides of the TCP. A fixing pad corresponding to the TCP fixing pattern is provided on the wiring board, and a mounting structure for soldering the fixing pattern and the pad is provided.

[0006]

The present invention will be described below with reference to the drawings. FIG. 1 is a plan view of the vicinity of TCP mounting according to the first embodiment of the present invention. In this embodiment, the other two sides of the TCP1 without the outer lead output terminal portion 9 and the outer lead input terminal portion 10, that is, both side portions of the TCP1, are fixed using the same technique as the outer lead input terminal portion 10. A pattern 14 is formed. On the other hand, also on the wiring board 2, fixing pads 15 are formed corresponding to the fixing patterns 14 in an area slightly larger than the fixing patterns 14. After the outer lead output terminal portion 9 of the TCP1 is thermally pressed against the LCD panel 3 and the outer lead input terminal portion 10 is soldered to the wiring board 2, the back surface of the TCP1, that is, the back side surface of the IC chip 7 is attached to the wiring board 2. TCP1 to prevent floating
Flatten the film substrate 4 and then the fixing pattern 1
4 is soldered to the fixing pad 15.

FIG. 2 is a plan view of the TPC according to the second embodiment of the present invention. A plurality of split fixing patterns 16 are arbitrarily formed on both sides of the TCP 1.
The divided fixing pads according to 6 are formed on the connection substrate, and the first
The structure is such that soldering is performed in the same manner as in the above embodiment. Large TC
In the case of P or a small TCP, the area of the fixed portion can be optimized by dividing the fixed portion.

[0008]

As described above, according to the present invention, a fixed pattern is formed on a TCP and a fixed pad is formed on a wiring board, and these are soldered, so that the TCP is connected to a connection board in addition to the outer lead input terminal portion. Since it is possible to obtain the fixing point of, it is possible to suppress the rise of TCP from the wiring board when the wiring board is shaken and the TAB is bent and mounted, and the outer lead input terminal portion of the TCP is cut or cracked. This has the effect of preventing cracks and disconnection from the inner lead portion of the IC chip.

[Brief description of drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention.

FIG. 2 is a plan view of a TPC according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional view of a conventional LCD module.

FIG. 4 is a perspective view of a conventional LCD module.

[Explanation of Codes] 1 TCP 2 Wiring board 3 LCD panel 4 Film board 5 Wiring pattern 6 Resist 8 Inner lead part 9 Outer lead output terminal part 10 Outer lead input terminal part 11 Connection pad 12 Panel terminal part 13 Window 14 Fixing pattern 15 Fixing pad 16 Split fixing pattern

Claims (1)

[Claims] 1. At least an LCD panel and the LCD
In a LCD module having a tape carrier package (TCP) on which a driver IC chip for driving a panel is mounted and a wiring board for supplying various control signals to TCP input terminals, a fixing pattern is provided on the TCP film substrate. Further, the LCD module is characterized in that a fixing pad corresponding to a TCP fixing pattern is also provided on the wiring board to connect and fix both.