JP3406517B2 - Semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a rectangular semiconductor element arranged on an outer edge of a liquid crystal display panel for driving the liquid crystal display device, and more particularly to an electrode at an input / output terminal of the semiconductor element. And the wiring pattern.

[0002]

2. Description of the Related Art Conventionally, in a liquid crystal display device, a semiconductor device for driving a liquid crystal, which is arranged on an outer edge of the liquid crystal display panel, is provided in order to secure a large area of the liquid crystal display panel and to downsize the entire device. It is desired to reduce the on-board capacity and eventually the frame of the liquid crystal display panel.

By the way, in a conventional semiconductor element 100 having a plurality of drive circuit elements for driving current or voltage, for example, as shown in FIG. 23, output terminals 101 ... Corresponding to each pixel of a liquid crystal display panel are rectangular. Semiconductor device 100
Are arranged in parallel with three sides or four sides (four sides in the same figure) in FIG. 1, and the input terminal 1 for inputting the image signal is provided on one side of the long sides.
02, power source terminals 103, etc. are arranged. In addition, inside the driving circuit element region 104
Is provided.

On the other hand, in Japanese Unexamined Patent Publication No. 4-242945, as shown in FIG. 24, an IC chip 201, which is a semiconductor element, is formed in an elongated rectangular shape, and its I
3 or 4 sides of C chip 201 (3 sides in the figure)
Are arranged on the liquid crystal display panel, and input terminals such as power supply terminals and input terminals 203 are arranged on one of the remaining long sides, which is a tape carrier package (TCP) 200. Is disclosed.

That is, in this TCP 200, the output terminal 2
02 are provided along one long side and both short sides of the rectangular IC chip 201, and these output terminals 20
2 are connected to a liquid crystal display panel (not shown) through the output wiring pattern 204.

[0006]

However, in the above conventional semiconductor device, as shown in FIG.
A substrate 205 such as a printed circuit board or a flexible substrate connected to the input side (power supply terminal and input terminal) of 0.200.
There is a problem that the patterning of the substrate wiring 206 ... As the input wiring pattern has a large area, and when it is mounted on a liquid crystal display device, the frame becomes large.

In addition, 3 of the IC chip 201 shown in FIG.
Since the output terminals 202 are arranged on the side, the TCP 20
The area of the leading wiring on 0 increases and TCP200
However, there is a problem in that the outer dimensions of the device become large and the manufacturing cost increases.

That is, when a terminal is provided on the short side of a rectangular semiconductor element and a wiring is routed from this terminal to the long side, the wiring efficiency is inevitably deteriorated.

The present invention has been made in view of the above-mentioned conventional problems, and an object thereof is to efficiently arrange electrodes of a semiconductor element and a wiring pattern to reduce an area of a wiring routed around the semiconductor element. By doing so, it is possible to narrow the frame of the liquid crystal display panel and provide a semiconductor device capable of reducing the cost.

[0010]

In order to solve the above-mentioned problems, a semiconductor device according to a first aspect of the present invention includes a rectangular semiconductor element arranged on an outer edge of a liquid crystal display panel for driving the liquid crystal display device. An electrode for transmitting and receiving an input / output signal for driving the liquid crystal display device and an electrode electrically connected to the liquid crystal display panel are formed along both long sides and both short sides of the semiconductor element. In the TCP type semiconductor device according to the above, an electrode electrically connected to the liquid crystal display panel is provided on one long side of the semiconductor element, and transmits / receives an input / output system signal for driving the liquid crystal display device. Some of the electrodes are arranged side by side along the short sides of the semiconductor element, and below or above the electrodes provided on these short sides, a plurality of ITO line segments are formed in parallel with the long sides of the semiconductor element. Wiring Input and output wiring is aligned arranged to be,
When transmitting / receiving an input / output system signal to / from electrodes arranged side by side along the short side of the semiconductor element, one short side of each of the input / output wirings via an input buffer circuit in the semiconductor element The input system signal is input to the electrode of and the output system signal is output from the other short side electrode via the output buffer circuit of the semiconductor element to each of the input / output wirings.

According to the above invention, the electrode electrically connected to the liquid crystal display panel is provided on one long side of the semiconductor element. On the other hand, some of the electrodes for transmitting and receiving input / output system signals for driving the liquid crystal display device are arranged side by side along the short side of the semiconductor element.

Further, below or above the electrodes provided on these short sides, input / output wirings composed of a plurality of line segment ITO wirings are arranged in parallel with the long sides of the semiconductor element.

When transmitting / receiving an input / output system signal to / from electrodes arranged side by side along the short side of the semiconductor element, the input / output signals from the input / output wirings are input to the semiconductor element.
Input system signal is input to the electrode on one short side via the buffer circuit , and is output to the input / output wiring from the electrode on the other short side via the output buffer circuit of the semiconductor element. Output system signal.

That is, conventionally, from the electrodes provided on the long side and the short side of the rectangular semiconductor element, to the liquid crystal display panel provided on the long side of the semiconductor element and the substrate provided on the other long side. Since it was connected to the input / output wiring of, the wiring area from the terminal provided on the short side of the semiconductor element requires an area,
There has been a problem that the area of the semiconductor device becomes large and the cost increases accordingly, and it is difficult to narrow the frame of the liquid crystal display panel.

However, in the present invention, for the liquid crystal display panel provided on one long side, output is made only from the terminal on one long side of the semiconductor element.

On the other hand, most of the electrodes for transmitting and receiving input / output system signals are input and output from the other terminal on the longer side of the semiconductor element, but some electrodes are arranged side by side along the shorter side of the semiconductor element. To be done.

Furthermore, with respect to the electrodes provided on these short sides, a plurality of electrodes arranged in line segments parallel to the long sides of the semiconductor element are provided below or above the electrodes provided on the short sides. It is input / output through the output wiring.

Therefore, the electrodes arranged side by side along the short side of the semiconductor element may be provided with a wiring pattern parallel to the long side direction. Also, the length of the wiring pattern is
Since there is an input / output wiring below or above the electrode, it is not necessary to make it long.

From the long side of the semiconductor element, toward the liquid crystal display panel provided on one long side of the semiconductor element and the input / output wiring provided on the other long side of the semiconductor element, the semiconductor element Since wiring may be made parallel to the short side, there is no waste in the wiring pattern and the wiring resistance can be reduced.

Here, in particular, in the present invention, when transmitting / receiving an input / output system signal to / from electrodes arranged side by side along the short side of the semiconductor element, the input / output signals in the semiconductor element are input from each line-shaped input / output wiring. The input system signal is input to the electrode on the short side on one side through the buffer circuit , and the output voltage of the semiconductor element is
An output system signal is output from the electrode on the other short side via the buffer circuit to each of the input / output wirings. Since each input / output wiring is formed in the shape of a line segment, short-circuiting of the input / output wiring on the same parallel line does not occur.

Therefore, input is made from the electrode on one short side of the semiconductor element, output from the electrode on the other short side of the semiconductor element, and input to the electrode on the one short side of the next adjacent semiconductor element. Therefore, the wiring between the adjacent semiconductor elements can be efficiently performed.

As a result, the electrodes of the semiconductor element and the wiring pattern are efficiently arranged, whereby the area of the routing wiring of the semiconductor element can be reduced, and the frame of the liquid crystal display panel can be narrowed, and the cost can be reduced. A semiconductor device capable of achieving the above can be provided.

In order to solve the above-mentioned problems, a semiconductor device according to a second aspect of the present invention includes a rectangular semiconductor element arranged on an outer edge of a liquid crystal display panel for driving the liquid crystal display device. A TCP type semiconductor device in which an electrode for transmitting and receiving an input / output signal for driving a liquid crystal display device and an electrode electrically connected to a liquid crystal display panel are formed along both long sides and both short sides. In the above, the electrodes electrically connected to the liquid crystal display panel are provided on one long side of the semiconductor element, while a part of the electrodes for transmitting and receiving the input / output system signals for driving the liquid crystal display device are A plurality of ITO wirings in line segments are arranged along the short sides of the semiconductor element and below or above the electrodes provided on these short sides in parallel with the long sides of the semiconductor element .
Ranaru output wiring is aligned disposed, upon reception of the input-output system signal for the sequence disposed electrodes along the short side of the semiconductor element, input and output buffers in the semiconductor device from above input-output lines input and output input-output system signal to one of the short side electrode through the circuit, and input and semiconductor device
An input / output system signal is input / output to / from each of the input / output wirings from the other short-side electrode via the force buffer circuit .

According to the above invention, for the liquid crystal display panel provided on one long side, the output is made only from the terminal on one long side of the semiconductor element.

On the other hand, most of the electrodes for transmitting and receiving the input / output system signals are input and output from the other terminal on the longer side of the semiconductor element, but some electrodes are arranged side by side along the shorter side of the semiconductor element. To be done.

Further, with respect to the electrodes provided on these short sides, a plurality of ITOs arranged below the electrodes provided on the short sides in parallel with the long sides of the semiconductor element are arranged in line segments. It is input and output at the input and output wiring consisting wiring.

Therefore, the electrodes arranged side by side along the short side of the semiconductor element may be provided with a wiring pattern parallel to the long side direction. Also, the length of the wiring pattern is
Since there is an input / output wiring below or above the electrode, it is not necessary to make it long.

From the terminal on the long side of the semiconductor element,
To the liquid crystal display panel provided on one long side of the semiconductor element and the input / output wiring provided on the other long side,
Since it suffices to wire in parallel with the short side of the semiconductor element, there is no waste in the wiring pattern and the wiring resistance can be reduced.

[0029] Here, in particular, in the present invention, upon reception of the input-output system signal for the sequence disposed electrodes along the short side of the semiconductor element is incident on the semiconductor device from the line segment shape of each input-output lines Input / output an input / output system signal to / from one short side electrode via the output buffer circuit , and
Input / output signals are also input / output to / from each of the input / output wirings from the electrode on the other short side via the input / output buffer circuit . still,
Since each input / output wiring is formed in a line segment shape, short-circuiting of the input / output wiring on the same parallel line does not occur.

Therefore, it is possible to cope with the signal coming from either of the short sides of the semiconductor element.

As a result, the electrodes of the semiconductor element are efficiently arranged and the wiring pattern is efficiently arranged, whereby the area of the routing wiring of the semiconductor element can be reduced, and the frame of the liquid crystal display panel can be narrowed to reduce the cost. A semiconductor device capable of achieving the above can be provided.

In order to solve the above-mentioned problems, a semiconductor device according to a third aspect of the present invention includes a rectangular semiconductor element arranged on an outer edge of a liquid crystal display panel for driving the liquid crystal display device. A TCP type semiconductor device in which an electrode for transmitting and receiving an input / output signal for driving a liquid crystal display device and an electrode electrically connected to a liquid crystal display panel are formed along both long sides and both short sides. In the above, the electrodes electrically connected to the liquid crystal display panel are provided on one long side of the semiconductor element, while a part of the electrodes for receiving an input system signal for driving the liquid crystal display device is provided in the semiconductor element. A plurality of elements are arranged side by side along at least one short side of the element, and a plurality of continuous electrodes are provided below or above the electrodes provided on these short sides in parallel with the long sides of the semiconductor element.
The input wirings made of ITO wirings are arranged side by side, and at the time of receiving an input system signal to the electrodes arranged side by side along the short side of the semiconductor element, the input buffer circuit in the semiconductor element is connected from each of the input wirings. It is characterized in that an input system signal is inputted to at least one of the electrodes on the short side of the via .

According to the above-mentioned invention, for the liquid crystal display panel provided on one long side, only the terminal on one long side of the semiconductor element outputs.

On the other hand, most of the electrodes for transmitting and receiving input / output system signals are input from the other long-side terminal of the semiconductor element, but some electrodes are arranged along at least one short side of the semiconductor element. It is arranged.

Further, with respect to the electrodes provided on at least one of the short sides, a plurality of ITO wirings are arranged below or above the electrodes provided on the short sides in parallel with the long sides of the semiconductor element. The input wiring consists of

Therefore, a wiring pattern may be formed parallel to the long side direction on the electrodes arranged side by side along the short side of the semiconductor element. Also, the length of the wiring pattern is
Since there is an input wiring below or above the electrode, it is not necessary to make it long.

From the terminal on the long side of the semiconductor element,
Since it is sufficient to wire parallel to the short side of the semiconductor element toward the liquid crystal display panel provided on one long side of the semiconductor element or the input wiring provided on the other long side of the semiconductor element, the wiring pattern is wasted. And the wiring resistance can be reduced.

Here, in particular, in the present invention, when receiving the input system signal to the electrodes arranged side by side along the short side of the semiconductor element, the input buffer circuit in the semiconductor element is passed from each continuous input wiring. The input system signal is input to at least one of the electrodes on the short side.

Therefore, the input wiring can be formed as a continuous line corresponding to the length of the liquid crystal display panel without being formed in a line segment shape as in the first and second aspects.

As a result, the electrodes of the semiconductor element and the wiring pattern are efficiently arranged, whereby the area of the routing wiring of the semiconductor element can be reduced, which in turn makes the frame of the liquid crystal display panel narrower and reduces the cost. A semiconductor device capable of achieving the above can be provided.

In order to solve the above problems, a semiconductor device according to a fourth aspect of the present invention is the semiconductor device according to the third aspect, wherein a part of an electrode for receiving an input system signal for driving the liquid crystal display device. Are arranged side by side along both short sides of the semiconductor element, and a plurality of ITO wirings continuous in parallel with the long sides of the semiconductor element are provided below or above the electrodes provided on the both short sides. The electrodes for receiving input signals, which are arranged side by side along both short sides of the semiconductor element, are arranged in parallel with each other. Each of the electrodes on the side is sequentially and alternately connected to the input wirings arranged side by side.

According to the above invention, some of the electrodes for receiving the input system signals for driving the liquid crystal display device are arranged side by side along both short sides of the semiconductor element. Also,
Below or above the electrodes provided on both of these short sides, there may be a plurality of ITO wirings continuous in parallel with the long sides of the semiconductor element .
The input wirings are arranged side by side. Further, in the electrodes for receiving the input system signals arranged side by side along both short sides of the semiconductor element, each electrode on one short side and each electrode on the other short side are The input wirings arranged side by side are sequentially and alternately connected.

Therefore, the terminals are provided not only on one short side of the rectangular semiconductor element but also on both short sides thereof. Therefore, since the crimping portions of the wiring to the terminals are provided on both short sides of the semiconductor element, the semiconductor element can be attached to the semiconductor device in a well-balanced manner.

In order to solve the above-mentioned problems, a semiconductor device according to a fifth aspect of the present invention is the semiconductor device according to the fourth aspect , wherein the electrodes on the one short side and the electrodes on the other short side are the same.
The poles are arranged in a zigzag pattern in whole or in part.
It is characterized by.

According to the above-mentioned invention, the short side is aligned with the direction perpendicular to the short side.
So that they do not overlap from the ITO wirings that are sequentially arranged.
In addition, the input system signals are input alternately from both short sides.
Become.

According to a sixth aspect of the present invention, there is provided a semiconductor device according to any one of the first to fourth aspects, wherein each of the electrodes is within a drive circuit element region. It is characterized by being provided in.

According to the above invention, each electrode is provided in the drive circuit element region. Therefore, the area of each electrode can be reduced by the area provided outside the drive circuit element area of the semiconductor element.

As a result, the size of the semiconductor element can be reduced, so that it is possible to provide a semiconductor device in which the frame of the liquid crystal display panel can be narrowed and the cost can be reduced.

According to a seventh aspect of the present invention, there is provided a semiconductor device as described above.
In order to solve the problem, a semiconductor device according to claim 6 is provided.
In the drive circuit element region, the semiconductor element and the substrate are
Spacer electrode serving as a support base provided between the
It is characterized by

According to the above invention, the base material is a semiconductor element.
Preventing damage to semiconductor devices due to contact
You can

In order to solve the above-mentioned problems, a semiconductor device according to an eighth aspect of the present invention is the semiconductor device according to any one of the first to sixth aspects, wherein the semiconductor devices are arranged along the long side of the semiconductor element. The electrodes for transmitting and receiving the input / output system signals are connected to the input / output wirings provided on the substrate or the substrate wirings as the input wirings, and are arranged side by side along the short sides of the semiconductor element. The electrode is connected to an input / output wiring or an ITO wiring as an input wiring arranged outside the substrate.

According to the above invention, the electrodes for transmitting and receiving the input / output system signals arranged side by side along the long side of the semiconductor element are the input / output wiring arranged on the substrate or the substrate serving as the input wiring. Connected to the wiring. On the other hand, the electrodes arranged side by side along the short sides of the semiconductor element are ITO as an input / output wiring or an input wiring arranged outside the substrate.
Connected to the wiring.

That is, without using the input / output wiring or the input wiring arranged on the substrate for the electrodes on the short side, the ITO wiring on the glass panel arranged outside the substrate is used. As a result, the substrate wiring area can be reduced.

As a result, it is possible to provide a semiconductor device in which the frame of the liquid crystal display panel can be narrowed and the cost can be reduced.

In order to solve the above-mentioned problems, a semiconductor device according to a ninth aspect of the present invention is the semiconductor device according to any one of the first to sixth aspects, in which the semiconductor devices are arranged along a long side of the semiconductor element. Both the provided electrodes for transmitting / receiving input / output system signals and the electrodes arranged side by side along the short side of the semiconductor element should be connected to the input / output wiring or the input wiring arranged on the substrate. Is characterized by.

According to the above invention, since the short side of the semiconductor element is connected to the input / output wiring or the input wiring arranged on the substrate in parallel, the short side of the semiconductor element is changed to the long side. The board width can be reduced as compared with the case where the wiring is bypassed and connected to the input / output wiring or the input wiring.

As a result, it is possible to provide a semiconductor device in which the frame of the liquid crystal display panel can be narrowed and the cost can be reduced.

[0058]

BEST MODE FOR CARRYING OUT THE INVENTION [First Embodiment] The following will describe one embodiment of the present invention with reference to FIGS. 1 to 5.

In the tape carrier package (hereinafter referred to as "TCP") 1 as the semiconductor device of the present embodiment, as shown in FIG. 2, in a device hole 2 formed in a rectangular shape at the center, A semiconductor element 3 which is an elongated rectangular chip is mounted.

The semiconductor element 3 functions as a liquid crystal driver for driving a liquid crystal display device (not shown). That is, the TCP 1 is mounted on a liquid crystal display device (not shown) after mounting the semiconductor element 3. This is the same as the conventional one.

On the surface of the semiconductor element 3, a large number of electrode pads 10 ... Are formed along both long sides and both short sides of the rectangle.

Gold bumps (Bumps) (not shown) are formed on the electrode pads 10 by plating. The height and size of the gold bumps vary depending on the bump pitch,
The bump size is, for example, 40 to 90 μm, and the bump height is 10 to 20 μm.

As shown in FIG. 3, Y1 to Y1 are formed on the one long side of the semiconductor element 3 in the electrode pads 10 ...
240 Y240 drive output terminals 11 are provided as electrodes electrically connected to the liquid crystal display panel, and a plurality of input terminals 12 and power supply terminals 13 are provided on the other long side. It is provided.

Further, the electrode pads 10 are provided with a plurality of input system terminals 14 arranged in a row on the short side (A side) on the left side in the figure, and the short side on the right side in the figure. On the side (B side), a plurality of output system terminals 15 ... Are similarly arranged in one row.

That is, the electrode pads 10 are composed of these drive output terminals 11 ... Input terminals 12 ... Power supply terminals 13 ... Input system terminals 14 ...

Electrode pad 10 in semiconductor element 3
A drive circuit element region 20 is provided on the inner side of the drive circuit element region 20. The drive circuit element region 20 is composed of a plurality of circuit cells, as shown in FIG.

That is, in the drive circuit element region 20, the same number of driver buffer control circuits 21 and driver buffers 22 and 22 as the drive output terminals 11 of the liquid crystal driver.
And output terminal ESD protection element 23, and data line latch circuits 24, 24 for holding serial data.
And a control circuit 25 for controlling data, etc.
An input buffer circuit 26, 26 for shaping the waveform of a signal input from the input terminal 12, an output buffer circuit 27 connected by the input buffer circuit 26, 26 and aluminum wiring, and an input terminal ESD. Protection element 2
8 and 28 and an ESD protection element 29 for liquid crystal power supply are provided. This configuration and its arrangement are examples,
It is not necessarily limited to this.

By the way, as shown in FIG. 2, in the present embodiment, the 240 driving output terminals 11 of Y1 to Y240 arranged on one long side of the semiconductor element 3 are
While being connected to the glass upper electrode of the liquid crystal display device (not shown) through the inner lead wirings 11a, the plurality of input terminals 12 ...
As shown in FIG. 1, it is connected to board wirings 4a ... Arranged on a board 4 such as a printed board or a flexible board.

On the other hand, the plurality of input system terminals 14 arranged on the left short side of the semiconductor element 3 shown in FIG.
In the figure, from the A side, ITO wirings 5a as input / output wirings on the glass panel 5 provided below the input system terminals 14 shown in FIG. 1 are connected. The ITO wirings 5a ... Are provided below the input system terminals 14, ... However, the present invention is not limited to this. For example, the input system terminals 14 ...
It is also possible to provide above. Further, although the ITO wirings 5a ... Are used in the present embodiment, the present invention is not limited to this, and it is also possible to use, for example, ordinary metal wirings.

The ITO wiring 5a and the input system terminals 14 ...
Are connected by the ITO wirings 5a ... Contacting each pin of the TCP1 (not shown) connected to each of the input system terminals 14.

Then, the input signal is output from the B side through the output system terminals 15 shown in FIG. 2 and passes through the ITO wirings 5a on the glass panel 5 shown in FIG.
It is connected to the semiconductor element 3 in CP1.

That is, as shown in FIG. 2, the input signal input from the A side is the inner lead wiring 14 on the TCP 1.
a, the bumps of the input system terminals 14 and the like, and wiring such as aluminum wiring (not shown) in the semiconductor element 3 to the input buffer circuits 26, 26 shown in FIG. Is driven. The input buffer circuits 26, 26 drive transistors (not shown) of the control circuits 25, 25 and the output buffer circuit 27, which are connected thereafter by wiring such as aluminum wiring. Further, the output buffer circuit 27 outputs to the B side via wiring such as aluminum wiring (not shown), bumps of the output system terminals 15 shown in FIG. 2, and inner lead wiring 15a on the TCP1. As shown in FIG. 1, this output signal is connected to the semiconductor element 3 in the next TCP 1 via the ITO wirings 5a, etc. on the glass panel 5, and drives the next semiconductor element 3. The ITO wiring 5a ...
The connection via TCP etc. is TCP1 on the output side and TC on the input side.
The connection is made only by the difference from P1. That is,
In the present embodiment, the ITO wirings 5a ...
On the lower side of 1, the input signal and the output signal are not short-circuited because they are discontinuous in the form of a line segment.

In the above description, the input is made from the A side and output to the B side, but the present invention is not limited to this, and the input may be made from the B side and output to the A side.
If input from B side and output to A side,
The positions of the input buffer circuit 26 and the output buffer circuit 27 are exchanged.

As a result, a plurality of input system terminals 14 ... Are arranged also on the short side, and especially the input system terminals 14 ... On the short side are the board wiring 4a of the board 4 such as a flexible board or a printed board.
, And the plurality of input terminals 2 and power supply terminals 3 arranged on one long side of the semiconductor element 3 via the TCP wiring 1 and the semiconductor element 3 via the ITO wiring 5a on the glass panel. The board wiring 4a of the board 4 connected to the board 4 can be reduced in wiring area and the wiring resistance of the board 4 can be reduced.

Further, the ITO wirings 5a have a higher resistance than the aluminum wirings, but since the ITO wirings are discontinued for each TCP, a low resistance is possible.

As described above, in the TCP 1 of this embodiment, the driving output terminals 11 ... Which are electrically connected to the liquid crystal display panel (not shown) are provided on one long side of the semiconductor element 3. On the other hand, an input system terminal 14 ... And an output system terminal 1 for transmitting and receiving input / output system signals for driving the liquid crystal display device.
5 are arranged side by side along the short side of the semiconductor element 3.

Further, the semiconductor element 3 is provided below the input system terminals 14 and the output system terminals 15 provided on these short sides.
A plurality of line-segment-shaped ITO wirings 5a ... Are arranged side by side in parallel with the long sides of the.

When the input / output system signals are transmitted / received to / from the input system terminals 14 and the output system terminals 15 arranged side by side along the short side of the semiconductor element 3, the ITO wiring 5a is used.
From the output element terminal 15 on the other short side of the semiconductor element 3 to the ITO wiring 5a. Is output.

That is, conventionally, from the electrodes provided on the long side and the short side of the rectangular semiconductor element to the liquid crystal display panel provided on the long side of the semiconductor element and the substrate provided on the other long side. Since it was connected to the input / output wiring of, the wiring area from the terminal provided on the short side of the semiconductor element requires an area,
There has been a problem that the area of the TCP1 becomes large and the cost increases accordingly, and it is difficult to narrow the frame of the liquid crystal display panel.

However, in the present embodiment, the semiconductor element 3 is used for the liquid crystal display panel provided on one long side.
Is output only from the drive output terminals 11 ...

On the other hand, most of the electrodes for receiving an input or a power source have, for example, the input terminal 12 on the other long side of the semiconductor element 3.
, And the power supply terminal 13, etc., but the input system terminal 14 ... And the output system terminal 15 ...
The semiconductor elements 3 are arranged side by side along the short side.

Further, with respect to the input system terminals 14 provided on these short sides, the input system terminals 14 provided on the short side are provided.
Input / output is performed by a plurality of ITO wirings 5a arranged in a line segment parallel to the long side of the semiconductor element 3 below.

Therefore, the input system terminals 14 and the output system terminals 15 arranged side by side along the short side of the semiconductor element 3 may be provided with a wiring pattern parallel to the long side direction. Further, the length of the wiring pattern does not need to be long because the ITO wirings 5a are located below the input system terminals 14 and the output system terminals 15. Specifically, adjacent TCP
The ITO wirings 5a are arranged only between 1 and TCP1.

Further, from the long side of the semiconductor element 3 toward the liquid crystal display panel provided on one long side of the semiconductor element 3 or the board wirings 4a of the substrate 4 provided on the other long side of the semiconductor element 3. Since it is sufficient to wire in parallel with the short side of the semiconductor element 3, the wiring pattern is not wasted and the wiring resistance can be reduced.

Here, in particular, in the present embodiment, when the input / output system signals are transmitted / received to / from the electrodes arranged side by side along the short side of the semiconductor element 3, each ITO wiring 5 in the shape of a line segment is used.
The input system signal is input from a to the input system terminals 14 on one short side of the semiconductor element 3, and the ITO wirings 5a ... From the output system terminals 15 on the other short side of the semiconductor element 3.
The output system signal is output to. In addition, each ITO wiring 5a ...
Since they are formed in line segments, short-circuiting of each ITO wiring 5a on the same parallel line does not occur.

Therefore, the input system terminals 14 on one short side of the semiconductor element 3 are input and the output system terminals 15 on the other short side of the semiconductor element 3 are output to the next adjacent semiconductor element 3. .. can be input to the input system terminals 14 on one short side, the wiring between the adjacent TCP1 and TCP1 can be efficiently performed.

As a result, the electrode arrangement and the wiring pattern of the semiconductor element 3 are efficiently performed, whereby the area of the leading wiring of the semiconductor element 3 can be reduced, and the frame of the liquid crystal display panel can be narrowed. It is possible to provide the TCP1 that can reduce the cost.

Further, in the TCP 1 of the present embodiment, the input terminals 12 ... And the power supply terminals 13 ... Which are arranged side by side along the long side of the semiconductor element 3 for receiving an input and a power supply are arranged on the substrate 4. Are connected to the board wirings 4a ... On the other hand, the input system terminals 14 and the output system terminals 15 arranged side by side along the short side of the semiconductor element 3.
Are connected to the ITO wiring 5a arranged outside the substrate 4.

That is, the board wiring 4a arranged on the board 4 for the input side terminals 14 and the output side terminals 15 on the short side.
The glass panel 5 disposed outside the substrate 4 without using the ...
By passing through the upper ITO wirings 5a, it is possible to reduce the area of the substrate wirings 4a.

As a result, the frame of the liquid crystal display panel can be narrowed, and the TCP1 capable of reducing the cost can be provided.

In the above description, the semiconductor element 3
Of the input system terminals 14 on the short side of the glass panel 5 without using the substrate 4 such as a flexible wiring board or a printed circuit board.
The input signal is transmitted and received through the semiconductor element 3 of the TCP 1 via the TO wiring 5a ... However, the present invention is not limited to this, and as shown in FIG. 5, the board wiring 4 arranged on the board 4 such as a flexible wiring board or a printed board.
The same effect can be obtained by using a ...

Further, this makes it possible to reduce the wiring area of the substrate 4 such as a flexible wiring board or a printed circuit board.

As described above, by connecting in parallel to the short side of the semiconductor element 3 to the board wirings 4a arranged on the substrate 4, the short side of the semiconductor element 3 is diverted to the long side. The width of the substrate 4 can be reduced as compared with the case where it is routed and connected to the substrate wiring 4a.

As a result, it is possible to provide the TCP1 capable of reducing the cost by reducing the frame size of the liquid crystal display panel.

Further, in the TCP 1 of the present embodiment, in order to transmit / receive the input / output signals for driving the liquid crystal display device, the drive circuit element region 20 has an input buffer on one short side of the semiconductor element 3. The circuit 26 is provided, and the output buffer circuit 27 is provided on the other short side.

Therefore, the wiring pattern can be efficiently formed in the drive circuit element region 20.

[Second Embodiment] The following will describe another embodiment of the present invention in reference to FIGS. 6 to 8. For convenience of explanation, members having the same functions as the members shown in the drawings of the first embodiment will be designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 6, the semiconductor element 30 mounted on the TCP 1 of the present embodiment is provided with the input / output system terminals 34 ... On both short sides. The input buffer circuit 26 and the output buffer circuit 27 shown in the first embodiment are replaced by the input / output buffer circuits 31 and 31, respectively.

Each of the input / output buffer circuits 31 and 31 has an input buffer circuit 26 on one side depending on the direction of the input signal.
, The other side serves as the output buffer circuit 27. Further, it is possible to set which is to be the input buffer circuit 26 or the output buffer circuit 27 from the outside of the semiconductor element 30 depending on from which direction the signal is sent.

TCP1 on which the above-mentioned semiconductor element 30 is mounted
A plan view in the case of mounting a plurality of is shown in FIG. 7 or FIG.

The plan view of the semiconductor element 30 mounted on the TCP1 is the same as that shown in FIG.

As described above, in the semiconductor element 30 of the TCP1 of the present embodiment, the input / output system terminals 34 ... Which transmit / receive the input / output system signals for driving the liquid crystal display device are provided on both short sides of the semiconductor element 30. Are arranged side by side along the short sides and the input / output terminals 34 ...
A plurality of line-shaped ITO wirings 5a ... Are arranged side by side in parallel with the long side of the semiconductor element 30. Then, the input / output system terminals 3 arranged side by side along the short side of the semiconductor element 30.
When sending / receiving input / output system signals to / from each IT
Input / output system signals from the O wirings 5a to the input / output system terminals 34 on one short side of the semiconductor element 30 and also from the input / output system terminals 34 on the other short side of the semiconductor element 30. Input / output signals are input / output to / from each ITO wiring 5a.
In this case, one of the input / output terminals 34 on the short side serves as the input terminal 14, and the input / output terminal 34 on the other short side serves as the output terminal 15. Will be fulfilled.

Since each of the ITO wirings 5a ... Is formed in the shape of a line segment, no short circuit of the ITO wirings 5a.

Therefore, it is possible to cope with the signal coming from either of the short sides of the semiconductor element 30.

As a result, the electrode arrangement and the wiring pattern of the semiconductor element 30 are efficiently performed, whereby the area of the leading wiring of the semiconductor element 30 can be reduced, and the frame of the liquid crystal display panel can be narrowed. It is possible to provide the TCP1 that can reduce the cost.

Further, in the TCP 1 of the present embodiment, the input / output buffer circuit is provided on the short side of the semiconductor element 30 in the drive circuit element region 20 in order to transmit / receive the input / output signals for driving the liquid crystal display device. 31 and 31 are respectively provided, and the input / output buffer circuits 31 and 31 are configured to perform transmission / reception of input / output signals by low wiring resistance. That is, the ITO wirings 5a ... Have a higher resistance than the aluminum wirings or the like, but the ITO wirings 5a ..

Therefore, the wiring pattern can be efficiently formed in the drive circuit element region 20, and
Signals can be input and output efficiently.

[Third Embodiment] The following will describe another embodiment of the present invention in reference to FIGS. 9 and 10. For convenience of explanation, members having the same functions as the members shown in the drawings of the first and second embodiments will be designated by the same reference numerals and the description thereof will be omitted.

In the first and second embodiments,
Semiconductor element 3 and semiconductor element 30 mounted on TCP1
The electrode pad 10 was provided in the periphery of, and the drive circuit element region 20 was formed in the electrode pad 10.

In the semiconductor element 40 mounted on the TCP 1 of the present embodiment, as shown in FIG. 9, the electrode pad 10 is provided inside the drive circuit element region 20.

This method is commonly called an inner pad method, and as shown in FIG. 10 (and FIG. 13 described later),
The device hole 2 is smaller than the semiconductor element 40.

As a result, the area is reduced by the area of the electrode pad 10, so that the semiconductor element 40 can be downsized.

Since the sum of the area of the semiconductor element 40 and the encapsulating resin area can be reduced accordingly, the outer dimensions of the TCP1 can be minimized.

As described above, in the TCP 1 of the present embodiment, the electrode pads 10 ... Are provided inside the drive circuit element region 20 in the semiconductor element 40.

Therefore, the area of each electrode pad 10 ... Can be reduced by the area provided outside the drive circuit element area 20 in the semiconductor element 40.

As a result, the size of the semiconductor element 40 can be reduced, so that the frame of the liquid crystal display panel can be narrowed, and the TCP1 can be provided in which the cost can be reduced.

[Fourth Embodiment] The following will describe another embodiment of the present invention in reference to FIGS. 11 to 13. For convenience of explanation, members having the same functions as those shown in the drawings of the first to third embodiments are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIGS. 11 and 12, in the semiconductor element 50 mounted on the TCP 1 of the present embodiment, the electrode pad 10 is provided inside the drive circuit element region 20 as in the third embodiment. It is a thing.

However, in the semiconductor element 50 of the present embodiment, the spacer electrode pads 51 ... Are arranged outside the electrode pad 10.

That is, as shown in FIG.
0 is provided on the lower side of the base material 1a of the TCP 1, and the inner lead wirings 11a, 12a, 13a are connected to the electrode pads 10 such as the driving output terminals 11 ... And the input terminals 12 ... Through the device holes 2 which are openings. Connected. And
Regarding the part of the device hole 2, the semiconductor element 5
It is sealed with a resin 2a to shield light from 0.

At this time, this spacer electrode pad 51
When there is no ..., The base material 1a of TCP1 is the semiconductor element 5
There is a risk that the semiconductor element 50 may be damaged by contact with 0, and that the functional element may be disconnected, leak current may occur, or short circuit may occur.

Therefore, the spacer electrode pad 51 is used as a support between the semiconductor element 50 and the base material 1a of the TCP1.
By providing ..., It is possible to prevent the contact of the base member 1a of the TCP1 with the semiconductor element 50. Thereby, the damage to the semiconductor element 50 described above can be prevented.

The base material 1a of the TCP1 is the semiconductor element 5
When it contacts 0, the resin 2a may not sufficiently spread between the semiconductor element 50 and the base material 1a, and as a result, the semiconductor element 50 may not be completely sealed.

However, when the spacer electrode pads 51 ... Are provided, a space is secured between the base material 1a and the semiconductor element 50, and the resin 2a is sufficiently distributed, so that the semiconductor element 50 is completely covered. Since it can be covered, there is an effect that the resin 2a for light shielding can be completely sealed.

As described above, in the TCP 1 of this embodiment, the electrode pad 10 is provided inside the drive circuit element region 20 in the semiconductor element 50, and inside the drive circuit element region 20 outside the electrode pad 10. The electrode pads 51 for spacers are further arranged along the above.

As a result, it is possible to prevent the base material 1a of the TCP1 from coming into contact with the semiconductor element 50 and prevent the semiconductor element 50 from being damaged, and the semiconductor element 50 is sealed with the resin 2a for shielding light. Can be done completely.

[Fifth Embodiment] The following will describe another embodiment of the present invention with reference to FIGS. 14 to 20. For convenience of explanation, members having the same functions as those shown in the drawings of the first to fourth embodiments will be designated by the same reference numerals and the description thereof will be omitted.

In the first to fourth embodiments, each ITO wiring 5a ... Is formed in a line segment shape.

However, in the present embodiment, as shown in FIG. 14, each ITO wiring 65a on the glass panel 5 is
It is formed so as to be continuous in parallel to the longitudinal direction of the substrate 4, and an input system signal such as an image signal is passed through each ITO wiring 65a.

In the TCP1 of this embodiment, the input system signals are input from both short sides of the semiconductor element 60.

That is, in the semiconductor element 60 mounted on the TCP1 of this embodiment, as shown in FIG. 15, the electrode pads 61 of the input system terminals 64 are provided on both the A side and the B side. The arrangement is as shown in FIG.
The input system terminals 64a on the A side and the input system terminals 64b on the B side are alternately arranged in a zigzag pattern.

That is, the input system terminals 64a on the A side and the input system terminals 64 on the B side are parallel to each other along the shorter side of the semiconductor element 60.
are alternately arranged so that the input system terminals 64a provided on the A side and the input system terminals 64b provided on the B side are not located on the same parallel line of the long side. ing. As a result, the input system signals are alternately input from both short sides so that the ITO wirings 65a, which are sequentially arranged along the direction perpendicular to the short sides, do not overlap.

Specifically, as shown in FIG. 14, the odd-numbered ITO wirings 65a are connected to the input side terminals 64a on the left side of the semiconductor element 60, and the columns are connected to the semiconductor element 6.
The even-numbered ITO wirings 65a ... Are connected to the input side terminals 64b ..

However, the present invention is not limited to this, and the input system terminals 64a on the left side on the short side are even-numbered ITO wirings 65a.
, And the input system terminals 64b on the short side on the right side are connected to the odd-numbered ITO wirings 65a.

As described above, in order to correspond to the input signals from the input system terminals 64 on both sides of the semiconductor element 60, in the drive circuit element region 20 provided in the semiconductor element 60 of the present embodiment, FIG. 4, the input buffer circuit 26 is provided on the B side as compared with the one shown in FIG.

In the above description, the semiconductor element 6 is used.
The input terminals 64 on the short side of 0 are not connected to the substrate 4 such as a flexible wiring board or a printed circuit board but via the ITO wirings 5a on the glass panel 5 and the like, and the semiconductor element 6 of the TCP1.
The input system signal is received via 0. However, the present invention is not limited to this, and as shown in FIG. 18, even if only the substrate 4 such as the flexible wiring board or the printed circuit board is used, as described in the first embodiment, the flexible wiring board or the printed circuit board or the like is not used. The wiring area of the substrate 4 can be reduced. In this case, the board wiring 4 on the board 4
The input is made with a ...

Further, in the above-described semiconductor element 60, the electrode pads 61 ... Are arranged in a zigzag pattern in which the short sides on the left and right of the semiconductor element 60 are alternately zigzag, but the invention is not limited to this. It can be partially arranged in a zigzag at an appropriate position.

As described above, in the TCP1 of the present embodiment, the input system terminals 64 for receiving the input system signals for driving the liquid crystal display device are arranged side by side along both short sides of the semiconductor element 60. It Further, the semiconductor element 60 is provided below the input system terminals 64 ...
IT as a plurality of input wiring that is continuous in parallel with the long side of
The O wirings 65a are arranged side by side. In addition, the semiconductor element 6
The input system terminals 64, which are arranged side by side along both short sides of 0, are the input system terminals 64a on one short side and the input system terminals 64b on the other short side. But,
The ITO wirings 65a arranged side by side are sequentially and alternately connected.

Therefore, the electrode pads 6 are formed not only on one short side of the rectangular semiconductor element 60 but also on both short sides.
1 ... is provided. Therefore, the wiring electrode pads 61 ...
Since the pressure-bonding portions for the semiconductor element 60 are provided on both short sides of the semiconductor element 60, the semiconductor element 60 can be attached to the TCP1 in a well-balanced manner as compared with the case where it is provided on one short side.

In this embodiment, the ITO wiring 65 is also used.
are formed as continuous lines corresponding to the length of the liquid crystal display panel, rather than being formed as line segments that are interrupted like the ITO wirings 5a.

As a result, the electrode pad 6 of the semiconductor element 60 is
The arrangement 1 and the wiring pattern are efficiently performed, whereby the area of the leading wiring of the semiconductor element 60 can be reduced, and by extension, the frame of the liquid crystal display panel can be narrowed, and the TCP1 capable of reducing the cost can be provided. be able to.

Further, in the TCP1 of the present embodiment, each input system terminal 64a on one short side of the semiconductor element 60.
Are connected to odd lines in the ITO wiring 65a,
Each of the input terminals 64b on the other short side is connected to the ITO wiring 6
5a ... Is connected to the even lines.

Therefore, it is possible to keep the left-right balance uniform.

In the present embodiment, the input system terminals 64 are provided on both short sides of the semiconductor element 60, and the input is alternately made from the ITO wirings 65a. However, the present invention is not limited to this. For example, as shown in FIGS. 19 and 20, it is possible to provide the input system terminals 64 ... On at least one short side of the semiconductor element 70.

By this, the continuous ITO wiring 65 is also formed.
Since the input system signals can be input from a ... Or the substrate wiring 4a ..., The wiring patterns of the ITO wiring 65a ... And the substrate wiring 4a.

[Sixth Embodiment] The following will describe another embodiment of the present invention in reference to FIGS. 21 and 22. For convenience of explanation, members having the same functions as those shown in the drawings of the first to fifth embodiments are designated by the same reference numerals and the description thereof will be omitted.

In this embodiment, as in the fifth embodiment, the electrode pads 81 are formed in a zigzag pattern. As shown in FIG. 21, as in the third embodiment, the drive circuit element region is formed. 20 is provided with electrode pads 81 ... Inside the pad structure.

That is, the semiconductor element 80 of the present embodiment has a structure in which the device hole 2 is smaller than the semiconductor element 60, as shown in FIG.

As a result, the area is reduced by the area corresponding to the electrode pads 61, and the semiconductor element 80 can be miniaturized.

Since the sum of the area of the semiconductor element 80 and the sealing resin area can be reduced accordingly, the outer dimension of the TCP1 can be minimized.

[0151]

As described above, in the TCP semiconductor device according to the first aspect of the present invention, the electrode electrically connected to the liquid crystal display panel is one long side of the semiconductor element. On the other hand, a part of the electrodes for transmitting and receiving the input / output system signals for driving the liquid crystal display device are arranged side by side along the short sides of the semiconductor element and provided on these short sides. Input / output wirings composed of a plurality of line-shaped ITO wirings are arranged in parallel below or above the electrodes in parallel with the long sides of the semiconductor element, and the electrodes arranged along the short sides of the semiconductor element. input buffer upon reception of the input-output system signal, in the semiconductor device from above input-output lines for
The input system signal is input to the electrode on the one short side through the circuit, and the output system signal is output to the input / output wiring from the electrode on the other short side via the output buffer circuit of the semiconductor element. It is a thing.

Therefore, the electrodes arranged side by side along the short side of the semiconductor element may be provided with a wiring pattern parallel to the long side direction. Further, the length of the wiring pattern does not need to be long because the input / output wiring is located below or above the electrodes.

From the long side of the semiconductor element, the semiconductor element is moved toward the liquid crystal display panel provided on one long side of the semiconductor element and the input / output wiring provided on the other long side. Since wiring may be made parallel to the short side, there is no waste in the wiring pattern and the wiring resistance can be reduced.

Further, in particular, in the present invention, when transmitting / receiving an input / output system signal to / from electrodes arranged side by side along the short side of the semiconductor element, each input / output wiring in a line segment form an input buffer in the semiconductor element. The input system signal is input to the electrode on the short side on one side through the circuit , and the output back
An output system signal is output from the other short-side electrode via the delay circuit to each of the input / output wirings. Since each input / output wiring is formed in the shape of a line segment, short-circuiting of the input / output wiring on the same parallel line does not occur.

Therefore, input is made from the electrode on one short side of the semiconductor element, output from the electrode on the other short side of the semiconductor element, and input to the electrode on the short side of the next adjacent semiconductor element. Therefore, the wiring between the adjacent semiconductor elements can be efficiently performed.

As a result, the electrodes of the semiconductor element and the wiring pattern are efficiently arranged, whereby the area of the routing wiring of the semiconductor element can be reduced, which in turn makes the frame of the liquid crystal display panel narrower and reduces the cost. There is an effect that a semiconductor device capable of achieving the above can be provided.

As described above, in the TCP type semiconductor device of the invention according to claim 2, the electrode electrically connected to the liquid crystal display panel is provided on one long side of the semiconductor element, and Some of the electrodes for transmitting and receiving input / output system signals for driving the device are arranged side by side along the short sides of the semiconductor element, and the semiconductor element is provided below or above the electrodes provided on these short sides. Input / output wirings composed of a plurality of line-shaped ITO wirings are arranged in parallel to the long sides of the above. When transmitting / receiving an input / output system signal to / from electrodes arranged side by side along the short side of the semiconductor element, , Input / output buffer circuit in the semiconductor device from each of the input / output wirings
I / O system signals are input / output to / from the electrodes on one short side through the input / output system to the above-mentioned input / output wirings from the electrodes on the other short side via the input / output buffer circuit of the semiconductor element. It inputs and outputs signals.

[0158] Therefore, upon reception of the input-output system signal for the sequence disposed electrodes along the short side of the semiconductor element is incident on the semiconductor device from the line segment shape of each input-output lines
Input and output input-output system signal to one of the short side electrode through the output buffer circuit, and output buffer times of the semiconductor element
Input / output signals are also input / output to / from each of the input / output wirings from the other electrode on the short side of the path . Since each input / output wiring is formed in the shape of a line segment, short-circuiting of the input / output wiring on the same parallel line does not occur.

Therefore, it is possible to cope with the signal coming from either of the short sides of the semiconductor element.

As a result, the electrode arrangement and the wiring pattern of the semiconductor element are efficiently performed, whereby the area of the routing wiring of the semiconductor element can be reduced, and the frame of the liquid crystal display panel can be narrowed to reduce the cost. There is an effect that a semiconductor device capable of achieving the above can be provided.

In the TCP type semiconductor device according to the third aspect of the present invention, as described above, the electrode electrically connected to the liquid crystal display panel is provided on one long side of the semiconductor element, while the liquid crystal display device is provided. A part of the electrodes for receiving an input system signal for driving the device are arranged side by side along at least one short side of the semiconductor element, and below or above the electrodes provided on these short sides. Input wirings composed of a plurality of ITO wirings continuous in parallel with the long side of the semiconductor element are arranged side by side, and when receiving an input system signal for the electrodes arranged side by side along the short side of the semiconductor element, From each input wiring to the input buffer circuit in the semiconductor device
An input system signal is input to at least one of the electrodes on the short side of the path .

Therefore, when receiving an input system signal for the electrodes arranged side by side along the short side of the semiconductor element,
From each continuous input wiring, the input
The input system signal is input to at least one of the electrodes on the short side via the circuit .

Therefore, the input wiring can be formed as a continuous line corresponding to the length of the liquid crystal display panel without being formed in a line segment shape as in the first and second aspects.

As a result, the electrodes of the semiconductor element and the wiring pattern are efficiently arranged, whereby the area of the routing wiring of the semiconductor element can be reduced, which in turn narrows the frame of the liquid crystal display panel and reduces the cost. There is an effect that a semiconductor device capable of achieving the above can be provided.

As described above, the semiconductor device of the invention according to claim 4 is the semiconductor device according to claim 3, wherein a part of an electrode for receiving an input system signal for driving the liquid crystal display device is the semiconductor device. For input, which is arranged along both short sides of the device, and which is composed of a plurality of ITO wirings continuous in parallel with the long sides of the semiconductor device below or above the electrodes provided on both of these short sides. The electrodes, which are arranged side by side and arranged along both short sides of the semiconductor element, for receiving an input system signal, have electrodes on one short side and the other short side. The respective electrodes are sequentially and alternately connected to the input wirings arranged side by side.

Therefore, the terminals are provided not only on one short side of the rectangular semiconductor element but also on both short sides. Therefore, since the crimping portions of the wiring to the terminals are provided on both short sides of the semiconductor element, the semiconductor element can be mounted on the semiconductor device in a well-balanced manner.

In order to solve the above-mentioned problems, a semiconductor device according to a fifth aspect of the present invention is the semiconductor device according to the fourth aspect, wherein each electrode on the one short side and each electrode on the other short side are the same.
The poles are arranged in a zigzag pattern in whole or in part
Of.

Therefore, the short sides are sequentially arranged along the direction perpendicular to each other.
Both short sides so that they do not overlap sequentially from the lined ITO wiring
It is said that the input system signals will be alternately input from the side
Produce an effect.

As described above, the semiconductor device according to a sixth aspect of the present invention is the semiconductor device according to any one of the first to fourth aspects, wherein the electrodes are provided in the drive circuit element region. It is what

Therefore, the area can be reduced by the area where each electrode is provided outside the drive circuit element area in the semiconductor element.

As a result, the size of the semiconductor element can be reduced, so that it is possible to provide a semiconductor device in which the frame of the liquid crystal display panel can be narrowed and the cost can be reduced.

The semiconductor device of the invention according to claim 7 is the above.
The semiconductor device according to claim 6, wherein
Within the dynamic circuit element area, there is a support between the semiconductor element and the substrate.
It has a spacer electrode as a pedestal
is there.

Therefore, the base material should not come into contact with the semiconductor element.
It is possible to prevent damage to the semiconductor element due to
Has the effect.

As described above, the semiconductor device of the invention according to claim 8 is the semiconductor device according to any one of claims 1 to 6 , wherein the semiconductor devices are arranged side by side along the long side of the semiconductor element. The electrodes for transmitting and receiving the input / output system signals are connected to the input / output wirings or the substrate wirings as the input wirings arranged on the substrate, while the electrodes arranged side by side along the short side of the semiconductor element are The wiring is connected to an input / output wiring arranged outside the substrate or an ITO wiring as an input wiring.

Therefore, the input / output wiring or the input wiring arranged on the substrate is not used for the electrode on the short side, but the ITO wiring on the glass panel is arranged outside the substrate. By doing so, the substrate wiring area can be reduced.

As a result, the effect that the frame of the liquid crystal display panel can be narrowed and the semiconductor device capable of reducing the cost can be provided.

As described above, the semiconductor device of the present invention according to claim 9 is the semiconductor device according to any one of claims 1 to 6 , wherein the semiconductor devices are arranged side by side along the long side of the semiconductor element. Both the electrode for transmitting and receiving the input / output system signal and the electrode arranged side by side along the short side of the semiconductor element are connected to the input / output wiring or the input wiring arranged on the substrate.

Therefore, since the short side of the semiconductor element is connected in parallel to the input / output wiring or the input wiring arranged on the substrate, the semiconductor element is detoured from the short side to the long side. The board width can be reduced as compared with connecting to the output wiring or the input wiring.

As a result, it is possible to provide a semiconductor device in which the frame of the liquid crystal display panel can be narrowed and the cost can be reduced.

[Brief description of drawings]

FIG. 1 shows an embodiment of a semiconductor device according to the present invention, and is a plan view showing a state where input system terminals are connected to a substrate and a glass panel in a plurality of semiconductor devices.

FIG. 2 is a plan view showing a configuration of the semiconductor device.

FIG. 3 is a plan view showing a configuration of a semiconductor element in the semiconductor device.

FIG. 4 is a plan view showing in detail an internal configuration of a drive circuit element region in the semiconductor element.

FIG. 5 is a plan view showing a state in which input system terminals are connected only to a substrate in the plurality of semiconductor devices.

FIG. 6 shows another embodiment of the semiconductor device according to the present invention, and is a plan view showing in detail the internal configuration of the drive circuit element region in the semiconductor element.

FIG. 7 is a plan view showing a state in which input terminals are connected to a substrate and a glass panel in a plurality of the semiconductor devices.

FIG. 8 is a plan view showing a state in which input system terminals are connected only to a substrate in the plurality of semiconductor devices.

FIG. 9 shows still another embodiment of the semiconductor device according to the present invention, and is a plan view showing a semiconductor element having electrode pads formed inside a drive circuit element region.

FIG. 10 is a plan view showing a semiconductor device on which the semiconductor element is mounted.

FIG. 11 shows still another embodiment of the semiconductor device according to the present invention, and is a plan view showing a semiconductor element in which a spacer electrode pad is provided outside an electrode pad.

FIG. 12 is a plan view showing a semiconductor device on which the semiconductor element is mounted.

FIG. 13 is a sectional view showing a semiconductor device on which the semiconductor element is mounted.

FIG. 14 shows still another embodiment of the semiconductor device according to the present invention, in which the input system terminals are provided on both sides along the short side, and the input system terminals are connected to the short sides on both sides. FIG. 7 is a plan view showing a state in which input system terminals are connected to a substrate and a glass panel in a plurality of semiconductor devices mounted with semiconductor elements that are alternately connected on the side.

FIG. 15 is a plan view showing the semiconductor element.

FIG. 16 is a main-portion plan view showing an enlarged connection state of input system terminals in the semiconductor element.

FIG. 17 is a plan view showing in detail the internal configuration of a drive circuit element region in the semiconductor element.

FIG. 18 is a plan view showing a state in which input system terminals are connected only to a substrate in a plurality of semiconductor devices mounted with the semiconductor element.

FIG. 19 shows a modification of the semiconductor device,
FIG. 3 is a plan view showing a state in which input system terminals provided along only one short side of a semiconductor element in a plurality of semiconductor devices are connected to a glass panel.

FIG. 20 is a plan view showing a state in which input system terminals provided along only one short side of a semiconductor element in the plurality of semiconductor devices are connected to a substrate.

FIG. 21 shows still another embodiment of the semiconductor device according to the present invention, in which the electrode pad is formed inside the drive circuit element region, and the input system is provided on both sides along the short side. FIG. 9 is a plan view showing a semiconductor element in which each input system terminal is alternately connected on both short side sides as a connection order of terminals.

FIG. 22 is a plan view showing a semiconductor device on which the semiconductor element is mounted.

FIG. 23 is a plan view showing a semiconductor element mounted on a conventional semiconductor device.

FIG. 24 is a plan view showing another conventional semiconductor device.

FIG. 25 is a plan view showing a state where the semiconductor device is attached to a substrate.

[Explanation of symbols]

1 TCP (semiconductor device) 3 semiconductor element 4 substrate 4a substrate wiring 5a ITO wiring (input / output wiring) 11 driving output terminal (electrode electrically connected to liquid crystal display panel) 14 input system terminal (input / output system signal) 15 output system terminal (electrode for transmitting / receiving input / output system signals) 20 drive circuit element region 34 input / output system terminal (electrode for transmitting / receiving input / output system signals) 65a ITO wiring (input wiring)

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-6-3684 (JP, A) JP-A-9-44100 (JP, A) JP-A-56-70586 (JP, A) JP-A-4- 313831 (JP, A) (58) Fields surveyed (Int.Cl. ⁷ , DB name) G02F 1/1345 H01L 21/60 311

Claims (9)

(57) [Claims] 1. A liquid crystal display device comprising a rectangular semiconductor element arranged on an outer edge of a liquid crystal display panel to drive the liquid crystal display device, and along both long sides and both short sides of the semiconductor element. In a TCP type semiconductor device in which an electrode for transmitting / receiving an input / output signal for driving a liquid crystal display device and an electrode electrically connected to a liquid crystal display panel are formed, the electrode electrically connected to the liquid crystal display panel is a semiconductor element. While being provided on one of the long sides of the semiconductor element, some of the electrodes for transmitting and receiving the input / output system signals for driving the liquid crystal display device are arranged side by side along the short side of the semiconductor element. Below the electrodes provided on the sides, input / output wirings composed of a plurality of ITO wirings in line segments are arranged in parallel in parallel with the long sides of the semiconductor element, and arranged along the short sides of the semiconductor element. Arranged Upon reception of the input-output system signal to the electrode receives the input system signal to the short side of the electrode of <br/> one through the input buffer circuit in the semiconductor device from above input and output wiring, and the semiconductor element A semiconductor device, wherein an output system signal is output from the other short-side electrode via the output buffer circuit to each of the input / output wirings. 2. A liquid crystal display device comprising a rectangular semiconductor element arranged at an outer edge of a liquid crystal display panel for driving the liquid crystal display device, and along both long sides and both short sides of the semiconductor element. In a TCP type semiconductor device in which an electrode for transmitting and receiving an input / output signal for driving the LCD and an electrode electrically connected to the liquid crystal display panel are formed, the electrode electrically connected to the liquid crystal display panel is a semiconductor element. While being provided on one of the long sides, a part of the electrodes for transmitting and receiving the input / output system signals for driving the liquid crystal display device are arranged side by side along the short side of the semiconductor element, and below or above the electrode provided on the sides long side and the input-output wiring in parallel consisting of a line segment shape of a plurality of ITO wiring of semiconductor elements are aligned disposed along the short sides of the semiconductor element Arranged side by side Upon reception of the input-output system signal to the electrode, via the output buffer circuit in the semiconductor device from above input-output lines
One of the input and output input-output system signals to the electrodes of the short side, and the other input-output system signal to be above the input-output lines from the shorter side of the electrode through the output buffer circuit of a semiconductor device A semiconductor device characterized by input and output. 3. A liquid crystal display device comprising a rectangular semiconductor element arranged on an outer edge of a liquid crystal display panel to drive the liquid crystal display device, and along both long sides and both short sides of the semiconductor element. In a TCP type semiconductor device in which an electrode for transmitting / receiving an input / output signal for driving a liquid crystal display device and an electrode electrically connected to a liquid crystal display panel are formed, the electrode electrically connected to the liquid crystal display panel is a semiconductor element. While being provided on one of the long sides, a part of electrodes for receiving an input system signal for driving the liquid crystal display device is arranged side by side along at least one short side of the semiconductor element, these include lower or upper electrode provided on the short sides a plurality of input lines of ITO wiring successive parallel to the long sides of the semiconductor element is aligned disposed, parallel along the short sides of the semiconductor element Upon reception of the input system signal to the disposed electrodes, the input system signal is input to the electrode of one of the short side and less <br/> via an input buffer circuit in the semiconductor device from above the input line A semiconductor device characterized by the above. 4. A part of an electrode for receiving an input system signal for driving the liquid crystal display device is arranged side by side along both short sides of the semiconductor element and provided on both short sides. A plurality of ITO wirings, which are continuous in parallel with the long sides of the semiconductor element, are arranged side by side below the formed electrodes, and are arranged along both short sides of the semiconductor element. In the electrodes for receiving the input system signals, the electrodes on one short side and the electrodes on the other short side are sequentially and alternately connected to the input wirings arranged side by side. The semiconductor device according to claim 3, wherein: 5. The electrodes on one short side and the other short side
Each electrode of the is arranged in a zigzag pattern in whole or in part
The semiconductor device according to claim 4, wherein the semiconductor device comprises: 6. Each of the above electrodes is provided in a drive circuit element region.
Any of claims 1 to 4, characterized in that
The semiconductor device according to item 1 . 7. A semiconductor device in the drive circuit device region.
An electrode for spacer as a support is installed between the base and the substrate.
7. The semiconductor device according to claim 6, wherein the semiconductor device is
Place 8. The semiconductor device is arranged along a long side of the semiconductor device.
The electrodes that send and receive input / output system signals are placed on the board.
Board wiring as input / output wiring or input wiring provided
While being connected to the semiconductor element, the electric currents arranged side by side along the short side of the semiconductor element.
The pole is the input / output wiring or the input wiring arranged outside the board.
Characterized in that it is connected to the ITO wiring as
Item 7. The semiconductor device according to any one of items 1 to 6 . 9. The semiconductor device is arranged along a long side of the semiconductor device.
Disposed electrodes for transmitting and receiving input / output system signals, and semiconductors
Both electrodes arranged side by side along the short side of the device
Both connect to the input / output wiring or input wiring arranged on the board.
7. The method according to any one of claims 1 to 6, characterized in that
The semiconductor device according to.