JP2837027B2 - Tape carrier package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier package for a driver IC of a liquid crystal display device.

[0002]

2. Description of the Related Art A driver IC in a conventional liquid crystal display device
5, 6, and 7 show the relationship between input and output signal connections between them. In general, the connection between driver ICs is printed circuit board (Printed Wir
ed Board), for example, as shown in FIG. FIG.
Is the TCP shape of a conventional driver IC. External connection terminal 51 for input / output signals common to a plurality of driver ICs
Is disposed under the TCP (Tape Carrier Package) (the side opposite to the liquid crystal drive output external connection terminal 55), and the terminal 51 and the connection lead terminals of the PWBs 71, 72, and 75 are connected by soldering. As a result, input / output signals are connected between driver ICs. For example, a conventional PWB has a vertical dimension H5 of 15 mm or more.

[0003] A driver chip 57 is arranged at substantially the center of the TCP, an external connection terminal portion 55 for liquid crystal drive output is provided on the upper side, and an external input / output connection terminal portion 51 (a plurality of driver I / Os) is provided on the lower side.
C common) and the terminals S _{1 to} S ₇ are drawn out. The chip portion is covered with resin and is electrically and physically protected. Further, the external connection terminal portions 5 5 for liquid crystal drive output
Is generally connected directly to a liquid crystal panel via an anisotropic conductive sheet. Input and output for external connection terminal portions 5 1,
PWB is provided with a slit from which the TCP base material is removed.
, It is possible to supply a common signal to a plurality of driver ICs.

FIG. 6 is an enlarged view of a connection portion between the chip 57 and the TCP. Pad 67 provided on the chip and T
The inner leads 64 provided at the central portion of the CP are electrically and physically connected by thermal compression bonding.
In this case, the terminals S _{1 to} S _{1 of} the input / output signal terminal 51 are provided.
₇ is one for each signal, and of course one pad
It is one by one.

FIG. 7 is a diagram showing the configuration of a conventional liquid crystal module. When a panel of 640 (horizontal) × 400 (vertical) dots is imaged, eight segment drivers arranged vertically have 160 liquid crystal driving outputs each, and four common drivers arranged on the left have four. Each has 100 liquid crystal drive outputs.

[0006]

As is apparent from FIGS. 5, 6, and 7, in order to connect a plurality of driver ICs in common, it is necessary to arrange PWBs on the upper, lower, and left sides of the panel. This inevitably leads to an increase in panel size. An increase in panel size is a fatal negative factor in devices that require miniaturization, such as notebook computers. In addition, there is another problem that the material cost of the PWB and the design and development cost are separately required, which leads to an increase in the price of the liquid crystal module.

An object of the present invention is to provide a TCP for a liquid crystal driver IC which eliminates these problems.

[0008]

According to the present invention, there is provided a tape carrier package comprising: an external connection terminal for input / output signals provided at a left end and a right end of a tape carrier package base ;
A liquid crystal driver IC having a pair of connection pads provided at a central portion and connected to an external connection terminal and having an internal wiring electrically connecting the pair of connection pads is provided. Also, the left end of the tape carrier package base
And at least one of the right end
It is also possible to provide a slit part that partially removes the base material
No.

[0009]

The two external connection terminals for input / output signals provided at the left and right ends of the TPC are connected to a pair of connection pads provided at the center, and the inside of the liquid crystal driver IC is provided between the pair of connection pads. are connected by wire, it is provided with a slit portion withdrawn partially TCP substrate to at least one terminal of them. When this TCP is used for a liquid crystal module, between the adjacent two adjacent TCPs,
The input / output signal external connection terminals of the first TCP and the second TCP can be connected without using another connection line, substrate, or the like.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a TCP shape according to the present invention. External connection terminals 11 and 12 for the same input / output signals (S _{1 to} S ₇ ) are arranged on the left and right sides of the TCP, and a slit formed by removing the TCP base material is provided on one side (the left side 11 in this embodiment) of the TCP. 13 and the opposite side (the right side 1 in this embodiment).
The lead 14 which can be soldered is formed at the external connection terminal of 2). This makes it possible to directly connect adjacent ICs without using PWB.

FIG. 2 is an enlarged view of a connection portion between the TCP of the present invention and a chip 17 in a driver IC. This chip 17 is attached to the hole 20 of FIG. The major difference from the prior art is that pads 27 for the same signals (S _{1 to} S ₇ ) are arranged on the left and right inside the chip.
The same signal pads 27 on the left and right of 7 are connected with a relatively low impedance by the wiring material 21 inside the chip. The wiring material 21 is formed of, for example, a conductor such as a second-layer metal on the chip or a gold bump (formed on a pad part of a TCP product) on the chip. Above the chip 17, a pad 28 for an output signal 23 for driving a liquid crystal is formed. Basically, no pad is provided below the chip 17. However, a dummy pad may be provided in order to secure the connection strength between the chip and the TCP.

FIG. 4 shows a specific connection procedure between ICs in the TCP driver IC of the present invention. T
The external connection terminal on the side of the slit 13b of the CP is arranged above,
The side of the connection lead 14a of the adjacent IC is placed below, and the positions are aligned, and both leads are overlapped to perform solder connection.

FIG. 3 shows an example of forming a liquid crystal module.
An example of connection between a liquid crystal panel and TCP is shown. FIG. 7 of a prior art example
And the same dot configuration (640 × 400). Eight segment drivers (4 each for upper and lower) adopting PWB according to the present invention above and below the panel, and 4 common drivers on the left side of the panel. It is used. Also in this case, the segment driver has 160 outputs and the common driver has 100 outputs.

Adjacent devices of eight segment drivers and four common drivers are soldered to each other by connection leads formed on overlapping TCP portions. That is, there are six locations on the segment side (three locations on the top and bottom) and three locations on the common side. The common driver and the segment driver can be connected in the same manner (in this case, two places).

[0016] T CP that by the present invention as described above it is possible to reduce the shape. Specific comparison, Ri Oh vertical dimension H5 of TCP of the prior art shown in FIG. 5 is 15mm or more, the dimensions H1 of FIG. 1 embodiment is 6mm or less.

[0017]

T CP of the present invention exhibits a substrate for parallel connection is not required. The liquid crystal module using the TCP of the present invention can be made smaller, lighter , narrower, more layered, and cost-effective.

[Brief description of the drawings]

It illustrates an embodiment of the TCP of the present invention in FIG. 1 liquid crystal for driver IC.

FIG. 2 is an enlarged view of a connection portion between a liquid crystal driver IC TCP of FIG. 1 and a chip.

FIG. 3 is a diagram illustrating a configuration example of a liquid crystal module using the liquid crystal driver IC TCP of FIG. 1;

FIG. 4 is a diagram illustrating a connection form between TCPs for the liquid crystal driver IC of FIG. 1;

FIG. 5 is a diagram showing a conventional TCP for a liquid crystal driver IC.

FIG. 6 is an enlarged view of a connection portion between a conventional TCP for a liquid crystal driver IC and a chip.

FIG. 7 is a diagram illustrating a configuration example of a liquid crystal module using a conventional TCP for a liquid crystal driver IC.

[Explanation of symbols]

 11, 12 External connection terminal for input / output signal 13 Slit 14 Connection lead 15 External connection terminal for liquid crystal drive 17 Chip 21 Metal or bump 23 Liquid crystal drive output signal 27, 28 pad

Claims (2)

(57) [Claims] 1. A tape carrier package, te
External connection terminals for input / output signals provided at the left end and the right end of the loop carrier package base material, a pair of connection pads provided at a central portion and connected to the external connection terminals, and between the pair of connection pads. A liquid crystal driver IC having an internal wiring for electrically connecting the tape carrier package. 2. The left end of the tape carrier package base material.
And at least one of the right edge
That the slit part was partially removed from the base material.
The tape carrier package according to claim 1, wherein
Di.