JPH063684A - Tape carrier package for liquid crystal driver ic - Google Patents

Abstract

PURPOSE:To provide a tape carrier package(TCP) for connection of liquid crystal driver IC's which enables embodying the resultant liquid crystal module light and small. CONSTITUTION:A tape carrier package(TCP) concerned is used to connect the driver IC's of a liquid crystal display device. An IC chip 17 is mounted in the center of this TCP in T-form, and input/output signal terminal parts 11, 12 are installed symmetrically on the left and right while an output terminal part 15 for driving liquid crystal is installed in the center, and the left and right input/output signals are connected by a low impedance through the internal circuitry of the driver IC chip 17. One of the input/output terminals 11 is furnished with a slit part 13 with the TCP material removed, which enables connection of the first circuit input/output terminal with the second circuit input/output terminal. This enables continuous transmission of input/output signals without use of other connection lines of a connection board, etc.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier package for a driver IC of a liquid crystal display device.

[0002]

2. Description of the Related Art A driver IC in a conventional liquid crystal display device
The relationship of connection of input / output signals between them is shown in FIGS. 5, 6 and 7. Generally, the connection between driver ICs is printed circuit board (Printed Wir
For example, as shown in FIG. Figure 5
Is a TCP shape of a conventional driver IC. External connection terminal portion 51 for input / output signals common to a plurality of driver ICs
Is arranged on the lower side of the TCP (Tape Carrier Package) (on the side opposite to the liquid crystal drive output external connection terminal portion 55), and this terminal portion 51 and the connection lead terminals of the PWBs 71, 72, and 75 are connected by soldering. Therefore, the input / output signals are connected between the driver ICs. For example, the vertical dimension H5 of the conventional PWB is 15 mm or more.

A driver chip 57 is arranged substantially in the center of the TCP, a liquid crystal drive output external connection terminal portion 55 is provided on the upper side, and an input / output signal external connection terminal portion 51 (common to a plurality of driver ICs) is provided on the lower side. The terminals S _{1 to} S ₇ are drawn out. The chip portion is covered with resin to be protected electrically and physically. In addition, the liquid crystal drive output external connection terminal portion 55 is generally provided with an anisotropic conductive sheet,
It is directly connected to the liquid crystal panel. The input / output external connection terminal portion 51 is provided with a slit from which the TCP material is extracted, and by soldering to the PWB, it is possible to supply a common signal to a plurality of driver ICs.

FIG. 6 is an enlarged view of a connecting portion between the chip 57 and TCP. Pad 67 and T provided on the chip
The inner leads 64 provided in the central portion of the CP are thermally pressure-bonded to electrically and physically connect them.
In this case, the terminals S _{1 to} S of the input / output signal terminal portion 51
₇ is one for each signal, and naturally one pad
One by one.

FIG. 7 is a diagram of a conventional liquid crystal module. If you imagine a panel of 640 (horizontal direction) × 400 (vertical direction) dots, the eight segment drivers arranged above and below each have 160 LCD drive outputs, and the four common drivers arranged on the left side are: The number of liquid crystal drive outputs is 100 in each case.

[0006]

As is apparent from FIGS. 5, 6, and 7, it is necessary to arrange PWBs on the upper and lower sides and the left side of the panel in order to commonly connect a plurality of driver ICs. This inevitably leads to an increase in panel size. The increase in panel size is a fatal negative factor in devices such as notebook computers that require miniaturization. In addition, there is a problem in that the cost of the material for the PWB and the design and development costs are separately required, which causes an increase in the price of the liquid crystal module.

An object of the present invention is to provide a TCP for a liquid crystal driver IC which eliminates these problems.

[0008]

The liquid crystal driver I of the present invention
The tape carrier package for C has an external connection terminal for input / output signals provided at the left end and the right end, and a pair of connection pads provided in the central portion corresponding to the connection terminal, and has a pair of connection pads. The pads are connected to each other through an internal circuit of the liquid crystal driver IC.

[0009]

The two external input / output signal connection terminals at the left and right ends of the TCP have symmetrical input / output signals, and the same signal terminals are connected by a conductive material, one of which is a TCP device. It has a slit part that is partially removed. When this TCP is used in a liquid crystal module, the input / output signal external connection terminals of the first TCP and the second TCP are connected between the adjacent TCPs on both sides without using any other connection line or substrate. be able to.

[0010]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a TCP shape of a driver IC in the liquid crystal display device of the present invention. The external connection terminal portions 11 and 12 for the same input / output signals (S _{1 to} S ₇ ) are arranged on the left and right sides of the TCP, and the slit for removing the TCP material is formed on the connection terminal portion on one side (the left side 11 in this embodiment). Thirteen
And a lead 14 capable of solder connection is formed on the external connection terminal on the opposite side (the right side 12 in this embodiment). As a result, it becomes possible to directly connect the adjacent ICs without passing through the PWB.

FIG. 2 is an enlarged view of the connecting portion between the chip 17 and the TCP in the driver IC of the present invention. This chip 17 is attached to the hole 20 of FIG. A big difference from the prior art is that the pads 27 for the same signal (S _{1 to} S ₇ ) are arranged on the left and right inside the chip, and the wiring between the pads 27 for the same signal on the left and right of the chip 17 is inside the chip. The material 21 is connected with a relatively low impedance. The wiring material 21 is formed of a conductor such as a second-layer metal on the chip and a gold bump (formed on the pad portion of the TCP product) on the chip. A pad 28 for a liquid crystal driving output signal 23 is formed on the chip 17. Basically, no pad is arranged below the chip 17. However, a dummy pad may be provided in order to secure the connection strength between the chip and the TCP.

FIG. 4 shows the I in the driver IC of the present invention.
The concrete connection procedure between C is shown. The external connection terminal on the side of the TCP slit 13b is arranged on the upper
The side of the connection lead 14a is placed downwards, the positions are aligned, and both leads are overlapped for solder connection.

FIG. 3 shows an example of forming a liquid crystal module,
An example of connection between the liquid crystal panel and TCP is shown. FIG. 7 of a conventional technology example
The same dot configuration (640 × 400) is imaged, and there are 8 segment drivers (4 each on the upper and lower sides) adopting the PWB according to the present invention on the upper and lower sides of the panel and 4 common drivers on the left side of the panel. It is used. Also in this case, the segment driver has 160 outputs and the common driver has 100 outputs.

Adjacent devices of eight segment drivers and four common drivers are solder-connected to each other by connecting leads formed in the overlapping TCP portions. That is, there are 6 locations on the segment side (3 locations on the upper and lower sides) and 3 locations on the common side. Also, the common driver and the segment driver can be connected in the same manner (in this case, two places).

As described above, the TCP of the driver IC according to the present invention can be reduced in shape. As a concrete comparison, the vertical dimension H5 of the conventional TCP shown in FIG.
Is 15 mm or more, and the same dimension H1 in FIG. 1 of the embodiment is 6 m.
m or less.

[0017]

The TCP for the liquid crystal driver IC of the present invention is
The board for parallel connection is unnecessary. The liquid crystal module using the TCP of the present invention can be reduced in size, weight and cost.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a TCP for a liquid crystal driver IC of the present invention.

FIG. 2 is an enlarged view of a connecting portion between a liquid crystal driver IC TCP of FIG. 1 and a chip.

FIG. 3 is a diagram showing a configuration example of a liquid crystal module using the liquid crystal driver IC TCP of FIG.

FIG. 4 is a diagram showing a connection configuration between TCPs for the liquid crystal driver IC of FIG.

FIG. 5 is a diagram showing a conventional TCP for a liquid crystal driver IC.

FIG. 6 is an enlarged view of a connection portion between a TCP for a liquid crystal driver IC and a chip according to the related art.

FIG. 7 is a diagram showing a configuration example of a liquid crystal module using a conventional TCP for a liquid crystal driver IC.

[Explanation of symbols]

 11, 12 I / O signal external connection terminal section 13 Slit 14 Connection lead 15 Liquid crystal drive external connection terminal section 17 Chip 21 Metal or bump 23 Liquid crystal drive output signal 27, 28 pad

Claims (1)

[Claims] 1. A tape carrier package for a liquid crystal driver IC, comprising external connection terminals for input / output signals provided at left and right ends, and a pair of connections provided at a central portion corresponding to the connection terminals. A tape carrier package for a liquid crystal driver IC, comprising a pad, and the pair of connection pads are connected via an internal circuit of the liquid crystal driver IC.