JP2001326879A - Display driver module and its manufacturing method - Google Patents
Display driver module and its manufacturing methodInfo
- Publication number
- JP2001326879A JP2001326879A JP2000146053A JP2000146053A JP2001326879A JP 2001326879 A JP2001326879 A JP 2001326879A JP 2000146053 A JP2000146053 A JP 2000146053A JP 2000146053 A JP2000146053 A JP 2000146053A JP 2001326879 A JP2001326879 A JP 2001326879A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit chip
- adhesive
- ground
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はディスプレイドライ
バモジュールおよびその製造方法に関し、特にプラズマ
ディスプレイなどのような大画面のフラットパネルディ
スプレイを駆動するためのドライブ用集積回路を搭載し
たディスプレイドライバモジュールおよびその製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display driver module and a method of manufacturing the same, and more particularly, to a display driver module having a drive integrated circuit for driving a large-screen flat panel display such as a plasma display, and a method of manufacturing the same. About the method.
【０００２】[0002]
【従来の技術】プラズマディスプレイのような大画面表
示装置は、制御ボードから制御信号を受けるディスプレ
イドライバモジュールにより制御駆動される。従来のこ
のようなディスプレイドライバモジュールの構造を図５
および図６に示す。2. Description of the Related Art A large screen display device such as a plasma display is controlled and driven by a display driver module which receives a control signal from a control board. The structure of such a conventional display driver module is shown in FIG.
And FIG.
【０００３】図５は従来のディスプレイドライバモジュ
ールの一例を示す斜視図、図６は従来のディスプレイド
ライバモジュールの要部断面図である。発熱量の大きな
集積回路チップを搭載した従来のディスプレイドライバ
モジュールは、上面に配線パターン（図示しない）を形
成したフレキシブル基板１に放熱用のアルミニウム板２
を接着した構造の基板を使用している。フレキシブル基
板１の集積回路チップ取り付け部（ダイボンディング
部）には、穴３が設けられ、その穴３を介してドライバ
用の集積回路チップ４を接着剤５を用いてアルミニウム
板２に直接接着する構造にしている。集積回路チップ４
は、その電極をフレキシブル基板１の配線用銅パターン
と金線６でワイヤボンディングしたのち、樹脂７によっ
てコーティングされている。FIG. 5 is a perspective view showing an example of a conventional display driver module, and FIG. 6 is a sectional view of a main part of the conventional display driver module. A conventional display driver module on which an integrated circuit chip generating a large amount of heat is mounted includes an aluminum plate 2 for heat dissipation on a flexible substrate 1 having a wiring pattern (not shown) formed on an upper surface thereof.
Is used. A hole 3 is provided in an integrated circuit chip attaching portion (die bonding portion) of the flexible substrate 1, and an integrated circuit chip 4 for a driver is directly bonded to the aluminum plate 2 through the hole 3 using an adhesive 5. It has a structure. Integrated circuit chip 4
Is coated with a resin 7 after wire bonding the electrode to the wiring copper pattern of the flexible substrate 1 with a gold wire 6.
【０００４】フレキシブル基板１の一端には、制御ボー
ドへの接続を行う入力電極８が設けられ、対向端にはプ
ラズマディスプレイパネルとの接続を行う電極が形成さ
れている。An input electrode 8 for connecting to a control board is provided at one end of the flexible substrate 1, and an electrode for connecting to a plasma display panel is formed at the opposite end.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
ディスプレイドライバモジュールでは、ドライバ用の集
積回路チップとフレキシブル基板の配線パターンとの接
続を、ワイヤホンダで１本１本張ることにより行ってい
るため、ワイヤボンディングすべき端子数が多い場合に
は、ワイヤボンディング工程に時間がかかり、多量に処
理する場合、多くのワイヤホンダを必要とするため、設
備投資費がかかるという問題点があった。また、ワイヤ
ボンディング用のアルミニウム板付きフレキシブル基板
はその構造上コスト高であるという問題点があった。However, in the conventional display driver module, the connection between the driver integrated circuit chip and the wiring pattern of the flexible substrate is performed by extending one by one with a wire honda. When the number of terminals to be wire-bonded is large, it takes a long time for the wire bonding process, and when processing a large amount, a large number of wire hondas are required, so that there is a problem that capital investment is required. Further, there is a problem that the flexible substrate with an aluminum plate for wire bonding is costly due to its structure.
【０００６】本発明はこのような点に鑑みてなされたも
のであり、集積回路チップとフレキシブル基板の配線パ
ターンとの接続工程にて時間がかからず、低コストのデ
ィスプレイドライバモジュールを提供することを目的と
する。SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and it is an object of the present invention to provide a low-cost display driver module which does not require much time in a process of connecting an integrated circuit chip and a wiring pattern of a flexible substrate. With the goal.
【０００７】[0007]
【課題を解決するための手段】本発明では上記問題を解
決するために、フラットパネルディスプレイを駆動する
ためのディスプレイドライバモジュールにおいて、グラ
ンド配線の一部のカバーレイまたはソルダーレジスト部
を開口させたフレキシブル基板と、バンプ電極を有し前
記フレキシブル基板にフリップチップ実装される少なく
とも１つの集積回路チップと、前記集積回路チップの発
熱を放熱する金属板と、前記金属板の集積回路チップ取
付部と前記集積回路チップとの間に介挿配置された集積
回路チップ接着剤と、前記金属板のグランド接続部と前
記フレキシブル基板の前記グランド配線との間に介挿配
置されたグランド用接着剤と、前記金属板の前記集積回
路チップ取付部およびグランド接続部を除く面と前記フ
レキシブル基板の開口された前記カバーレイまたはソル
ダーレジスト部との間に介挿配置された両面テープと、
を備えていることを特徴とするディスプレイドライバモ
ジュールが提供される。According to the present invention, in order to solve the above-mentioned problem, in a display driver module for driving a flat panel display, a flexible cover in which a coverlay or a solder resist portion of a part of a ground wiring is opened. A substrate, at least one integrated circuit chip having bump electrodes and flip-chip mounted on the flexible substrate, a metal plate for dissipating heat of the integrated circuit chip, an integrated circuit chip mounting portion of the metal plate, and the integration An integrated circuit chip adhesive interposed between the circuit chip, a ground adhesive interposed between a ground connection portion of the metal plate and the ground wiring of the flexible board, and The surface of the board excluding the integrated circuit chip mounting portion and the ground connection portion and the flexible substrate A double-sided tape that is interposed arranged between the coverlay or solder resist portion which is the mouth,
There is provided a display driver module comprising:
【０００８】このようなディスプレイドライバモジュー
ルによれば、フリップチップ実装構造にしたことによ
り、集積回路チップとフレキシブル基板の配線パターン
との接続が一括ボンディングとなって、接続工程が大幅
に短縮され、しかもアルミニウム板などにフレキシブル
基板を取り付けた高価な基板を使用する必要がないた
め、コストを低減することができる。According to such a display driver module, the connection between the integrated circuit chip and the wiring pattern of the flexible substrate is performed by batch bonding due to the flip-chip mounting structure, and the connection process is greatly reduced. Since there is no need to use an expensive substrate in which a flexible substrate is attached to an aluminum plate or the like, costs can be reduced.
【０００９】また、本発明では、フラットパネルディス
プレイを駆動するためのディスプレイドライバモジュー
ルの製造方法において、フレキシブル基板に１個または
複数個のドライバ用のバンプ電極付き集積回路チップを
フリップチップ実装し、放熱用の金属板に、集積回路チ
ップ取付部およびグランド接続部を除いて両面テープを
貼付しかつ前記集積回路チップ取付部に集積回路チップ
接着剤を付着するとともに前記グランド接続部にグラン
ド用接着剤を付着し、前記両面テープを貼付し、集積回
路チップ接着剤およびグランド用接着剤を付着した前記
金属板と前記集積回路チップをフリップチップ実装した
前記フレキシブル基板とを貼り付け、前記集積回路チッ
プ取付部およびグランド接続部を前記フレキシブル基板
の側から加圧しながら前記金属板を裏面加熱して前記集
積回路チップ接着剤およびグランド用接着剤を仮硬化さ
せ、前記集積回路チップ接着剤およびグランド用接着剤
を本硬化させる、ようにしたことを特徴とするディスプ
レイドライバモジュールの製造方法が提供される。According to the present invention, in a method of manufacturing a display driver module for driving a flat panel display, one or a plurality of integrated circuit chips with bump electrodes for drivers are flip-chip mounted on a flexible substrate, and heat is dissipated. A double-sided tape is adhered to a metal plate except for an integrated circuit chip mounting portion and a ground connection portion, and an integrated circuit chip adhesive is attached to the integrated circuit chip mounting portion, and a ground adhesive is applied to the ground connection portion. The integrated circuit chip mounting portion, wherein the metal plate to which the integrated circuit chip adhesive and the ground adhesive are attached and the flexible substrate on which the integrated circuit chip is flip-chip mounted are attached, And pressurize the ground connection from the flexible substrate side. Display, wherein the metal plate is back-heated to temporarily cure the integrated circuit chip adhesive and the ground adhesive, and the integrated circuit chip adhesive and the ground adhesive are fully cured. A method for manufacturing a driver module is provided.
【００１０】このディスプレイドライバモジュールの製
造方法によれば、フレキシブル基板のグランド端子の金
属板への接続を、集積回路チップと金属板との接続と同
時工程で実施することができ、加工費を低減することが
できる。According to this display driver module manufacturing method, the connection of the ground terminal of the flexible substrate to the metal plate can be performed simultaneously with the connection of the integrated circuit chip and the metal plate, thereby reducing the processing cost. can do.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照して詳細に説明する。図１は本発明の第１の実施
の形態に係るディスプレイドライバモジュールを示す斜
視図、図２は第１の実施の形態に係るディスプレイドラ
イバモジュールの断面図である。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view showing a display driver module according to a first embodiment of the present invention, and FIG. 2 is a sectional view of the display driver module according to the first embodiment.
【００１２】ディスプレイドライバモジュールは、フレ
キシブル基板１１と、少なくとも１つの集積回路チップ
１２と、この集積回路チップ１２によって発生され熱を
放熱する金属板１３とから構成されている。The display driver module comprises a flexible substrate 11, at least one integrated circuit chip 12, and a metal plate 13 generated by the integrated circuit chip 12 and radiating heat.
【００１３】金属板１３は、フレキシブル基板１１と面
する側に、集積回路チップ１２を収容する凹部１４およ
びグランド接続用の凸部１５が形成されている。凹部１
４は集積回路チップ１２の厚み程度の深さを有し、凸部
１５はフレキシブル基板１１の銅パターン１６上に形成
されるカバーレイ１７またはソルダーレジストの厚み程
度の突起を有している。On the side of the metal plate 13 facing the flexible substrate 11, a concave portion 14 for accommodating the integrated circuit chip 12 and a convex portion 15 for ground connection are formed. Recess 1
4 has a depth about the thickness of the integrated circuit chip 12, and the projection 15 has a projection about the thickness of a cover lay 17 or a solder resist formed on the copper pattern 16 of the flexible substrate 11.
【００１４】集積回路チップ１２は、バンプ電極１８が
取り付けられており、そのバンプ電極１８を有する面を
下にしてフレキシブル基板１１に形成された銅パターン
１６の集積回路チップ接続部にワイヤを用いずに接続、
すなわちフリップチップボンディングがなされている。The integrated circuit chip 12 has bump electrodes 18 mounted thereon, and the surface having the bump electrodes 18 faces downward without using wires at the integrated circuit chip connecting portion of the copper pattern 16 formed on the flexible substrate 11. Connect to the
That is, flip chip bonding is performed.
【００１５】金属板１３は、フレキシブル基板１１の銅
パターン１６を被覆しているカバーレイ１７に両面テー
プ１９によって接着され、カバーレイ１７が開口した銅
パターン１６の露出部には銀ペーストなどのグランド用
接着剤２０によって接着され、集積回路チップ１２には
熱伝導性の高い集積回路チップ接着剤２１によって接着
されている。また、フレキシブル基板１１と反対側の金
属板１３の面には、パネルシャーシへの取り付け穴２２
が設けられている。The metal plate 13 is adhered to a cover lay 17 covering the copper pattern 16 of the flexible substrate 11 with a double-sided tape 19, and the exposed portion of the copper pattern 16 where the cover lay 17 is opened is grounded with silver paste or the like. And an integrated circuit chip adhesive 21 having a high thermal conductivity. In addition, the surface of the metal plate 13 opposite to the flexible substrate 11 has a mounting hole 22 for attaching to the panel chassis.
Is provided.
【００１６】フレキシブル基板１１にボンディングされ
た集積回路チップ１２は、その周囲にエポキシ樹脂など
のアンダーフィル材２３が流し込まれ、硬化されて、表
面保護および接続強度補強を行っている。The underfill material 23 such as an epoxy resin is poured into the periphery of the integrated circuit chip 12 bonded to the flexible substrate 11, and is hardened to perform surface protection and connection strength reinforcement.
【００１７】次に、このような構成のディスプレイドラ
イバモジュールの製造方法について説明する。まず、フ
レキシブル基板１１にバンプ電極１８が取り付けられた
少なくとも１つの集積回路チップ１２をフェイスダウン
ボンディングによりフリップチップ実装する。放熱器と
して、集積回路チップ１２と同じ配置位置に凹部１４を
設け、グランド接続部に凸部１５を設けたアルミニウム
板または銅板などの金属板１３を用意し、その凹部１４
および凸部１５を除いた部分に両面テープ１９を貼付す
る。また、凹部１４および凸部１５に、集積回路チップ
接着剤２１およびグランド用接着剤２０をディスペンサ
にて塗布するか、またはシート状の集積回路チップ接着
剤２１およびグランド用接着剤２０を貼付する。その
後、金属板１３と集積回路チップ１２を実装したフレキ
シブル基板１１とを貼り合わせる。これにより、集積回
路チップ１２の裏面は、金属板１３の凹部１４に集積回
路チップ接着剤２１を介して熱接合され、フレキシブル
基板１１のグランド配線は、金属板１３の凸部１５にグ
ランド用接着剤２０を介して電気的接続がなされる。こ
のとき、各集積回路チップ１２およびグランド配線部を
フレキシブル基板１１の面から加圧し、同時に金属板１
３を裏面加熱することで接着剤を仮硬化させる。その
後、キュアー炉などでバッチ処理または連続処理にて接
着剤を本硬化させる。Next, a method of manufacturing the display driver module having such a configuration will be described. First, at least one integrated circuit chip 12 having the bump electrodes 18 attached to the flexible substrate 11 is flip-chip mounted by face-down bonding. As a radiator, a metal plate 13 such as an aluminum plate or a copper plate having a concave portion 14 at the same position as the integrated circuit chip 12 and a convex portion 15 at a ground connection portion is prepared.
Then, a double-sided tape 19 is attached to a portion excluding the convex portion 15. Further, the integrated circuit chip adhesive 21 and the ground adhesive 20 are applied to the concave portion 14 and the convex portion 15 with a dispenser, or the sheet-shaped integrated circuit chip adhesive 21 and the ground adhesive 20 are attached. After that, the metal plate 13 and the flexible substrate 11 on which the integrated circuit chip 12 is mounted are bonded. Thereby, the back surface of the integrated circuit chip 12 is thermally bonded to the concave portion 14 of the metal plate 13 via the integrated circuit chip adhesive 21, and the ground wiring of the flexible substrate 11 is bonded to the convex portion 15 of the metal plate 13 by ground bonding. Electrical connection is made via the agent 20. At this time, each integrated circuit chip 12 and the ground wiring portion are pressed from the surface of the flexible substrate 11 and simultaneously the metal plate 1 is pressed.
The adhesive is temporarily cured by heating the back surface of 3. Thereafter, the adhesive is fully cured by a batch process or a continuous process in a curing furnace or the like.
【００１８】図３は本発明の第２の実施の形態に係るデ
ィスプレイドライバモジュールを示す斜視図、図４は第
２の実施の形態に係るディスプレイドライバモジュール
の断面図である。これらの図において、図１および図２
に示した構成要素と同じ要素については同じ符号を付し
てある。FIG. 3 is a perspective view showing a display driver module according to a second embodiment of the present invention, and FIG. 4 is a sectional view of the display driver module according to the second embodiment. In these figures, FIGS. 1 and 2
The same reference numerals are given to the same components as those shown in FIG.
【００１９】ディスプレイドライバモジュールは、フレ
キシブル基板１１と、少なくとも１つの集積回路チップ
１２と、この集積回路チップ１２によって発生され熱を
放熱する平板形状の金属板１３とから構成されている。The display driver module includes a flexible substrate 11, at least one integrated circuit chip 12, and a flat metal plate 13 generated by the integrated circuit chip 12 and radiating heat.
【００２０】集積回路チップ１２は、バンプ電極１８が
取り付けられており、そのバンプ電極１８を有する面を
下にしてフレキシブル基板１１に形成された銅パターン
１６の集積回路チップ接続部にフリップチップボンディ
ングがなされている。The integrated circuit chip 12 has bump electrodes 18 attached thereto, and flip chip bonding is performed on the integrated circuit chip connecting portion of the copper pattern 16 formed on the flexible substrate 11 with the surface having the bump electrodes 18 facing down. It has been done.
【００２１】金属板１３は、フレキシブル基板１１の銅
パターン１６を被覆しているカバーレイ１７に両面テー
プ１９によって接着され、カバーレイ１７が開口した銅
パターン１６の露出部にはグランド用接着剤２０によっ
て接着され、集積回路チップ１２には熱伝導性の高い集
積回路チップ接着剤２１によって接着されている。この
とき、集積回路チップ１２が実装されるフレキシブル基
板１１は、集積回路チップ１２の厚みの分だけ撓んだ状
態で金属板１３と接着されている。また、フレキシブル
基板１１と反対側の金属板１３の面には、パネルシャー
シへの取り付け穴２２が設けられている。The metal plate 13 is adhered to the cover lay 17 covering the copper pattern 16 of the flexible substrate 11 by a double-sided tape 19, and the exposed portion of the copper pattern 16 in which the cover lay 17 is opened has a ground adhesive 20. And bonded to the integrated circuit chip 12 with an integrated circuit chip adhesive 21 having high thermal conductivity. At this time, the flexible substrate 11 on which the integrated circuit chip 12 is mounted is bonded to the metal plate 13 in a state where the flexible substrate 11 is bent by the thickness of the integrated circuit chip 12. Further, on the surface of the metal plate 13 opposite to the flexible substrate 11, a mounting hole 22 to the panel chassis is provided.
【００２２】フレキシブル基板１１にボンディングされ
た集積回路チップ１２は、その周囲にアンダーフィル材
２３が流し込まれ、硬化されている。次に、このような
構成のディスプレイドライバモジュールの製造方法につ
いて説明する。The integrated circuit chip 12 bonded to the flexible substrate 11 has an underfill material 23 poured around it and is hardened. Next, a method of manufacturing the display driver module having such a configuration will be described.
【００２３】まず、フレキシブル基板１１にバンプ電極
１８が取り付けられた少なくとも１つの集積回路チップ
１２をフェイスダウンボンディングによりフリップチッ
プ実装する。放熱器として、平板のアルミニウム板また
は銅板などの金属板１３を用意し、フレキシブル基板１
１はグランド配線の一部のカバーレイ１７またはソルダ
ーレジスト部を開口させた構造とする。金属板１３の集
積回路チップ取付部およびグランド接続部を除いて片面
に両面テープ１９を貼付する。また、金属板１３の集積
回路チップ取付部およびグランド接続部に、集積回路チ
ップ接着剤２１およびグランド用接着剤２０をディスペ
ンサにて塗布するか、またはシート状の集積回路チップ
接着剤２１およびグランド用接着剤２０を貼付する。次
に、そのような処理を施した金属板１３と集積回路チッ
プ１２を実装したフレキシブル基板１１とを貼り合わせ
る。これにより、集積回路チップ１２の裏面は、金属板
１３に集積回路チップ接着剤２１を介して熱接合され、
フレキシブル基板１１のグランド配線は、金属板１３に
グランド用接着剤２０を介して電気的接続がなされる。
このとき、各集積回路チップ１２およびグランド配線部
をフレキシブル基板１１の面から加圧し、同時に金属板
１３を裏面加熱することで接着剤を仮硬化させる。その
後、キュアー炉などでバッチ処理または連続処理にて接
着剤を本硬化させる。First, at least one integrated circuit chip 12 having the bump electrodes 18 attached to the flexible substrate 11 is flip-chip mounted by face-down bonding. A metal plate 13 such as a flat aluminum plate or a copper plate is prepared as a radiator, and a flexible substrate 1 is provided.
Reference numeral 1 denotes a structure in which a coverlay 17 or a solder resist part of the ground wiring is opened. A double-sided tape 19 is attached to one side of the metal plate 13 except for the integrated circuit chip mounting portion and the ground connection portion. Further, the integrated circuit chip adhesive 21 and the ground adhesive 20 are applied to the integrated circuit chip mounting portion and the ground connection portion of the metal plate 13 with a dispenser, or the sheet-shaped integrated circuit chip adhesive 21 and the ground The adhesive 20 is attached. Next, the metal plate 13 that has been subjected to such processing is bonded to the flexible substrate 11 on which the integrated circuit chip 12 is mounted. Thereby, the back surface of the integrated circuit chip 12 is thermally bonded to the metal plate 13 via the integrated circuit chip adhesive 21,
The ground wiring of the flexible substrate 11 is electrically connected to the metal plate 13 via the ground adhesive 20.
At this time, the adhesive is temporarily cured by pressing each integrated circuit chip 12 and the ground wiring portion from the surface of the flexible substrate 11 and simultaneously heating the back surface of the metal plate 13. Thereafter, the adhesive is fully cured by a batch process or a continuous process in a curing furnace or the like.
【００２４】以上、本発明の好適な実施の形態について
詳述したが、本発明はこの特定の実施の形態に限定され
るものではなく、本発明の精神の範囲内での変化変形は
可能である。たとえば、集積回路チップをフレキシブル
基板にフリップチップ実装した部分の周りをアンダーフ
ィル材で形成したが、これに代わって、異方性導電フィ
ルムまたは導電粒子を含まない樹脂ペーストで形成して
もよい。Although the preferred embodiment of the present invention has been described in detail above, the present invention is not limited to this particular embodiment, and can be changed and modified within the spirit of the present invention. is there. For example, although the periphery of the portion where the integrated circuit chip is flip-chip mounted on the flexible substrate is formed of an underfill material, the integrated circuit chip may be formed of an anisotropic conductive film or a resin paste containing no conductive particles.
【００２５】[0025]
【発明の効果】以上説明したように、本発明では、集積
回路チップ取付部およびグランド接続部に集積回路チッ
プ接着剤およびグランド用接着剤を設け、それ以外の部
分に両面テープを貼付した放熱用の金属板と集積回路チ
ップを量産性に富む一括ボンディング（フリップチッ
プ）により実装したフレキシブル基板とを貼り合わせ、
これらを加圧・加熱して集積回路チップ接着剤およびグ
ランド用接着剤を硬化させた構成にした。これにより、
アルミニウム板などにフレキシブル基板を取り付けた高
価な基板を使用する必要がなく、かつ一括ボンディング
方式によりタクトタイムが上がり、設備的、直材的にコ
ストを低減させることができる。As described above, according to the present invention, the integrated circuit chip mounting portion and the ground connecting portion are provided with an integrated circuit chip adhesive and a ground adhesive, and the other portions are provided with a double-sided tape for heat dissipation. And a flexible board on which the integrated circuit chip is mounted by mass bonding (flip chip) with high productivity.
These were pressurized and heated to cure the integrated circuit chip adhesive and the ground adhesive. This allows
It is not necessary to use an expensive substrate in which a flexible substrate is attached to an aluminum plate or the like, and the tact time is increased by the collective bonding method, so that costs can be reduced in terms of equipment and materials.
【００２６】また、フレキシブル基板のグランド端子の
金属板への接続を集積回路チップと金属板との接続と同
時工程で実施できることから、加工費を低減することが
できる。また、このグランド部分の処理は、耐ノイズ性
の向上やグランド配線の強化につながり、電気的特性を
向上させることができる。Further, since the connection of the ground terminal of the flexible substrate to the metal plate can be performed simultaneously with the connection between the integrated circuit chip and the metal plate, the processing cost can be reduced. Further, the processing of the ground portion leads to improvement of noise resistance and strengthening of the ground wiring, and electrical characteristics can be improved.
【図１】本発明の第１の実施の形態に係るディスプレイ
ドライバモジュールを示す斜視図である。FIG. 1 is a perspective view showing a display driver module according to a first embodiment of the present invention.
【図２】第１の実施の形態に係るディスプレイドライバ
モジュールの断面図である。FIG. 2 is a sectional view of the display driver module according to the first embodiment.
【図３】本発明の第２の実施の形態に係るディスプレイ
ドライバモジュールを示す斜視図である。FIG. 3 is a perspective view showing a display driver module according to a second embodiment of the present invention.
【図４】第２の実施の形態に係るディスプレイドライバ
モジュールの断面図である。FIG. 4 is a sectional view of a display driver module according to a second embodiment.
【図５】従来のディスプレイドライバモジュールの一例
を示す斜視図である。FIG. 5 is a perspective view showing an example of a conventional display driver module.
【図６】従来のディスプレイドライバモジュールの要部
断面図である。FIG. 6 is a sectional view of a main part of a conventional display driver module.
１１ フレキシブル基板 １２ 集積回路チップ １３ 金属板 １４ 凹部 １５ 凸部 １６ 銅パターン １７ カバーレイ １８ バンプ電極 １９ 両面テープ ２０ グランド用接着剤 ２１ 集積回路チップ接着剤 ２２ 取り付け穴 ２３ アンダーフィル材 DESCRIPTION OF SYMBOLS 11 Flexible board 12 Integrated circuit chip 13 Metal plate 14 Concave part 15 Convex part 16 Copper pattern 17 Coverlay 18 Bump electrode 19 Double-sided tape 20 Adhesive for ground 21 Integrated circuit chip adhesive 22 Mounting hole 23 Underfill material
Claims (9)
ためのディスプレイドライバモジュールにおいて、 グランド配線の一部のカバーレイまたはソルダーレジス
ト部を開口させたフレキシブル基板と、 バンプ電極を有し前記フレキシブル基板にフリップチッ
プ実装される少なくとも１つの集積回路チップと、 前記集積回路チップの発熱を放熱する金属板と、 前記金属板の集積回路チップ取付部と前記集積回路チッ
プとの間に介挿配置された集積回路チップ接着剤と、 前記金属板のグランド接続部と前記フレキシブル基板の
前記グランド配線との間に介挿配置されたグランド用接
着剤と、 前記金属板の前記集積回路チップ取付部およびグランド
接続部を除く面と前記フレキシブル基板の開口された前
記カバーレイまたはソルダーレジスト部との間に介挿配
置された両面テープと、 を備えていることを特徴とするディスプレイドライバモ
ジュール。1. A display driver module for driving a flat panel display, comprising: a flexible substrate having a coverlay or a solder resist portion opened as a part of ground wiring; and a flip chip mounted on the flexible substrate having a bump electrode. At least one integrated circuit chip, a metal plate for dissipating heat generated by the integrated circuit chip, and an integrated circuit chip bonded between the integrated circuit chip mounting portion of the metal plate and the integrated circuit chip A bonding agent, a ground adhesive interposed between the ground connection portion of the metal plate and the ground wiring of the flexible substrate, and a surface of the metal plate excluding the integrated circuit chip mounting portion and the ground connection portion. And the coverlay or the solder resist portion having the flexible substrate opened. And a double-sided tape interposed between the display driver module and the display driver module.
キシブル基板は前記金属板と反対側に前記集積回路チッ
プの厚みの分だけ撓んだ状態になっていることを特徴と
する請求項１記載のディスプレイドライバモジュール。2. The semiconductor device according to claim 1, wherein the metal plate has a flat plate shape, and the flexible substrate is bent to a side opposite to the metal plate by a thickness of the integrated circuit chip. A display driver module as described.
部の位置に前記集積回路チップの厚み程度の深さを有す
る凹部および前記グランド接続部の位置に前記カバーレ
イまたはソルダーレジストの厚み程度高さを有する凸部
が形成され、前記フレキシブル基板を平面状態で前記金
属板に接着されていることを特徴とする請求項１記載の
ディスプレイドライバモジュール。3. The metal plate has a concave portion having a depth of about the thickness of the integrated circuit chip at the position of the integrated circuit chip mounting portion and a height of about the thickness of the coverlay or solder resist at the position of the ground connection portion. The display driver module according to claim 1, wherein a convex portion having a thickness is formed, and the flexible substrate is adhered to the metal plate in a planar state.
ためのディスプレイドライバモジュールの製造方法にお
いて、 フレキシブル基板に１個または複数個のドライバ用のバ
ンプ電極付き集積回路チップをフリップチップ実装し、 放熱用の金属板に、集積回路チップ取付部の位置にあっ
て前記集積回路チップの厚み程度の深さを有する凹部お
よびグランド接続部の位置にあって前記フレキシブル基
板のカバーレイまたはソルダーレジストの厚み程度高さ
を有する凸部を除いて両面テープを貼付しかつ前記金属
板の前記凹部に集積回路チップ接着剤を付着するととも
に前記凸部にグランド用接着剤を付着し、 前記両面テープを貼付し、集積回路チップ接着剤および
グランド用接着剤を付着した前記金属板と前記集積回路
チップをフリップチップ実装した前記フレキシブル基板
とを貼り付け、 前記集積回路チップ取付部およびグランド接続部を前記
フレキシブル基板の側から加圧しながら前記金属板を裏
面加熱して前記集積回路チップ接着剤およびグランド用
接着剤を仮硬化させ、 前記集積回路チップ接着剤およびグランド用接着剤を本
硬化させる、 ようにしたことを特徴とするディスプレイドライバモジ
ュールの製造方法。4. A method of manufacturing a display driver module for driving a flat panel display, comprising: mounting a flip-chip integrated circuit chip with one or more driver bump electrodes on a flexible substrate; A concave portion having a depth of about the thickness of the integrated circuit chip at the position of the integrated circuit chip mounting portion and a height of about the thickness of the coverlay or solder resist of the flexible substrate at the position of the ground connection portion. Affixing a double-sided tape except for the convex portion and attaching an integrated circuit chip adhesive to the concave portion of the metal plate and attaching a ground adhesive to the convex portion, and attaching the double-sided tape to the integrated circuit chip. Flip-chip the metal plate and the integrated circuit chip to which an adhesive and a ground adhesive are attached. Affixing the mounted flexible substrate, and applying pressure to the integrated circuit chip mounting portion and the ground connection portion from the side of the flexible substrate, heating the back surface of the metal plate to apply the integrated circuit chip adhesive and the ground adhesive. A method for manufacturing a display driver module, comprising: temporarily hardening; and finally hardening the integrated circuit chip adhesive and the ground adhesive.
ド用接着剤は、前記金属板の前記凹部および前記凸部に
ディスペンサにて塗布したことを特徴とする請求項４記
載のディスプレイドライバモジュールの製造方法。5. The method according to claim 4, wherein the integrated circuit chip adhesive and the ground adhesive are applied to the concave and convex portions of the metal plate by a dispenser. .
ド用接着剤は、シート状の接着剤であって、前記金属板
の前記凹部および前記凸部にそれぞれ貼付されることを
特徴とする請求項４記載のディスプレイドライバモジュ
ールの製造方法。6. The integrated circuit chip adhesive and the ground adhesive are sheet-like adhesives, and are respectively attached to the concave portions and the convex portions of the metal plate. A manufacturing method of the display driver module described in the above.
ためのディスプレイドライバモジュールの製造方法にお
いて、 フレキシブル基板に１個または複数個のドライバ用のバ
ンプ電極付き集積回路チップをフリップチップ実装し、 放熱用の平板形状の金属板に、集積回路チップ取付部お
よびグランド接続部を除いて両面テープを貼付しかつ前
記集積回路チップ取付部に集積回路チップ接着剤を付着
するとともに前記グランド接続部にグランド用接着剤を
付着し、 前記両面テープを貼付し、集積回路チップ接着剤および
グランド用接着剤を付着した前記金属板と前記集積回路
チップをフリップチップ実装した前記フレキシブル基板
とを貼り付け、 前記集積回路チップ取付部およびグランド接続部を前記
フレキシブル基板の側から加圧しながら前記金属板を裏
面加熱して前記集積回路チップ接着剤およびグランド用
接着剤を仮硬化させ、 前記集積回路チップ接着剤およびグランド用接着剤を本
硬化させる、 ようにしたことを特徴とするディスプレイドライバモジ
ュールの製造方法。7. A method for manufacturing a display driver module for driving a flat panel display, wherein one or more integrated circuit chips with bump electrodes for drivers are flip-chip mounted on a flexible substrate, and a flat plate shape for heat radiation is provided. A double-sided tape is attached to the metal plate except for the integrated circuit chip mounting portion and the ground connection portion, and an integrated circuit chip adhesive is bonded to the integrated circuit chip mounting portion, and a ground adhesive is bonded to the ground connection portion. Affixing the double-sided tape, affixing the metal plate to which an integrated circuit chip adhesive and a ground adhesive are adhered and the flexible substrate on which the integrated circuit chip is flip-chip mounted, and While pressing the ground connection from the side of the flexible substrate A display driver characterized in that the back surface of the metal plate is heated to temporarily cure the integrated circuit chip adhesive and the ground adhesive, and that the integrated circuit chip adhesive and the ground adhesive are fully cured. Module manufacturing method.
ド用接着剤は、前記金属板の前記凹部および前記凸部に
ディスペンサにて塗布したことを特徴とする請求項７記
載のディスプレイドライバモジュールの製造方法。8. The method according to claim 7, wherein the integrated circuit chip adhesive and the ground adhesive are applied to the concave and convex portions of the metal plate by a dispenser. .
ド用接着剤は、シート状接着剤であることを特徴とする
請求項７記載のディスプレイドライバモジュールの製造
方法。9. The method according to claim 7, wherein the integrated circuit chip adhesive and the ground adhesive are sheet adhesives.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000146053A JP4069574B2 (en) | 2000-05-18 | 2000-05-18 | Display driver module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000146053A JP4069574B2 (en) | 2000-05-18 | 2000-05-18 | Display driver module and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001326879A true JP2001326879A (en) | 2001-11-22 |
| JP4069574B2 JP4069574B2 (en) | 2008-04-02 |
Family
ID=18652469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000146053A Expired - Fee Related JP4069574B2 (en) | 2000-05-18 | 2000-05-18 | Display driver module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4069574B2 (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004271819A (en) * | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | Electro-optical device, projection display device, and electronic equipment |
| WO2005088711A1 (en) * | 2004-03-16 | 2005-09-22 | Matsushita Electric Industrial Co., Ltd. | Driver module structure |
| JP2005338706A (en) * | 2004-05-31 | 2005-12-08 | Matsushita Electric Ind Co Ltd | Plasma display apparatus |
| KR100683702B1 (en) | 2004-11-16 | 2007-02-20 | 삼성에스디아이 주식회사 | Plasma display device |
| KR100696488B1 (en) * | 2005-01-26 | 2007-03-19 | 삼성에스디아이 주식회사 | Plasma display device |
| KR100740118B1 (en) | 2004-03-30 | 2007-07-16 | 삼성에스디아이 주식회사 | Plasma display apparatus and tcp |
| US7251140B2 (en) | 2003-10-17 | 2007-07-31 | Samsung Sdi Co., Ltd | Display apparatus having heat dissipating structure for driver integrated circuit |
| CN100337516C (en) * | 2003-10-23 | 2007-09-12 | 三星Sdi株式会社 | Plasma display apparatus having heat dissipating structure for driver integrated circuit |
| CN100361563C (en) * | 2003-10-23 | 2008-01-09 | 三星Sdi株式会社 | Plasma display |
| US7414851B2 (en) * | 2005-03-03 | 2008-08-19 | Lg Electronics Inc. | Display apparatus and flexible substrate |
| US7508673B2 (en) | 2004-03-04 | 2009-03-24 | Samsung Sdi Co., Ltd. | Heat dissipating apparatus for plasma display device |
| KR100914892B1 (en) * | 2008-04-03 | 2009-08-31 | 삼성전기주식회사 | Ball grid array package and manufacturing method thereof |
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2000
- 2000-05-18 JP JP2000146053A patent/JP4069574B2/en not_active Expired - Fee Related
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004271819A (en) * | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | Electro-optical device, projection display device, and electronic equipment |
| US7251140B2 (en) | 2003-10-17 | 2007-07-31 | Samsung Sdi Co., Ltd | Display apparatus having heat dissipating structure for driver integrated circuit |
| CN100337516C (en) * | 2003-10-23 | 2007-09-12 | 三星Sdi株式会社 | Plasma display apparatus having heat dissipating structure for driver integrated circuit |
| CN100361563C (en) * | 2003-10-23 | 2008-01-09 | 三星Sdi株式会社 | Plasma display |
| US7508673B2 (en) | 2004-03-04 | 2009-03-24 | Samsung Sdi Co., Ltd. | Heat dissipating apparatus for plasma display device |
| US7582959B2 (en) | 2004-03-16 | 2009-09-01 | Panasonic Corporation | Driver module structure with flexible circuit board |
| WO2005088711A1 (en) * | 2004-03-16 | 2005-09-22 | Matsushita Electric Industrial Co., Ltd. | Driver module structure |
| JPWO2005088711A1 (en) * | 2004-03-16 | 2008-01-31 | 松下電器産業株式会社 | Driver module structure |
| US7696614B2 (en) | 2004-03-16 | 2010-04-13 | Panasonic Corporation | Driver module structure |
| KR100740118B1 (en) | 2004-03-30 | 2007-07-16 | 삼성에스디아이 주식회사 | Plasma display apparatus and tcp |
| JP2005338706A (en) * | 2004-05-31 | 2005-12-08 | Matsushita Electric Ind Co Ltd | Plasma display apparatus |
| KR100683702B1 (en) | 2004-11-16 | 2007-02-20 | 삼성에스디아이 주식회사 | Plasma display device |
| KR100696488B1 (en) * | 2005-01-26 | 2007-03-19 | 삼성에스디아이 주식회사 | Plasma display device |
| US7414851B2 (en) * | 2005-03-03 | 2008-08-19 | Lg Electronics Inc. | Display apparatus and flexible substrate |
| KR100914892B1 (en) * | 2008-04-03 | 2009-08-31 | 삼성전기주식회사 | Ball grid array package and manufacturing method thereof |
| JP2019165146A (en) * | 2018-03-20 | 2019-09-26 | Ｎｅｃプラットフォームズ株式会社 | Semiconductor device and electronic apparatus |
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