JPH10308413A - Electronic component and electronic component mount module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a defeat in connection from being caused when a semiconductor chip which has a connection terminal at part of the circumference of the reverse surface is mounted on a liquid crystal display panel by thermocompression bonding with an anisotropic conductive agent. SOLUTION: At the reverse surface periphery of a semiconductor chip 4, a dummy connection terminal 11 is provided where the connection terminal 6 is not provided. Consequently, when the semiconductor chip 4 is bonded onto the liquid crystal display panel 1 by thermocompression across the anisotropic conductive adhesive 7, pressure can be applied to an insulating adhesive 8 by the connection terminal 6 of the semiconductor chip 4 and pressure can be applied to the insulating by the dummy connection terminal 11 as well. Consequently, a connection defective which is possibly caused when the dummy connection terminal 11 is absent can be eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component and an electronic component mounting module.

[0002]

2. Description of the Related Art For example, an LSI for driving a liquid crystal display panel is provided in a liquid crystal display device (electronic component mounting module).
2. Description of the Related Art There is a liquid crystal display panel in which a semiconductor chip (electronic component) including a chip or the like is mounted via an anisotropic conductive adhesive.

FIG. 4 shows a part of an example of such a conventional liquid crystal display device. The liquid crystal display panel 1 shown in FIG. 1 includes a lower transparent substrate 2 made of glass, resin, or the like, and an upper transparent substrate (not shown).
Are protruded from the upper transparent substrate, and a plurality of connection terminals 3 are provided on the upper surface of the protruding portion.
The semiconductor chip 4 has a structure in which a plurality of connection terminals 6 made of gold bumps or the like are provided at predetermined positions on the periphery of the lower surface of the chip body 5. The anisotropic conductive adhesive 7 is formed by mixing conductive particles 9 into an insulating adhesive 8.

Next, the semiconductor chip 4 is placed on the lower transparent substrate 2.
A case in which the semiconductor device is mounted via the anisotropic conductive adhesive 7 will be described. First, the anisotropic conductive adhesive 7 is placed on the connection portion including the connection terminal 3 of the lower transparent substrate 2, and the semiconductor chip 4 is placed thereon. Next, when thermocompression bonding is performed, the pressure at this time causes the connection terminals 6 of the semiconductor chip 4 to approach the connection terminals 3 of the lower transparent substrate 2, and the insulating adhesive 8 interposed therebetween receives heat and pressure. A portion of the conductive particles 9 flow and escape, and the conductive particles 9 present in this portion come into contact with the facing connection terminals 3 and 6, whereby the facing connection terminals 3 and 6 are conductively connected to each other. You. Also,
By solidifying the insulating adhesive 8, the semiconductor chip 4
Is adhered on the connection portion including the connection terminal 3 of the lower transparent substrate 2. Thus, the semiconductor chip 4 is mounted on the lower transparent substrate 2.

Here, an example of a specific arrangement of the connection terminals 6 provided on the lower surface of the chip body 5 of the semiconductor chip 4 will be described with reference to FIG. The lower surface of the chip body 5 has a rectangular shape. Input connection terminals 6a are arranged in a row at the left end of the lower surface of the chip body 5, the left half of the upper end, and the left half of the lower end, and the output connection terminals 6b are staggered at the right half of the upper end. Are located in

[0006]

That is, in such a conventional semiconductor chip 4, the connection terminals 6a and 6b are not provided at the right end of the lower surface of the chip body 5 and the right half of the lower end. As a result, when the semiconductor chip 4 is thermocompression-bonded to the lower transparent substrate 2 with the anisotropic conductive adhesive 7 interposed therebetween, the connection terminals 6a, 6b of the semiconductor chip 4
Is hardly applied to the portion where no is provided, particularly the insulating adhesive 8 existing under the lower right of the lower surface of the chip body 5, and under the influence of this, the connection terminals 6a and 6b in the vicinity thereof are affected.
The pressure is less likely to be applied to the portion where the is provided, especially the insulating adhesive 8 existing below the upper right portion of the lower surface of the chip body 5. As described above, if sufficient pressure is not applied to the insulating adhesive 8 existing below the portion where the connection terminals 6a and 6b are provided, the connection between the connection terminals 6a and 6b and the connection terminal 3 facing the connection terminals 6a and 6b will not occur. A part of the insulating adhesive 8 interposed between the connecting terminals 6a and 6b and the connecting terminal 3 opposed to the connecting terminals 6a and 6b is not expected. This makes it difficult to make contact, and there is a problem that poor connection may occur. An object of the present invention is to prevent a connection failure from occurring.

[0007]

According to a first aspect of the present invention, there is provided an electronic component, wherein a plurality of connection terminals are provided at a predetermined location in a rectangular area, and a plurality of connection terminals are provided at another predetermined location in the area. Are provided in at least one of the left half and the right half and at least one of the upper half and the lower half of the region, and are provided in the two halves of the connection terminal and the dummy connection terminal, respectively. Each of the total area ratios is 1 to 1 when the other is 1 to 1.5. In the electronic component mounting module according to the second aspect of the present invention, a plurality of connection terminals are provided at a predetermined location in the rectangular area, and a plurality of dummy connection terminals are provided at another predetermined location in the area. In at least one of the left and right halves and the upper and lower halves of the region, the total area ratio of the connection terminals and the dummy connection terminals provided in the two halves is one. When the electronic component is set to 1, the other electronic component is set to 1 to 1.5, and the electronic component is mounted on a substrate provided with connection terminals at portions corresponding to the connection terminals of the electronic component.

According to the present invention, dummy connection terminals are provided in addition to the connection terminals in the rectangular area, and the total area relation of these connection terminals is set to a predetermined relation. In the case where thermocompression bonding is performed with an anisotropic conductive adhesive interposed between them, in areas where connection terminals are not provided, sufficient pressure can be applied to the insulating adhesive by means of dummy connection terminals. Accordingly, a sufficient pressure can be applied to the insulating adhesive by the connection terminals in the vicinity of the dummy connection terminals, so that a connection failure can be prevented.

[0009]

FIG. 1 shows a part of a liquid crystal display device to which an embodiment of the present invention is applied, and FIG. 2 shows a lower surface of a semiconductor chip in the liquid crystal display device.
In these drawings, the same reference numerals are given to the same parts as those in FIGS. 4 and 5, and the description thereof will be omitted as appropriate. However,
FIG. 1 corresponds to a cross-sectional view taken along line AA of FIG.

As shown in FIG. 2, the left end of the rectangular lower surface of the chip body 5 of the semiconductor chip 4, the left half of the upper end, and the left half of the lower end are similar to those in the conventional example shown in FIG. The input-side connection terminals 6a are provided in a row, and the output-side connection terminals 6b are provided in the right half of the upper end in a staggered manner, as in the case of the conventional example shown in FIG. . In the semiconductor chip 4 in this embodiment, FIG.
Are different from the conventional example shown in FIG. 1 in that dummy connection terminals 11 are provided in one row at the right end of the lower surface of the chip body 5 and the right half of the lower end thereof, respectively, and the following point.

Next, the connection terminals 6 provided on the rectangular lower surface (square region) of the chip body 5 of the semiconductor chip 4
The overall area relationship between a, 6b and the dummy connection terminal 11 will be described. The ratio of the total area of the input-side connection terminals 6a provided on the left half of the lower surface of the chip body 5 to the total area of the output-side connection terminals 6b and the dummy connection terminals 11 provided on the right half of the lower surface of the chip body 5 is When one is set to 1, the other is set to 1 to 1.5. Further, the total area of the input-side connection terminals 6a, the output-side connection terminals 6b, and the dummy connection terminals 11 provided in the upper half of the lower surface of the chip body 5, and the input-side connection terminals provided in the lower half of the lower surface of the chip body 5 The ratio of 6a to the total area of the dummy connection terminals 11 is 1 to 1.5 when one is 1.

In this manner, the insulating adhesive 8 can be pressed almost uniformly by the connection terminals 6a and 6b and the dummy connection terminals 11. As a result, the semiconductor chip 4
Is thermocompression-bonded onto the lower transparent substrate 2 with the anisotropic conductive adhesive 7 interposed therebetween, the dummy connection terminals 11 are provided in portions of the semiconductor chip 4 where the connection terminals 6a and 6b are not provided. Accordingly, sufficient pressure can be applied to the insulating adhesive 8, and accordingly, the connecting terminals 6 a and 6 b in the vicinity of the dummy connection terminal 11 can sufficiently apply pressure to the insulating adhesive 8. Therefore,
Part of the insulating adhesive 8 interposed between the connection terminals 6a and 6b and the connection terminal 3 facing the connection terminals 6a and 6b escapes favorably,
The conductive particles 9 existing in this portion are connected to the connection terminal 6a,
6b and the opposing connection terminal 3 are in good contact with each other, so that poor connection can be prevented.

In the above embodiment, the semiconductor chip 4
The case where the dummy connection terminal 11 is provided only on the lower surface of the above has been described. However, the present invention is not limited to this. For example, as shown in FIG.
Dummy connection terminals 12 are also provided on the upper surface of lower transparent substrate 2 at portions corresponding to dummy connection terminals 11 of semiconductor chip 4.
May be provided. In this manner, the thermocompression bonding conditions between the opposing connection terminals 3 and 6 and the thermocompression bonding conditions between the dummy connection terminals 11 and 12 can be made substantially the same, so that further poor connection does not occur. can do.

The object on which the semiconductor chip 4 is mounted is
Not limited to the liquid crystal display panel 1, for example, a circuit board made of a ceramic substrate, a glass epoxy substrate, or the like, or a flexible wiring board made of a polyimide substrate or the like may be used. The object to be mounted on the substrate is not limited to the semiconductor chip 4, but may be a CSP (chip size package) or a BGA (ball grida).
rray) or the like.

[0015]

As described above, according to the present invention, dummy connection terminals are provided in addition to the connection terminals in the rectangular area, and the total area relation of these connection terminals is set to a predetermined relation. So, for example, when thermocompression bonding electronic components on a substrate with an anisotropic conductive adhesive between them,
In portions where connection terminals are not provided, sufficient pressure can be applied to the insulating adhesive by the dummy connection terminals, and accordingly, sufficient pressure can be applied to the insulating adhesive also by the connection terminals near the dummy connection terminals. Can be added, so that a connection failure can be prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a main part of a liquid crystal display device to which an embodiment of the present invention is applied.

FIG. 2 is a bottom view of a semiconductor chip in the liquid crystal display device.

FIG. 3 is a cross-sectional view showing a main part of a liquid crystal display device to which another embodiment of the present invention is applied.

FIG. 4 is a cross-sectional view showing a part of a conventional liquid crystal display device.

FIG. 5 is a bottom view of a semiconductor chip in the liquid crystal display device.

[Description of Signs] 2 Lower transparent substrate 3, 6a, 6b Connection terminal 4 Semiconductor chip 7 Anisotropic conductive adhesive 11 Dummy connection terminal

Claims (4)

[Claims] 1. A plurality of connection terminals are provided at predetermined positions in a rectangular region, and a plurality of dummy connection terminals are provided at other predetermined positions in the region, and a left half and a right half of the region are provided. In at least one of the upper half and the lower half, the total area ratio of the connection terminals and the dummy connection terminals provided in the two halves is one when one is one and the other is one to one. An electronic component, wherein the electronic component is set to 1.5. 2. A plurality of connection terminals are provided at predetermined positions in a rectangular region, and a plurality of dummy connection terminals are provided at other predetermined positions in the region, and a left half and a right half of the region are provided. And in at least one of the upper half and the lower half, when the total area ratio of the connection terminals and the dummy connection terminals provided in the two halves is one when one is one and the other is one to one. An electronic component mounting module, wherein the electronic component set to 1.5 is mounted on a substrate provided with connection terminals at portions corresponding to the connection terminals of the electronic component. 3. The electronic component mounting module according to claim 2, wherein said electronic component is mounted on said substrate via an anisotropic conductive adhesive. 4. The electronic component mounting module according to claim 2, wherein a dummy connection terminal is provided at a portion of the substrate corresponding to the dummy connection terminal of the electronic component.