JP3264103B2 - Liquid crystal display - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display.

[0002]

2. Description of the Related Art FIG. 4A shows an example of a conventional liquid crystal display device, and FIG. 4B shows its wiring structure. This liquid crystal display device includes a liquid crystal display panel 1, three semiconductor chips 2 to 4, a flexible wiring board 5, a control circuit circuit board (not shown), and the like. The liquid crystal display panel 1 has a liquid crystal (not shown) sealed between two transparent substrates 6 and 7 provided with display electrodes (not shown) on opposing surfaces.
The lower and right sides of the lower transparent substrate 7 are the upper transparent substrate 6
Project from the corresponding lower and right sides. Two semiconductor chip mounting areas 8 and 9 indicated by chain lines are provided on the upper surface of the projecting portion on the lower side of the lower transparent substrate 7, and a plurality of output chips are provided at the upper end of each of the semiconductor chip mounting areas 8 and 9. Side connection wirings 10 and 11 are provided, and a plurality of input side connection wirings 12 and 13 are provided at the lower ends of the semiconductor chip mounting areas 8 and 9, respectively. One end of each of the output side connection wirings 10 and 11 is connected to the drive element of the lower display electrode, and the other end protrudes into the semiconductor chip mounting areas 8 and 9. Input side connection wiring 1
One end of each of 2 and 13 protrudes into the semiconductor chip mounting areas 8 and 9, and the other end is disposed at the lower end of the lower transparent substrate 7. One semiconductor chip mounting area 14 indicated by a dashed line is provided on the upper surface of the protruding portion on the right side of the lower transparent substrate 7, and a plurality of output side connection wirings are provided at the left end of the semiconductor chip mounting area 14. A plurality of input-side connection wires 16 are provided at the right end of the semiconductor chip mounting area 14, and one common electrode-side connection wire 17 is provided at a predetermined location. Output side connection wiring 1
5 is connected to the lower display electrode driving element,
Each other end protrudes into the semiconductor chip mounting area 14. One end of the input-side connection wiring 16 protrudes into the semiconductor chip mounting area 14, and the other end is disposed at the right end of the lower transparent substrate 7. One end of the common electrode side connection wiring 17 is connected to the upper display electrode via the cross member 18, and the other end is disposed on the right end of the lower transparent substrate 7.

As shown in FIG. 5, a plurality of output-side connection electrodes (bump electrodes) 19 are provided on the lower surface of the semiconductor chips 2 to 4 immediately inside the upper side, and a plurality of input-side connection electrodes 19 are provided immediately inside the lower side. An electrode (bump electrode) 20 is provided. The predetermined two semiconductor chips 2 and 3 are mounted on the respective semiconductor chip mounting areas 8 and 9 on the upper surface of the protruding portion on the lower side of the lower transparent substrate 7. In this case, each input-side connection electrode 20 and each output-side connection electrode 19
Are electrically connected to the input side connection wirings 12 and 13 and the output side connection wirings 10 and 11 in the semiconductor chip mounting areas 8 and 9 via an anisotropic conductive adhesive or the like. Similarly, the remaining one semiconductor chip 4 is mounted on the semiconductor chip mounting area 14 on the upper surface of the protrusion on the right side of the lower transparent substrate 7.

The flexible wiring board 5 is substantially L-shaped, and the input-side connection wiring 1 provided on the lower surface of the lower transparent substrate 7 on the upper surface of the lower transparent substrate 7 is provided on the lower surface of one end 5a.
Two sets of connection wirings 21 and 22 corresponding to 2 and 13 are provided, and an input-side connection wiring provided on the upper surface of the protruding portion on the right side of the lower transparent substrate 7 on the lower surface of the other end 5b. 16
Further, connection wirings 23 and 24 corresponding to the common electrode side connection wiring 17 are provided. In this case, on one end side 5a of the flexible wiring board 5, the connection wiring 21 is wired on both sides via a group of through-hole conducting portions 25, and is connected to another side via another group of through-hole conducting portions 26.
A pair of connection wires 21 and 22 are conductively connected as a common wire. Then, one end 5 of the flexible wiring board 5
The connection wirings 21 and 22 and the connection wirings 23 and 24 on the other end 5b correspond to the connection wirings 12 and 13 and the connection wirings via connection members such as an anisotropic conductive adhesive. 16 and 17 are conductively connected to the flexible wiring board 5
Are electrically connected to predetermined portions of the control circuit board.

[0005]

However, in such a conventional liquid crystal display device, a substantially L-shaped flexible wiring substrate 5 having connection wirings 21 to 24 is connected to each of the semiconductor chips 2 to 2 of the liquid crystal display panel 1. 4 are conductively connected to each other, so that the area occupied by the flexible wiring board 5 is increased, and there is a problem that the size is increased. In addition, since the connection wirings 21 and 22 for the two semiconductor chips 2 and 3 are conductively connected as a common wiring, the flexible wiring board 5 has a double-sided wiring structure via the through-hole conductive portions 25 and 26, so that the flexible wiring There is a problem that the structure of the substrate 5 is complicated and the cost is high. This is because as the number of semiconductor chips 2 and 3 increases,
Notable. An object of the present invention is to provide a liquid crystal display device that can be reduced in size and can simplify the structure of a flexible wiring board.

[0006]

According to the first aspect of the present invention,
Phase protrusion least one of the substrates is projected from at least one side of the other substrate of the opposing two display electrodes formed on a surface substrate is formed, at least the other substrate on one surface of the projecting portion a plurality of semiconductor chip mounting areas provided along one side, in a liquid crystal display device rectangular semiconductor chips are mounted to the each semiconductor chip mounting area, on the semiconductor chip, the semiconductor chip
A plurality of output connection electrodes arranged along one long side of
A first input-side connection electrode arranged along the other three sides and
And at least one pair of corresponding second input connections
An electrode and at least a pair of corresponding second inputs
The wiring for connecting the connection electrodes are mutually disposed, the one
One surface of the protruding portion of the substrate is connected to one of the display electrodes.
And an output connected to an output-side connection electrode of the semiconductor chip.
Power connection wiring and the semiconductor chip mounting area
To connect the first input-side electrode.
A first input-side connection wiring and a second input-side connection
Do not cross the second input connection wires connecting the poles
And at least the first input side connection wiring is
The entire area in the longitudinal direction is passed through the semiconductor chip mounting area.
The first input-side connection wiring and the
One end of each of the second input-side connection wires is collectively arranged at one position on one surface of the protruding portion. According to a second aspect of the present invention, the first input connection electrode is defined as a signal input electrode.
And the second input connection electrode is connected to a power signal input electrode.
It was done.

[0007]

According to the first aspect of the present invention, one surface of the protrusion is provided.
And continuously over the semiconductor chip mounting area.
A first input provided for connecting the first input-side electrode;
Connecting the second side connection wiring and the second input side connection electrode
Of the input side connection wires of
Both the first input side connection wiring is the semiconductor chip mounted
In the area, pass through the entire area in the longitudinal direction
The first input-side connection wiring and the second input-side connection
Since one end of each wiring is collectively arranged at one position on one surface of the protruding portion, the size is reduced as compared with a case where a flexible wiring board having connection wiring on both surfaces is conductively connected to a plurality of semiconductor chips. it can, after which it is possible to simplify the structure of the flexible wiring board, a first input-side contact
The connection wiring runs in the semiconductor chip mounting area in the longitudinal direction.
Is provided so as to pass through the entire area of
Of the semiconductor chip can be reduced.
A second input in which two input-side connection electrodes are provided on one surface of the protrusion;
Side connection wiring and the wiring inside the semiconductor chip.
Thus, the wiring resistance can be reduced.

[0008]

FIG. 1 shows an embodiment of the liquid crystal display device according to the present invention, and FIGS. 2A and 2B show the wiring structure thereof. In these figures, the same reference numerals are given to the same parts as those in FIGS. 4A and 4B, and the description thereof will be omitted as appropriate. Semiconductor chip mounting areas 8 and 9 are provided on the upper surface of the projection on the lower side of the transparent substrate 7 on the lower side of the liquid crystal display device as in the conventional case.
Semiconductor chips 31 and 32 are mounted on the semiconductor chip mounting areas 8 and 9 instead of the conventional semiconductor chips 2 and 3. On the lower surfaces of the semiconductor chips 31 and 32, FIG.
As shown in (A), a plurality of output side connection electrodes 33 are provided immediately inside the upper side, four signal input side connection electrodes 34a are provided just inside the right side, and four output side connection electrodes 34a are provided just inside the lower side. Two power input side connection electrodes 34b and 34c are provided, respectively. In this case, the left power input side connection electrode 34b and the right power input side connection electrode 3 corresponding to each other.
4c are connected inside the chip. Also, a semiconductor chip mounting area 14 is provided on the upper surface of the protruding portion on the right side of the lower transparent substrate 7 as in the conventional case. In this semiconductor chip mounting area 14, a semiconductor chip 35 is mounted instead of the conventional semiconductor chip 4. On the lower surface of the semiconductor chip 35, as shown in FIG. 3B, a plurality of output-side connection electrodes 33 are provided just inside the upper side, and four signal input-side connection electrodes 34a are provided just inside the left side. In addition, four power supply input side connection electrodes 34b and 34c are respectively provided at two places just inside the lower side. Also in this case, the left power input side connection electrode 34b and the corresponding right power input side connection electrode 34c are connected inside the chip.

On the upper surface of the protruding portion on the lower side of the lower transparent substrate 7, instead of the conventional input side connection lines 12, 13, four signal input side connection lines 36 not intersecting with each other and four signal side connection lines 36 are provided. The power supply input side connection wiring 37 is provided. 4
The signal input side connection wiring 36 is composed of a semiconductor chip 31 mounted on the left semiconductor chip mounting area 8 and a semiconductor chip 32 mounted on the right semiconductor chip mounting area 9.
Corresponding to the signal input side connection electrodes 34a, 34a
Are connected to each other, and both semiconductor chip mounting areas 8,
9, the right end portions are collectively arranged at the right end portion of the protruding portion of the lower transparent substrate 7. 4
The power supply input side connection wiring 37 includes a semiconductor chip 31 mounted on the left semiconductor chip mounting area 8 and a semiconductor chip 32 mounted on the right semiconductor chip mounting area 9.
Input side connection electrodes 34c, 34b corresponding to each other
The two power input side connection electrodes 34b and 34c of the semiconductor chip 32 mounted on the semiconductor chip mounting area 9 on the right side are connected to each other, and are continuously connected to the semiconductor chip mounting areas 8 and 9. The right end portions are collectively arranged at the right end portion of the protruding portion of the lower transparent substrate 7. Also, instead of the conventional input-side connection wiring 16, four signal-input-side connection wirings 38 and four power-supply-input sides that do not intersect each other are provided on the upper surface of the right-side protruding portion of the lower transparent substrate 7. A connection wiring 39 is provided. The four signal input side connection wires 38 are connected at their upper ends to the signal input side connection electrodes 34 a of the semiconductor chip 35 mounted on the semiconductor chip mounting area 14, and each lower end of the lower transparent substrate 7. They are arranged together at the right end of the protrusion. The four power supply input side connection wirings 39 are provided at respective upper ends of the power supply input side connection electrodes 34 of the semiconductor chip 35 mounted on the semiconductor chip mounting area 14.
b, and each lower end is collectively arranged at the right end of the protruding portion of the lower transparent substrate 7. 2A and 2B, the connection electrodes 33, 34a to 34c of the semiconductor chips 31, 32, 35 are indicated by black circles.

Then, two predetermined semiconductor chips 31,
Reference numeral 32 is mounted on two semiconductor chip mounting areas 8 and 9 provided on the lower side protruding portion of the lower transparent substrate 7, respectively. In this case, the signal input side connection electrodes 34a of the semiconductor chips 31 and 32 are connected to the corresponding signal input side connection wirings 36 of the semiconductor chip mounting areas 8 and 9 via connection members such as an anisotropic conductive adhesive. Each of the power supply input side connection electrodes 34b and 34c is conductively connected to the corresponding power supply input side connection wiring 37 of the semiconductor chip mounting area 8 and 9 via a connection member such as an anisotropic conductive adhesive. The respective output side connection electrodes 33 are connected to the corresponding output side connection wirings 10 and 11 of the semiconductor chip mounting areas 8 and 9 via connection members such as an anisotropic conductive adhesive in the same manner as in the related art. Conductively connected. The remaining one semiconductor chip 4 is similarly mounted on one predetermined semiconductor chip mounting area 14.

As described above, in this liquid crystal display device, the input side connection electrodes 34a to 34 corresponding to the respective semiconductor chips 31, 32 mounted on the semiconductor chip mounting areas 8, 9 respectively.
A plurality of non-intersecting connection wirings 36 and 37 for conductively connecting the wirings c are provided continuously over the semiconductor chip mounting areas 8 and 9, and one end of each of the connection wirings 36 and 37 is connected to the lower transparent substrate 7. 4 are collectively arranged on the right end of one surface of the projecting portion, so that the conventional flexible wiring board 5 having connection wirings 21 on both sides as shown in FIG. In comparison, the size can be reduced and the structure of the flexible wiring board 5 can be simplified. Further, since the plurality of signal input side connection wirings 36 pass through the inside of the semiconductor chip mounting area 9 on the right side, the width of the protruding portion on the lower side of the lower transparent substrate 7 can be reduced accordingly. The size can be reduced. Further, two sets of the power input side connection electrodes 34b and 34c corresponding to each other of the semiconductor chips 31 and 32 are conductively connected to the corresponding power input side connection wiring 37, so that the power input side connection electrodes 34b and 34c are Even if there is a set, conductive connection can be made without increasing the number of wirings.
Further, since two sets of the corresponding power input side connection electrodes 34b and 34c of the semiconductor chips 31 and 32 are connected inside the chip, two sets of the corresponding power input side connection electrodes 34b of the semiconductor chips 31 and 32 correspond to each other. , 34c, the connection of the semiconductor chip 32 and the power supply input side connection wiring 37 are arranged in parallel. As a result, the semiconductor chip 31 mounted on the semiconductor chip mounting area 8 on the left side far from the flexible wiring board 5 In addition, both power input side connection electrodes 34 of the semiconductor chip 31 mounted on the semiconductor chip mounting area 8 on the left side can be reduced.
It is possible to omit the power supply input side connection wiring 37 for connecting between b and 34c.

In the above embodiment, the lower transparent substrate 7
The two semiconductor chips 31 and 3 are provided on the upper surface of the protrusion on the lower side.
2 is mounted, and the corresponding input-side connection electrodes 34a to 34c of the two semiconductor chips 31 and 32 are conductively connected to each other via the input-side connection wirings 36 and 37, but the present invention is not limited to this. For example, three semiconductor chips 31 and 32 are mounted on the upper surface of the projecting portion on the lower side of the lower transparent substrate 7, and the corresponding input-side connection electrodes 34 a of the three semiconductor chips 31 and 32 are mounted. To 34c may be conductively connected to each other via the input side connection wirings 36 and 37. Further, in the above-described embodiment, the case where one set of the signal input side connection electrodes 34a is provided on the lower surface of the semiconductor chips 31, 32, 35 is described. However, the present invention is not limited to this.
Similarly to 4c, two sets of signal input side connection electrodes 34a corresponding to each other are provided on the semiconductor chips 31, 32 and 35, and the two sets of signal input side connection electrodes 34a are electrically connected to the corresponding signal input side connection wirings 36, respectively. Connected and semiconductor chip 3
1, 32, 35 corresponding two sets of signal input side connection electrodes 3
4a may be internally connected to each other.

[0013]

As described above, according to the first aspect of the present invention, each of the semiconductor chips is mounted on one surface of the protrusion.
The first input side, which is provided continuously over the area;
First input side connection wiring for connecting electrodes and second input
The second input connection wires connecting the connection electrodes are connected to each other.
At least the first input side connection
The line extends through the entire area in the semiconductor chip mounting area in the longitudinal direction.
The first input-side connection wiring and the
And one end of the second input-side connection wiring is collectively arranged at one location on one surface of the protruding portion, so that a flexible wiring board having connection wiring on both surfaces is conductively connected to a plurality of semiconductor chips. compared to, it can be miniaturized, after which it is possible to simplify the structure of the flexible wiring board, a first input connection wiring the semiconductor chip tower
The mounting area is provided so as to pass through the entire area in the longitudinal direction.
Therefore, the width of the protruding portion of one substrate can be reduced,
Furthermore, the second input-side connection electrode of the semiconductor chip is projected
The second input side connection wiring provided on one surface of the semiconductor chip and
Because of the connection of the wiring of
it can.

[Brief description of the drawings]

FIG. 1 is a plan view of one embodiment of a liquid crystal display device according to the present invention.

FIG. 2A is a plan view of a wiring structure of the liquid crystal display device,
(B) is a plan view of the main part.

3A is a plan view of two predetermined semiconductor chips used in the liquid crystal display device, and FIG. 3B is a plan view of another semiconductor chip used in the liquid crystal display device.

FIG. 4A is a plan view of an example of a conventional liquid crystal display device,
(B) is a plan view of the wiring structure.

FIG. 5 is a plan view of a semiconductor chip used in the liquid crystal display device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 5 Flexible wiring board 6, 7 Transparent board 8, 9, 14 Semiconductor chip mounting area 31, 32, 35 Semiconductor chip 34a Signal input side connection electrode 34b, 34c Power input side connection electrode 36, 38 Signal input side connection Wiring 37, 39 Wiring for power input side connection

Claims (2)

(57) [Claims] At least one of two substrates having display electrodes formed on opposing surfaces is protruded from at least one side of the other substrate to form a protruding portion, and the protruding portion is formed on one surface of the protruding portion. In a liquid crystal display device in which a plurality of semiconductor chip mounting areas are provided along at least one side of the other substrate and a rectangular semiconductor chip is mounted in each of the semiconductor chip mounting areas, the semiconductor chip includes Along one long side
Along the multiple output connection electrodes arranged along the other three sides
A first input connection electrode arranged and at least a relative
A corresponding pair of second input connection electrodes and at least
The pair of second input-side connection electrodes corresponding to the phases are also connected to each other.
Wiring for connection to each other is provided, and one of the display electrodes is provided on one surface of the protruding portion of the one substrate.
Connected to the output connection electrode of the semiconductor chip.
Connected to the output side and the semiconductor chip mounting
The first input side power supply is provided continuously over the rear.
A first input-side connection wiring for connecting a pole and the second input-side connection wiring;
The second input-side connection wires that connect the power-side connection electrodes
Non-intersecting and at least the first input connection
The wiring runs in the semiconductor chip mounting area in the longitudinal direction.
The first input-side connection wiring, which is provided so as to pass through the entire area;
And one end of each of the second input-side connection wirings is collectively arranged at one position on one surface of the protruding portion. 2. The first input-side connection electrode is connected to a signal input terminal.
Side electrode, and the second input side connection electrode is connected to a power signal
A liquid crystal display device, which is an input electrode .