JP4135478B2

JP4135478B2 - Liquid crystal display

Info

Publication number: JP4135478B2
Application number: JP2002329392A
Authority: JP
Inventors: 康宏代工
Original assignee: Casio Computer Co Ltd
Current assignee: Casio Computer Co Ltd
Priority date: 2002-11-13
Filing date: 2002-11-13
Publication date: 2008-08-20
Anticipated expiration: 2022-11-13
Also published as: JP2004163651A

Description

【０００１】
【発明の属する技術分野】
この発明は液晶表示装置に関する。
【０００２】
【従来の技術】
従来のパッシブマトリクス型の液晶表示装置は、列方向に配列された複数のセグメント電極を有するセグメント基板と、行方向に配列された複数のコモン電極を有するコモン基板とをほぼ方形枠状のシール材を介して貼り合わせ、シール材の内側における両基板間に液晶を封入し、セグメント基板の所定の一辺部をコモン基板から突出させ、この一辺突出部の中央部に複数のセグメント端子を設け、その両側に複数ずつのコモン端子を設け、セグメント電極とセグメント端子とをその間に設けられた引き回し線を介して接続し、コモン電極とコモン端子とをコモン基板のコモン電極配列領域の行方向両側に設けられた引き回し線、上下配線導通部材、セグメント基板の一辺突出部の両側に設けられた引き回し線を介して接続し、セグメント端子及びコモン端子に外部接続用のフレキシブル配線板の一端部を接続している（例えば、特許文献１参照）。
【０００３】
【特許文献１】
特開２０００−２５９０９１号公報（図１、図２、図５、図６）
【０００４】
【発明が解決しようとする課題】
しかしながら、上記従来の液晶表示装置では、コモン電極とコモン端子とを接続するために、コモン基板のコモン電極配列領域の行方向両側に引き回し線を設けるとともに、セグメント基板の一辺突出部の両側に引き回し線を設けているので、両基板の行方向のサイズがこれらの引き回し線の配設領域の幅の分だけ大きくなり、ひいては装置全体が大型化してしまうという問題があった。
そこで、この発明は、装置全体を小型化することができる液晶表示装置を提供することを目的とする。
【０００５】
【課題を解決するための手段】
請求項１に記載の発明は、第１の基板と第２の基板が対向配置されるとともに前記第１の基板と前記第２の基板との間に液晶が封入され、前記第１の基板の前記第２の基板との対向面側に第１の電極が形成され、前記第２の基板の前記第１の基板との対向面側に第２の電極が形成された液晶表示装置において、前記第１の基板は、前記第２の基板から突出する第１の突出部及び第２の突出部を有し、前記第１の突出部は、前記第１の基板の前記対向面側に、所定の駆動回路を配置する駆動回路配置領域と、前記駆動回路配置領域に向かって延伸配置された第１の引き回し線及び第２の引き回し線と、前記第１の引き回し線に電気的に接続される第１の中継接続端子と、を有し、前記第２の突出部は、前記第１の基板の前記対向面側に、前記第２の基板に形成された前記第２の電極と所定の導通部材を介して電気的に接続される第３の引き回し線と、前記第３の引き回し線と電気的に接続される第２の中継接続端子と、を有し、前記第２の引き回し線が前記第１の電極に電気的に接続され、前記第１の中継接続端子と前記第２の中継接続端子とが、前記第１の基板の前記対向面側とは異なる側の面、または、前記第２の基板の前記対向面側とは異なる側の面を介して電気的に接続されていることを特徴とする。
請求項２に記載の発明は、請求項１に記載の発明において、前記第１の基板の前記対向面側とは異なる側の面に、前記第１の中継接続端子と前記第２の中継接続端子とを電気的に接続するための第４の引き回し線が形成されていることを特徴とする。
請求項３に記載の発明は、請求項２に記載の発明において、前記第１の基板の前記対向面側とは異なる側の面に、第１のフレキシブル配線板を介して前記第１の中継接続端子に電気的に接続される第３の中継接続端子と、第２のフレキシブル配線板を介して前記第２の中継接続端子に電気的に接続される第４の中継接続端子と、を有し、前記第３の中継接続端子と前記第４の中継接続端子とが前記第４の引き回し線を介して電気的に接続されていることを特徴とする。
請求項４に記載の発明は、請求項３に記載の発明において、前記第１の基板の前記対向面側とは異なる側の面に所定のフィルムが貼付され、前記第４の引き回し線、前記第３の中継接続端子、及び、前記第４の中継接続端子は、前記フィルム上に形成されていることを特徴とする。
請求項５に記載の発明は、請求項２から４の何れかに記載の発明において、前記第４の引き回し線は、透明導電材によって形成されていることを特徴とする。
請求項６に記載の発明は、請求項１から５の何れかに記載の発明において、前記基板平面において、前記第１の電極が前記第２の電極に対して直行するように配置され、前記第１の突出部は、前記第１の電極の延伸方向に突出し、前記第２の突出部は、前記第２の電極の延伸方向に突出していることを特徴とする。
請求項７に記載の発明は、請求項１から６の何れかに記載の発明において、前記第２の基板は、前記第１の基板との対向面側に前記第２の電極と平行に配置された第３の電極が形成され、前記第１の基板は、前記第２の突出部と逆方向に前記第２の基板から突出する第３の突出部を有し、前記第３の突出部は、前記第１の基板の前記対向面側に、前記第２の基板に形成された前記第３の電極と所定の導通部材を介して電気的に接続される第５の引き回し線と、前記第５の引き回し線と電気的に接続される第５の中継接続端子と、を有し、前記第５の中継接続端子と前記第１の中継接続端子とが、前記第１の基板の前記対向面側とは異なる側の面、または、前記第２の基板の前記対向面側とは異なる側の面を介して電気的に接続されていることを特徴とする。
請求項８に記載の発明は、請求項７に記載の発明において、前記第１の基板の前記対向面側とは異なる側の面に、前記第５の中継接続端子と前記第１の中継接続端子とを電気的に接続するための第６の引き回し線が形成されていることを特徴とする。
請求項９に記載の発明は、請求項８に記載の発明において、前記第１の基板の前記対向面側とは異なる側の面に、第３のフレキシブル配線板を介して前記第５の中継接続端子に電気的に接続される第６の中継接続端子を有し、前記第６の中継接続端子と前記第３の中継接続端子とが前記第６の引き回し線を介して電気的に接続されていることを特徴とする。
請求項１０に記載の発明は、請求項８または９に記載の発明において、前記第６の引き回し線は、透明導電材によって形成されていることを特徴とする。
請求項１１に記載の発明は、請求項１に記載の発明において、前記第２の基板の前記対向面側とは異なる側の面に、前記第１の中継接続端子と前記第２の中継接続端子とを電気的に接続するための第４の引き回し線が形成されていることを特徴とする。
請求項１２に記載の発明は、請求項１１に記載の発明において、前記第２の基板の前記対向面側とは異なる側の面に、第１のフレキシブル配線板を介して前記第１の中継接続端子に電気的に接続される第３の中継接続端子と、第２のフレキシブル配線板を介して前記第２の中継接続端子に電気的に接続される第４の中継接続端子と、を有し、前記第３の中継接続端子と前記第４の中継接続端子とが前記第４の引き回し線を介して電気的に接続されていることを特徴とする。
請求項１３に記載の発明は、請求項１２に記載の発明において、前記第２の基板の前記対向面側とは異なる側の面に所定のフィルムが貼付され、前記第４の引き回し線、前記第３の中継接続端子、及び、前記第４の中継接続端子は、前記フィルム上に形成されていることを特徴とする。
請求項１４に記載の発明は、請求項１１から１３の何れかに記載の発明において、前記第４の引き回し線は、透明導電材によって形成されていることを特徴とする。
請求項１５に記載の発明は、請求項１から１４の何れかに記載の発明において、前記第２の基板側から前記第１の基板側へ光が照射されるようにバックライトが配置されていることを特徴とする。
請求項１６に記載の発明は、請求項１から１５の何れかに記載の発明において、前記駆動回路配置領域に半導体チップからなる駆動回路が搭載されていることを特徴とする。
【０００６】
【発明の実施の形態】
（第１実施形態）
図１はこの発明の第１実施形態としての液晶表示装置の平面図を示し、図２及び図３はそれぞれそのうちのセグメント基板の平面図及び底面図を示し、図４はそのうちのコモン基板の透過平面図を示したものである。
【０００７】
図１に示すように、この液晶表示装置は、紙面垂直方向に対し下側のセグメント基板１と上側のコモン基板２とがほぼ方形枠状のシール材３を介して貼り合わされ、シール材３の内側における両基板１、２間に液晶（図示せず）が封入されたものからなっている。
【０００８】
この場合、セグメント基板１の図１で下方の下辺部、左方向の左辺部及び右方向の右辺部はコモン基板２から突出されている。以下、これらの突出部を下辺突出部１ａ、左辺突出部１ｂ及び右辺突出部１ｃという。また、コモン基板２の外形サイズはシール材３の外形サイズとほぼ同じとなっている。さらに、シール材３に形成された切欠部からなる液晶注入口３ａは、両基板１、２の図１で上方の上辺部のほぼ中央部に設けられている。
【０００９】
下辺突出部１ａの内面（コモン基板２と対向する側の面）左側には、この液晶表示装置を駆動するためのＬＳＩ等からなる半導体チップ４が搭載されている。下辺突出部１ａの内面左側で半導体チップ４搭載領域の外側には外部接続用のフレキシブル配線板５の一端部が接合されている。
【００１０】
下辺突出部１ａの内面右側でその突出端部には第１の中継用のフレキシブル配線板６の一端部が接合され、その他端部は同部分の外面に接合されている。左辺突出部１ｂの内面ほぼ中央部でその突出端部には第２の中継用のフレキシブル配線板７の一端部が接合され、その他端部は同部分の外面に接合されている。右辺突出部１ｃの内面ほぼ中央部でその突出端部には第３の中継用のフレキシブル配線板８の一端部が接合され、その他端部は同部分の外面に接合されている。
【００１１】
図２（セグメント基板１の平面図）に示すように、セグメント基板１の内面のシール材３で囲まれた領域には複数のセグメント電極１１が列方向(紙面上下方向)に平行に延在されて設けられている。セグメント電極１１の下端部は、その下側領域に設けられた引き回し線１２(両側の２本のみ図示)を介して、図１に示す半導体チップ４が搭載される半導体チップ搭載領域１３（点線で囲まれた領域）内の上辺部左側に設けられたセグメント出力端子（図示せず）に接続されている。
【００１２】
半導体チップ搭載領域１３内の上辺部右側に設けられたコモン出力端子（図示せず）は、その右側領域に設けられた引き回し線１４(両側の２本のみ図示)を介して、下辺突出部１ａの内面右側でその突出端部に設けられた中継接続端子１５に接続されている。この中継接続端子１５には、図１に示す第１の中継用のフレキシブル配線板６の一端部が異方性導電接着剤（図示せず）を介して接続されている。
【００１３】
半導体チップ搭載領域１３内の下辺部に設けられたセグメント入力端子及びコモン入力端子（共に図示せず）は、その下側領域に設けられた外部接続端子１６に接続されている。この外部接続端子１６には、図１に示す外部接続用のフレキシブル配線板５の一端部が異方性導電接着剤（図示せず）を介して接続されている。
【００１４】
ここで、半導体チップ搭載領域１３に搭載された半導体チップ４は、セグメント電極１１に駆動電圧を供給する信号側ドライバと、後述するコモン電極３６（図４参照）に駆動電圧を供給する走査側ドライバを内蔵しており、その下面の一辺部に設けられた入力端子（図示せず）は、半導体チップ搭載領域１３内の下辺部に設けられたセグメント入力端子１６ａ及びコモン入力端子１６ａを介して外部接続端子１６に接続されるものであり、半導体チップ４の下面の他辺部に設けられた出力端子（図示せず）は、半導体チップ搭載領域１３内の上辺部に設けられたセグメント出力端子１２ａ（第１の外部接続端子）及びコモン出力端子１４ａ（第２の外部接続端子）を介して、それぞれ、引き回し線１２、１４に接続されている。
【００１５】
セグメント基板１の内面においてセグメント電極１１配列領域の左右両側におけるシール材３配置領域及びその各内側には複数ずつのコモン接続端子２１、２２が設けられている。コモン接続端子２１、２２は、その各外側領域に設けられた引き回し線２３、２４(各両側の２本のみ図示)を介して、左辺突出部１ｂ及び右辺突出部１ｃの各内面ほぼ中央部でその突出端部に設けられた中継接続端子（中継配線）２５、２６に接続されている。これらの中継接続端子２５、２６には、図１に示す第２及び第３の中継用のフレキシブル配線板７、８の各一端部が異方性導電接着剤（図示せず）を介して接続されている。
【００１６】
図３（セグメント基板１の底面図）に示すように、セグメント基板１の外面の下辺部左側には複数の中継接続端子３１が設けられている。セグメント基板１の外面の右辺部ほぼ中央部及び左辺部ほぼ中央部には複数ずつの中継接続端子３２、３３が設けられている。中継接続端子３２、３３は、セグメント基板１の外面の各所定の箇所に設けられた引き回し線３４、３５(各両側の２本のみ図示)を介して複数の中継接続端子３１の右半分及び左半分にそれぞれ接続されている。
【００１７】
そして、中継接続端子３１には、図１に示す第１の中継用のフレキシブル配線板６の他端部が異方性導電接着剤（図示せず）を介して接続されている。中継接続端子３２には、図１に示す第２の中継用のフレキシブル配線板７の他端部が異方性導電接着剤（図示せず）を介して接続されている。中継接続端子３３には、図１に示す第３の中継用のフレキシブル配線板８の他端部が異方性導電接着剤（図示せず）を介して接続されている。
【００１８】
したがって、図２に示す半導体チップ搭載領域１３内の上辺部右側に設けられたコモン出力端子は、引き回し線１４、中継接続端子１５、図１に示す第１の中継用のフレキシブル配線板６、図３に示す中継接続端子３１、引き回し線３４、３５、中継接続端子３２、３３、図１に示す第２及び第３の中継用のフレキシブル配線板７、８、図２に示す中継接続端子２５、２６、引き回し線２３、２４を介してコモン接続端子２１、２２に接続されている。
【００１９】
図４（コモン基板２の透過平面図）に示すように、コモン基板２の内面（セグメント基板１と対向する側の面）のシール材３で囲まれた領域には複数のコモン電極３６が行方向(紙面左右方向)に平行に延在されて設けられている。この場合、図４において、奇数行のコモン電極３６の右端部はコモン基板２の右端面（シール材３配置領域）まで延出され、偶数行のコモン電極３６の左端部はコモン基板２の左端面（シール材３配置領域）まで延出されている。
【００２０】
そして、コモン電極３６のシール材３配置領域に延出された部分は、シール材３として異方性導電接着剤を用いることにより、シール材３中に含有された導電性粒子（図示せず）からなる上下配線導通部材を介して、図２に示すコモン接続端子２１、２２に接続されている。
【００２１】
このように、この液晶表示装置では、図２を参照して説明すると、セグメント基板１の下辺突出部１ａの半導体チップ搭載領域１３内に設けられたコモン出力端子１４ａと、セグメント基板１の内面のセグメント電極１１配列領域の左右両側におけるシール材３配置領域及びその各内側に設けられたコモン接続端子２１、２２とを、セグメント基板１の外面に設けられた引き回し線３４、３５等を介して電気的に接続しているので、セグメント基板１の左辺突出部１ｂ及び右辺突出部１ｃに引き回し線２３、２４及び中継接続端子２５、２６を配設するための領域を最小必要限の面積とすることができる。
【００２２】
この結果、セグメント基板１側のコモン用の引き回し線２３、２４及び中継接続端子２５、２６の配設領域の幅を、セグメント基板１の左辺突出部１ｂ及び右辺突出部１ｃのみを介して引き回す場合に比べて相当に小さくすることができ、ひいては装置全体を小型化することができる。
【００２３】
上記において、セグメント基板１の内面に形成するセグメント電極１１、外部接続端子１６、中継接続端子１５、２５、２６、コモン接続端子２１、２２、引き回し線１２、１４、２３、２４の全てをＩＴＯにより形成することが可能であり、生産性を向上することができる。また、セグメント基板１の外面に設ける引き回し線３４、３５及び中継接続端子３１〜３３をＩＴＯ等の透明導電材によって形成すると、これらが液晶表示駆動時に視認されることはなく、したがって表示品位が低下しないようにすることができる。
【００２４】
（第２実施形態）
上記第１実施形態では、図３に示すように、セグメント基板１の外面に引き回し線３４、３５及び中継接続端子３１〜３３を設けた場合について説明したが、これに限らず、図５に示すこの発明の第２実施形態のようにしてもよい。すなわち、コモン基板２の外面に引き回し線３４、３５及び中継接続端子３１〜３３を設け、中継接続端子３１に第１の中継用のフレキシブル配線板６の他端部を接続し、中継接続端子３２に第２の中継用のフレキシブル配線板７の他端部を接続し、中継接続端子３３に第３の中継用のフレキシブル配線板８の他端部を接続するようにしてもよい。
【００２５】
なお、上述の第１、第２実施形態において、半導体チップ搭載領域１３に搭載される半導体チップ４は、信号側ドライバと走査側ドライバが別体のものでもよく、また、半導体チップを搭載するのではなく、セグメント基板１の半導体チップ搭載領域１３上に薄膜トランジスタにより信号側ドライバと走査側ドライバを形成するようにしてもよい。
【００２６】
また、信号側ドライバと走査側ドライバをフレキシブル配線板５に搭載し、各ドライバの出力を外部接続端子１６に接続するようにすることも可能である。その場合、外部接続端子１６の一部は、直接、引き回し線１２に接続されてセグメント電極１１に接続され、外部接続端子１６の残りは、直接、引き回し線１４に接続されて中継端子１５に接続される構成となる。
【００２７】
さらに、上述の実施形態は、一方の基板の内面にセグメント電極１１およびコモン電極３６が形成され、その各交点近傍にスイッチング素子および画素電極が形成されたアクティブ型の液晶表示装置に適用することもできるものであり、その場合は、引き回し線２３、２４がコモン電極３６に直接接続される構成となり、コモン接続端子２１または２２とコモン電極３６とを導通するための上下配線導通部材は不要となる。
【００２８】
（第３実施形態）
図６はこの発明の第３実施形態としての液晶表示装置の平面図を示し、図７及び図８はそれぞれそのうちのセグメント基板の平面図及び底面図を示したものである。これらの図において、図１〜図３とほぼ同一部分には同一の符号を付し、その説明を適宜省略する。なお、コモン基板２は図４に示す場合と同じであるので、必要な場合には図４を参照して説明する。
【００２９】
この液晶表示装置において、上記第１実施形態としての液晶表示装置と大きく異なる点は、図６及び図７に示すように、セグメント基板１の左辺突出部１ｂ及び右辺突出部１ｃの各内面に、この液晶表示装置の駆動に必要なコンデンサ、ダイオード、抵抗等からなる複数ずつのチップ部品４０、４１を適宜に搭載し、図７に示すように、セグメント基板１の内面のセグメント電極１１配列領域の左右両側においてシール材３配置領域の内側及びその各下側領域の下辺突出部１ａの内面にコモン用の引き回し線（配線）４２、４３（各両側の２本のみ図示）を設け、図６に示すように、セグメント基板１の左辺部外面の所定の箇所に外部接続用のフレキシブル配線板４４の一端部を接合したことである。
【００３０】
次に、その他の部分について説明する。図６に示すように、セグメント基板１の下辺突出部１ａの内面中央部には半導体チップ４が搭載されている。半導体チップ４は、図示はしないが、信号側ドライバと走査側ドライバを内蔵するものであり、中央部に信号側の入出力端子、その両側に走査側の入出力端子を有しているものである。
【００３１】
下辺突出部１ａの内面中央部で半導体チップ４搭載領域の外側には第１の中継用のフレキシブル配線板４５の一端部が接合され、その他端部は同部分の外面に接合されている。下辺突出部１ａの内面左端部には第２の中継用のフレキシブル配線板４６の一端部が接合され、その他端部は同部分の外面に接合されている。下辺突出部１ａの内面右端部には第３の中継用のフレキシブル配線板４７の一端部が接合され、その他端部は同部分の外面に接合されている。
【００３２】
図７（セグメント基板１の平面図）に示すように、セグメント電極１１の下端部は、その下側領域に設けられた引き回し線１２(両側の２本のみ図示)を介して、図６に示す半導体チップ４が搭載される半導体チップ搭載領域１３（点線で囲まれた領域）内の上辺部中央部に設けられたセグメント出力端子（図示せず）に接続されている。
【００３３】
半導体チップ搭載領域１３内の上辺部中央には、セグメント出力端子（第１の接続端子）１２ａが引き回し線１２を介してセグメメント電極１１に接続されており、その左右両側及び左右辺部に設けられたコモン出力端子（第２の接続端子）４２ａ、４３ａは、上記コモン用の引き回し線４２、４３を介して、セグメント基板１の内面においてセグメント電極１１配列領域の左右両側におけるシール材３配置領域及びその各内側に設けられたコモン接続端子２１、２２に接続されている。
【００３４】
半導体チップ搭載領域１３内の下辺部に設けられたセグメント入力端子及びコモン入力端子４８ａは、その下側領域に設けられた中継接続端子４８に接続されている。この中継接続端子４８には、図６に示す第１の中継用のフレキシブル配線板４５の一端部が異方性導電接着剤（図示せず）を介して接続されている。
【００３５】
セグメント基板１の下辺突出部１ａの内面の左右端部には中継接続端子４９、５０が設けられている。これらの中継接続端子４９、５０には、セグメント基板１の左辺突出部１ｂ及び右辺突出部１ｃの各内面に、チップ部品４０、４１を適宜に例えば直列的にあるいは並列的に接続するように設けられた配線（図示せず）が接続されている。そして、中継接続端子４９、５０には、図６に示す第２及び第３の中継用のフレキシブル配線板４６、４７の各一端部が異方性導電接着剤（図示せず）を介して接続されている。
【００３６】
図８（セグメント基板１の底面図）に示すように、セグメント基板１の外面の下辺部中央部には複数の中継接続端子５１が設けられている。セグメント基板１の外面の右辺部下端部及び左辺部下端部には複数ずつの中継接続端子５２、５３が設けられている。セグメント基板１の外面の右辺部の所定の箇所には外部接続端子５４が設けられている。外部接続端子５４は、セグメント基板１の外面の所定の箇所に設けられた引き回し線５５（両側の２本のみ図示）を介して中継接続端子５１、５２、５３に接続されている。
【００３７】
そして、外部接続端子５４には、図６に示す外部接続用のフレキシブル配線板４４の一端部が異方性導電接着剤（図示せず）を介して接続されている。中継接続端子５１には、図６に示す第１の中継用のフレキシブル配線板４６の他端部が異方性導電接着剤（図示せず）を介して接続されている。中継接続端子５２には、図６に示す第２の中継用のフレキシブル配線板４６の他端部が異方性導電接着剤（図示せず）を介して接続されている。中継接続端子５３には、図６に示す第３の中継用のフレキシブル配線板４７の他端部が異方性導電接着剤（図示せず）を介して接続されている。
【００３８】
したがって、図８に示す外部接続端子５４の一部は、引き回し線５５、中継接続端子５１、図６に示す第１の中継用のフレキシブル配線板４５、図７に示す中継接続端子４８を介して、半導体チップ搭載領域１３に搭載された半導体チップ４の入力端子（図示せず）に接続されている。半導体チップ４の出力端子（図示せず）の一部は引き回し線１２を介してセグメント電極１１に接続され、残部は引き回し線４２、４３を介してコモン接続端子２１、２２に接続されている。コモン接続端子２１、２２は、シール材３中に含有された導電性粒子（図示せず）からなる上下配線導通部材を介して、図４に示すコモン基板２のコモン電極３６に接続されている。
【００３９】
一方、図８に示す外部接続端子５４の残部は、引き回し線５５、中継接続端子５２、５３、図６に示す第２、第３の中継用のフレキシブル配線板４６、４７、図７に示す中継接続端子４９、５０等を介してチップ部品４０、４１に接続されている。
【００４０】
ところで、この液晶表示装置では、図７に示すように、セグメント基板１の内面のセグメント電極１１配列領域の左右両側においてシール材３配置領域の内側及びその各下側領域の下辺突出部１ａの内面にコモン用の引き回し線４２、４３を設けているので、図２に示す場合と比較すると、セグメント電極１１配列領域の左右方向の長さを小さくせざるを得ず、表示領域の左右方向の長さが小さくなってしまう。
【００４１】
しかし、図７に示す場合には、セグメント基板１の左辺突出部１ｂおよび右辺突出部１ｃの各内面に複数ずつのチップ部品４０、４１を搭載しているので、装置全体の左右方向の長さを図２に示す場合と同じとすると、チップ部品４０、４１を搭載した上、装置全体を小型化することができると言える。
【００４２】
なお、図９は図６に示す液晶表示装置（ただし、フレキシブル配線板４４、４５、４６、４７は図示せず）に対してバックライトを配置した状態の平面図を示し、図１０はその右側面図を示したものである。この場合の液晶表示装置では、セグメント基板１の左辺突出部１ｂに搭載されたチップ部品４０と右辺突出部１ｃに搭載されたチップ部品４１との間におけるコモン基板２の外面側に平面型のバックライト６１が配置されている。
【００４３】
このように、セグメント基板１の両側のチップ部品４０、４１間におけるコモン基板２の外面側に平面型のバックライト６１を配置すると、チップ部品４０、４１の厚さがコモン基板２の厚さよりも厚くなっていても、この厚さの差をバックライト６１配置領域の両側の空間で吸収することができる。この結果、バックライト６１を含む液晶表示装置が厚くならないようにすることができ、ひいては装置全体を薄型化することができる。
【００４４】
（第４実施形態）
上記第３実施形態では、図８に示すように、セグメント基板１の外面に外部接続端子５４、引き回し線５５及び中継接続端子５１〜５３を設けた場合について説明したが、これに限らず、図１１に示すこの発明の第４実施形態のようにしてもよい。すなわち、コモン基板２の外面に外部接続端子５４、引き回し線５５及び中継接続端子５１〜５３を設け、外部接続端子５４に外部接続用のフレキシブル配線板４４の一端部を接続し、中継接続端子５１に第１の中継用のフレキシブル配線板４５の他端部を接続し、中継接続端子５２に第２の中継用のフレキシブル配線板４６の他端部を接続し、中継接続端子５３に第３の中継用のフレキシブル配線板４７の他端部を接続するようにしてもよい。
【００４５】
なお、上述の第３、第４実施形態において、半導体チップ搭載領域１３に搭載される半導体チップ４は、信号側ドライバと走査側ドライバが別体のものでもよく、また、半導体チップを搭載するのではなく、セグメント基板１の半導体チップ搭載領域１３上に薄膜トランジスタにより信号側ドライバと走査側ドライバを形成するようにしてもよい。
【００４６】
また、信号側ドライバと走査側ドライバをフレキシブル配線板４４に搭載し、各ドライバの出力を外部接続端子５４に接続するようにすることも可能である。その場合には、セグメント出力端子１２ａおよびコモン出力端子４２ａ、４３ａを形成する必要はなく、中継接続端子４８の中央部のものを、直接、引き回し線１２に接続して、セグメント電極１１と接続し、中継接続端子４８の両側のものを、直接、引き回し線４２、４３に接続してコモン電極３６に接続する構成となる。
【００４７】
さらに、上述の実施形態は、一方の基板の内面にセグメント電極１１およびコモン電極３６が形成され、その各交点近傍にスイッチング素子および画素電極が形成されたアクティブ型の液晶表示装置に適用することもできるものであり、その場合は、引き回し線４２、４３がコモン電極３６に直接接続される構成となり、コモン接続端子２１または２２とコモン電極３６とを導通するための上下配線導通部材は不要となる。また、上述の実施形態においても、セグメント基板１の内面に形成する電極、端子、引き回し線の全てをＩＴＯにより形成することが可能であり、生産性を向上することができる。
【００４８】
（その他の実施形態）
例えば、図３及び図８を参照して説明すると、引き回し線３４、３５及び中継接続端子３１〜３３を、セグメント基板１の外面に設けずに、図示していないが、セグメント基板１の外面に貼り付けられた透明フィルム基板の外面に設けるようにしてよい。また、図５及び図１１を参照して説明すると、引き回し線３４、３５及び中継接続端子３１〜３３を、コモン基板２の外面に設けずに、図示していないが、コモン基板２の外面に貼り付けられた透明フィルム基板の外面に設けるようにしてよい。
【００４９】
ところで、通常の液晶表示装置では、セグメント基板１及びコモン基板２の各外面にそれぞれ偏光板が貼り付けられている。そこで、上記透明フィルム基板は、バックライト側に配置される基板の外側に配置する場合には、当該基板の外面に貼り付けられた偏光板の外側に配置し、バックライト側とは反対側に配置される基板の外側に配置する場合には、当該基板とその外側に配置される偏光板との間に配置する。
【００５０】
なお、上記各実施形態では、セグメント基板の外面側のみまたはコモン基板の外面側のみに外部配線を設けた場合について説明したが、これに限らず、セグメント基板の外面側及びコモン基板の外面側にそれぞれ外部配線を設けるようにしてもよい。
【００５１】
また、上記各実施形態では、例えば図１及び図２に示すように、セグメント基板１の左辺部及び右辺部をコモン基板２から突出させ、左辺突出部１ｂの部分の構造と右辺突出部１ｃの部分の構造とをほぼ左右対称としているが、これに限らず、セグメント基板１の左右辺部のいずれか一方の辺部のみをコモン基板２から突出させるようにしてもよい。
【００５２】
【発明の効果】
以上説明したように、この発明によれば、両基板のうちの少なくとも一方の基板の外面側に配線の一部としての外部配線を設けているので、それに応じて装置全体を小型化することができる。
【図面の簡単な説明】
【図１】この発明の第１実施形態としての液晶表示装置の平面図。
【図２】図１に示すセグメント基板の平面図。
【図３】図１に示すセグメント基板の底面図。
【図４】図１に示すコモン基板の透過平面図。
【図５】この発明の第２実施形態としての液晶表示装置の平面図。
【図６】この発明の第３実施形態としての液晶表示装置の平面図。
【図７】図６に示すセグメント基板の平面図。
【図８】図６に示すセグメント基板の底面図。
【図９】図６に示す液晶表示装置に対してバックライトを配置した状態の平面図。
【図１０】図８の右側面図。
【図１１】この発明の第４実施形態としての液晶表示装置の平面図。
【符号の説明】
１セグメント基板
１ａ、１ｂ、１ｃ突出部
２コモン基板
３シール材
４半導体チップ
５外部接続用のフレキシブル配線板
６、７、８中継用のフレキシブル配線板
１１セグメント電極
１２引き回し線
１３半導体チップ搭載領域
１４引き回し線
１５中継接続端子
１６外部接続端子
２１、２２コモン接続端子
２３、２４引き回し線
２５、２６中継接続端子
３１、３２、３３中継接続端子
３４、３５引き回し線
３６コモン電極
４０、４１チップ部品
６１バックライト[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a liquid crystal display device.
[0002]
[Prior art]
A conventional passive matrix type liquid crystal display device includes a segment substrate having a plurality of segment electrodes arranged in a column direction and a common substrate having a plurality of common electrodes arranged in a row direction. Liquid crystal is sealed between both substrates inside the sealing material, a predetermined one side portion of the segment substrate is protruded from the common substrate, and a plurality of segment terminals are provided at the central portion of the one side protruding portion. Provide multiple common terminals on both sides, connect the segment electrodes and segment terminals via lead wires provided between them, and provide the common electrodes and common terminals on both sides in the row direction of the common electrode array area of the common substrate Connected via the routed lines provided on both sides of the one side projecting part of the segment substrate And connecting one end portion of the flexible wiring board for external connection to the common terminal (e.g., see Patent Document 1).
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 2000-259091 (FIGS. 1, 2, 5, and 6)
[0004]
[Problems to be solved by the invention]
However, in the above conventional liquid crystal display device, in order to connect the common electrode and the common terminal, a lead line is provided on both sides in the row direction of the common electrode arrangement region of the common substrate, and the both sides of the one side projecting portion of the segment substrate are routed. Since the lines are provided, the size in the row direction of both the substrates is increased by the width of the area where the lead lines are arranged, and as a result, the entire apparatus is increased in size.
SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid crystal display device capable of reducing the size of the entire device.
[0005]
[Means for Solving the Problems]
  The invention described in claim 1A first substrate and a second substrate are arranged to face each other, and liquid crystal is sealed between the first substrate and the second substrate, and the first substrate faces the second substrate. In the liquid crystal display device in which the first electrode is formed on the side and the second electrode is formed on the surface of the second substrate facing the first substrate, the first substrate is the second substrate. A first projecting portion and a second projecting portion projecting from the substrate, wherein the first projecting portion has a driving circuit arrangement in which a predetermined driving circuit is disposed on the opposite surface side of the first substrate. A first routing line and a second routing line that are extended toward the drive circuit layout area, and a first relay connection terminal that is electrically connected to the first routing line. And the second protrusion is formed on the second substrate on the opposite surface side of the first substrate. A third lead wire electrically connected to the two electrodes via a predetermined conducting member, and a second relay connection terminal electrically connected to the third lead wire, A second lead wire is electrically connected to the first electrode, and the first relay connection terminal and the second relay connection terminal are different from the facing surface side of the first substrate. It is electrically connected through a surface of the second substrate or a surface on a side different from the facing surface side of the second substrate.
  The invention described in claim 2In the first aspect of the present invention, for electrically connecting the first relay connection terminal and the second relay connection terminal to a surface of the first substrate that is different from the facing surface side. The fourth lead line is formed.
  The invention according to claim 3In the invention according to claim 2, the first substrate is electrically connected to the first relay connection terminal via a first flexible wiring board on a surface different from the facing surface side of the first substrate. A third relay connection terminal; and a fourth relay connection terminal electrically connected to the second relay connection terminal via a second flexible wiring board. And the fourth relay connection terminal are electrically connected through the fourth lead-out line.
  The invention according to claim 4In the invention according to claim 3, a predetermined film is affixed to a surface of the first substrate that is different from the facing surface side, the fourth lead line, the third relay connection terminal, and The fourth relay connection terminal is formed on the film.
  The invention described in claim 5The invention according to any one of claims 2 to 4, wherein the fourth lead wire is formed of a transparent conductive material.
  The invention described in claim 66. The invention according to claim 1, wherein the first electrode is disposed so as to be orthogonal to the second electrode in the plane of the substrate, and the first projecting portion is the first projection. It protrudes in the extending | stretching direction of 1 electrode, and the said 2nd protrusion part protrudes in the extending | stretching direction of the said 2nd electrode, It is characterized by the above-mentioned.
  The invention described in claim 77. The invention according to claim 1, wherein the second substrate is formed with a third electrode disposed in parallel with the second electrode on the side facing the first substrate. The first substrate has a third protrusion protruding from the second substrate in a direction opposite to the second protrusion, and the third protrusion is the first protrusion of the first substrate. A fifth lead wire electrically connected to the third electrode formed on the second substrate via a predetermined conducting member on the opposite surface side, and the fifth lead wire electrically connected to the fifth lead wire A fifth relay connection terminal to be connected, and the fifth relay connection terminal and the first relay connection terminal are different from the opposite surface side of the first substrate, Alternatively, the second substrate is electrically connected through a surface different from the facing surface side.
  The invention according to claim 8 provides:In the invention according to claim 7, in order to electrically connect the fifth relay connection terminal and the first relay connection terminal to a surface on the side different from the facing surface side of the first substrate. The sixth lead line is formed.
  The invention according to claim 9 is:The invention according to claim 8 is electrically connected to the fifth relay connection terminal via a third flexible wiring board on a surface different from the facing surface side of the first substrate. A sixth relay connection terminal; the sixth relay connection terminal and the third relay connection terminal; The connection terminal is electrically connected through the sixth lead wire.
  The invention according to claim 10 is:The invention according to claim 8 or 9 is characterized in that the sixth lead line is formed of a transparent conductive material.
  The invention according to claim 11In the first aspect of the present invention, for electrically connecting the first relay connection terminal and the second relay connection terminal to a surface of the second substrate that is different from the facing surface side. The fourth lead line is formed.
  The invention according to claim 1212. The invention according to claim 11, wherein the second substrate is electrically connected to the first relay connection terminal via a first flexible wiring board on a surface different from the facing surface side of the second substrate. A third relay connection terminal; and a fourth relay connection terminal electrically connected to the second relay connection terminal via a second flexible wiring board. And the fourth relay connection terminal are electrically connected through the fourth lead-out line.
  The invention according to claim 13The invention according to claim 12, wherein a predetermined film is affixed to a surface on the side different from the facing surface side of the second substrate, the fourth lead line, the third relay connection terminal, and The fourth relay connection terminal is formed on the film.
  The invention according to claim 14The invention according to any one of claims 11 to 13, wherein the fourth lead line is formed of a transparent conductive material.
  The invention according to claim 15 is:The invention according to any one of claims 1 to 14, wherein a backlight is arranged so that light is irradiated from the second substrate side to the first substrate side.
  The invention described in claim 16The invention according to any one of claims 1 to 15, wherein a drive circuit comprising a semiconductor chip is mounted in the drive circuit arrangement region.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
FIG. 1 is a plan view of a liquid crystal display device as a first embodiment of the present invention. FIGS. 2 and 3 are a plan view and a bottom view of a segment substrate, respectively, and FIG. 4 is a transmission through a common substrate. A plan view is shown.
[0007]
As shown in FIG. 1, in this liquid crystal display device, a lower segment substrate 1 and an upper common substrate 2 are bonded to each other through a substantially rectangular frame-shaped sealing material 3 with respect to a direction perpendicular to the paper surface. A liquid crystal (not shown) is sealed between the substrates 1 and 2 on the inner side.
[0008]
In this case, the lower side of the segment substrate 1 in FIG. 1, the left side in the left direction, and the right side in the right direction protrude from the common substrate 2. Hereinafter, these protrusions are referred to as a lower side protrusion 1a, a left side protrusion 1b, and a right side protrusion 1c. Further, the external size of the common substrate 2 is substantially the same as the external size of the sealing material 3. Further, a liquid crystal injection port 3a composed of a notch formed in the sealing material 3 is provided at a substantially central portion of the upper side of the substrates 1 and 2 in FIG.
[0009]
A semiconductor chip 4 made of LSI or the like for driving the liquid crystal display device is mounted on the left side of the inner surface (the surface facing the common substrate 2) of the lower side protruding portion 1a. One end of a flexible wiring board 5 for external connection is joined to the left side of the inner surface of the lower side protruding portion 1a and outside the semiconductor chip 4 mounting region.
[0010]
One end portion of the first flexible wiring board 6 is joined to the projecting end portion on the right side of the inner surface of the lower side projecting portion 1a, and the other end portion is joined to the outer surface of the same portion. One end portion of the second flexible wiring board 7 is joined to the projecting end portion of the left side projecting portion 1b at substantially the center of the inner surface, and the other end portion is joined to the outer surface of the second portion. One end portion of the third flexible wiring board 8 is joined to the projecting end portion of the right side projecting portion 1c at substantially the center of the inner surface, and the other end portion is joined to the outer surface of the same portion.
[0011]
As shown in FIG. 2 (plan view of the segment substrate 1), a plurality of segment electrodes 11 extend in parallel in the column direction (up and down direction on the paper surface) in the region surrounded by the sealing material 3 on the inner surface of the segment substrate 1. Is provided. The lower end portion of the segment electrode 11 is connected to a semiconductor chip mounting region 13 (indicated by a dotted line) on which the semiconductor chip 4 shown in FIG. 1 is mounted via a lead wire 12 (only two on both sides are shown) provided in the lower region. It is connected to a segment output terminal (not shown) provided on the left side of the upper side in the enclosed area.
[0012]
A common output terminal (not shown) provided on the right side of the upper side in the semiconductor chip mounting area 13 is connected to the lower side protruding part 1a via a lead wire 14 (only two shown on both sides) provided in the right side. Is connected to the relay connection terminal 15 provided at the protruding end on the right side of the inner surface. One end of the first flexible wiring board 6 for relay shown in FIG. 1 is connected to the relay connection terminal 15 via an anisotropic conductive adhesive (not shown).
[0013]
A segment input terminal and a common input terminal (both not shown) provided on the lower side of the semiconductor chip mounting region 13 are connected to an external connection terminal 16 provided on the lower region. One end of the external connection flexible wiring board 5 shown in FIG. 1 is connected to the external connection terminal 16 via an anisotropic conductive adhesive (not shown).
[0014]
Here, the semiconductor chip 4 mounted in the semiconductor chip mounting region 13 includes a signal-side driver that supplies a drive voltage to the segment electrode 11 and a scanning-side driver that supplies a drive voltage to a common electrode 36 (see FIG. 4) described later. And an input terminal (not shown) provided on one side portion of the lower surface is externally provided via a segment input terminal 16a and a common input terminal 16a provided on the lower side portion in the semiconductor chip mounting region 13. An output terminal (not shown) connected to the connection terminal 16 and provided on the other side of the lower surface of the semiconductor chip 4 is a segment output terminal 12a provided on the upper side in the semiconductor chip mounting region 13. (First external connection terminal) and common output terminal 14a (second external connection terminal) are connected to the lead wires 12 and 14, respectively.
[0015]
A plurality of common connection terminals 21 and 22 are provided on the inner surface of the segment substrate 1 on the left and right sides of the segment electrode 11 arrangement region on the left and right sides of the segment substrate 1 and on the inner sides thereof. The common connection terminals 21 and 22 are arranged at substantially central portions on the inner surfaces of the left-side protruding portion 1b and the right-side protruding portion 1c via lead wires 23 and 24 (only two on each side are shown) provided in each outer region. It is connected to relay connection terminals (relay wiring) 25 and 26 provided at the protruding end. The relay connection terminals 25 and 26 are connected to one end portions of the second and third relay flexible wiring boards 7 and 8 shown in FIG. 1 via an anisotropic conductive adhesive (not shown). Has been.
[0016]
As shown in FIG. 3 (bottom view of the segment substrate 1), a plurality of relay connection terminals 31 are provided on the left side of the lower side of the outer surface of the segment substrate 1. A plurality of relay connection terminals 32 and 33 are provided at the substantially central portion on the right side and the substantially central portion on the left side of the outer surface of the segment substrate 1. The relay connection terminals 32 and 33 are connected to the right half and the left of the plurality of relay connection terminals 31 via lead wires 34 and 35 (only two on each side are shown) provided at predetermined positions on the outer surface of the segment substrate 1. Each is connected in half.
[0017]
The other end of the first relay flexible wiring board 6 shown in FIG. 1 is connected to the relay connection terminal 31 via an anisotropic conductive adhesive (not shown). The other end of the second relay flexible wiring board 7 shown in FIG. 1 is connected to the relay connection terminal 32 via an anisotropic conductive adhesive (not shown). The other end of the third relay flexible wiring board 8 shown in FIG. 1 is connected to the relay connection terminal 33 via an anisotropic conductive adhesive (not shown).
[0018]
Therefore, the common output terminal provided on the right side of the upper side portion in the semiconductor chip mounting region 13 shown in FIG. 2 includes the lead wire 14, the relay connection terminal 15, the first flexible wiring board 6 for relay shown in FIG. 3, the relay connection terminal 31, the lead wires 34 and 35, the relay connection terminals 32 and 33, the second and third flexible wiring boards 7 and 8 shown in FIG. 1, the relay connection terminal 25 shown in FIG. 26, connected to the common connection terminals 21, 22 through the lead wires 23, 24.
[0019]
As shown in FIG. 4 (transmission plan view of the common substrate 2), a plurality of common electrodes 36 are arranged in a region surrounded by the sealing material 3 on the inner surface of the common substrate 2 (the surface facing the segment substrate 1). It is provided so as to extend in parallel with the direction (left and right direction on the paper). In this case, in FIG. 4, the right end portion of the odd-numbered common electrodes 36 extends to the right end surface (the region where the sealing material 3 is disposed) of the common substrate 2, and the left end portion of the even-numbered common electrodes 36 is the left end of the common substrate 2. It is extended to the surface (sealing material 3 arrangement | positioning area | region).
[0020]
And the part extended to the sealing material 3 arrangement | positioning area | region of the common electrode 36 uses the electroconductive particle (not shown) contained in the sealing material 3 by using an anisotropic conductive adhesive as the sealing material 3. 2 are connected to the common connection terminals 21 and 22 shown in FIG.
[0021]
As described above, in this liquid crystal display device, as will be described with reference to FIG. 2, the common output terminal 14 a provided in the semiconductor chip mounting region 13 of the lower side protruding portion 1 a of the segment substrate 1 and the inner surface of the segment substrate 1. The seal material 3 arrangement region on both the left and right sides of the segment electrode 11 arrangement region and the common connection terminals 21 and 22 provided on the inner sides thereof are electrically connected via the lead wires 34 and 35 provided on the outer surface of the segment substrate 1. Therefore, the area for arranging the lead wires 23 and 24 and the relay connection terminals 25 and 26 on the left side protrusion 1b and the right side protrusion 1c of the segment substrate 1 is set to the minimum necessary area. Can do.
[0022]
As a result, when the width of the arrangement area of the common routing lines 23 and 24 and the relay connection terminals 25 and 26 on the segment substrate 1 side is routed only through the left side protruding portion 1b and the right side protruding portion 1c of the segment substrate 1 As a result, the overall size of the apparatus can be reduced.
[0023]
In the above, all of the segment electrode 11, the external connection terminal 16, the relay connection terminals 15, 25, 26, the common connection terminals 21, 22, and the lead wires 12, 14, 23, 24 formed on the inner surface of the segment substrate 1 are made of ITO. It can be formed and productivity can be improved. Further, when the lead wires 34 and 35 and the relay connection terminals 31 to 33 provided on the outer surface of the segment substrate 1 are formed of a transparent conductive material such as ITO, these are not visually recognized when driving the liquid crystal display, and therefore the display quality is deteriorated. You can avoid it.
[0024]
(Second Embodiment)
In the first embodiment, as shown in FIG. 3, the case where the lead wires 34 and 35 and the relay connection terminals 31 to 33 are provided on the outer surface of the segment substrate 1 has been described. You may make it like 2nd Embodiment of this invention. That is, the lead wires 34 and 35 and the relay connection terminals 31 to 33 are provided on the outer surface of the common substrate 2, the other end of the first flexible wiring board 6 is connected to the relay connection terminal 31, and the relay connection terminal 32. The other end of the second flexible wiring board 7 may be connected to the relay connection terminal 33, and the other end of the third flexible wiring board 8 may be connected to the relay connection terminal 33.
[0025]
In the first and second embodiments described above, the semiconductor chip 4 mounted in the semiconductor chip mounting region 13 may have a signal-side driver and a scanning-side driver separately, and the semiconductor chip is mounted. Instead, the signal side driver and the scanning side driver may be formed by thin film transistors on the semiconductor chip mounting region 13 of the segment substrate 1.
[0026]
It is also possible to mount the signal side driver and the scanning side driver on the flexible wiring board 5 and connect the output of each driver to the external connection terminal 16. In that case, a part of the external connection terminal 16 is directly connected to the lead wire 12 and connected to the segment electrode 11, and the rest of the external connection terminal 16 is directly connected to the lead wire 14 and connected to the relay terminal 15. It becomes the composition to be done.
[0027]
Further, the above-described embodiment may be applied to an active liquid crystal display device in which the segment electrode 11 and the common electrode 36 are formed on the inner surface of one substrate, and the switching element and the pixel electrode are formed in the vicinity of each intersection. In this case, the lead wires 23 and 24 are directly connected to the common electrode 36, and the upper and lower wiring conducting members for conducting the common connection terminal 21 or 22 and the common electrode 36 become unnecessary. .
[0028]
(Third embodiment)
FIG. 6 is a plan view of a liquid crystal display device as a third embodiment of the present invention, and FIGS. 7 and 8 are a plan view and a bottom view of the segment substrate, respectively. In these drawings, substantially the same parts as those in FIGS. 1 to 3 are denoted by the same reference numerals, and the description thereof is omitted as appropriate. The common substrate 2 is the same as that shown in FIG. 4 and will be described with reference to FIG. 4 when necessary.
[0029]
In this liquid crystal display device, the main difference from the liquid crystal display device as the first embodiment is that, as shown in FIGS. 6 and 7, on the inner surfaces of the left side protruding portion 1b and the right side protruding portion 1c of the segment substrate 1, A plurality of chip parts 40 and 41 each including capacitors, diodes, resistors, and the like necessary for driving the liquid crystal display device are appropriately mounted, and as shown in FIG. On both the left and right sides, common lead wires (wirings) 42 and 43 (only two on each side are shown) are provided on the inner side of the sealing material 3 arrangement region and the inner surface of the lower side protruding portion 1a of each lower region. As shown, one end portion of the flexible wiring board 44 for external connection is joined to a predetermined location on the outer surface of the left side portion of the segment substrate 1.
[0030]
Next, other parts will be described. As shown in FIG. 6, a semiconductor chip 4 is mounted at the center of the inner surface of the lower side protruding portion 1 a of the segment substrate 1. Although not shown, the semiconductor chip 4 incorporates a signal-side driver and a scanning-side driver, and has a signal-side input / output terminal at the center and a scanning-side input / output terminal on both sides thereof. is there.
[0031]
One end portion of the first flexible wiring board 45 for joining is joined to the outside of the semiconductor chip 4 mounting region at the center of the inner surface of the lower side protruding portion 1a, and the other end portion is joined to the outer surface of the same portion. One end of the second flexible wiring board 46 for joining is joined to the left end of the inner surface of the lower side protruding portion 1a, and the other end is joined to the outer surface of the same portion. One end portion of the third relay flexible wiring board 47 is joined to the right end portion of the inner surface of the lower side protruding portion 1a, and the other end portion is joined to the outer surface of the same portion.
[0032]
As shown in FIG. 7 (plan view of the segment substrate 1), the lower end portion of the segment electrode 11 is shown in FIG. 6 via a lead wire 12 (only two on both sides are shown) provided in the lower region. The semiconductor chip 4 is connected to a segment output terminal (not shown) provided at the center of the upper side in a semiconductor chip mounting area 13 (area surrounded by a dotted line) on which the semiconductor chip 4 is mounted.
[0033]
A segment output terminal (first connection terminal) 12a is connected to the segment electrode 11 through a lead wire 12 at the center of the upper side in the semiconductor chip mounting region 13, and is provided on both the left and right sides and the left and right sides. The common output terminals (second connection terminals) 42a and 43a are arranged on the inner surface of the segment substrate 1 via the common lead wires 42 and 43, on the left and right sides of the segment electrode 11 arrangement region, It is connected to common connection terminals 21 and 22 provided inside each of them.
[0034]
The segment input terminal and common input terminal 48a provided in the lower side portion in the semiconductor chip mounting area 13 are connected to the relay connection terminal 48 provided in the lower area. One end of a first flexible wiring board 45 for relay shown in FIG. 6 is connected to the relay connection terminal 48 via an anisotropic conductive adhesive (not shown).
[0035]
Relay connection terminals 49 and 50 are provided on the left and right ends of the inner surface of the lower side protruding portion 1a of the segment substrate 1. The relay connection terminals 49 and 50 are provided so that the chip components 40 and 41 are appropriately connected to the inner surfaces of the left side protruding portion 1b and the right side protruding portion 1c of the segment substrate 1, for example, in series or in parallel. Connected wiring (not shown) is connected. Then, one end portions of the second and third relay flexible wiring boards 46 and 47 shown in FIG. 6 are connected to the relay connection terminals 49 and 50 via an anisotropic conductive adhesive (not shown). Has been.
[0036]
As shown in FIG. 8 (bottom view of the segment substrate 1), a plurality of relay connection terminals 51 are provided at the center of the lower side portion of the outer surface of the segment substrate 1. A plurality of relay connection terminals 52, 53 are provided at the lower end of the right side and the lower end of the left side of the outer surface of the segment substrate 1. External connection terminals 54 are provided at predetermined locations on the right side of the outer surface of the segment substrate 1. The external connection terminal 54 is connected to the relay connection terminals 51, 52, and 53 via lead wires 55 (only two on both sides are shown) provided at predetermined locations on the outer surface of the segment substrate 1.
[0037]
One end portion of the external connection flexible wiring board 44 shown in FIG. 6 is connected to the external connection terminal 54 via an anisotropic conductive adhesive (not shown). The other end of the first relay flexible wiring board 46 shown in FIG. 6 is connected to the relay connection terminal 51 via an anisotropic conductive adhesive (not shown). The other end of the second relay flexible wiring board 46 shown in FIG. 6 is connected to the relay connection terminal 52 via an anisotropic conductive adhesive (not shown). The other end portion of the third relay flexible wiring board 47 shown in FIG. 6 is connected to the relay connection terminal 53 via an anisotropic conductive adhesive (not shown).
[0038]
Therefore, a part of the external connection terminal 54 shown in FIG. 8 is routed through the lead wire 55, the relay connection terminal 51, the first flexible wiring board 45 for relay shown in FIG. 6, and the relay connection terminal 48 shown in FIG. Are connected to input terminals (not shown) of the semiconductor chip 4 mounted in the semiconductor chip mounting region 13. A part of an output terminal (not shown) of the semiconductor chip 4 is connected to the segment electrode 11 via a lead wire 12, and the remaining part is connected to the common connection terminals 21 and 22 via lead wires 42 and 43. The common connection terminals 21 and 22 are connected to the common electrode 36 of the common substrate 2 shown in FIG. 4 through upper and lower wiring conducting members made of conductive particles (not shown) contained in the sealing material 3. .
[0039]
On the other hand, the remaining part of the external connection terminal 54 shown in FIG. 8 includes the lead wire 55, the relay connection terminals 52 and 53, the second and third flexible wiring boards 46 and 47 shown in FIG. 6, and the relay shown in FIG. It is connected to the chip components 40 and 41 via connection terminals 49 and 50 and the like.
[0040]
By the way, in this liquid crystal display device, as shown in FIG. 7, the inner surface of the seal material 3 arrangement region and the inner surface of the lower side protruding portion 1a in each lower region on both the left and right sides of the segment electrode 11 arrangement region on the inner surface of the segment substrate 1 Since the common lead lines 42 and 43 are provided in FIG. 2, compared with the case shown in FIG. 2, the length of the segment electrode 11 arrangement region in the left-right direction must be reduced, and the length of the display region in the left-right direction. Will become smaller.
[0041]
However, in the case shown in FIG. 7, since a plurality of chip components 40 and 41 are mounted on the inner surfaces of the left side protrusion 1b and the right side protrusion 1c of the segment substrate 1, the length of the entire apparatus in the left-right direction is shown. 2 is the same as that shown in FIG. 2, it can be said that the chip apparatus 40 and 41 are mounted and the entire apparatus can be downsized.
[0042]
9 shows a plan view of a state in which a backlight is arranged with respect to the liquid crystal display device shown in FIG. 6 (however, flexible wiring boards 44, 45, 46 and 47 are not shown), and FIG. A plane view is shown. In the liquid crystal display device in this case, a flat back is provided on the outer surface side of the common substrate 2 between the chip component 40 mounted on the left side protruding portion 1b of the segment substrate 1 and the chip component 41 mounted on the right side protruding portion 1c. A light 61 is arranged.
[0043]
As described above, when the planar backlight 61 is disposed on the outer surface side of the common substrate 2 between the chip components 40 and 41 on both sides of the segment substrate 1, the thickness of the chip components 40 and 41 is larger than the thickness of the common substrate 2. Even if it is thick, this difference in thickness can be absorbed by the space on both sides of the backlight 61 arrangement region. As a result, the liquid crystal display device including the backlight 61 can be prevented from becoming thicker, and as a result, the entire device can be made thinner.
[0044]
(Fourth embodiment)
In the third embodiment, as shown in FIG. 8, the case where the external connection terminals 54, the lead wires 55, and the relay connection terminals 51 to 53 are provided on the outer surface of the segment substrate 1 has been described. A fourth embodiment of the present invention shown in FIG. That is, the external connection terminal 54, the lead wire 55, and the relay connection terminals 51 to 53 are provided on the outer surface of the common substrate 2, one end portion of the flexible wiring board 44 for external connection is connected to the external connection terminal 54, and the relay connection terminal 51. The other end of the first relay flexible wiring board 45 is connected to the relay connection terminal 52, the other end of the second relay flexible wiring board 46 is connected to the relay connection terminal 53, and the third connection to the relay connection terminal 53. You may make it connect the other end part of the flexible wiring board 47 for a relay.
[0045]
In the third and fourth embodiments described above, the semiconductor chip 4 mounted in the semiconductor chip mounting region 13 may have a signal side driver and a scanning side driver separately, and the semiconductor chip is mounted. Instead, the signal side driver and the scanning side driver may be formed by thin film transistors on the semiconductor chip mounting region 13 of the segment substrate 1.
[0046]
It is also possible to mount the signal side driver and the scanning side driver on the flexible wiring board 44 and connect the output of each driver to the external connection terminal 54. In that case, it is not necessary to form the segment output terminal 12a and the common output terminals 42a and 43a, and the central part of the relay connection terminal 48 is directly connected to the lead wire 12 and connected to the segment electrode 11. In this case, both sides of the relay connection terminal 48 are directly connected to the lead wires 42 and 43 and connected to the common electrode 36.
[0047]
Further, the above-described embodiment may be applied to an active liquid crystal display device in which the segment electrode 11 and the common electrode 36 are formed on the inner surface of one substrate, and the switching element and the pixel electrode are formed in the vicinity of each intersection. In this case, the lead wires 42 and 43 are directly connected to the common electrode 36, and the upper and lower wiring conducting members for conducting the common connection terminal 21 or 22 and the common electrode 36 become unnecessary. . Moreover, also in the above-mentioned embodiment, it is possible to form all of the electrodes, terminals, and lead wires formed on the inner surface of the segment substrate 1 from ITO, and productivity can be improved.
[0048]
(Other embodiments)
For example, referring to FIG. 3 and FIG. 8, the lead wires 34 and 35 and the relay connection terminals 31 to 33 are not provided on the outer surface of the segment substrate 1. It may be provided on the outer surface of the attached transparent film substrate. 5 and FIG. 11, the lead wires 34 and 35 and the relay connection terminals 31 to 33 are not provided on the outer surface of the common substrate 2 and are not illustrated, but are not illustrated on the outer surface of the common substrate 2. It may be provided on the outer surface of the attached transparent film substrate.
[0049]
By the way, in a normal liquid crystal display device, polarizing plates are respectively attached to the outer surfaces of the segment substrate 1 and the common substrate 2. Therefore, when the transparent film substrate is disposed outside the substrate disposed on the backlight side, the transparent film substrate is disposed outside the polarizing plate attached to the outer surface of the substrate, on the side opposite to the backlight side. When arrange | positioning on the outer side of the board | substrate arrange | positioned, it arrange | positions between the said board | substrate and the polarizing plate arrange | positioned on the outer side.
[0050]
In each of the above embodiments, the case where the external wiring is provided only on the outer surface side of the segment substrate or only on the outer surface side of the common substrate has been described. However, the present invention is not limited to this, and is provided on the outer surface side of the segment substrate and the outer surface side of the common substrate. External wiring may be provided for each.
[0051]
Moreover, in each said embodiment, as shown, for example in FIG.1 and FIG.2, the left side part and right side part of the segment board | substrate 1 are protruded from the common board | substrate 2, and the structure of the part of the left side protrusion part 1b and the right side protrusion part 1c Although the structure of the portion is substantially bilaterally symmetric, the present invention is not limited to this, and only one of the left and right side portions of the segment substrate 1 may protrude from the common substrate 2.
[0052]
【The invention's effect】
As described above, according to the present invention, since the external wiring as a part of the wiring is provided on the outer surface side of at least one of the two substrates, the entire apparatus can be downsized accordingly. it can.
[Brief description of the drawings]
FIG. 1 is a plan view of a liquid crystal display device as a first embodiment of the invention.
FIG. 2 is a plan view of the segment substrate shown in FIG.
3 is a bottom view of the segment substrate shown in FIG. 1. FIG.
4 is a transmission plan view of the common substrate shown in FIG. 1. FIG.
FIG. 5 is a plan view of a liquid crystal display device as a second embodiment of the invention.
FIG. 6 is a plan view of a liquid crystal display device as a third embodiment of the present invention.
7 is a plan view of the segment substrate shown in FIG. 6. FIG.
8 is a bottom view of the segment substrate shown in FIG. 6. FIG.
9 is a plan view showing a state in which a backlight is arranged with respect to the liquid crystal display device shown in FIG.
10 is a right side view of FIG.
FIG. 11 is a plan view of a liquid crystal display device as a fourth embodiment of the invention.
[Explanation of symbols]
1 segment substrate
1a, 1b, 1c Projection
2 Common substrate
3 Sealing material
4 Semiconductor chip
5 Flexible wiring board for external connection
6, 7, 8 Flexible wiring board for relay
11 segment electrode
12 Lead line
13 Semiconductor chip mounting area
14 Lead line
15 Relay connection terminal
16 External connection terminals
21, 22 Common connection terminal
23, 24 Lead line
25, 26 Relay connection terminal
31, 32, 33 Relay connection terminal
34, 35 Lead line
36 Common electrode
40, 41 Chip parts
61 Backlight

Claims

A liquid crystal is sealed between the first substrate and the second substrate while the first substrate and the second substrate are disposed opposite to each other;
A first electrode is formed on a surface of the first substrate facing the second substrate;
In the liquid crystal display device in which the second electrode is formed on the surface of the second substrate facing the first substrate ,
The first substrate has a first protrusion and a second protrusion protruding from the second substrate,
The first protrusion is on the opposite surface side of the first substrate,
A drive circuit placement region for placing a predetermined drive circuit;
A first lead line and a second lead line arranged to extend toward the drive circuit placement region;
A first relay connection terminal electrically connected to the first lead wire;
Have
The second protrusion is on the opposite surface side of the first substrate,
A third lead wire electrically connected to the second electrode formed on the second substrate via a predetermined conducting member;
A second relay connection terminal electrically connected to the third lead wire;
Have
The second lead wire is electrically connected to the first electrode;
The first relay connection terminal and the second relay connection terminal are different from the surface on the side different from the opposing surface side of the first substrate or the opposing surface side of the second substrate. A liquid crystal display device, wherein the liquid crystal display device is electrically connected through a side surface .

A fourth lead line for electrically connecting the first relay connection terminal and the second relay connection terminal is formed on a surface of the first substrate different from the facing surface side. The liquid crystal display device according to claim 1 .

On the surface on the side different from the facing surface side of the first substrate,
A third relay connection terminal electrically connected to the first relay connection terminal via a first flexible wiring board;
A fourth relay connection terminal electrically connected to the second relay connection terminal via a second flexible wiring board;
Have
3. The liquid crystal display device according to claim 2, wherein the third relay connection terminal and the fourth relay connection terminal are electrically connected via the fourth lead-out line .

A predetermined film is affixed to a surface on a side different from the facing surface side of the first substrate;
The liquid crystal display device according to claim 3, wherein the fourth lead line, the third relay connection terminal, and the fourth relay connection terminal are formed on the film .

The fourth lead lines, the liquid crystal display device according to claims 2 to any of the 4, characterized in that it is formed of a transparent conductive material.

In the substrate plane, the first electrode is arranged so as to be orthogonal to the second electrode,
The first protrusion protrudes in the extending direction of the first electrode,
The liquid crystal display device according to claim 1, wherein the second projecting portion projects in the extending direction of the second electrode .

The second substrate is formed with a third electrode disposed in parallel with the second electrode on the side facing the first substrate,
The first substrate has a third protrusion protruding from the second substrate in a direction opposite to the second protrusion,
The third protrusion is on the opposite surface side of the first substrate,
A fifth lead wire electrically connected to the third electrode formed on the second substrate via a predetermined conductive member;
A fifth relay connection terminal electrically connected to the fifth routing line;
Have
The fifth relay connection terminal and the first relay connection terminal are different from the opposite surface side of the first substrate or the opposite surface side of the second substrate. The liquid crystal display device according to claim 1, wherein the liquid crystal display device is electrically connected via a side surface .

A sixth routing line for electrically connecting the fifth relay connection terminal and the first relay connection terminal is formed on a surface of the first substrate different from the facing surface side. The liquid crystal display device according to claim 7 .

A sixth relay connection terminal electrically connected to the fifth relay connection terminal via a third flexible wiring board is provided on a surface different from the facing surface side of the first substrate. ,
The liquid crystal display device according to claim 8, wherein the sixth relay connection terminal and the third relay connection terminal are electrically connected via the sixth lead-out line .

10. The liquid crystal display device according to claim 8, wherein the sixth lead line is formed of a transparent conductive material .

A fourth lead line for electrically connecting the first relay connection terminal and the second relay connection terminal is formed on a surface different from the facing surface side of the second substrate. The liquid crystal display device according to claim 1 .

On the surface on the side different from the facing surface side of the second substrate,
A third relay connection terminal electrically connected to the first relay connection terminal via a first flexible wiring board;
A fourth relay connection terminal electrically connected to the second relay connection terminal via a second flexible wiring board;
Have
The liquid crystal display device according to claim 11, wherein the third relay connection terminal and the fourth relay connection terminal are electrically connected via the fourth lead line .

A predetermined film is affixed to a surface on the side different from the facing surface side of the second substrate;
The liquid crystal display device according to claim 12, wherein the fourth lead line, the third relay connection terminal, and the fourth relay connection terminal are formed on the film .

The liquid crystal display device according to claim 11, wherein the fourth lead line is formed of a transparent conductive material .

The liquid crystal display device according to claim 1, wherein a backlight is disposed so that light is irradiated from the second substrate side to the first substrate side .

16. The liquid crystal display device according to claim 1, wherein a drive circuit made of a semiconductor chip is mounted in the drive circuit arrangement region .