JPH07263485A - Ic chip and connecting structure between chip and board - Google Patents

Abstract

PURPOSE:To increase a width of a common input wire without increasing in size a liquid crystal display panel and to reduce a wire resistance. CONSTITUTION:Predetermined two common input wires 7a are discontinued in an IC chip placing area 4 on a transparent board 3 of a lower side, and not provided therebetween. Two repeating terminals 32 provided at one longitudinal end of a lower surface of an IC chip 21 are connected to two input terminals 26 provided at the other longitudinal end of the chip 21 corresponding thereto via repeating wires 33. When the chip 21 is placed on the area 4, the right and left separate wires 7a are connected via the wires 33 of the chip 21. As a result, a width of the residual six common input wires 7 can be increased without enlarging that part of the board 3 where the wires 7a are not present.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC chip and a connection structure for connecting it to a substrate.

[0002]

2. Description of the Related Art For example, some liquid crystal display devices have an IC chip for driving the liquid crystal display panel directly mounted on the liquid crystal display panel. 3A and 3B show an example of such a conventional liquid crystal display device. A liquid crystal display panel 1 of this liquid crystal display device is made up of liquid crystal (not shown) sealed between upper and lower transparent substrates 2 and 3 made of glass or the like. Two adjacent predetermined sides of the lower transparent substrate 3 are projected from corresponding two corresponding sides of the upper transparent substrate 2, respectively. First and second IC chip mounting areas 4 and 5 are provided in series at predetermined two locations on the upper surface of one of the protruding portions of the lower transparent substrate 3, and a predetermined one on the upper surface of the other protruding portion is provided. A third IC chip mounting area 6 is provided at the location. Eight common input wirings 7 are provided in parallel with each other at predetermined locations on the upper surface of one of the protruding portions of the lower transparent substrate 3, and a plurality of common input wirings 7 are provided at the other two predetermined locations.
Two sets of output wirings 8 and 9 are provided. Further, eight input wirings 10 are provided in parallel with each other at predetermined positions on the upper surface of the other protruding portion of the lower transparent substrate 3.
A plurality of sets of output wirings 11 are provided at other predetermined locations.
Is provided. It should be noted that a predetermined two of the eight input wirings 7 and 10 are power supply lines.

First to third IC chip mounting areas 4 to 6
1st to 3rd IC chips 21 to 23 are mounted respectively. Here, as an example, the first IC chip 2
1 will be described with reference to FIGS. 4A and 4B. First, FIG. 4A shows a portion of the first IC chip mounting area 4. First IC
A total of eight input-side connection terminals 2 of 6 + 2 are provided at one end in the length direction of the chip mounting area 4 and one end in the width direction in the vicinity thereof.
4 is provided, and a plurality of output side connection terminals 25 are provided at the other end in the width direction. In this case, the input side connection terminal 24
Are provided in the middle of the corresponding common input wiring 7,
The output-side connection terminals 25 are provided at one ends of the corresponding output wirings 8. On the other hand, FIG. 4B shows the first IC.
The bottom surface of the chip 21 is shown. A total of 8 + 6 + 2 input terminals (bumps) 26 are provided at one end in the length direction of the lower surface of the first IC chip 21 and one end in the width direction in the vicinity thereof.
And a plurality of output terminals (bumps) 26 are provided at the other end in the width direction. The input terminal 26 and the output terminal 27 of the first IC chip 21 are connected to the corresponding input-side connecting terminals 24 and output-side connecting terminals 25 in the first IC chip mounting area 4, respectively, by an anisotropic conductive adhesive (not shown). Alternatively, they are connected via solder. As shown in FIGS. 3A and 3B, the base ends of the input wirings 7 and 10 are connected to a control circuit circuit board (not shown) via a flexible wiring board 28.

[0004]

By the way, in such a conventional liquid crystal display device, the transparent electrode in the display area is made of ITO.
The wirings 7 to 11 and the connection terminals 24 and 25 on the lower transparent substrate 3 are also formed of ITO. However, since the resistance value of ITO is relatively large, the resistance value becomes high especially when the width of the common input wiring 7 is narrow, and as a result, the first IC chip 2
The signal attenuation rate for the second IC chip 12 becomes larger than the signal attenuation rate for 1, so that the right half display screen corresponding to the first IC chip 21 and the left half display screen corresponding to the second IC chip 12 are displayed. There is a problem in that there is a difference in brightness and a difference in contrast with the screen. In order to avoid this, the width of the common input wiring 7 may be widened to reduce its resistance value. In this case, the width of the common input wiring 7 is widened and the lower transparent portion is provided. There is another problem that the substrate 3 becomes large and the liquid crystal display panel 1 becomes large. An object of the present invention is to provide an IC chip that can include a part of common wiring for another IC chip arranged on the rear side. Another object of the present invention is to provide a connection structure between an IC chip and a substrate, which can widen the width of the common wiring of the substrate without increasing the size of the substrate.

[0005]

According to a first aspect of the present invention, there is provided an IC chip having a relay wiring extending from one end to the other end of the one surface. The connection structure according to claim 2, wherein a plurality of IC chip mounting areas are provided in series at one end of one surface, and a plurality of common wirings are provided at one end of the one surface. At least a part of the common wiring is the plurality of I's.
A divided substrate is provided in a portion corresponding to the IC chip mounting area on the front side of the C chip mounting area, and the IC chip according to claim 1 is mounted on the IC chip mounting area on the front stage side, and the divided board is formed. A part of the common wiring is divided by the relay wiring.

[0006]

According to the first aspect of the invention, since the relay wiring is provided, the relay wiring can be used as a common wiring for other IC chips arranged on the subsequent stage side. As a result, according to the invention described in claim 2, even if a part of the common wiring of the substrate is omitted, the omitted common wiring can be supplemented by the relay wiring of the IC chip according to claim 1, and by extension, The width of the common wiring of the substrate can be widened without increasing the size of the substrate in at least a portion where the common wiring of the substrate is omitted.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A shows a main part of a liquid crystal display panel of a liquid crystal display device to which an embodiment of the present invention is applied, and FIG. 1B shows a lower surface of an IC chip mounted on this liquid crystal display panel. It is a thing. In these figures, parts having the same names as those in FIGS. 4A and 4B are designated by the same reference numerals, and the description thereof will be appropriately omitted.

First, as shown in FIG. 1A, in the first IC chip mounting area 4 of the transparent substrate 3 on the lower side of the liquid crystal display panel 1, a predetermined number of eight common input wirings 7 are provided. The two common input wirings 7a are divided on both sides so as to sandwich the output side connection terminal 25 and the output wiring 8, and no common input wiring is provided between them. Then, an input side connection terminal 24 is provided in the divided portion on the right side of FIG. 1A of the divided common input wiring 7a as in the conventional case,
Unlike the conventional case, a relay connection terminal 31 is provided on the left side divided portion in FIG. 1A. In this case, assuming that the arrangement position of the output-side connection terminals 25 is the same as in the conventional case shown in FIG. 4A, the two divided common input wirings 7a are almost on the extension line of the arrangement of the output-side connection terminals 25. It is located directly above or provided on the transparent substrate 2 side.

On the other hand, as shown in FIG. 1 (B), the first I
Two relay terminals (bumps) 32 are provided at the other end in the width direction of the other end in the length direction of the lower surface of the C chip 21.
The two relay terminals 32 and the corresponding first IC
The two input terminals 26 provided at one end of the lower surface of the chip 21 in the lengthwise direction and the other end in the widthwise direction are respectively connected to the relay wiring 3
3 are connected. Incidentally, although not shown in detail, the first IC chip 21 is generally provided with a pad including a routing line made of aluminum or the like on a silicon chip, and the insulating film 34 is provided on the entire upper surface except the pad portion. The input terminal 26 and the output terminal 27 made of gold or the like are provided on the pad via the under bump metal. Therefore, as an example, the relay terminal 32 has the same structure as the input terminal 26 and the output terminal 27. Further, the relay wiring 33 has the same structure as the lead wire and is covered with the insulating film 34. Note that the two relay wirings 33 are connected to the first IC chip 2
The output terminals 27 are provided in parallel with each other on the other end in the width direction of the lower surface of 1, and the output terminals 27 are arranged on one end side in the width direction.

The input terminal 26, the output terminal 27 and the relay terminal 32 of the first IC chip 21 are the first IC.
The corresponding input side connection terminal 24, output side connection terminal 25 and relay connection terminal 31 in the chip mounting area 4 respectively.
Are connected via an anisotropic conductive adhesive or solder (not shown). In this state, the input-side connection terminal 24 of the split common input wiring 7a on the right side and the relay connection terminal 31 of the split common input wiring 7a on the left side in FIG.
Are connected through the input terminal 26 of the IC chip 21, the relay wiring 33, and the relay terminal 32. In this case, the relay wiring 33 and the output wiring 8 cross each other, but since the insulating film 34 of the first IC chip 21 is interposed therebetween, a short circuit does not occur between them. .

Thus, in this liquid crystal display device, the first
Since the common input wirings 7a on both the left and right sides divided in the IC chip mounting area 4 are connected via the relay wiring 33 of the first IC chip 21 or the like, the relay wiring of the first IC chip 21 is connected. 33, etc. are arranged on the rear stage side.
It can be used as a common input wiring for a C chip (for example, the second IC chip 22 shown in FIG. 3B).
As a result, even if a part of the two divided common input wirings 7a is omitted, the omitted portion can be supplemented by the relay wiring 33 of the first IC chip 21 and at least the divided common input wiring 7a. In the part where a part of is omitted, the lower transparent substrate 3 is not enlarged and the remaining 6
The width of the common input wiring 7 of the book can be widened. Further, the resistance value of the material of the relay terminal 32 or the relay wiring 33 of the first IC chip 21 such as gold or aluminum is IT.
Since it is much lower than that of O, it is possible to prevent signal attenuation from occurring in this portion. As a result, without increasing the size of the liquid crystal display panel 1, the right half display screen corresponding to the first IC chip 21 and, for example, FIG.
It is possible to prevent a difference in brightness and a difference in contrast from occurring between the left half display screen corresponding to the second IC chip 22 shown in FIG.

In the above embodiment, the case where the relay wiring 33 of the first IC chip 21 is formed of aluminum or the like has been described, but the present invention is not limited to this. For example, a high-concentration impurity implantation region provided in the silicon chip itself. It may be formed by. Further, in the above embodiment, for example, as shown in FIG. 3A, two IC chip mounting areas 4 and 5 are provided in series on the upper surface of one protruding portion of the lower transparent substrate 3 and the other protruding portion is provided. One IC chip mounting area 6 is provided on the upper surface of the part, and these IC chip mounting areas 4 to
In the liquid crystal display device in which the IC chips 21 to 23 are mounted on each of the six, as shown in FIGS. 1 (A) and 1 (B),
Structure of first IC chip mounting area 4 and first IC
The case where the structure of the C chip 21 is a special structure has been described, but the structure is not limited to this. For example,
As shown in FIG. 2, three IC chip mounting areas 41 to 43 are provided in series on the upper surface of one protruding portion of the lower transparent substrate 3, and two IC chip mounting areas 44 are formed on the upper surface of the other protruding portion. , 45 are provided in series, and in the liquid crystal display device in which the IC chips 46 to 50 are mounted on these IC chip mounting areas 41 to 45, respectively, the structure of the IC chip mounting area on the preceding stage shown by reference numerals 41, 42 and 44. And the structure of the IC chips indicated by reference numerals 46, 47 and 49 in FIG.
It may be a special structure as shown in (A) and (B). Furthermore, it is needless to say that the present invention can be applied not only to the liquid crystal display device but also to other electronic devices provided with a substrate on which an IC chip is mounted.

[0013]

As described above, according to the first aspect of the present invention, since the relay wiring is provided, the common wiring for other IC chips arranged on the rear side of the relay wiring is provided. Can be used as As a result, according to the invention of claim 2, even if a part of the common wiring of the substrate is omitted,
The omitted common wiring can be supplemented by the relay wiring of the IC chip according to claim 1, and at least in a portion where a part of the common wiring of the board is omitted, the common wiring of the board is not enlarged. Can be widened.

[Brief description of drawings]

FIG. 1A is a plan view showing a main part of a liquid crystal display device to which an embodiment of the present invention is applied, and FIG. 1B is a bottom view of an IC chip mounted in the liquid crystal display device.

FIG. 2 is a plan view showing a main part of a liquid crystal display device to which another embodiment of the present invention is applied.

3A is a plan view showing an example of a conventional liquid crystal display device, and FIG. 3B is a detailed view of a part thereof.

4A is a more detailed view of a portion of FIG. 3B, FIG.
(B) is a bottom view of the IC chip.

[Explanation of symbols]

 1 Liquid Crystal Display Panel 3 Lower Transparent Substrate 4 First IC Chip Mounting Area 7 Common Input Wiring 7a Split Common Input Wiring 8 Output Wiring 21 First IC Chip 24 Input Side Connection Terminal 25 Output Side Connection Terminal 26 Input Terminal 27 Output terminal 31 Relay connection terminal 32 Relay terminal 33 Relay wiring

Claims (3)

[Claims] 1. An IC having a relay wire provided on one surface thereof extending from one end to the other end of the one surface.
Chips. 2. A plurality of IC chip mounting areas are provided in series at one end of one surface, a plurality of common wirings are provided at one end of the one surface, and at least a part of these common wirings is provided. 2. The I wiring according to claim 1, wherein the common wiring includes a substrate divided in a portion corresponding to the IC chip mounting area on the front side of the plurality of IC chip mounting areas, and the IC chip mounting area on the front side is divided.
A connection structure between an IC chip and a substrate, wherein a C chip is mounted, and a divided portion of the divided common wiring is connected by the relay wiring. 3. The connection structure between an IC chip and a substrate according to claim 2, wherein the substrate is a transparent substrate of a liquid crystal display panel.