JP3649050B2 - Junction structure of semiconductor devices - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a junction structure of a semiconductor device.
[0002]
[Prior art]
For example, there is a liquid crystal display device in which a semiconductor device made of a liquid crystal driving LSI or the like is bonded (mounted) on an LCD panel via an anisotropic conductive adhesive. FIG. 3 is a plan view of a part of an example of such a conventional liquid crystal display device. This liquid crystal display device includes an active matrix type liquid crystal display panel 1. The liquid crystal display panel 1 is configured such that a lower glass substrate 2 and an upper glass substrate 3 are bonded together via a sealing material (not shown), and liquid crystal (not shown) is sealed therebetween. In this case, the right side portion and the lower side portion of the lower glass substrate 2 protrude from the upper glass substrate 3, and a semiconductor device 4 made of a liquid crystal driving LSI or the like is provided at each predetermined position on the upper surface of these protruding portions 2a and 2b. 5 are joined via an anisotropic conductive adhesive (not shown).
[0003]
Although not shown, the display area 6 surrounded by the two-dot chain line on the upper surface of the lower glass substrate 2 is provided with a plurality of scanning lines extending in the row direction and a plurality of signal lines extending in the column direction. It is extended. The right end of the scanning line is connected to the right semiconductor device 4 through an output wiring 7 provided at a predetermined location on the upper surface of the lower glass substrate 2. Accordingly, the semiconductor device 4 on the right side is for scanning line driving for supplying voltages to a plurality of scanning lines. The lower end portion of the signal line is connected to the lower semiconductor device 5 via an output wiring 8 provided at a predetermined location on the upper surface of the lower glass substrate 2. Therefore, the lower semiconductor device 5 is for driving signal lines for supplying voltages to a plurality of signal lines. One end portion of the flexible wiring substrate 9 is bonded to a predetermined portion of the upper surface on the right side of the lower side portion of the lower glass substrate 2 via an anisotropic conductive adhesive (not shown). The flexible wiring board 9 and the semiconductor devices 4 and 5 are connected via input wirings 10 and 11 provided at predetermined locations on the upper surface of the lower glass substrate 2. The other end of the flexible wiring board 9 is connected to a circuit board (not shown).
[0004]
Next, FIG. 4 shows a plan view of a part of a portion where the semiconductor device 4 on the right side of the liquid crystal display panel 1 shown in FIG. 3 is joined. As shown by a one-dot chain line in FIG. 4, a predetermined portion of the upper surface of the right protruding portion 2 a of the lower glass substrate 2 is a rectangular semiconductor device bonding region 12. 4, a plurality of input terminals 13a, 13b, and 13c are appropriately provided on the lower side, upper side, and left side of the left side portion of the semiconductor device junction region 12, and the plurality of output terminals 14 are provided on the right side of the upper side portion. Two rows are provided in a staggered pattern. The input terminals 13a, 13b, and 13c are connected to one end of input wirings 10a, 10b, and 10c (input wiring 10 shown in FIG. 3) provided outside the left side portion of the semiconductor device junction region 12. The output terminal 14 is connected to one end portion of the output wiring 7 (see FIG. 3) provided outside the upper side portion of the semiconductor device bonding region 12.
[0005]
Next, FIG. 5 shows a transmission plan view of a part of the semiconductor device 4 on the right side shown in FIG. In FIG. 5, a plurality of input terminals 15a, 15b, and 15c are appropriately provided on the lower side, upper side, and left side of the left side of the rectangular lower surface of the semiconductor device 4, and the plurality of output terminals 16 are provided on the right side of the upper side. Are provided in a staggered pattern in two rows, and a plurality of dummy terminals 17 are provided in one row on the right side of the lower side. The semiconductor device 4 is bonded to the semiconductor device bonding region 12 shown in FIG. 4 via an anisotropic conductive adhesive (not shown). In this state, the input terminals 15 a, 15 b, 15 c and the output terminal 16 of the semiconductor device 4 are connected to the input terminals 13 a, 13 b, 13 c and the output terminal 14 in the semiconductor device junction region 12 of the liquid crystal display panel 1. In this case, the dummy terminal 17 has a pressure applied to the anisotropic conductive adhesive under the semiconductor device 4 when the semiconductor device 4 is bonded (thermocompression bonding) to the semiconductor device bonding region 12 via the anisotropic conductive adhesive. It is for making it join uniformly. That is, the dummy terminal 17 cooperates with the output terminal 16 to equalize the pressure balance at the time of joining.
[0006]
[Problems to be solved by the invention]
By the way, in the conventional semiconductor device 4, since the plurality of dummy terminals 17 are provided on the right side of the lower side portion of the rectangular bottom surface, the size in the width direction of the semiconductor device 4 is increased by that amount, so that the distance from the wafer is increased. There is a problem that the number of chips is reduced, which leads to an increase in cost. Such a problem is the same when the dummy terminal as described above is provided in the lower semiconductor device 5. Further, in the liquid crystal display device provided with such semiconductor devices 4 and 5, there is a problem that the width of the frame is increased in accordance with the increase in size of the semiconductor devices 4 and 5 in the width direction.
An object of the present invention is to make it possible to equalize the pressure balance during bonding of semiconductor devices and to reduce the size in the width direction of the semiconductor device.
[0007]
[Means for Solving the Problems]
According to the present invention, a first output terminal group is provided on one long side portion of one surface of the rectangular shape, and a second output terminal group is provided on the other long side portion of the one surface. the semiconductor device 1 and the input terminal group in the vicinity of the second output terminals are provided, the first output terminal group is provided at one of the long sides of the rectangular semiconductor device junction region, the semiconductor device the second output terminal group is provided on the other long side of the joint region while one of the first and second output lines to the outside of the long side portion side of the semiconductor device junction region of the semiconductor junction region An input wiring that crosses only the long side of the semiconductor device and is connected alternately to the first and second output terminals and is connected to the input terminal outside the semiconductor device junction region. and a substrate provided with, said semiconductor device to a semiconductor device junction region of the substrate It is obtained by bonding and pressed through the anisotropic conductive adhesive. According to the present invention, the semiconductor device is provided with the first output terminal group on one long side portion of one surface of the rectangular shape, and the second output terminal group on the other long side portion of the one surface. Since the first and second output terminals are used, the pressure balance at the time of bonding of the semiconductor devices can be made uniform, so that there is no need to provide dummy terminals as in the prior art, and the semiconductor device is correspondingly increased. The size in the width direction can be reduced.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a plan view similar to FIG. 4 in an embodiment of a liquid crystal display device to which the present invention is applied, that is, a plan view of a part of a portion where a predetermined semiconductor device 4 of a liquid crystal display panel 1 is joined. is there. For convenience of explanation, the same reference numerals in FIG. 1 denote the same names as those in FIG. As shown by a one-dot chain line in FIG. 1, a predetermined portion on the upper surface of the predetermined protrusion 2 a of the lower glass substrate 2 of the liquid crystal display panel 1 is a rectangular semiconductor device bonding region 12. A plurality of input terminals 13a, 13b, and 13c are appropriately provided on the lower side, upper side, and left side of the left side portion (one short side portion) of the semiconductor device bonding region 12, and the upper side portion (one long side portion) is provided. A plurality of first output terminals 14a are provided in a row on the right side, and a plurality of second output terminals 14b are provided in a row on the right side of the lower side portion (the other long side portion). In this case, the first output terminal 14a and the second output terminal 14b are arranged so as to be shifted by one pitch.
[0009]
The input terminals 13a, 13b, and 13c are connected to one end portions of the input wirings 10a, 10b, and 10c provided outside the left side portion of the semiconductor device junction region 12. The first output terminal 14 a is connected to one end portion of the first output wiring 7 a provided outside the upper side portion of the semiconductor device bonding region 12. The second output terminal 14 b is connected to one end portion of the second output wiring 7 b provided in the semiconductor device junction region 12 and outside the upper side portion of the semiconductor device junction region 12. In this case, in the semiconductor device junction region 12, the second output wiring 7b is disposed between the first output terminals 14a. In addition, outside the upper side portion of the semiconductor device bonding region 12, the first output wiring 7a and the second output wiring 7b are alternately arranged.
[0010]
Next, FIG. 2 is a transmission plan view similar to FIG. 5 in this embodiment, that is, a transmission plan view of a part of a predetermined semiconductor device 4. Also in this case, for convenience of explanation, in FIG. 2, the same reference numerals are given to those having the same names as those in FIG. 5. A plurality of input terminals 15a, 15b, and 15c are appropriately provided on the lower side, upper side, and left side of the left side (one short side) of the rectangular lower surface of the semiconductor device 4, and the upper side (one long side) A plurality of first output terminals 16a are provided in a row on the right side of (), and a plurality of second output terminals 16b are provided in a row on the right side of the lower side portion (the other long side portion). The semiconductor device 4 is bonded to the semiconductor device bonding region 12 shown in FIG. 1 via an anisotropic conductive adhesive (not shown). In this state, the input terminals 15a, 15b, 15c and the output terminals 16a, 16b of the semiconductor device 4 are connected to the input terminals 13a, 13b, 13c and the output terminals 14a, 14b in the semiconductor device junction region 12 of the liquid crystal display panel 1. ing.
[0011]
Thus, in this embodiment, the semiconductor device 4 includes a plurality of first output terminals 16a arranged in a row on the right side of the upper side portion of the rectangular lower surface, and a plurality of second output terminals on the right side of the lower side portion of the lower surface. Therefore, the first and second output terminals 16a and 16b can equalize the pressure balance when the semiconductor device 4 is joined (thermocompression bonding). Therefore, there is no need to provide a dummy terminal as in the prior art, and the size in the width direction of the semiconductor device 4 can be reduced by that amount, and as a result, the number of chips taken from the wafer is increased, and the cost can be reduced. . Incidentally, in the case of the semiconductor device 4 shown in FIG. 2, it is possible to reduce the size in the width direction by about 10% (specifically, about 0.17 mm) as compared with the semiconductor device 4 shown in FIG. it can.
[0012]
Thus, in this embodiment, since the size in the width direction of the semiconductor device 4 can be reduced, the size in the width direction of the semiconductor device bonding region 12 of the liquid crystal display panel 1 for bonding the semiconductor device 4 is also reduced. Can be small. As a result, the width (projection length) of the predetermined protrusion 2a of the lower glass substrate 2 can be reduced, and consequently the width of the frame corresponding to the protrusion 2a can be reduced. The above will be described with reference to FIG. 3, and the same applies to the lower semiconductor device 5, so that the width of the frame corresponding to the lower protruding portion 2 b can be reduced.
[0013]
【The invention's effect】
As described above, according to the present invention, the semiconductor device is provided with the first output terminal group on one long side portion of one surface of the rectangular shape and the second long side portion on the one surface. Since the two output terminal groups are provided, the pressure balance at the time of bonding of the semiconductor devices can be made uniform by the first and second output terminals, and therefore there is no need to provide a dummy terminal as in the prior art. Therefore, the size of the semiconductor device in the width direction can be reduced by that amount, and as a result, the number of chips taken from the wafer increases, and the cost can be reduced.
[Brief description of the drawings]
FIG. 1 is a plan view of a part of a portion to which a predetermined semiconductor device of a liquid crystal display panel is bonded in an embodiment of a liquid crystal display device to which the present invention is applied.
FIG. 2 is a partially transparent plan view of a predetermined semiconductor device according to the embodiment.
FIG. 3 is a plan view of a part of an example of a conventional liquid crystal display device.
4 is a plan view of a part of a portion to which a semiconductor device on the right side of the liquid crystal display panel shown in FIG. 3 is bonded.
5 is a transmission plan view of a part of the semiconductor device on the right side shown in FIG. 3. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 2 Lower glass substrate 3 Upper glass substrate 4 Semiconductor device 7a, 7b Output wiring 10a, 10b, 10c Input wiring 12 Semiconductor device joining area | region 13a, 13b, 13c Input terminal 14a, 14b Output terminal 15a, 15b, 15c Input Terminal 16a, 16b Output terminal

Claims (4)

A first output terminal group is provided on one long side of one surface of the rectangular shape, and a second output terminal group is provided on the other long side of the one surface, and the first and second the semiconductor device input terminals are provided in the vicinity of the output terminal group, a first output terminal group is provided at one of the long sides of the rectangular semiconductor device junction region of the semiconductor device junction region A second output terminal group is provided on the other long side portion, and the first and second output wirings are on one long side portion of the semiconductor junction region outside the one long side portion side of the semiconductor device junction region. The input wiring connected to the input terminal is provided outside the semiconductor device junction region, and is provided alternately and connected to the first and second output terminals. and a substrate, the anisotropic conductive Dense' the semiconductor device to a semiconductor device junction region of the substrate Junction structure of a semiconductor device, characterized in that agents which have been joined and pressed through. 2. The semiconductor device junction according to claim 1, wherein the first and second output terminals of the semiconductor device and the first and second output terminals of the substrate are all arranged in one row. Construction. 3. The semiconductor device according to claim 2, wherein the first and second output terminals of the semiconductor device and the first and second output terminals of the substrate are arranged so as to be shifted by one pitch. Bonding structure. 4. The semiconductor device bonding structure according to claim 1, wherein the substrate is one substrate of a liquid crystal display panel.

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